TW201863B - - Google Patents

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Publication number
TW201863B
TW201863B TW081100804A TW81100804A TW201863B TW 201863 B TW201863 B TW 201863B TW 081100804 A TW081100804 A TW 081100804A TW 81100804 A TW81100804 A TW 81100804A TW 201863 B TW201863 B TW 201863B
Authority
TW
Taiwan
Prior art keywords
plane
patent application
item
mating
substrate
Prior art date
Application number
TW081100804A
Other languages
English (en)
Chinese (zh)
Original Assignee
Carborundum Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carborundum Co filed Critical Carborundum Co
Application granted granted Critical
Publication of TW201863B publication Critical patent/TW201863B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Preparation Of Compounds By Using Micro-Organisms (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)
  • Peptides Or Proteins (AREA)
  • Structure Of Printed Boards (AREA)
  • Die Bonding (AREA)
TW081100804A 1990-11-19 1992-02-01 TW201863B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61520690A 1990-11-19 1990-11-19

Publications (1)

Publication Number Publication Date
TW201863B true TW201863B (OSRAM) 1993-03-11

Family

ID=24464440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081100804A TW201863B (OSRAM) 1990-11-19 1992-02-01

Country Status (9)

Country Link
US (1) US5324570A (OSRAM)
EP (1) EP0561914A1 (OSRAM)
JP (1) JP2509428B2 (OSRAM)
KR (1) KR100191485B1 (OSRAM)
AU (1) AU9068491A (OSRAM)
CA (1) CA2096008A1 (OSRAM)
MX (1) MX9102106A (OSRAM)
TW (1) TW201863B (OSRAM)
WO (1) WO1992008606A1 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132743B2 (en) * 2003-12-23 2006-11-07 Intel Corporation Integrated circuit package substrate having a thin film capacitor structure

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
US3852877A (en) * 1969-08-06 1974-12-10 Ibm Multilayer circuits
US4131516A (en) * 1977-07-21 1978-12-26 International Business Machines Corporation Method of making metal filled via holes in ceramic circuit boards
US4376287A (en) * 1980-10-29 1983-03-08 Rca Corporation Microwave power circuit with an active device mounted on a heat dissipating substrate
JPS5756953A (en) * 1981-08-10 1982-04-05 Nec Corp Transistor
US4446477A (en) * 1981-08-21 1984-05-01 Sperry Corporation Multichip thin film module
JPS61158839A (ja) * 1984-12-28 1986-07-18 Okuno Seiyaku Kogyo Kk ガラス組成物
JP2686928B2 (ja) * 1985-08-26 1997-12-08 アンリツ株式会社 シリコン・ゲルマニウム混晶薄膜導電体
US4732780A (en) * 1985-09-26 1988-03-22 General Electric Company Method of making hermetic feedthrough in ceramic substrate
US4684446A (en) * 1985-09-26 1987-08-04 General Electric Company Secondary metallization by glass displacement in ceramic substrate
US4714905A (en) * 1986-10-08 1987-12-22 K & L Microwave SMC filter and method of manufacture thereof
JPS63274196A (ja) * 1987-05-06 1988-11-11 Mitsubishi Electric Corp 金属芯印刷配線板
US4861641A (en) * 1987-05-22 1989-08-29 Ceramics Process Systems Corporation Substrates with dense metal vias
US4925723A (en) * 1988-09-29 1990-05-15 Microwave Power, Inc. Microwave integrated circuit substrate including metal filled via holes and method of manufacture
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits

Also Published As

Publication number Publication date
JPH06504650A (ja) 1994-05-26
WO1992008606A1 (en) 1992-05-29
KR100191485B1 (ko) 1999-06-15
EP0561914A4 (OSRAM) 1994-02-09
EP0561914A1 (en) 1993-09-29
KR930703148A (ko) 1993-11-29
JP2509428B2 (ja) 1996-06-19
US5324570A (en) 1994-06-28
CA2096008A1 (en) 1992-05-20
AU9068491A (en) 1992-06-11
MX9102106A (es) 1992-07-08

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