TW201912839A - 微蝕刻劑以及配線基板的製造方法 - Google Patents

微蝕刻劑以及配線基板的製造方法 Download PDF

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Publication number
TW201912839A
TW201912839A TW107125153A TW107125153A TW201912839A TW 201912839 A TW201912839 A TW 201912839A TW 107125153 A TW107125153 A TW 107125153A TW 107125153 A TW107125153 A TW 107125153A TW 201912839 A TW201912839 A TW 201912839A
Authority
TW
Taiwan
Prior art keywords
copper
micro
etching agent
polymer
etching
Prior art date
Application number
TW107125153A
Other languages
English (en)
Chinese (zh)
Inventor
斉藤知志
福井優
Original Assignee
日商Ｍｅｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｍｅｃ股份有限公司 filed Critical 日商Ｍｅｃ股份有限公司
Publication of TW201912839A publication Critical patent/TW201912839A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW107125153A 2017-08-23 2018-07-20 微蝕刻劑以及配線基板的製造方法 TW201912839A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017160151A JP6333455B1 (ja) 2017-08-23 2017-08-23 銅のマイクロエッチング剤および配線基板の製造方法
JP2017-160151 2017-08-23

Publications (1)

Publication Number Publication Date
TW201912839A true TW201912839A (zh) 2019-04-01

Family

ID=62236415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107125153A TW201912839A (zh) 2017-08-23 2018-07-20 微蝕刻劑以及配線基板的製造方法

Country Status (5)

Country Link
JP (1) JP6333455B1 (fr)
KR (1) KR20200043993A (fr)
CN (1) CN111051571A (fr)
TW (1) TW201912839A (fr)
WO (1) WO2019039023A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102404620B1 (ko) * 2020-06-02 2022-06-15 멕크 가부시키가이샤 마이크로 에칭제 및 배선 기판의 제조 방법
JP6799347B1 (ja) * 2020-06-02 2020-12-16 メック株式会社 マイクロエッチング剤および配線基板の製造方法
WO2022044893A1 (fr) * 2020-08-24 2022-03-03 富士フイルム株式会社 Liquide de traitement et procédé de traitement de substrat
CN112725799A (zh) * 2020-12-10 2021-04-30 昆山市板明电子科技有限公司 环保型铜表面粗化液及其制备方法
CN112708423B (zh) * 2020-12-15 2022-08-05 河北中瓷电子科技股份有限公司 酸性微蚀试剂及金属引线的处理方法
KR20220126436A (ko) * 2021-03-09 2022-09-16 주식회사 이엔에프테크놀로지 디스플레이 기판용 식각액

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3432629B2 (ja) * 1995-02-23 2003-08-04 日立化成工業株式会社 銅箔の表面処理液並びにその処理液を用いた多層プリント配線板の製造方法
JP3458023B2 (ja) * 1995-08-01 2003-10-20 メック株式会社 銅および銅合金のマイクロエッチング剤
CN1195895C (zh) * 1997-01-29 2005-04-06 美克株式会社 铜和铜合金的微浸蚀剂
US7393461B2 (en) * 2005-08-23 2008-07-01 Kesheng Feng Microetching solution
DE602005023739D1 (de) * 2005-10-25 2010-11-04 Atotech Deutschland Gmbh Zusammensetzung und Verfahren zur Haftfähigkeitsverbesserung der polymerischen Materialien auf Kupfer- oder Kupferlegierungsoberflächen
US7456114B2 (en) * 2005-12-21 2008-11-25 Kesheng Feng Microetching composition and method of using the same
US7875558B2 (en) * 2005-12-21 2011-01-25 Kesheng Feng Microetching composition and method of using the same
JP4917872B2 (ja) * 2006-12-08 2012-04-18 三新化学工業株式会社 銅および／または銅合金用化学溶解処理液
US7645393B2 (en) * 2007-04-27 2010-01-12 Kesheng Feng Metal surface treatment composition
JP4967800B2 (ja) * 2007-05-17 2012-07-04 凸版印刷株式会社 銅溶解液およびそれを用いた銅または銅合金のエッチング方法
JP5443863B2 (ja) * 2009-07-09 2014-03-19 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP2011233769A (ja) * 2010-04-28 2011-11-17 Mec Co Ltd 銅配線パターンの形成方法
JP6135999B2 (ja) * 2012-04-10 2017-05-31 三菱瓦斯化学株式会社 銅およびモリブデンを含む多層膜のエッチングに使用される液体組成物、およびそれを用いたエッチング方法
JP5219008B1 (ja) 2012-07-24 2013-06-26 メック株式会社 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法
JP5404978B1 (ja) * 2012-09-28 2014-02-05 メック株式会社 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法
JP5559288B2 (ja) * 2012-11-13 2014-07-23 メック株式会社 プリント配線板の製造方法及び表面処理装置
CN104955985B (zh) * 2013-04-15 2018-07-20 Mec股份有限公司 蚀刻液、补给液及铜配线的形成方法
JP6218000B2 (ja) * 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法

Also Published As

Publication number Publication date
CN111051571A (zh) 2020-04-21
KR20200043993A (ko) 2020-04-28
JP6333455B1 (ja) 2018-05-30
JP2019039027A (ja) 2019-03-14
WO2019039023A1 (fr) 2019-02-28

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