TW201831437A - 製備改進之量子點樹脂配製物的方法 - Google Patents
製備改進之量子點樹脂配製物的方法 Download PDFInfo
- Publication number
- TW201831437A TW201831437A TW107103588A TW107103588A TW201831437A TW 201831437 A TW201831437 A TW 201831437A TW 107103588 A TW107103588 A TW 107103588A TW 107103588 A TW107103588 A TW 107103588A TW 201831437 A TW201831437 A TW 201831437A
- Authority
- TW
- Taiwan
- Prior art keywords
- monomer mixture
- monomer
- composition
- quantum dot
- group
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 134
- 239000002096 quantum dot Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000009472 formulation Methods 0.000 title description 25
- 239000011347 resin Substances 0.000 title description 4
- 229920005989 resin Polymers 0.000 title description 4
- 239000000178 monomer Substances 0.000 claims abstract description 134
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002808 molecular sieve Substances 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000012298 atmosphere Substances 0.000 claims abstract description 8
- 238000007872 degassing Methods 0.000 claims abstract description 8
- 239000011148 porous material Substances 0.000 claims abstract description 5
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 5
- 238000010257 thawing Methods 0.000 claims abstract description 4
- 238000007710 freezing Methods 0.000 claims abstract description 3
- 230000008014 freezing Effects 0.000 claims abstract description 3
- 239000011261 inert gas Substances 0.000 claims abstract description 3
- 229920000642 polymer Polymers 0.000 claims description 45
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 28
- 125000002723 alicyclic group Chemical group 0.000 claims description 22
- 238000000746 purification Methods 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 239000011258 core-shell material Substances 0.000 claims description 14
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 13
- 239000011162 core material Substances 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 11
- -1 polypropylene Polymers 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011257 shell material Substances 0.000 claims description 8
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 238000003109 Karl Fischer titration Methods 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 32
- 238000006862 quantum yield reaction Methods 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 239000000243 solution Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- 239000002105 nanoparticle Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 5
- 229910005540 GaP Inorganic materials 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 229910004262 HgTe Inorganic materials 0.000 description 5
- 229910007709 ZnTe Inorganic materials 0.000 description 5
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 238000005424 photoluminescence Methods 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910000673 Indium arsenide Inorganic materials 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003446 ligand Substances 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- DABQKEQFLJIRHU-UHFFFAOYSA-N 2-Propenoic acid, 2-methyl-, 3,3,5-trimethylcyclohexyl ester Chemical compound CC1CC(OC(=O)C(C)=C)CC(C)(C)C1 DABQKEQFLJIRHU-UHFFFAOYSA-N 0.000 description 2
- UZFMOKQJFYMBGY-UHFFFAOYSA-N 4-hydroxy-TEMPO Chemical group CC1(C)CC(O)CC(C)(C)N1[O] UZFMOKQJFYMBGY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229920003086 cellulose ether Polymers 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000004770 highest occupied molecular orbital Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004768 lowest unoccupied molecular orbital Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000013110 organic ligand Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004402 ultra-violet photoelectron spectroscopy Methods 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- REPVLJRCJUVQFA-UHFFFAOYSA-N (-)-isopinocampheol Natural products C1C(O)C(C)C2C(C)(C)C1C2 REPVLJRCJUVQFA-UHFFFAOYSA-N 0.000 description 1
- RKHXKNKPYLRWER-UHFFFAOYSA-N 1,10-bis(prop-1-enoxy)decane Chemical compound CC=COCCCCCCCCCCOC=CC RKHXKNKPYLRWER-UHFFFAOYSA-N 0.000 description 1
- FIXKCCRANLATRP-UHFFFAOYSA-N 3,5,5-trimethylhexyl prop-2-enoate Chemical compound CC(C)(C)CC(C)CCOC(=O)C=C FIXKCCRANLATRP-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017107 AlOx Inorganic materials 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- XJBRSZAYOKVFRH-GRYCIOLGSA-N [(1r,2s,5r)-5-methyl-2-propan-2-ylcyclohexyl] prop-2-enoate Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@H]1OC(=O)C=C XJBRSZAYOKVFRH-GRYCIOLGSA-N 0.000 description 1
- NEJNOEFCQDFDQM-UHFFFAOYSA-N [2-ethyl-2-(2-methylprop-2-enoyloxymethyl)hexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CC)(CCCC)COC(=O)C(C)=C NEJNOEFCQDFDQM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 210000000476 body water Anatomy 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229940116229 borneol Drugs 0.000 description 1
- CKDOCTFBFTVPSN-UHFFFAOYSA-N borneol Natural products C1CC2(C)C(C)CC1C2(C)C CKDOCTFBFTVPSN-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- ZOJPTQRKWVDKTP-UHFFFAOYSA-N decane methanol prop-2-enoic acid Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.CO.CO.CCCCCCCCCC ZOJPTQRKWVDKTP-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- DTGKSKDOIYIVQL-UHFFFAOYSA-N dl-isoborneol Natural products C1CC2(C)C(O)CC1C2(C)C DTGKSKDOIYIVQL-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- BDOFFEYJSIJAFH-UHFFFAOYSA-K dodecanoate;indium(3+) Chemical compound [In+3].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O BDOFFEYJSIJAFH-UHFFFAOYSA-K 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- LWDCPOMFNRJKLX-UHFFFAOYSA-N formic acid;prop-2-enoic acid Chemical compound OC=O.OC(=O)C=C LWDCPOMFNRJKLX-UHFFFAOYSA-N 0.000 description 1
- 238000007755 gap coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002707 nanocrystalline material Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-M oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC([O-])=O ZQPPMHVWECSIRJ-KTKRTIGZSA-M 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920006260 polyaryletherketone Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D15/00—Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor
- B01D15/08—Selective adsorption, e.g. chromatography
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/22—Luminous paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/62—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing gallium, indium or thallium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/70—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus
- C09K11/701—Chalcogenides
- C09K11/703—Chalcogenides with zinc or cadmium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/74—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing arsenic, antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/883—Chalcogenides with zinc or cadmium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C27/00—Processes involving the simultaneous production of more than one class of oxygen-containing compounds
- C07C27/26—Purification; Separation; Stabilisation
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C67/00—Preparation of carboxylic acid esters
- C07C67/48—Separation; Purification; Stabilisation; Use of additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
- C08F2800/20—Copolymer characterised by the proportions of the comonomers expressed as weight or mass percentages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3009—Sulfides
- C08K2003/3036—Sulfides of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/54—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing zinc or cadmium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/70—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing phosphorus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/962—Quantum dots and lines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
- Y10S977/774—Exhibiting three-dimensional carrier confinement, e.g. quantum dots
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/813—Of specified inorganic semiconductor composition, e.g. periodic table group IV-VI compositions
- Y10S977/815—Group III-V based compounds, e.g. AlaGabIncNxPyAsz
- Y10S977/818—III-P based compounds, e.g. AlxGayIn2P
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/813—Of specified inorganic semiconductor composition, e.g. periodic table group IV-VI compositions
- Y10S977/824—Group II-VI nonoxide compounds, e.g. CdxMnyTe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald
- Y10S977/892—Liquid phase deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/949—Radiation emitter using nanostructure
- Y10S977/95—Electromagnetic energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Analytical Chemistry (AREA)
- Polymerisation Methods In General (AREA)
- Luminescent Compositions (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
本發明提供用於製備可聚合單體組合物之方法,所述方法包括藉由以下任一種或多種方法純化(b)(i)一種或多種具有至少兩個可聚合乙烯基之單體與(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分之單體的單體混合物:在活性多孔氧化鋁或二氧化矽管柱中處理單體混合物;在真空下篩乾燥單體混合物,接著在平均孔徑為2至20埃之乾燥分子篩上乾燥;藉由在器皿或容器中將單體混合物冷凍至低於-75℃之溫度,施加在102
至10-2
Pa範圍內之真空使單體混合物脫氣,在真空下密封器皿或容器,並將組合物解凍至室溫來進行冷凍-抽真空-解凍(FPT)處理;以及在惰性氣體氣氛下將所得到的單體混合物(b)與呈乾燥形式或有機溶劑溶液形式之量子點之組合物(a)組合。
Description
本發明係關於製備提供改善之初始量子產率性能的含量子點、較佳無鎘量子點之可聚合單體組合物的方法,以及所述組合物及用所述組合物製備之聚合物複合材料。
半導體量子點(QD)提供光學吸收及發射(光致發光PL或電致發光EL)行為,使其能夠用於許多顯示器及照明應用中。許多QD具有由較大帶隙之材料製成的無機殼,用以將電子及空穴對限制在核心區域內,並防止任何表面電荷狀態。外殼或QD自身則經有機配體封端以減少可能導致量子產率(QY)降低的殼之陷阱態。包圍QD的典型有機配體幫助QD分散在有機/含水溶劑中,並具有相對較長之烷基鏈,用以在非極性溶劑或單體中提供高溶解度。不幸的是,QD在光吸收及/或光轉換過程中對光氧化非常敏感。另外,濕度亦會有類似的影響。QD通常係封裝在聚合物基質中以保護其免受水及氧氣之不利影響。然而,當QD自溶劑溶液轉移至單體配製物中且隨後聚合形成QD聚合物複合材料,諸如膜時,QY仍然有明顯的損失。
Leong之美國專利申請號US 2009/0146202 A1揭示包括控制層、活性層以及在該兩者之間的由有機介電共聚物材料之上或之內之奈米顆粒構成之電荷存儲層的有機存儲裝置,其中聚合物已藉由溶劑萃取處理,移除離子雜質並形成聚合物溶液。奈米顆粒可以塗覆在介電共聚物上或者可以為共聚物層之一部分。在聚合物溶液與奈米顆粒一起使用之情況下,奈米顆粒或QD在溶液中原位形成。即使打算自含有奈米顆粒之聚合物溶液中萃取離子雜質,Leong亦只揭示移除鹽或水溶液中之離子,從而得到聚合物之有機溶劑溶液。此方法不會改進含有QD及可聚合單體之配製物的性能。
本發明者致力於提供製備具有改善之初始量子產率性能的含QD之可聚合單體組合物及其膜的方法。
本發明提供一種可聚合單體組合物,其包含:(a)量子點;及(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團上的單體與(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分之單體的單體混合物,其中所述酯含有脂環族基團或C6
至C24
烷基,諸如脂肪烷基,其中所述組合物包含如由卡爾費休滴定法(Karl Fisher Titration)所測定的150 ppm或更少,或較佳60 ppm或更少,例如5至60 ppm的H2
O,包含如由參考文獻(《聚合物科學A輯:聚合物化學(J. Polym. Sci. A:Polym. Chem.)》2004, 第(42)卷, 第285-1292頁)中所描述之光化學方法測定的75 ppm或更少,或較佳60 ppm或更少的總溶解氧,包含50 ppm或更少,或較佳25 ppm或更少,例如1至25 ppm的總阻聚劑化合物,諸如氫醌,以及150 ppm或更少,或較佳100 ppm或更少,例如10至100 ppm的有機自由基活性分子,諸如自由基引發劑及光引發劑。
根據本發明之可聚合單體組合物,(a)量子點較佳係無鎘量子點,諸如ZnS、ZnSe、ZnTe、HgS、HgSe、HgTe、GaN、GaP、GaAs、InP、InAs或其混合物,或者更佳地,(a)量子點係具有核殼結構之核殼型無鎘量子點,其中相較於核材料,殼材料具有較寬之帶隙及較小之晶格失配,例如具有III-V奈米顆粒核及II-VI奈米顆粒殼的材料,或甚至更佳地,(a)量子點係具有含銦核、InP、GaP、GaN、GaAs或InAs核及含Zn殼、ZnS、ZnSe、ZnTe、HgS、HgSe或HgTe殼的無鎘量子點。
根據本發明之可聚合單體組合物,單體混合物(b)包含(i)二乙烯基苯、三環癸烷二甲醇二丙烯酸酯、二甲基丙烯酸異冰片酯或其混合物,以及(b)(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體,其中酯含有脂環族基團或C6
至C24
烷基。
根據本發明之可聚合單體組合物,單體混合物(b)包含(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體以及(b)(ii)丙烯酸異冰片酯(IBOA)。
根據本發明之可聚合單體組合物,所述組合物包含(a)0.001至5重量%,或較佳0.01至5重量%,或更佳0.1至5重量%的量子點;(b)0.5至40重量%,或較佳0.5至10重量%的(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體,以及55至95重量%,或55至94.999重量%,或55至94.99重量%,或55至94.9重量%,或較佳65至92重量%的(b)(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體,其中酯含有脂環族基團或C6
至C24
烷基,所有重量%皆以所述組合物之總固體含量計。
在第二態樣中,本發明提供製備可聚合單體組合物之方法,其包括: 藉由以下任一種或多種方法純化(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體與(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分之單體的單體混合物,其中所述酯含有脂環族基團或C6
至C24
烷基,諸如脂肪烷基:在例如具有100至300 m2
/g,諸如130至180 m2
/g,例如155 m2
/g表面積之活性多孔氧化鋁或二氧化矽管柱中處理單體混合物;將單體混合物在真空中過篩乾燥,接著在重均孔徑為2至20埃,或較佳為2.5至10埃之乾燥分子篩,諸如沸石上乾燥;藉由在器皿或容器中將單體混合物冷凍至-75℃或更低溫度,接著施加真空,例如102
至1×10−2
Pa,使單體混合物脫氣,並在真空下密封器皿或容器且將組合物解凍至室溫來進行冷凍-抽真空-解凍(FPT)處理,較佳重複FPT直至解凍時見不到氣泡; 將純化之單體混合物(b)儲存於乾燥之惰性氣體,諸如氮氣中;以及 在惰性氣氛中,諸如在氮氣下,將得到的單體混合物(b)與呈乾燥形式或呈有機溶劑溶液形式,較佳呈乾燥形式之量子點之組合物(a)組合或隨後乾燥,以製備可聚合單體組合物,所述組合物包含150 ppm或更少,或較佳60 ppm或更少,例如5至60 ppm的H2
O,包含如由參考文獻(《聚合物科學A輯:聚合物化學》2004,第42卷,第1285-1292頁)中所描述之光化學方法測定的75 ppm或更少,或較佳60 ppm或更少的總溶解氧,包含50 ppm或更少,或較佳25 ppm或更少,例如1至25 ppm的總阻聚劑化合物,例如醌類,諸如單甲基醚氫醌(MEHQ)、氫醌,及N-氧基化合物類,諸如4-羥基-2,2,6,6-四甲基哌啶氧基(4-HT),以及150 ppm或更少,或較佳100 ppm或更少,例如10至100 ppm的有機自由基活性分子,諸如自由基引發劑及光引發劑。
根據本發明之方法,其中單體混合物(b)之純化較佳包括冷凍-抽真空-解凍(FPT)處理,接著在乾燥之分子篩上乾燥所得到的經處理之單體混合物。
根據本發明之方法,其中單體混合物(b)之純化包括在102
至10-2
Pa之真空下,使單體混合物脫氣1小時,接著在活性多孔氧化鋁或二氧化矽管柱中對其進行處理,其中活性氧化鋁或二氧化矽已藉由在102
至1×10−2
Pa之真空下,在60至120℃熱處理2至16小時進行乾燥,接著裝入管柱,諸如拋棄式聚丙烯管柱中。
根據本發明之方法,其中單體混合物(b)之純化包括在102
至10−2
Pa之真空下使單體混合物脫氣,接著藉由使其暴露於分子篩或較佳藉由將其與分子篩混合來進行乾燥,所述分子篩已在75至200℃,例如120至200℃之溫度下脫水4至24小時的時間,且保持在惰性氣氛,諸如氮氣中。
根據本發明之方法,其中在單體混合物(b)與量子點之組合物(a)組合時,在組合之前,使(a)量子點在真空下乾燥以移除任何有機溶劑,或將可聚合單體組合物與(a)量子點一起在真空下乾燥以移除任何有機溶劑。
根據本發明之方法,其中在單體混合物(b)與量子點之組合物(a)組合時,量子點較佳包含無鎘量子點,例如ZnS、ZnSe、ZnTe、HgS、HgSe、HgTe、GaN、GaP、GaAs、InP、InAs或其混合物,或更佳地,量子點之組合物(a)包含核殼型無鎘量子點,所述核殼型無鎘量子點具有核殼結構,其中相較於核材料,殼材料具有較寬之帶隙及較小之晶格失配,例如具有III-V奈米顆粒核及II-VI奈米顆粒殼的量子點,或甚至更佳地,量子點包含具有含銦核之無鎘量子點,或者甚至更佳地,(a)量子點係具有InP、GaP、GaN、GaAs或InAs核以及含Zn殼、ZnS、ZnSe、ZnTe、HgS、HgSe或HgTe殼的無鎘量子點。
根據本發明之方法,單體混合物(b)包含(i)二乙烯基苯、三環癸烷二甲醇二丙烯酸酯、二甲基丙烯酸異冰片酯或其混合物,以及(b)(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體,其中酯含有脂環族基團或C6
至C24
烷基。
根據本發明之方法,單體混合物(b)包含(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體,以及(b)(ii)丙烯酸異冰片酯(IBOA)。
根據本發明之方法,單體混合物(b)包含以固體計0.5至40重量份,或較佳0.5至10重量份的(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體,以及55至95重量份,或較佳65至92重量份的(b)(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體,其中酯含有脂環族基團或C6
至C24
烷基。
根據本發明之方法,其中所述方法進一步包括使可聚合單體組合物聚合以形成聚合物複合材料,諸如膜。
在第三態樣中,本發明提供聚合物複合材料,其包含由可聚合單體組合物形成的聚合物,所述可聚合單體組合物包含(a)量子點以及(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體,較佳三環癸烷二甲醇二丙烯酸酯、二甲基丙烯酸異冰片酯、二乙烯基苯或其混合物,及(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體,其中酯含有脂環族基團或C6
至C24
烷基。
根據本發明之聚合物複合材料,其中(a)量子點係無鎘量子點,或較佳為核-殼型量子點。
根據本發明之聚合物複合材料,其中所述複合材料係膜。
根據本發明之聚合物複合材料,其中聚合物複合材料構成多層膜、層壓材料或組件之一部分,所述多層膜、層壓材料或組件亦在聚合物複合膜之每一側上包含外層。較佳地,外層係氧氣阻隔層,例如聚對苯二甲酸乙二酯(PET),其亦抑制濕氣通過。
除非另有說明,否則百分數係重量百分數(重量%)且溫度以℃為單位。
除非另有說明,否則操作及實例均在室溫(20-25℃)下進行。
除非另有說明,否則沸點係在大氣壓力(約101千帕)下量測。
除非另外指明,否則包含括號之任何術語可選地指整個術語,就好像不存在括號一樣,以及沒有括號之術語,及每個備選之組合。因此,術語「(甲基)丙烯酸酯」係指丙烯酸酯、甲基丙烯酸酯或其混合物。
所有範圍均包括端點在內且為可組合的。例如,術語「50至3000 cPs,或者100或更高cPs之範圍」將包括50至100 cPs、50至3000 cPs以及100至3000 cPs中之每一個。
如本文所用,術語「ASTM」係指賓夕法尼亞州西康舍霍肯的ASTM國際標準組織(ASTM International, West Conshohocken, PA)之出版物。
如本文所用,術語「平均孔徑」係指由製造商文件提供的藉由BET表面積法測定之指定材料之孔徑。
如本文所用,術語「帶隙」係指如藉由紫外光電子能譜法(UPS)量測的在給定量子點或其層中之最高佔據分子軌道(HOMO)與最低未佔分子軌道(LUMO)之間的能隙。
如本文所用,術語「固體」係指在本發明之方法中不揮發並由此最終以本發明之聚合物複合材料結束的任何材料。氨、水及揮發性有機溶劑(VOC)不視為固體。根據本發明,當含有量子點(QD)之組合物分散於經純化之丙烯酸或乙烯基單體的單體混合物中時,聚合物複合材料之光致發光量子產率(PLQY)得到改善。在本發明中,自用於製造聚合物複合材料之可聚合單體組合物中移除大部分的雜質,諸如水、氧氣、自由基引發劑、光引發劑及阻聚劑。本發明者已發現,在QD轉移至單體混合物中以及隨後含QD之單體混合物配製物聚合期間,此等雜質之存在會對PLQY產生負面影響。其他雜質,諸如一些溶解的離子物種、酸、醇、酮以及醛類,可以吸收光或還會在QD合成期間以及QD之長期操作中對QD的PLQY不利。藉由在配製期間移除雜質,在含有QD之聚合物複合材料或膜中實現了更高的初始或時間零點性能。
量子點係此項技術中熟知的,參見例如Dubrow等人之美國專利公開案第US2012/0113672A號。較佳地,本發明之聚合物複合材料中的量子點係無鎘量子點,或者更佳地為核-殼型無鎘量子點。
合適的量子點及核-殼型量子點可以包括以下任一種中揭示之量子點中的任何一種:Mushtaq等人之美國專利第7,588,828 B2號,例如含有富集銦之InP核的量子點,諸如藉由使InP與銦羧酸鹽(亦即,羧酸銦(III))接觸而形成的量子點,諸如月桂酸銦;Guo等人之美國專利公開案第2015/0236195 A1號中揭示之量子點;Mingjun等人之美國專利公開案第US2015/0166342 A1號中揭示之量子點;第III-IV族半導體奈米結構,諸如在Scher等人之美國專利第7557028 B1號、Scher等人之美國專利第8062967 B1號、Scher等人之美國專利第US8884273 B1號或Scher等人之美國專利第US9469538 B1號中;具有第IIIA族及第VA族元素之核的奈米晶體,諸如在Clough等人之美國專利第9136428 B2中號;Breen等人之美國專利第US9212056 B2號中揭示的奈米顆粒;或Bawendi等人之US6322901 B1中揭示的奈米結晶材料。
無鎘量子點材料的可接受效率(PLQY)在40%以上,或者較佳地在60%以上,或者更佳地為75%或以上,諸如自75至95%。
(b)單體混合物中的可聚合乙烯基較佳為(甲基)丙烯酸酯基團(CH2
=C(R)C(O)O-,其中R係H或CH3
;又稱為(甲基)丙烯醯氧基。
(b)單體混合物中的單體較佳僅具有碳、氫、氧及氮原子;或者更佳僅具有碳、氫及氧原子。
在(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體中,芳族環可以為例如苯、萘或吡啶環,或者較佳芳族環具有三至二十個碳原子,或較佳五至十五個碳原子。較佳地,芳族環不含雜原子且具有六至十五個碳原子,較佳六至十二個碳原子。
(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體較佳具有二至六個可聚合乙烯基,或更佳具有不超過四個可聚合乙烯基。
尤佳的具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體(b)(i)包括三環[5.2.1.02,6
]癸烷二甲醇二丙烯酸酯、雙酚A二甲基丙烯酸酯、2-丁基-2-乙基-1,3-丙二醇二甲基丙烯酸酯、1,10-雙(丙烯醯氧基)癸烷以及。
根據本發明之聚合物複合材料亦包含(b)(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分之單體的聚合單元,其中所述酯含有脂環族基團或C6
至C24
烷基。較佳地,此類單體(b)(ii)係脂族或脂環族單體,諸如丙烯酸異冰片酯(IBOA)。
尤佳的(b)(ii)具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團(其中酯包含脂環族基團或C6
至C24
烷基)之一部分的單體包括丙烯酸異冰片酯、丙烯酸3,5,5-三甲基己酯、丙烯酸十二烷基酯、丙烯酸癸酯、丙烯酸十三烷基酯、丙烯酸異癸酯、丙烯酸L-薄荷酯、丙烯酸三環[5.2.1.02,6
]癸基甲酯,甲基丙烯酸3,3,5-三甲基環己酯及甲基丙烯酸3,3,5-三甲基環己酯。
較佳地,本發明之聚合物複合材料係多層膜、層壓材料或組件之一部分,所述多層膜、層壓材料或組件還在聚合物複合材料之每一側上包括外層。較佳地,外層係氧氣阻隔層,其亦抑制濕氣通過。較佳地,外層包含聚合物複合材料,較佳包含聚對苯二甲酸乙二酯(PET)、聚芳基醚酮、聚醯亞胺、聚烯烴、聚碳酸酯、聚甲基丙烯酸甲酯(PMMA)、聚苯乙烯或其組合的聚合物複合材料。較佳地,外層進一步包含氧化物或氮化物,較佳氧化矽、二氧化鈦、氧化鋁、氮化矽或其組合。較佳地,氧化物或氮化物係塗覆在聚合物複合材料面向QD層之表面上。較佳地,每個外層包含厚度為25至150微米(較佳50至100微米)之聚合物複合材料及厚度係10至100 nm(較佳30至70 nm)之氧化物/氮化物層。
根據本發明之聚合物複合材料,多層膜、層壓材料或組件之外層較佳包含至少兩個聚合物複合材料層及/或至少兩個氧化物/氮化物層。在本發明之任何多層膜中,不同的層可以具有不同的組成。較佳地,外層具有極低的透氧率(OTR,<10-1
cc/m2
/天)及較低的水蒸氣透過率(WVTR,<10-2
g/m2
/天)。
較佳地,外層中的聚合物複合材料之Tg係60至200℃;或者更佳為至少90℃,或者最佳為至少100℃。
較佳地,根據本發明之聚合物複合材料的厚度係20至500微米,較佳為至少50微米,較佳為至少70微米,較佳為至少80微米,較佳為至少90微米;較佳不大於400微米,較佳不大於300微米,較佳不大於250微米,較佳不大於200微米,較佳不大於160微米。較佳地,每個外層之厚度係20至100微米,較佳為25至75微米。
較佳地,本發明之聚合物複合材料係藉由將(b)單體混合物與一種或多種QD之組合物(a)以及任何可選添加劑混合而製備之配製物的自由基聚合來製備。較佳地,藉由典型方法,例如旋塗、槽模塗覆、凹版印刷、噴墨及噴塗,將配製物塗覆於第一外層上,隨後使其固化。較佳地,藉由使配製物暴露於紫外光或熱,較佳紫外光,較佳在UVA範圍內來起始固化。
較佳地,本發明之聚合物複合材料包含以固體計0.01至5重量%,較佳至少0.025重量%,較佳至少0.03重量%,較佳不超過4重量%,較佳不超過3重量%,較佳不超過2重量%的量子點。
較佳地,量子點包含CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、HgS、HgSe、HgTe、GaN、GaP、GaAs、InP、InAs或其組合。更佳地,量子點係無鎘的。最佳地,量子點係核-殼型量子點,諸如核-殼型無鎘量子點。
較佳地,(a)量子點之組合物包含在量子點之無機部分周圍的具有非極性組分之配體。較佳之配體包括,例如包括三辛基氧化膦、十二烷硫醇及脂肪酸鹽(例如硬脂酸鹽、油酸鹽)。
可以摻入本發明之可聚合單體組合物或聚合物複合材料中的其他添加劑包括紫外線(UV)穩定劑、抗氧化劑、改善光提取之散射劑以及增加黏度之增稠劑(例如聚胺基甲酸酯丙烯酸酯低聚物)。較佳地,可聚合單體組合物中之任何UV穩定劑的用量僅為至多100 ppm,或者較佳為至多50 ppm。
較佳的增稠劑包括聚胺基甲酸酯丙烯酸酯、纖維素醚、纖維素丙烯酸酯、聚苯乙烯聚合物、聚苯乙烯嵌段共聚物、丙烯酸樹脂以及聚烯烴彈性體。較佳地,聚苯乙烯、丙烯酸類及聚烯烴增稠劑的Mw在50,000至400,000;較佳100,000至200,000的範圍內。較佳地,纖維素醚之Mw在1,000至100,000範圍內。
胺基甲酸酯丙烯酸酯低聚物可以在其所含丙烯酸酯基團之間具有聚酯、聚醚、聚丁二烯或聚己內酯主鏈。其可以具有雙官能、三官能、六官能反應性。此類低聚物在50℃下之黏度可以為1000至200,000 cPs。對於非極性配體QD,聚丁二烯胺基甲酸酯丙烯酸酯低聚物較佳。
聚合物複合材料之較佳形式包括例如複合材料、珠粒、條形、棒狀、立方體以及板狀。聚合物複合材料可用於許多應用中,包括例如顯示器、照明及醫療應用。較佳之顯示器應用包括公共信息顯示器、標牌、電視機、監控器、行動電話、平板電腦、膝上型電腦、汽車以及其他儀錶板及錶。
實例:以下實例說明本發明。除非另外指明,否則所有溫度單位均為室溫且所有壓力單位均為標準壓力或101 kPa。
使用以下測試方法:
藉由用測微計量測固化膜,接著減去任何阻隔膜厚度之厚度來確定膜厚度。
光致發光量子產率(PLQY) 在處理液體及膜時,使用Quantaurus-QY絕對PL量子產率光譜儀(Absolute PL quantum yield spectrometer)(C11347-01型)(Hamamatsu Photonics KK,日本濱松市(Hamamatsu City,Japan))量測光致發光量子產率(PLQY)。對於每個報告之實例,自每一指定分析物基質中之三(3)個隨機選擇的點獲取總共三(3)個量測值,且指示的PLQY表示所獲取之量測值的平均值。
發射峰之半高全寬(FWHM)係用Quantaurus-QY絕對PL量子產率光譜儀(C11347-01型)積分球(Hamamatsu Photonics KK)量測。
膜厚度係藉由用測微計量測固化膜,接著減去阻隔膜厚度來確定。
峰值發射波長(PWL)係使用Quantaurus-QY絕對PL量子產率光譜儀(C11347-01型,Hamamatsu Photonics KK)測定;對於以下實例中之綠光QD,目標波長係520至540 nm;對於紅光QD,目標波長係620至640 nm。
卡爾-費休滴定:利用如製造商之文獻中所述校準的Metrohm 831型庫侖計式KARL FISCHER滴定儀(Metrohm Ltd,瑞士黑里紹(Herisau,Switzerland))以及703 Ti stand(Metrohm)分析單體之含水量。 單體純化方法:如下所示的實例中使用以下方法:
冷凍-抽真空-解凍(FPT):將所示單體混合物裝入20 mL閃爍小瓶中。若使用篩來乾燥單體,則將篩加入到小瓶中,接著在小瓶中裝上隔膜。將小瓶浸入液氮中,直至單體冷凍(冷凍)。一旦冷凍,立即使用Schlenk真空線上配備之針抽真空(1-0.1Pa)以排空頂部空間(抽真空)。使單體在靜態真空下解凍,直至完全溶化。進行冷凍-抽真空-解凍循環3次或直至解凍循環中不再見到氣泡。用氮氣回填經冷凍-抽真空-解凍(FPT)純化的單體小瓶,接著將其放入充滿N2
之手套箱中以供後續處理。FPT單體在純化之48小時內使用。
柱純化:將活性氧化鋁(pH 4.5-9.5於水中,Aldrich,密蘇里州聖路易斯(St. Louis,MO))在80℃下真空乾燥4小時,接著裝入拋棄式聚丙烯管柱中。使所示單體在真空烘箱(0.1-1Pa)中脫氣1小時,接著緩慢通過管柱。管柱在惰性氣氛下展開且經純化之單體儲存在氮氣吹掃箱中。經純化之單體在純化之48小時內使用。
篩乾燥:在所示實例中,使用沸石分子篩(4 Å平均粒度)來乾燥單體。使篩在110℃之烘箱中脫水隔夜,並趁熱裝入充滿N2
之手套箱中。乾燥單體。在充滿N2
之手套箱中,將篩加入到單體中,輕輕振盪,接著在室溫下靜置數小時待用。篩乾燥過之單體在純化的48小時內使用。 實例中使用的縮寫:
IBOA係丙烯酸異冰片酯;SR833係三環[5.2.1.02,6
]癸烷二甲醇二丙烯酸酯;I-819及I-651係IRGACURE光敏性聚合引發劑(BASF AG,德國勒沃庫森(Leverkusen,DE));Finex™氧化鋅顆粒(日本Sakai Chemical Industry co., LTD.);且CFQD代表無鎘量子點。綠光CFQD包含具有含銦核之核-殼型QD且展現73.9% QY、44.1 nm FWHM及534.4 nm PWL(在吸光度= 0.3時);紅光CFQD包含具有含銦核之核-殼型QD且展現85% QY、52.8 nm FWHM及630 nm PWL(在吸光度= 0.35)。
除非另外指明,否則在以下實施例中,如下製備配製物:
所有QD及單體混合物配製物均在惰性環境中製備。在除量子點或量子點溶液外的所有指定組分皆裝載到鉗口小瓶之後,使小瓶脫氣並使用雙軸行星式混合器(THINKY ARE-310,Thinky CA)混合3至5分鐘。藉由氮氣吹掃10分鐘自量子點移除甲苯,接著將乾燥之QD粉末分散於所示單體混合物中,將量子點自甲苯轉移到單體。將量子點預分散於丙烯酸異冰片酯(IBOA)或所示單體混合物中,接著與其他組分混合,隨後在N2
氣氛下使用雙軸行星式混合器混合1分鐘。將單體混合物組分與乾燥之QD粉末以所示方式處理後組合,所述方式包括短暫脫氣以將其引入惰性氣氛(僅用於比較),或藉由在活性氧化鋁管柱上展開(柱純化),用分子篩乾燥>2小時(篩乾燥),在用或不用篩情況下進行3個循環的冷凍-抽真空-解凍(FPT及篩乾燥或僅FPT),或在室溫下藉由施加真空48至72小時脫氣(RT脫氣)來純化。
膜製備:藉由在兩個i-組分PET阻隔膜之間層壓樹脂配製物來製備所述配製物之膜。在底膜上施配約2 mL樹脂且頂部用間隙塗覆棒施加,所述塗覆棒具有基於所需膜厚度的間隙設置。樣品在Fusion UV F300S或FUSION UV SYSTEMS, INC(DRS-10/12 QNH,Fusion UV Systems,Inc.,馬里蘭州蓋瑟斯堡(Gaithersburg,MD))固化系統中用約400 mJ/cm2
之UVA固化。
單體純化對PLQY的影響:使用溶液PLQY來確定QD與單體之間的相容性,其中使用約1克下表1中各溶液(以組合物之總重量計,0.025重量%的QD固體)放入1 mL小瓶中並在450 nm激發下量測PLQY。 表1.溶液PLQY量測值
*-表示比較實例;1.在真空(0.1-1Pa)下處理60分鐘的脫氣材料。
如上表1中所示,量子點在溶劑中展現出適當的量子產率(QY)(參見比較實例1及10),但在轉移至單體混合物或單體配製物時會損失大部分QY(參見比較實例2及11)。然而,無論使用哪種單體,管柱純化、FPT或FPT與篩乾燥的組合在量子點溶液轉移至單體混合物中後保留了原始QY的大部分QY。參見實例3、6、7及12。僅僅篩乾燥使量子點溶液保留與FPT幾乎一樣多的QY。參見實例8及9。 表2:藉由卡爾費休滴定表徵水含量
*-表示比較實例;1.在真空(0.1-1Pa)下處理60分鐘的脫氣材料。
如上表2中所示,篩乾燥及管柱純化有效地乾燥單體混合物;不過,僅使用FPT而不單獨乾燥無法乾燥單體混合物。
使用棒塗機(Paul N. Gardner Co.,美國佛羅里達州(FL,USA))拉伸下表3中之配製物以製備具有一致厚度之膜並量測每一膜之PLQY。藉由在兩個i-組分PET阻隔膜之間層壓所示配製物來製備每一膜。將約2 mL樹脂施配於底部阻隔膜上,並用具有250至300(10 mil-12 mil)間隙之間隙塗覆棒拉伸,以確保所需膜厚度。使用DRS-10/12 QNH(Fusion UV Systems,Inc.,馬里蘭州蓋瑟斯堡)以500 mJ/cm2
UV固化強度固化所有配製物。結果呈現於下表4中。 表3. QD配方(均為重量份)
*-表示比較實例;1.藉由AlOx管柱純化的單體;2.藉由篩乾燥之純化的單體。 表4:膜PLQY的表徵
*-表示比較實例。
如上表4中所示,本發明之純化組合物顯示在管柱純化後初始量子產率顯著提高。
在以下實例中,如上所述處理如下表5中所示的單體混合物及QD的配製物,其中脫氣之IBOA在氧化鋁管柱上純化。基於下面之配方,在惰性氣氛下將每種QD組合物加入到單體中。將1.0克每種配製物裝載至玻璃小瓶中,並使用Quantaurus量子產率光譜儀量測PLQY。以配製物之總重量計,單體中QD的裝載量係0.0025重量%。測試結果在下表6中示出。 表5:更多的配方
*-表示比較實例。 表6:配製物性能
*-表示比較實例。
如上表6中所示,本發明配製物之初始量子產率性能明顯高於比較配製物,特別是在無鎘InP點(InP/ZnS核-殼型)之情況下。相較於比較實例21,本發明配製物在實例20中亦展現出較少的紅移。
無
Claims (10)
- 一種用於製備可聚合單體組合物之方法,包括: 藉由以下任一種或多種方法純化(b)(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團的單體與(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分之單體的單體混合物,其中所述酯含有脂環族基團或C6 至C24 烷基:在具有例如100至300 m2 /g表面積之活性多孔氧化鋁或二氧化矽管柱中處理所述單體混合物;在真空下篩乾燥所述單體混合物,接著在平均孔徑為2至20埃之乾燥分子篩上乾燥;藉由在器皿或容器中將所述單體混合物冷凍至低於-75℃之溫度,施加在102 至10-2 Pa)範圍內之真空使所述單體混合物脫氣,在真空下密封所述器皿或容器,並將所述組合物解凍至室溫來進行冷凍-抽真空-解凍(FPT)處理; 將所述純化之單體混合物(b)儲存於乾燥之惰性氣體中;以及 在惰性氣氛中,將所得到的單體混合物(b)與呈乾燥形式或呈有機溶劑溶液形式之量子點之組合物(a)組合以製備可聚合單體組合物,其包含150 ppm或更少的H2 O、100 ppm或更少的總阻聚劑化合物以及150 ppm或更少的有機自由基活性分子。
- 如申請專利範圍第1項所述的方法,其中所述單體混合物(b)之純化包括冷凍-抽真空-解凍(FPT)處理,隨後在乾燥之分子篩上乾燥所得到的經處理之單體混合物。
- 如申請專利範圍第1項所述的方法,其中所述單體混合物(b)之純化包括在102 至10-2 Pa之真空下使所述單體混合物脫氣,接著在填入拋棄式聚丙烯管柱中之活性氧化鋁管柱中處理。
- 如申請專利範圍第1項所述的方法,其中所述單體混合物(b)之純化包括在102 至10-2 Pa之真空下使所述單體混合物脫氣,接著藉由使其暴露於分子篩或藉由將其與分子篩混合來進行乾燥,所述分子篩已在75至200℃之溫度下脫水4至24小時的時間,且保持在惰性氣氛中。
- 如申請專利範圍第1項所述的方法,其中在所述單體混合物(b)與所述量子點之組合物(a)組合時,在所述組合之前,使所述(a)量子點在真空下乾燥以移除任何有機溶劑,或將所述可聚合單體組合物與所述(a)量子點一起在真空下乾燥以移除任何有機溶劑。
- 如申請專利範圍第1項所述的方法,其中在所述單體混合物(b)與所述量子點之組合物(a)組合時,所述量子點包含無鎘量子點。
- 如申請專利範圍第6項所述的方法,其中所述量子點之組合物(a)包含具有核殼結構之核殼型無鎘量子點,其中相較於所述核材料,所述殼材料具有較寬之帶隙及較小之晶格失配。
- 如申請專利範圍第1項所述的方法,其中所述單體混合物(b)包含(i)二乙烯基苯、三環癸烷二甲醇二丙烯酸酯、二甲基丙烯酸異冰片酯或其混合物以及(b)(ii)一種或多種具有單一可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分的單體,其中所述酯含有脂環族基團或C6 至C24 烷基。
- 如申請專利範圍第1項所述的方法,其中所述單體混合物(b)包含(i)一種或多種具有至少兩個可聚合乙烯基作為(甲基)丙烯酸酯基團之一部分或直接連接至芳族環或脂環族基團之單體以及(b)(ii)丙烯酸異冰片酯(IBOA)。
- 如申請專利範圍第1項所述的方法,其中所述可聚合單體組合物包含如由卡爾費休滴定法測定的150 ppm或更少之H2 O,且包含如由參考文獻(《聚合物科學A輯:聚合物化學》2004, 第42卷, 第1285-1292頁)中所描述之光化學方法測定的75 ppm或更少之總溶解氧。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762459923P | 2017-02-16 | 2017-02-16 | |
US62/459923 | 2017-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201831437A true TW201831437A (zh) | 2018-09-01 |
TWI753094B TWI753094B (zh) | 2022-01-21 |
Family
ID=61731285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107103588A TWI753094B (zh) | 2017-02-16 | 2018-02-01 | 製備改進之量子點樹脂配製物的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10472563B2 (zh) |
JP (1) | JP7129170B2 (zh) |
KR (1) | KR102564151B1 (zh) |
CN (1) | CN108440707B (zh) |
DE (1) | DE102018102663A1 (zh) |
GB (1) | GB2564505B (zh) |
TW (1) | TWI753094B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10508232B2 (en) * | 2017-02-16 | 2019-12-17 | Dow Global Technologies Llc | Polymer composites and films comprising reactive additives having thiol groups for improved quantum dot dispersion and barrier properties |
US10828716B2 (en) * | 2017-06-19 | 2020-11-10 | Lincoln Global, Inc. | Systems and methods for real time, long distance, remote welding |
US10919770B2 (en) * | 2017-06-23 | 2021-02-16 | Nanosys, Inc. | Homogeneous anaerobically stable quantum dot concentrates |
KR20200135688A (ko) | 2019-05-24 | 2020-12-03 | 삼성디스플레이 주식회사 | 양자점-폴리머 복합체 패턴, 그 제조방법, 및 이를 포함하는 전자 소자 |
CN113122050B (zh) * | 2019-12-30 | 2022-11-04 | Tcl科技集团股份有限公司 | 量子点墨水及量子点薄膜的制备方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6322901B1 (en) | 1997-11-13 | 2001-11-27 | Massachusetts Institute Of Technology | Highly luminescent color-selective nano-crystalline materials |
US7470420B2 (en) | 2000-12-05 | 2008-12-30 | The Regents Of The University Of California | Optical determination of glucose utilizing boronic acid adducts |
EP1410031A2 (en) | 2001-06-28 | 2004-04-21 | ADVANCED RESEARCH AND TECHNOLOGY INSTITUTE, Inc. | Methods of preparing multicolor quantum dot tagged beads and conjugates thereof |
US7588828B2 (en) | 2004-04-30 | 2009-09-15 | Nanoco Technologies Limited | Preparation of nanoparticle materials |
JP4072961B2 (ja) | 2004-05-21 | 2008-04-09 | 北海道電力株式会社 | Sog開閉器の系統連系保護機能を備えた制御装置 |
US7557028B1 (en) | 2004-07-28 | 2009-07-07 | Nanosys, Inc. | Process for group III-V semiconductor nanostructure synthesis and compositions made using same |
JP5333777B2 (ja) | 2006-05-22 | 2013-11-06 | ナンヤン テクノロジカル ユニヴァーシティー | 有機メモリデバイス及びその製造方法 |
US9212056B2 (en) | 2006-06-02 | 2015-12-15 | Qd Vision, Inc. | Nanoparticle including multi-functional ligand and method |
WO2008133660A2 (en) | 2006-11-21 | 2008-11-06 | Qd Vision, Inc. | Nanocrystals including a group iiia element and a group va element, method, composition, device and other prodcucts |
KR101018111B1 (ko) | 2008-10-07 | 2011-02-25 | 삼성엘이디 주식회사 | 양자점-금속산화물 복합체, 양자점-금속산화물 복합체의 제조방법 및 양자점-금속산화물 복합체를 포함하는 발광장치 |
GB0821122D0 (en) | 2008-11-19 | 2008-12-24 | Nanoco Technologies Ltd | Semiconductor nanoparticle - based light emitting devices and associated materials and methods |
US8283412B2 (en) | 2009-05-01 | 2012-10-09 | Nanosys, Inc. | Functionalized matrices for dispersion of nanostructures |
WO2011031876A1 (en) * | 2009-09-09 | 2011-03-17 | Qd Vision, Inc. | Formulations including nanoparticles |
CN102482457B (zh) | 2009-09-09 | 2015-04-15 | Qd视光有限公司 | 包含纳米颗粒的颗粒、其应用和方法 |
GB0916699D0 (en) | 2009-09-23 | 2009-11-04 | Nanoco Technologies Ltd | Semiconductor nanoparticle-based materials |
CN103228983A (zh) | 2010-11-10 | 2013-07-31 | 纳米系统公司 | 量子点薄膜、照明器件及照明方法 |
KR101385214B1 (ko) | 2011-12-01 | 2014-04-21 | 주식회사 엘엠에스 | 양자점을 포함하는 조성물 및 이를 이용한 장치 |
CN102585417B (zh) * | 2012-01-04 | 2013-12-25 | 武汉理工大学 | 量子点/聚合物复合一氧化氮荧光探针及其制备方法 |
WO2013122820A1 (en) * | 2012-02-15 | 2013-08-22 | Qd Vision, Inc. | Method of processing quantum dot inks |
WO2013175317A1 (en) | 2012-05-22 | 2013-11-28 | Nanoco Technologies, Ltd. | Enhancement of quantum yield using highly reflective agents |
TWI596188B (zh) | 2012-07-02 | 2017-08-21 | 奈米系統股份有限公司 | 高度發光奈米結構及其製造方法 |
KR102086712B1 (ko) | 2013-08-14 | 2020-05-15 | 나노코 테크놀로지스 리미티드 | 다상의 수지를 이용한 양자점 막 |
KR101546938B1 (ko) * | 2013-10-08 | 2015-08-24 | 삼성전자주식회사 | 나노 결정 폴리머 복합체 및 그 제조 방법 |
US20170218264A1 (en) | 2014-10-13 | 2017-08-03 | Los Alamos National Security, Llc | Luminescent solar concentrators comprising semiconductor nanocrystals |
KR101686713B1 (ko) * | 2014-12-08 | 2016-12-14 | 엘지전자 주식회사 | 양자점-고분자 복합체의 제조 방법, 양자점-고분자 복합체, 이를 포함하는 광 변환 필름, 백라이트 유닛 및 표시장치 |
JP6277142B2 (ja) | 2015-02-02 | 2018-02-07 | 富士フイルム株式会社 | 機能性複合フィルムおよび量子ドットフィルム |
KR20160097445A (ko) | 2015-02-06 | 2016-08-18 | 삼성디스플레이 주식회사 | 감광성 수지 조성물 및 표시 패널 |
EP3070109B1 (en) * | 2015-03-16 | 2018-12-05 | Rohm and Haas Electronic Materials LLC | Multilayer polymer composite for encapsulating quantum dots |
CN105504120B (zh) * | 2015-11-30 | 2018-09-21 | 东莞职业技术学院 | 一种双酚芴类丙烯酸树脂及其制备方法、量子点-彩色光敏树脂组合物及其制备方法和应用 |
-
2018
- 2018-01-26 US US15/880,879 patent/US10472563B2/en active Active
- 2018-02-01 TW TW107103588A patent/TWI753094B/zh active
- 2018-02-06 CN CN201810118091.7A patent/CN108440707B/zh active Active
- 2018-02-06 JP JP2018019158A patent/JP7129170B2/ja active Active
- 2018-02-06 DE DE102018102663.3A patent/DE102018102663A1/de active Pending
- 2018-02-07 KR KR1020180014957A patent/KR102564151B1/ko active IP Right Grant
- 2018-02-14 GB GB1802439.8A patent/GB2564505B/en active Active
Also Published As
Publication number | Publication date |
---|---|
GB201802439D0 (en) | 2018-03-28 |
TWI753094B (zh) | 2022-01-21 |
CN108440707B (zh) | 2021-12-28 |
JP2018131607A (ja) | 2018-08-23 |
KR102564151B1 (ko) | 2023-08-04 |
US10472563B2 (en) | 2019-11-12 |
GB2564505A (en) | 2019-01-16 |
CN108440707A (zh) | 2018-08-24 |
US20180230377A1 (en) | 2018-08-16 |
KR20180094788A (ko) | 2018-08-24 |
DE102018102663A1 (de) | 2018-08-16 |
JP7129170B2 (ja) | 2022-09-01 |
GB2564505B (en) | 2022-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI753094B (zh) | 製備改進之量子點樹脂配製物的方法 | |
TWI782946B (zh) | 包括具有硫醇基之反應性添加劑之聚合物複合材料及膜以用於提高量子點分散及阻隔性質 | |
JP6741445B2 (ja) | 量子ドットを封入するための多層ポリマー複合材料 | |
KR101415994B1 (ko) | 카로티노이드를 안정화한 이중층 구조의 고분자 캡슐, 그 제조 방법 및 이를 함유하는 화장료 조성물 | |
Yu et al. | Open-air preparation of cross-linked CO 2-responsive polymer vesicles by enzyme-assisted photoinitiated polymerization-induced self-assembly | |
JP6766173B2 (ja) | 封入された量子ドットを製造する方法 | |
JP5386495B2 (ja) | ポリマーマトリックス中に吸湿性無機塩を溶解させて成るh2o除去用複合収着剤の製造方法 | |
EP3443047B1 (en) | Curable resin system containing quantum dots | |
KR20130045197A (ko) | 열경화형 수분 포획체 형성용 조성물, 수분 포획체 및 전자 디바이스 | |
KR20190007023A (ko) | 양자점을 캡슐화하기 위한 레올로지 개질제 | |
TWI736583B (zh) | 含有量子點之聚合物複合物 | |
TW201323079A (zh) | 熱硬化型水分捕獲體形成用組成物、水分捕獲體及電子裝置 | |
JP2007509191A (ja) | 無機フレーク材料を含むバリアコーティング組成物およびこのバリアコーティング組成物を含むデバイス | |
Xiong et al. | Continuous spin fractionation and characterization by size-exclusion chromatography for styrene–butadiene block copolymers | |
US20240110058A1 (en) | Polymeric hybrid material with photothermal properties and production method thereof |