TW201823171A - Cutter wheel capable of forming a complete high-penetration scribe line even with a smaller scribing load divided into unit products with excellent end face strength - Google Patents

Cutter wheel capable of forming a complete high-penetration scribe line even with a smaller scribing load divided into unit products with excellent end face strength Download PDF

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Publication number
TW201823171A
TW201823171A TW106142883A TW106142883A TW201823171A TW 201823171 A TW201823171 A TW 201823171A TW 106142883 A TW106142883 A TW 106142883A TW 106142883 A TW106142883 A TW 106142883A TW 201823171 A TW201823171 A TW 201823171A
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Taiwan
Prior art keywords
cutter wheel
substrate
groove portion
ridge line
penetration
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TW106142883A
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Chinese (zh)
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TWI752132B (en
Inventor
地主貴裕
中垣智貴
阿部浩
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日商三星鑽石工業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Abstract

The invention provides a cutter wheel which is capable of forming a complete high-penetration scribe line even with a smaller scribing load divided into unit products with excellent end face strength. The cutter wheel of the invention has a V-shaped knife point ridge line 4 formed by two inclined faces 3a, 3a intersecting with each other on a circumferential surface, and a groove portion 5 globally machined on the knife point ridge line 4 at a specific pitch P, so as to alternately form the groove portion 5 and the remaining knife point ridge line portion 6. By setting the pitch P to be 100 [mu]m to 200 [mu]m, the length 5a of the groove portion 5 to be 3 [mu]m to 10 [mu]m, and the depth 5b of the groove portion 5 to be 1 [mu]m to 3 [mu]m, the high-penetration scribe line S can be formed with a smaller load.

Description

切刀輪Cutter wheel

本發明係關於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線(切槽)時所使用之切刀輪(亦稱為劃線輪)。The present invention relates to a cutter wheel (also referred to as a scribing wheel) used for processing a scribe line (groove) for breaking on the surface of a brittle material substrate such as glass or a bonded substrate on which two brittle material substrates are bonded ).

先前,一般已知有一種方法,其係於分斷玻璃基板等脆性材料基板(以下亦稱為「基板」)之加工中,將切刀輪按壓於基板表面而形成劃線,其後,沿劃線自背面側施加外力使基板撓曲,藉此分斷為各單位基板者,例如揭示於專利文獻1中。 對脆性材料基板加工出劃線之切刀輪係使用切刀輪,其於圓周面具有由彼此相交之2個斜面構成之V字形刀尖,於中心具備安裝用軸承孔。 作為上述切刀輪,有平順地精加工出刀尖脊線之切刀輪(以下亦將其稱為「普通切刀輪」),及於刀尖脊線以特定之節距設有槽部(缺口)之切刀輪(以下亦將其稱為「附槽之切刀輪」)。 一面參照圖3一面針對由該等切刀輪形成之劃線進行說明。圖3係顯示形成於基板之劃線之肋紋及垂直裂紋裂紋者,圖3(a)係沿劃線方向之剖視圖,圖3(b)係沿與劃線正交方向之剖視圖。 劃線S係由基板表面之切刀輪之咬入痕跡即塑性變形區域,及產生於塑性變形區域正下方且於基板W之厚度方向滲透之垂直裂紋8而形成。於垂直裂紋8之上部遍及特定之深度產生稱為肋紋7之特徵性痕跡。圖3之L1表示自基板W表面之肋紋量(深度),L2係表示自基板W表面之垂直裂紋量(滲透深度)者。 利用普通切刀輪,雖可於劃線時形成完好之槽面,但另一方面,有對基板表面之咬入力較小而刀尖易滑動之缺點。因此,由基板之端面自內側開始劃線之情形時,不易於劃線開始後立即產生垂直裂紋,又,若為形成較深之垂直裂紋而增大劃線荷重,則於基板表面產生在水平方向延伸之不規則龜裂,或於槽部產生傷痕,使得不良品之產生頻率變高。 相對於此,於刀尖脊線設有槽部(切口)之切刀輪中,槽部與刀尖脊線部(凸部)係交替形成。藉此,與普通切刀輪相比可對基板施加較高之劃線荷重,可由充分深之垂直裂紋形成劃線,且可抑制向不規則方向裂開或水平裂紋之產生。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第3787489號公報Previously, a method is generally known, which involves cutting a brittle material substrate such as a glass substrate (hereinafter also referred to as a "substrate") by pressing a cutter wheel against the surface of the substrate to form a scribing line. The scribing is performed by applying an external force from the back surface side to deflect the substrate, thereby dividing it into individual unit substrates, as disclosed in Patent Document 1, for example. A cutting wheel used for processing a frangible material substrate is a cutting wheel. It has a V-shaped cutting edge composed of two inclined surfaces that intersect each other on the circumferential surface, and a bearing hole for mounting is provided in the center. As the above-mentioned cutter wheel, there are a cutter wheel (hereinafter also referred to as a "common cutter wheel") which smoothly finishes the blade ridge line, and a groove portion is provided at a specific pitch at the blade ridge line ( Notch) cutter wheel (hereinafter also referred to as "slotted cutter wheel"). The scribe lines formed by the cutter wheels will be described with reference to FIG. 3. FIG. 3 is a diagram showing ribs and vertical cracks formed on the substrate, FIG. 3 (a) is a cross-sectional view along the scribe direction, and FIG. 3 (b) is a cross-sectional view along the direction orthogonal to the scribe line. The scribe line S is formed by the bite mark of the cutter wheel on the surface of the substrate, that is, the plastic deformation region, and the vertical crack 8 generated directly below the plastic deformation region and penetrating in the thickness direction of the substrate W. A characteristic mark called a rib 7 is generated over a specific depth above the vertical crack 8. L1 in FIG. 3 represents the amount of ribs (depth) from the surface of the substrate W, and L2 represents the amount of vertical cracks (depth of penetration) from the surface of the substrate W. Although a normal cutter wheel can be used to form a perfect groove surface when scribing, on the other hand, it has the disadvantages that the bite force on the substrate surface is small and the blade tip is easy to slide. Therefore, when a scribing is started from the inner side of the substrate from the inside, it is not easy to produce vertical cracks immediately after the scribing is started, and if the scribing load is increased to form a deeper vertical crack, the substrate surface is horizontally generated. Irregular cracks extending in the direction, or scars in the grooves, make the frequency of defective products higher. On the other hand, in a cutter wheel in which a groove portion (notch) is provided on the blade ridge line, the groove portion and the blade ridge line (convex portion) are alternately formed. As a result, compared with ordinary cutter wheels, a higher scribe load can be applied to the substrate, a scribe can be formed by a sufficiently deep vertical crack, and the occurrence of cracks in irregular directions or horizontal cracks can be suppressed. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent No. 3787489

[發明所欲解決之問題] 近年來,由於將玻璃基板分斷加工而得之液晶面板等單位製品之小型化及精密化,而要求切斷面之端面強度優良之高精度之分斷。因此,需要能以更小之劃線荷重加工出高滲透之完好的劃線之附槽之切刀輪。 尤其如圖6、7所示,在將2片玻璃基板W、W經由密封部10貼合、且具有由該密封部10區分成格子狀之複數個液晶注入區域11之貼合基板中,於密封部10之正上方,使用切刀輪12於玻璃基板W加工出劃線S之情形時,有因密封部10之彈性等而使得切刀輪12之咬入變差,而於通常之劃線荷重下無法充分形成肋紋或垂直裂紋之問題。又,若增大劃線荷重,則玻璃基板W之撓曲變大,於基板表面產生在水平方向延伸之不規則龜裂,或於槽部產生傷痕等破損,使得不良品之產生頻率變高。 因此,本發明之目的係提供一種切刀輪,其即使以小於先前之劃線荷重,亦可對玻璃等脆性材料基板形成高滲透之完好的劃線,藉此可分斷成端面強度優良之單位製品。 [解決問題之技術手段] 為解決上述問題,本發明係講求如下之技術方法。即,本發明係於圓周面具有由彼此相交之2個斜面所成之V字形刀尖脊線,以特定之節距對該刀尖脊線之全域加工出槽部,且由上述槽部與餘下之刀尖脊線部交替形成之圓板狀切刀輪,且以上述節距為100~200 μm、上述槽部之長度為3~10 μm、上述槽部之深度為1~3 μm之範圍而構成。 此處,較佳為將上述切刀輪之直徑設為1~5 mm,將上述2個斜面相交之刀尖角度設為90~120°。 [發明之效果] 於本發明之切刀輪中,藉由以上述條件構成,即使為以較低之劃線荷重亦可確實咬入基板而形成肋紋,且形成分斷所需要之高滲透之垂直裂紋。藉此,可於裂斷時以無傷痕之完好的分斷面進行裂斷,可獲得端面強度優良之單位製品。 尤其,於經由密封部將2片玻璃基板貼合之貼合基板中,於密封部正上方對玻璃基板加工出劃線之情形時,有如下效果:不受密封部存在之影響,能以較小之劃線荷重加工出具有較深肋紋與高滲透之垂直裂紋之劃線,可於端面強度優良之分斷面進行裂斷。 於本發明中,較佳為以上述槽部之深度之3倍鄰近值之尺寸形成上述槽部之長度。 藉此,刀尖脊線部向基板咬入與槽部之底部之抑制咬入可平衡良好地作用,可有效地形成具有高滲透之垂直裂紋之劃線。[Problems to be Solved by the Invention] In recent years, due to the miniaturization and precision of unit products such as liquid crystal panels obtained by cutting glass substrates, high-precision cutting with excellent end-face strength of the cut surface is required. Therefore, a slotted cutter wheel capable of processing a high-permeability intact scribing line with a smaller scribing load is needed. In particular, as shown in FIGS. 6 and 7, in a bonding substrate in which two glass substrates W and W are bonded via a sealing portion 10 and a plurality of liquid crystal injection regions 11 divided into a grid shape by the sealing portion 10 are used in When the scribe line S is processed on the glass substrate W by using the cutter wheel 12 directly above the seal portion 10, the bite of the cutter wheel 12 may be deteriorated due to the elasticity of the seal portion 10, etc. The problem that ribs or vertical cracks cannot be fully formed under a linear load. Moreover, if the load of the scribing line is increased, the deflection of the glass substrate W becomes large, irregular cracks extending in the horizontal direction occur on the substrate surface, or damages such as flaws occur in the grooves, which increases the frequency of defective products. . Therefore, the object of the present invention is to provide a cutter wheel which can form a high-permeability intact scribing of a substrate such as glass, even with a load smaller than that of the previous scribing, so that it can be broken into a surface with excellent end strength. Unit products. [Technical means to solve the problem] In order to solve the above-mentioned problems, the present invention is directed to the following technical methods. That is, the present invention relates to a V-shaped cutting edge ridge line formed by two inclined surfaces that intersect each other on a circumferential surface, and a groove portion is processed at a specific pitch over the entire area of the cutting edge ridge line, and the groove portion and the The disc-shaped cutter wheel formed alternately by the remaining ridge lines of the blade tip, and the pitch is 100 to 200 μm, the length of the groove is 3 to 10 μm, and the depth of the groove is 1 to 3 μm. Range. Here, it is preferable that the diameter of the cutter wheel is set to 1 to 5 mm, and the angle at which the two inclined surfaces intersect is set to 90 to 120 °. [Effects of the Invention] In the cutter wheel of the present invention, by forming under the above conditions, it is possible to bite into the substrate surely and form ribs even with a lower scribing load, and to form a high penetration required for breaking. Vertical crack. Thereby, when the fracture is broken, the fracture can be performed with an intact cut surface without a flaw, and a unit product with excellent end face strength can be obtained. In particular, in a bonded substrate in which two glass substrates are bonded via a sealing portion, when a scribe line is processed on the glass substrate directly above the sealing portion, it has the following effects: it is not affected by the presence of the sealing portion, and can be compared with The small scribe line load produces a scribe line with deep ribs and high-permeability vertical cracks, which can be fractured on the section with excellent end face strength. In the present invention, it is preferable that the length of the groove portion is formed with a size that is three times the adjacent value of the depth of the groove portion. Thereby, the bite of the blade ridge line toward the substrate and the suppression of the bite at the bottom of the groove can work well in a balanced manner, and can effectively form a vertical scribe line with high penetration.

以下,基於圖式針對本發明之附槽之切刀輪詳細說明。 圖1係顯示本發明之附槽之切刀輪A之立體圖,圖2係其側視圖及前視圖。該附槽之切刀輪A係由工具特性優良之金屬材料、例如超硬合金或燒結金剛石、單結晶金剛石等製作,於圓板狀主體1之中心之具有安裝用軸承孔2,於圓周面形成有由彼此相交之左右斜面3a、3a構成之刀尖脊線4。附槽之切刀輪A之直徑D係選自1~5 mm者,但於本實施形態中,以直徑D為2 mm、左右斜面3a、3a相交之刀尖角度α為105°形成,且以厚度為650 μm、軸承孔2之內徑為0.8 mm形成。 再者,本發明之附槽之切刀輪A係以特定之節距P於刀尖脊線4之全域加工出槽部5…,且藉由交替形成該槽部5與餘下之刀尖脊線6而構成。 於本實施例中,將槽部5之節距P設為0.126 mm,以槽部5之深度5b為1.5 μm、槽部5之圓周方向之長度5a為槽部5之深度5b的約3倍之4.4μm形成。該情形時,刀尖脊線部6之圓周方向之長度6a為自節距P減去槽部5之長度5a之尺寸。另,於圖式中,為易於理解,將而槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與實際尺寸之比率不同地表示。 於直徑2 mm之切刀輪中,可藉由將其全周50分割而獲得槽部5之126 μm尺寸之節距P。以式表示如下: P=πD/n 其中,D為切刀輪之直徑(mm),n為切刀輪全周之分割數。 又,用以獲得期望之節距P之尺寸0.126 mm之分割數n為: P=πD/P ,於例如直徑3 mm之切刀輪中,用以獲得期望之節距P之尺寸0.126 mm之分割數由上述計算式得出為約75分割。 同樣地,於直徑4 mm之切刀輪中,用以獲得期望之節距P之尺寸0.126 mm之分割數約為100分割。 將如上構成之附槽之切刀輪A安裝於圖8所示之劃線裝置B之劃線頭13,一面按壓於載置於平台14上之基板W之表面一面使其相對直線移動,藉此於基板W表面加工出分斷用劃線S。 此時,於本發明之附槽之切刀輪A中,藉由以上述構成為條件,如圖4所示,即使在不易於基板形成垂直裂紋之劃線低荷重般之條件下,亦可確實咬入基板W,可形成分斷所需要之高滲透之垂直裂紋。 圖4係顯示準備上述50分割之附槽之切刀輪A,及具有與該附槽之切刀輪A同為2 mm直徑、同為105°刀尖角度之附槽之切刀輪分別5分割、200分割、600分割者,以0.02、0.03及0.04 MPa之劃線荷重,對玻璃基板W各進行複數次劃線試驗時之肋紋量L1、及垂直裂紋量L2之平均值者。另,將5分割、200分割及600分割時之槽部5之長度5a及深度5b設為與50分割之附槽之切刀輪A相同。又,5分割、200分割及600分割時之節距分別計算後為1256 μm、31.4 μm、10.5 μm。又,成為加工對象之玻璃基板W係使用厚度0.2 mm之單板。 再者,圖5係以曲線圖表示圖4之各數值資料者,圖5(a)係顯示自基板表面之肋紋深度者,圖5(b)係顯示自基板表面之包含肋紋之垂直裂紋之深度者。 藉此,於本發明之50分割之附槽之切刀輪A中,於0.02 MPa之較低劃線荷重區域,檢測出與其他者相比最深之30 μm以上之肋紋量L1。且,雖為0.02 MPa之較低劃線荷重,但垂直裂紋量L2較其他更大,檢測出141.46 μm之數值。由該試驗資料可知,即使為0.02 MPa之低劃線荷重,亦確實地於玻璃基板W形成肋紋,且形成分斷所需要之高滲透之垂直裂紋。藉此,於裂斷時不會使基板大幅撓曲,能以完好的分斷面進行裂斷,且可獲得端面強度優良之單位製品。 尤其在經由密封部將2片玻璃基板貼合之貼合基板中,於密封部正上方對玻璃基板加工出劃線之情形時,可不受密封部存在之影響,以較小之劃線荷重加工出較深之垂直裂紋,而極其有效。 又,由於槽部相對於脊線之長度之比例較小,故可有效地形成較深之垂直裂紋並同時抑制端面強度降低。 另,雖省略試驗資料之提示,但在具有與上述直徑2 mm之附槽之切刀輪A相同之槽的深度與長度、且以相同槽節距經75分割之直徑3 mm的附槽之之切刀輪,或經100分割之直徑4 mm的附槽之切刀輪之情形下,亦可形成具有如與上述直徑2 mm的附槽之切刀輪A相仿的深度之肋紋與高滲透垂直裂紋之完好的劃線。 上述之附槽之切刀輪A之槽部5之節距P,及槽部5之長度5a及深度5b之數值係作為最佳例而表示者,本發明不限於上述數值,可於以下之範圍內實施。即,可於節距P為100~200 μm、槽部5之長度5a為3~10 μm、深度5b為1~3 μm之範圍內實施。又,刀尖角度α亦非特定為105°,可容許90~120°之範圍內者。再者,槽部5之側面形狀亦可取代圖示之梯形狀,而設為V字形狀或圓弧形狀。 以上已針對發明之代表性實施例進行說明,但本發明並非特定為上述實施形態,可於達成本發明之目的且不脫離申請專利範圍之範疇內適當修正、變更。 [產業上之可利用性] 本發明可較佳應用於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線時使用之切刀輪。Hereinafter, the slotted cutter wheel of the present invention will be described in detail based on the drawings. FIG. 1 is a perspective view showing the slotted cutter wheel A of the present invention, and FIG. 2 is a side view and a front view thereof. The slotted cutter wheel A is made of a metal material with excellent tool characteristics, such as cemented carbide or sintered diamond, single crystal diamond, etc., and has a bearing hole 2 for mounting in the center of the disc-shaped body 1 and a circumferential surface. A knife-edge ridge line 4 composed of left and right inclined surfaces 3a, 3a intersecting each other is formed. The diameter D of the slotted cutter wheel A is selected from 1 to 5 mm, but in this embodiment, it is formed by a blade tip angle α of 105 mm, where the diameter D is 2 mm and the left and right inclined surfaces 3a and 3a intersect, and It is formed with a thickness of 650 μm and an inner diameter of the bearing hole 2 of 0.8 mm. In addition, the slotted cutter wheel A of the present invention processes the slot portion 5 at a specific pitch P over the entire area of the blade tip ridge line 4 ..., and the slot portion 5 and the remaining blade tip ridge are alternately formed Line 6. In this embodiment, the pitch P of the groove portion 5 is set to 0.126 mm, the depth 5b of the groove portion 5 is 1.5 μm, and the length 5a in the circumferential direction of the groove portion 5 is approximately three times the depth 5b of the groove portion 5. 4.4 μm was formed. In this case, the length 6a in the circumferential direction of the blade ridge line portion 6 is a dimension obtained by subtracting the length 5a of the groove portion 5 from the pitch P. In the drawings, for ease of understanding, the ratios of the length 5a and depth 5b of the groove portion 5 and the length 6a of the ridge line portion 6 to the actual size are shown differently. In a cutter wheel with a diameter of 2 mm, the pitch P of the 126 μm dimension of the groove 5 can be obtained by dividing the entire circumference by 50. The expression is as follows: P = πD / n where D is the diameter (mm) of the cutter wheel and n is the number of divisions of the cutter wheel. In addition, the number of divisions n to obtain the desired pitch P size of 0.126 mm is: P = πD / P, for example, in a cutter wheel with a diameter of 3 mm, to obtain the desired pitch P size of 0.126 mm. The number of divisions is approximately 75 divisions from the above calculation formula. Similarly, in a cutter wheel with a diameter of 4 mm, the number of divisions to obtain a desired pitch P of 0.126 mm is about 100 divisions. The grooved cutter wheel A configured as described above is mounted on the scribing head 13 of the scribing device B shown in FIG. 8, and while pressing against the surface of the substrate W placed on the platform 14, it is relatively linearly moved. A cutting scribe line S is formed on the surface of the substrate W. At this time, in the grooved cutter wheel A of the present invention, by using the above-mentioned configuration as a condition, as shown in FIG. 4, even under the condition of a low load that is not prone to form a vertical crack on the substrate, it can be used. By biting into the substrate W, a high-permeability vertical crack required for breaking can be formed. Figure 4 shows the preparation of the above-mentioned 50-section slotted cutter wheel A, and a slotted cutter wheel having the same diameter of 2 mm and the same 105 ° tip angle as the slotted cutter wheel A. 5 For the division, 200 division, and 600 division, the average value of the rib amount L1 and the vertical crack amount L2 when each of the glass substrates W is subjected to a plurality of scribe tests with a scribe load of 0.02, 0.03, and 0.04 MPa. In addition, the length 5a and the depth 5b of the groove portion 5 at the time of 5 divisions, 200 divisions, and 600 divisions are set to be the same as the cutter wheel A with grooves of 50 divisions. The pitches at the time of 5 divisions, 200 divisions, and 600 divisions were calculated to be 1256 μm, 31.4 μm, and 10.5 μm, respectively. The glass substrate W to be processed is a single plate having a thickness of 0.2 mm. In addition, FIG. 5 is a graph showing each numerical data of FIG. 4, FIG. 5 (a) is a graph showing the depth of the ribs from the surface of the substrate, and FIG. 5 (b) is a graph showing the verticality of the ribs from the surface of the substrate. Depth of Crack. With this, in the 50-division slotted cutter wheel A of the present invention, in the lower scribe load area of 0.02 MPa, the rib amount L1, which is the deepest 30 μm or more compared with the others, is detected. And, although it is a lower scribe load of 0.02 MPa, the vertical crack amount L2 is larger than the others, and a value of 141.46 μm is detected. From this test data, it can be seen that even with a low scribe load of 0.02 MPa, ribs are surely formed on the glass substrate W, and vertical cracks with high permeability required for breaking are formed. Thereby, the substrate is not greatly deflected at the time of cracking, the cracking can be performed with a perfect fracture surface, and a unit product with excellent end face strength can be obtained. In particular, in a bonded substrate in which two glass substrates are bonded via a sealing portion, when the glass substrate is processed with a scribe line directly above the sealing portion, it can be processed with a small scribe line load without being affected by the existence of the sealing portion. Deep vertical cracks are produced, which is extremely effective. In addition, since the ratio of the groove portion to the length of the ridge line is small, it is possible to effectively form deep vertical cracks while suppressing the decrease in end face strength. In addition, although the hints of the test data are omitted, the depth and length of the groove with a diameter of 3 mm and a diameter of 75 mm divided by 75 with the same groove pitch have the same depth and length as the cutter wheel A with a groove of 2 mm in diameter described above. In the case of a cutting wheel with a diameter of 4 mm and a slotted cutting wheel with a diameter of 100 mm, it can also form ribs and heights with a depth similar to that of the slotted cutting wheel A with a diameter of 2 mm. Intact scribes that penetrate vertical cracks. The above-mentioned numerical values of the pitch P of the groove portion 5 of the cutter wheel A with groove, and the length 5a and depth 5b of the groove portion 5 are shown as the best examples. The present invention is not limited to the above values, but may be in the following Implemented within range. That is, it can implement within the range of the pitch P being 100-200 micrometers, the length 5a of the groove part 5 being 3-10 micrometers, and the depth 5b being 1-3 micrometers. In addition, the blade point angle α is not specifically 105 °, and a range of 90 to 120 ° is acceptable. In addition, the side shape of the groove portion 5 may be a V shape or an arc shape instead of the ladder shape shown in the figure. The representative embodiments of the invention have been described above, but the present invention is not specifically the above-mentioned embodiments, and can be appropriately modified and changed within the scope of achieving the purpose of the invention without departing from the scope of patent application. [Industrial Applicability] The present invention can be preferably applied to a cutter wheel used for processing a scribe line for breaking on the surface of a brittle material substrate such as glass or a bonded substrate on which two pieces of brittle material substrate are bonded.

1‧‧‧主體1‧‧‧ main body

2‧‧‧軸承孔2‧‧‧bearing hole

3a‧‧‧斜面3a‧‧‧ bevel

4‧‧‧刀尖脊線4‧‧‧Blade ridge line

5‧‧‧槽部5‧‧‧Slot

5a‧‧‧槽部之長度5a‧‧‧length of groove

5b‧‧‧槽部之深度5b‧‧‧ Depth of groove

6‧‧‧刀尖脊線部6‧‧‧Blade ridge line

6a‧‧‧刀尖脊線部之長度6a‧‧‧ Length of the ridge of the blade

7‧‧‧肋紋7‧‧‧ rib

8‧‧‧垂直裂紋8‧‧‧ vertical crack

10‧‧‧密封部10‧‧‧Sealing Department

11‧‧‧液晶注入區域11‧‧‧LCD injection area

12‧‧‧切刀輪12‧‧‧ cutter wheel

13‧‧‧劃線頭13‧‧‧ crossed head

14‧‧‧平台14‧‧‧platform

A‧‧‧附槽之切刀輪A‧‧‧Slotted cutter wheel

B‧‧‧劃線裝置B‧‧‧ scribing device

D‧‧‧直徑D‧‧‧ diameter

L1‧‧‧肋紋量L1‧‧‧ rib amount

L2‧‧‧垂直裂紋量L2‧‧‧Vertical Crack Amount

P‧‧‧節距P‧‧‧ pitch

S‧‧‧劃線S‧‧‧ crossed

W‧‧‧基板W‧‧‧ substrate

α‧‧‧刀尖角度α‧‧‧ Blade angle

圖1係本發明之附槽之切刀輪之立體圖。 圖2(a)、(b)係本發明之附槽之切刀輪之側視圖與前視圖。 圖3(a)、(b)係顯示形成於脆性材料基板之劃線之剖視圖。 圖4係顯示使用分割數不同之附槽之切刀輪之劃線試驗資料之圖。 圖5(a)、(b)係以曲線圖表示圖4之數值資料之圖。 圖6係顯示成為加工對象之貼合基板之俯視圖。 圖7係圖6之剖視圖。 圖8係概略性顯示劃線裝置之前視圖。FIG. 1 is a perspective view of a slotted cutter wheel according to the present invention. 2 (a) and 2 (b) are a side view and a front view of a slotted cutter wheel according to the present invention. 3 (a) and 3 (b) are cross-sectional views showing scribe lines formed on a brittle material substrate. Fig. 4 is a graph showing the scribe test data of a cutter wheel with grooves having different division numbers. 5 (a) and 5 (b) are graphs showing the numerical data of FIG. 4. FIG. 6 is a plan view showing a bonded substrate to be processed. FIG. 7 is a sectional view of FIG. 6. FIG. 8 is a schematic front view of the scribing device.

Claims (3)

一種切刀輪,其係於圓周面具有由彼此相交之2個斜面構成之V字形刀尖脊線,以特定之節距對該刀尖脊線之全域加工出槽部,且由上述槽部與殘留之刀尖脊線部交替形成之圓板狀切刀輪, 上述節距為100~200 μm,上述槽部之長度為3~10 μm,上述槽部之深度為1~3 μm。The utility model relates to a cutter wheel, which is formed on a circumferential surface of a V-shaped tip ridge line composed of two inclined surfaces that intersect each other. A groove portion is processed at a specific pitch over the entire area of the tip ridge line. The disc-shaped cutter wheel alternately formed with the remaining ridge line of the blade tip has a pitch of 100 to 200 μm, a length of the groove of 3 to 10 μm, and a depth of the groove of 1 to 3 μm. 如請求項1之切刀輪,其中上述切刀輪之直徑為1~5 mm,上述2個斜面相交之刀尖角度為90~120°。For example, the cutter wheel of claim 1, wherein the diameter of the cutter wheel is 1 to 5 mm, and the angle of the cutter point where the two inclined surfaces intersect is 90 to 120 °. 如請求項1或請求項2之切刀輪,其中上述槽部之長度係以該槽部之深度之3倍的鄰近值形成。For example, the cutter wheel of claim 1 or claim 2, wherein the length of the above-mentioned groove part is formed by the adjacent value of three times the depth of the groove part.
TW106142883A 2016-12-28 2017-12-07 cutter wheel TWI752132B (en)

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SG149824A1 (en) 2004-02-02 2009-02-27 Mitsuboshi Diamond Ind Co Ltd Cutter wheel, methods for scribing and breaking brittle material substrate using same, and method for manufacturing cutter wheel
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