TWI682906B - How to draw - Google Patents

Abstract

The present invention uses a conventional wheel, on the one hand, it minimizes the surface damage of the substrate, and makes the divided section of the substrate beautiful.

The present invention is a scribing method for breaking a substrate and forming a scribing line on the upper surface of the substrate, which uses a conventional wheel to intermittently deepen or shallowen the depth of plastic deformation of the substrate surface caused by the wheel. Moving forward, a line is formed on one side.

Description

How to draw

The present invention relates to a scribe line forming method for cutting brittle materials such as LCD (Liquid Crystal Display) panels, semiconductor wafers, glass, and ceramics.

In order to divide the substrate as the original plate of brittle materials such as LCD panels, semiconductor wafers, glass, ceramics, etc. into pieces of a desired size, a wheel pair made of diamond or artificial diamond is used before breaking The substrate is pressed to form horizontal and vertical scribe lines.

As for the types of wheels used in the formation of the scribe line, there are high-permeability wheels and conventional wheels. As shown in FIG. 4, the high-permeability wheel has teeth or grooves 14 formed on the outer periphery of the wheel 13. If the high-permeability wheel is used, the vertical cracks can penetrate deeply to the thickness of the substrate when the scribe line is formed. As a result, the breaking operation of the substrate after the scribe line is formed can be smoothly performed. That is, if a high penetration wheel is used, vertical cracks can be propagated to about 80 to 90% of the thickness of the substrate. However, on the other hand, when a high-permeability wheel is used, high-pressure stress will remain in the scribe line forming portion, which may easily cause debris during the operation of breaking the substrate.

For example, as shown in FIG. 5, a groove 14 is formed in the wheel 13 of the high-permeability wheel. When a scribe line is formed on the mounted substrate, if the groove 14 and the groove 14 related to the blade edge of the wheel 13 are formed The interval is set to A, the groove 14 is set to C, and the boundary between A and C is set to B, then the distribution of the scoring load on the substrate generated by each part of A, B, and C becomes the lower half of FIG. The curve shown.

That is, when the wheel 13 rotates, a strong Score the load. Furthermore, at the portion C where the groove 14 is formed, there is no scoring load, so the load distribution line is greatly reduced.

According to the above load distribution diagram, during the scribing operation of the substrate using the high penetration wheel, a very irregular stress concentration phenomenon occurs. Therefore, after the scribe line is formed, the substrate cannot be broken into a straight line during the breaking process, and the broken surface may not be smooth and some of the broken surfaces may be damaged. As a result, the quality of the broken substrate is reduced.

Furthermore, at the intersection of the scribe lines, unnecessary cracks are generated due to the concentration of shear force and stress, and defects or cracks are easily generated at the corners of the broken substrate.

In order to solve the above problem, if a normal wheel 3 as shown in FIG. 6 that is not a high-permeability wheel, that is, without a groove 14 on the outer circumference of the wheel is used to form a scribe line, the pressure load of the wheel 3 on the substrate becomes uniform, but The penetration depth of the crack becomes shallower. That is, as shown in FIG. 7, the vertical crack penetrates only about one tenth of the thickness t of the substrate 1.

In order to allow vertical cracks to penetrate in the thickness direction of the substrate 1, a fracture operation using pressure or bending stress caused by a break bar is performed. In this case, when the crack spreads in the thickness direction from the front end of the shallow crack, it is difficult to ensure the straightness in the vertical direction, as shown in FIG. 7, the split surface 24 is formed to deviate to the left and right, resulting in poor quality.

On the other hand, in the case of the conventional wheel 3 in which the blade tip is not subjected to groove processing, a uniform load is applied to the surface of the substrate, and defects such as stress concentration or uneven stress caused by the high-permeability wheel are unlikely to occur.

Therefore, the portion where the scribe line crosses is less damaged and the penetration wheel is less, and the vertical cracks are shallower as described above, so there is a possibility that a defect occurs when the substrate is broken.

[Prior Technical Literature] [Patent Literature]

[Patent Literature 1] Korean Registered Patent Gazette No. 10-0573986

[Patent Document 2] Korean Registered Patent Gazette No. 10-1365049

The present invention was invented to solve the above-mentioned problems. The purpose of the present invention is to use conventional wheels to minimize the damage to the surface of the substrate in order to produce high-quality substrate products, and can produce deeper cracks to make up for the disadvantages of the conventional wheels. And adopt the advantages of high penetration wheel.

Another object of the present invention is to control the depth of plastic deformation of a substrate caused by a conventional wheel, so that vertical cracks are formed deeper.

Another object of the present invention is to prevent damage to the substrate at the intersection of the scribe lines.

Another object of the present invention is to use a servo motor to change the plastic deformation depth of the wheelset substrate, no matter what kind of brittle substrate can be controlled to form an optimal scribing line.

The main structure of the present invention for solving the above-mentioned object is a scribing method, which is characterized in that it is a substrate for breaking a substrate and a scribing is formed on the upper surface of the substrate, which uses a conventional wheel In the manner of intermittently deepening or shallowing the depth of plastic deformation caused on the surface of the substrate, a scribe line is formed while advancing and moving.

Another feature of the present invention is that the depth of plastic deformation of the substrate caused by the subsequent conventional wheel is formed to be shallower than the existing scribe line at the intersection of the subsequent conventional wheel to traverse the existing scribe line.

Another feature of the present invention is that the plastic deformation depth of the substrate caused by the conventional wheel is deepened in the portion of the substrate that does not cross the scribe line.

Another feature of the present invention is that the plastic deformation depth of the substrate caused by the conventional wheels is a depth of 10% to 20% of the thickness of the substrate.

Another feature of the present invention is that the plastic deformation depth of the substrate at the intersection point caused by the subsequent conventional wheel is 2 μm or less.

The present invention is characterized in that the depth of plastic deformation of the substrate caused by the above-mentioned conventional wheel at a portion other than the above-mentioned intersection is 2 to 5 μm.

Another feature of the present invention is that the plastic deformation depth of the base plate caused by the conventional wheel is controlled by a servo motor.

Generally, if a conventional wheel is used, only vertical cracks of about 10% of the thickness of the substrate are generated, but according to the present invention, there is an advantage that vertical cracks up to about 80% of the thickness of the substrate are generated similarly to the high-permeability wheel.

Moreover, according to the present invention, it is possible to produce a high-quality substrate with extremely smooth cut surfaces of the substrate to be cut.

Moreover, according to the present invention, under the precise control of the servo motor, the plastic deformation depth of the substrate can be arbitrarily controlled, and any brittle material can be broken without damage.

Furthermore, according to the present invention, even at the intersection of scribe lines where damage is likely to occur, it can be broken without damage, which can reduce the number of damaged substrates and help save materials.

1‧‧‧ substrate

2‧‧‧Intersection

3‧‧‧ round

5‧‧‧ crossed

13‧‧‧ round

14‧‧‧slot

24‧‧‧Section

A‧‧‧Interval

B‧‧‧Border

C‧‧‧slot

t‧‧‧thickness

FIG. 1 is a diagram illustrating the scoring operation of the present invention.

FIG. 2 is a diagram illustrating the use of a wheel to perform a scoring operation in order to divide the substrate into a desired size.

FIG. 3 is a diagram illustrating another embodiment of FIG. 1. FIG.

Figure 4 is a diagram showing a high permeability wheel.

FIG. 5 is a diagram illustrating the scribing load of the substrate by the high-permeability wheel.

Fig. 6 is a diagram showing a conventional wheel.

FIG. 7 is a diagram illustrating fracture after scoring using a conventional wheel.

Hereinafter, the present invention will be described in detail based on the accompanying drawings.

FIG. 1 is used to illustrate the situation of using the wheel 3 to perform the scoring operation on the upper surface of the substrate 1 A diagram of the depth of plastic deformation of the substrate 1 caused by the wheel 3. The scoring operation is a step performed at a stage before the substrate 1 is broken, and is an operation of forming a scribe line on the substrate 1 using the wheel 3.

As shown in the figure, according to the present invention, when the wheel 3 is moved on the upper surface of the substrate 1 while performing the scoring operation, the plastic deformation depth of the substrate 1 (the depth where the substrate is not restored to its original position after being pressed) is periodically Penetrate deeply or shallowly. The adjustment of the above-mentioned plastic deformation depth can be realized by the control of the precise ascent and descent action of the wheel 3 using the servo motor.

The reason why the depth of the plastic deformation region of the substrate is important is that if the plastic deformation depth is known, it can be known that the depth of the vertical crack of the substrate can be formed to the deepest limit value. Therefore, according to the present invention, even if a conventional wheel is used to form the scribe line, the depth of the vertical crack of the substrate can be extended to 80% of the thickness of the substrate.

The part where the depth of the wheel 3 in FIG. 1 enters shallowly, as shown in FIG. 2, is the part of the intersection 2 where the scribe line 5 of the substrate 1 overlaps. At this intersection point 2, partial damage or irregular cracks are likely to occur. Thus, at the intersection 2, the depth of plastic deformation of the substrate 1 caused by the wheel 3 is shallow, thereby minimizing the occurrence of damage such as cracks or fine damage.

Previously, the plastic deformation depth of the substrate caused by the wheel was set to about 10% of the thickness of the substrate. In the present invention, the plastic deformation depth of the substrate 1 caused by the wheel 3 is more than 10% of the thickness of the substrate.

In the present invention, the plastic deformation depth of the substrate 1 caused by the wheel 3 is set to a depth of 10% or more of the thickness of the substrate 1, but if a range relative to the depth is to be given, it is set to 10% to 20 of the thickness of the substrate 1 % Depth. If it is below this depth, it cannot be broken smoothly, and if it is above this depth, excessive cracks may occur in the thickness direction of the substrate 1 and unnecessary power consumption increases, which is not good. In a specific embodiment, the plastic deformation depth of the substrate 1 caused by the ordinary wheel 3 is preferably about 2 to 5 μm. If it is set in this range, vertical cracks can be given up to about 80% of the thickness of the substrate, and the divided surface of the substrate can be finished to be beautiful.

FIG. 3 is another embodiment of the plastic deformation depth of the substrate 1 when the wheel 3 of FIG. 1 moves.

As shown in the figure, the trajectory of the plastic deformation depth of the substrate 1 caused by the wheel 3 becomes a wavy shape with the intersection 2 of the scribe line 5 as the apex, or a trajectory drawn in various shapes such as a trapezoid shape and a mountain shape.

According to the characteristics of the brittle material, or according to the size of the substrate to be broken, before the wheel 3 reaches the intersection point 2, it can be pre-mastered to adjust and set the trajectory of the line due to the damage to the surface of the substrate due to its peripheral position. Regarding the adjustment of the plastic deformation depth of the substrate 1 caused by the above-mentioned wheel 3, it can be adjusted by the precise control of the operation of the servo motor.

Therefore, no matter what the brittle material is, or what size the substrate 1 is divided into, by adjusting the depth of plastic deformation of the substrate 1 caused by the wheel 3, it is possible to form a beautiful one without damaging the substrate 1 The cross-section line.

On the other hand, instead of controlling the depth of plastic deformation of the substrate 1 caused by the wheel 3, a change in the pressure applied to the substrate 1 by the wheel 3 can be used to form a scribe line. However, in this case, since the wheel 3 only provides the change of the pressing force to the substrate 1, the plastic deformation depth of the substrate 1 cannot be accurately controlled. If the depth of plastic deformation of the substrate 1 caused by the wheel 3 is correctly known, it is possible to clearly know to what degree of plastic deformation the damage of the substrate 1 is generated, and there is a disadvantage that it cannot be correctly known only by applying pressure. Therefore, controlling the depth of plastic deformation of the substrate caused by the wheel during the formation of the scribe line can most certainly prevent damage to the substrate.

As described above, according to the present invention, a conventional wheel can be used to minimize the damage to the surface of the substrate, and to make the divided surface of the substrate beautiful, and also to minimize the damage of the intersection of the scribe lines.

In addition, during the scoring operation, the vertical cracks of the substrate can be deepened while using a conventional wheel, and the substrate can be smoothly divided, and the following defects are prevented: debris or The broken and broken section becomes rough.

1‧‧‧ substrate

3‧‧‧ round

Claims (5)

A method for forming a scribe line, characterized in that the scribe line is formed on the upper surface of the substrate to break the substrate, and a conventional wheel with no groove formed on the outer peripheral cutting blade portion is placed on the upper portion of the substrate. The wheel pressurizes the substrate, plastically deforms the substrate to a predetermined depth, and moves the conventional wheel in this state. While continuously pressurizing the substrate during the conventional wheel movement, the conventional wheel is changed. Applying pressure to the substrate, and forming continuous scribe lines with different depths on the substrate; in order to suppress the stress concentration at the intersection points where the scribe lines cross, causing cracks to occur, the depth of the plastic deformation at the intersection points is formed It should be shallower than the part where the crossed lines are not crossed. The scribing method of claim 1, wherein the plastic deformation depth of the substrate caused by the above-mentioned conventional wheel is formed at a depth of 10% to 20% of the thickness of the substrate. As in the scribe line forming method of claim 1, wherein the plastic deformation depth of the substrate caused by the above-mentioned conventional wheel at the intersection is 2 μm or less. The method for forming a scribe line according to claim 1, wherein the plastic deformation depth of the substrate caused by the conventional wheel in the part other than the intersection point is 2 to 5 μm. As in the scribe line forming method of claim 1, wherein the plastic deformation depth of the substrate caused by the above-mentioned conventional wheel is controlled by a servo motor.

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