CN105936093B - Scribing line forming method - Google Patents
Scribing line forming method Download PDFInfo
- Publication number
- CN105936093B CN105936093B CN201511009803.4A CN201511009803A CN105936093B CN 105936093 B CN105936093 B CN 105936093B CN 201511009803 A CN201511009803 A CN 201511009803A CN 105936093 B CN105936093 B CN 105936093B
- Authority
- CN
- China
- Prior art keywords
- substrate
- wheel
- depth
- plastic deformation
- scribe line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The invention uses the common wheel to minimize the surface damage of the substrate and make the cutting surface of the substrate beautiful. The present invention relates to a scribing line forming method for forming a scribing line on an upper surface of a substrate in order to cut the substrate, wherein a common wheel is used, and the scribing line is formed while moving forward in a mode of intermittently making the plastic deformation depth of the substrate surface caused by the wheel deeper or shallower.
Description
Technical Field
The present invention relates to a scribe line forming method for cutting a brittle material such as an LCD (Liquid Crystal Display) panel, a semiconductor wafer, glass, or ceramics.
Background
In order to cut a substrate, which is a raw plate of a brittle material such as an LCD panel, a semiconductor wafer, glass, or ceramic, into a plurality of pieces with a desired size, a wheel (reel) made of diamond or synthetic diamond is used to press the substrate before cutting, thereby forming horizontal and vertical scribe lines.
As the kind of wheel used in forming the scribe line, there are a high permeability wheel and a general wheel. As shown in fig. 4, the high-permeability wheel has teeth or grooves 14 formed on the outer periphery of the wheel 13, and if the high-permeability wheel is used, the vertical cracks can be penetrated deeply into the thickness of the substrate during scribing. This makes it possible to smoothly perform the cutting operation of the substrate after the formation of the scribe line. That is, if the high-permeability wheel is used, the vertical crack can be propagated to about 80 to 90% of the thickness of the substrate. However, when the high-penetration wheel is used, a high-pressure stress remains in the scribe line forming portion, and thus, a chip is likely to be generated during the operation of cutting the substrate.
For example, as shown in fig. 5, when a groove 14 is formed in a wheel 13 of a high-permeability wheel and a scribe line is formed on a substrate placed thereon, if a section between the groove 14 and the groove 14 with respect to the edge of the wheel 13 is denoted by a, the groove 14 is denoted by C, and a boundary between a and C is denoted by B, a distribution of a scribing load applied to the substrate at each part of A, B, C becomes a curve shown in the lower half of fig. 5.
That is, when the wheel 13 rotates, a strong scribing load is applied at a boundary portion of the tip and the groove 14, i.e., B. Further, since the state of no scribing load is obtained at the portion C where the groove 14 is formed, the load distribution line is greatly reduced.
As shown in the load distribution diagram, a very irregular stress concentration phenomenon occurs in the scribing operation of the substrate using the high-penetration wheel. Therefore, after the scribe line is formed, the substrate cannot be cut into a straight line in the cutting process, and the cut surface may be uneven and a part of the cut surface may be damaged. As a result, the quality of the cut substrate is degraded.
In addition, unnecessary cracks are generated at the portions where the scribe lines intersect due to concentration of shear force and stress, and chipping and cracking are likely to occur at the corners of the cut substrate.
In order to solve the above problem, if a normal wheel (normal wheel)3 as shown in fig. 6, which is not a high-penetration wheel, i.e., a wheel having no groove 14 on the outer periphery thereof, is used to form the scribe line, the pressing load of the wheel 3 to the substrate becomes uniform, but the penetration depth of the crack becomes shallow. That is, as shown in fig. 7, the vertical crack penetrates only about one tenth of the thickness t of the substrate 1.
In order to allow the vertical crack to penetrate in the thickness direction of the substrate 1, a breaking operation using a pressure or a bending stress caused by a breaking bar (break bar) or the like is performed. In this case, when the crack propagates from the tip of the shallow crack in the thickness direction, it is difficult to ensure straightness in the vertical direction, and as shown in fig. 7, the cut surface 24 is formed so as to be deviated to the left and right, resulting in poor quality.
On the other hand, in the case of the normal wheel 3 in which the cutting edge is not subjected to the groove processing, a uniform load is applied to the surface of the substrate, and defects due to stress concentration or stress unevenness such as those of a high-permeability wheel are less likely to occur.
Therefore, the portion where the scribe lines intersect is less broken than the high-penetration wheel, and the vertical crack is shallower as described above, so that there is a concern that a failure may occur when the substrate is cut.
[ background Art document ]
[ patent document ]
[ patent document 1] Korean registered patent publication No. 10-0573986
[ patent document 2] Korean registered patent publication No. 10-1365049
Disclosure of Invention
[ problems to be solved by the invention ]
The present invention has been made to solve the above problems, and an object of the present invention is to minimize damage to a substrate surface using a general wheel and to complement disadvantages of the general wheel by generating deep cracks and to adopt only advantages of a high-permeability wheel in order to produce a high-quality substrate product.
Another object of the present invention is to control the depth of plastic deformation of a substrate caused by a general wheel to allow vertical cracks to be deeply formed.
Another object of the present invention is to prevent damage to a substrate at a portion where scribe lines intersect.
Still another object of the present invention is to form an optimum scribe line by changing the plastic deformation depth of a substrate by a servo motor and controlling the thickness of the substrate regardless of a brittle substrate.
[ means for solving problems ]
The present invention for solving the above-described problems is mainly configured as a scribe line forming method including: in order to cut the substrate and form a scribe line on the upper surface of the substrate, a normal wheel is used, and the scribe line is formed while advancing so that the plastic deformation depth of the substrate surface by the normal wheel becomes intermittently deeper or shallower.
Another feature of the present invention is: at the intersection where the subsequent normal wheel crosses the existing scribe line, the depth of plastic deformation of the substrate caused by the subsequent normal wheel is made shallower than the existing scribe line.
Yet another feature of the present invention is: and scribing a non-crossed part in the substrate to deepen the plastic deformation depth of the substrate caused by the common wheel.
Yet another feature of the present invention is: the plastic deformation depth of the substrate caused by the common wheel is 10 to 20% of the thickness of the substrate.
Yet another feature of the present invention is: the depth of plastic deformation of the substrate at the intersection point by the following normal wheel is 2 [ mu ] m or less.
The invention is characterized in that: the plastic deformation depth of the substrate caused by the ordinary wheel is 2-5 μm in the portion other than the intersection point.
Yet another feature of the present invention is: the depth of plastic deformation of the substrate caused by the normal wheel is controlled by a servomotor.
[ Effect of the invention ]
In general, if a normal wheel is used, only vertical cracks of about 10% of the thickness of the substrate are generated, but according to the present invention, there is an advantage in that vertical cracks are generated up to about 80% of the thickness of the substrate, as in the case of a high-permeability wheel.
Further, according to the present invention, a high-quality substrate having an extremely smooth cut surface of a substrate to be cut can be manufactured.
Further, according to the present invention, the plastic deformation depth of the substrate can be arbitrarily controlled under the precise control of the servo motor, and any brittle material can be cut without being damaged.
Further, according to the present invention, even at the intersection of the scribe lines where damage is likely to occur, cutting can be performed without damage, so that the loss of the substrate can be reduced, which contributes to material saving.
Drawings
FIG. 1 is a diagram illustrating a scribing operation according to the present invention.
Fig. 2 is a diagram illustrating scribing performed using a wheel in order to cut the substrate into a desired size.
Fig. 3 is a diagram illustrating another embodiment of fig. 1.
Fig. 4 is a view showing a high-permeability wheel.
Fig. 5 is a graph illustrating the scoring load of the high-permeability wheel on the substrate.
Fig. 6 is a view showing a general wheel.
Fig. 7 is a diagram illustrating the breaking performed after scribing by a general wheel.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a view for explaining the depth of plastic deformation of the substrate 1 by the wheel 3 in the case where the scribing operation is performed on the upper surface of the substrate 1 by the wheel 3. The scribing operation is a step performed before cutting the substrate 1, and is an operation of forming a scribe line on the substrate 1 using the wheel 3.
As shown in the drawings, according to the present invention, when scribing is performed while the wheel 3 is moved on the upper surface of the substrate 1, the plastic deformation depth of the substrate 1 (the depth at which the substrate does not return to the original position after being pressed) is periodically made to penetrate deeper or shallower. The adjustment of the plastic deformation depth can be achieved by controlling the precise ascending and descending operation of the wheel 3 using a servo motor.
The reason why the depth of the plastic deformation region of the substrate is important is that if the plastic deformation depth can be known, a limit value that can maximally form the depth of the vertical crack of the substrate deep can be known. Therefore, according to the present invention, even if a scribe line is formed using a common wheel, the depth of a vertical crack of a substrate can be extended to 80% of the thickness of the substrate.
The part of the wheel 3 in fig. 1 that enters less deeply, as shown in fig. 2, is the part of the intersection 2 where the scribe lines 5 of the substrate 1 overlap. At this intersection 2, partial breakage or irregular cracking is likely to occur. Thus, at the intersection 2, the depth of plastic deformation of the substrate 1 by the wheel 3 is made shallow, thereby minimizing the occurrence of damage such as cracking or fine breakage.
Conventionally, the plastic deformation depth of the substrate by the wheels was set to about 10% of the thickness of the substrate. In the present invention, the plastic deformation depth of the substrate 1 by the wheels 3 is 10% or more of the thickness of the substrate.
In the present invention, the depth of plastic deformation of the substrate 1 by the wheels 3 is set to a depth of 10% or more of the thickness of the substrate 1, and if a range is provided for the depth, the depth is set to a depth of about 10% to 20% of the thickness of the substrate 1. If the depth is less than this, smooth cutting cannot be performed, and if the depth is more than this, unwanted cracks may occur in the thickness direction of the substrate 1, and unnecessary power consumption increases, which is less preferable. In a specific embodiment, the plastic deformation depth of the substrate 1 by the common wheel 3 is preferably about 2 to 5 μm. If the thickness falls within this range, the vertical cracks can be imparted to about 80% of the thickness of the substrate, and the cut surface of the substrate can be finished to be beautiful.
Fig. 3 shows another example of the plastic deformation depth of the substrate 1 when the wheel 3 of fig. 1 travels.
As shown in the drawing, the locus of the plastic deformation depth of the substrate 1 by the wheel 3 is a wave shape having the intersection 2 of the scribe line 5 as a vertex, or a locus having various shapes such as a trapezoidal shape and a mountain shape.
The scribing trajectory can be adjusted and set by grasping in advance the damage of the peripheral position on the surface of the substrate before the wheel 3 reaches the intersection 2 according to the characteristics of the brittle material or the size of the substrate to be cut. The adjustment of the plastic deformation depth of the substrate 1 by the wheel 3 can be adjusted by fine control of the operation of the servo motor.
Therefore, when the substrate 1 is cut into any size or a brittle material of any material, the scribing line having a beautiful cut surface can be formed without damaging the substrate 1 by adjusting the plastic deformation depth of the substrate 1 by the wheel 3.
On the other hand, instead of controlling the plastic deformation depth of the substrate 1 by the wheel 3, the scribe line may be formed by using a change in the pressure applied to the substrate 1 by the wheel 3. However, in this case, since the wheel 3 only applies a change in the pressurizing force to the substrate 1, the plastic deformation depth of the substrate 1 cannot be accurately controlled. If the depth of plastic deformation of the substrate 1 by the wheel 3 is accurately known, it is possible to clearly know how much the damage of the substrate 1 is caused by the depth of plastic deformation, and there is a disadvantage that only the pressurizing force cannot be accurately known. Therefore, the damage of the substrate can be prevented most reliably by controlling the plastic deformation depth of the substrate caused by the wheel when the scribing line is formed.
As described above, according to the present invention, it is possible to minimize damage to the surface of the substrate using a common wheel, to make the cut surface of the substrate beautiful, and to minimize damage at the intersection of the scribe lines.
Further, in the scribing operation, the vertical crack of the substrate can be deepened while using a general wheel, and the substrate can be smoothly cut, and the following defects can be prevented from occurring: chipping and breakage occur at the end of the cut surface of the substrate, and the cut surface becomes rough.
[ description of symbols ]
1 substrate
2 cross point
3 wheels
5 scribing
14 groove
Claims (4)
1. A scribe line forming method is characterized in that: forming a scribe line on the upper surface of the substrate in order to cut the substrate,
placing a normal wheel having no groove formed in an outer peripheral cutting blade portion on an upper portion of a substrate, pressing the substrate with the normal wheel to plastically deform the substrate to a predetermined depth, and moving the normal wheel in this state, wherein while the substrate is continuously pressed during the moving of the normal wheel, a pressing force of the normal wheel to the substrate is changed, and continuous scribe lines having different depths are formed on the substrate;
a depth of plastic deformation at an intersection point where the scribe lines intersect is formed shallower than a depth of a portion where the scribe lines do not intersect, in order to suppress generation of cracks due to stress concentration at the intersection point where the scribe lines intersect;
the depth of plastic deformation of the substrate by the normal wheel is controlled by the ascending and descending operation of the normal wheel by a servo motor, and the trajectory of the scribe line to be formed can be adjusted and set before the subsequent normal wheel crosses the intersection point of the existing scribe line according to the characteristic or the size of the substrate.
2. The scribe line forming method according to claim 1, wherein:
the plastic deformation depth of the substrate caused by the common wheel is 10 to 20% of the thickness of the substrate.
3. The scribe line forming method according to claim 1, wherein:
the depth of plastic deformation of the substrate by the normal wheel at the intersection is 2 μm or less.
4. The scribe line forming method according to claim 1, wherein:
the plastic deformation depth of the substrate caused by the ordinary wheel is 2-5 μm in the portion other than the intersection point.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0029538 | 2015-03-03 | ||
| KR1020150029538A KR101648010B1 (en) | 2015-03-03 | 2015-03-03 | Scribing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105936093A CN105936093A (en) | 2016-09-14 |
| CN105936093B true CN105936093B (en) | 2020-06-30 |
Family
ID=56844056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511009803.4A Expired - Fee Related CN105936093B (en) | 2015-03-03 | 2015-12-29 | Scribing line forming method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6641885B2 (en) |
| KR (1) | KR101648010B1 (en) |
| CN (1) | CN105936093B (en) |
| TW (1) | TWI682906B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6276355B1 (en) * | 1999-05-03 | 2001-08-21 | Macro Energy-Tech, Inc. | Cutting method and apparatus for sectioning multilayer electronic devices |
| JP2003267742A (en) * | 2002-03-13 | 2003-09-25 | Nakamura Tome Precision Ind Co Ltd | Method for scribing hard fragile plate |
| JP2004189556A (en) * | 2002-12-12 | 2004-07-08 | Mitsuboshi Diamond Industrial Co Ltd | Chip holder, scribing head, scribing apparatus and scribing method |
| CN1708381A (en) * | 2002-10-29 | 2005-12-14 | 三星钻石工业股份有限公司 | Method and device for scribing fragile material substrate |
| CN102795767A (en) * | 2011-05-24 | 2012-11-28 | 三星钻石工业股份有限公司 | Marking device |
| CN103288343A (en) * | 2012-02-27 | 2013-09-11 | 三星钻石工业股份有限公司 | Scribing wheel, scribing apparatus, and method for manufacturing scribing wheel |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0585694B1 (en) * | 1992-09-01 | 1997-12-10 | Corning Incorporated | Separating sheet glass |
| US6484711B2 (en) * | 2001-02-23 | 2002-11-26 | Multiquip, Inc. | Automatic depth of cut control for concrete saw |
| JP2003212579A (en) * | 2002-01-24 | 2003-07-30 | Nakamura Tome Precision Ind Co Ltd | Cross-scribing method of hard brittle plate and apparatus thereof |
| EP1779988A4 (en) * | 2004-07-16 | 2010-03-24 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel and method of manufacturing the same, manual scribing tool, and scribing device |
| JP4818120B2 (en) * | 2004-10-13 | 2011-11-16 | 三星ダイヤモンド工業株式会社 | A scribing method for a brittle material substrate, a scribing apparatus, and a cutting system for the brittle material substrate. |
| JP5023547B2 (en) * | 2006-04-28 | 2012-09-12 | 坂東機工株式会社 | Glass plate cutting method and glass plate cutting machine |
| JP5076662B2 (en) * | 2007-06-13 | 2012-11-21 | 澁谷工業株式会社 | Method and apparatus for cleaving brittle materials |
| KR100786126B1 (en) * | 2007-08-14 | 2007-12-18 | 주식회사 아바코 | Scribe method of cutting object by sustenance contactless flatness and scribe head apparatus of cutting object by sustenance contactless flatness |
-
2015
- 2015-03-03 KR KR1020150029538A patent/KR101648010B1/en active IP Right Grant
- 2015-10-30 JP JP2015213812A patent/JP6641885B2/en not_active Expired - Fee Related
- 2015-12-16 TW TW104142337A patent/TWI682906B/en not_active IP Right Cessation
- 2015-12-29 CN CN201511009803.4A patent/CN105936093B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6276355B1 (en) * | 1999-05-03 | 2001-08-21 | Macro Energy-Tech, Inc. | Cutting method and apparatus for sectioning multilayer electronic devices |
| JP2003267742A (en) * | 2002-03-13 | 2003-09-25 | Nakamura Tome Precision Ind Co Ltd | Method for scribing hard fragile plate |
| CN1708381A (en) * | 2002-10-29 | 2005-12-14 | 三星钻石工业股份有限公司 | Method and device for scribing fragile material substrate |
| JP2004189556A (en) * | 2002-12-12 | 2004-07-08 | Mitsuboshi Diamond Industrial Co Ltd | Chip holder, scribing head, scribing apparatus and scribing method |
| CN102795767A (en) * | 2011-05-24 | 2012-11-28 | 三星钻石工业股份有限公司 | Marking device |
| CN103288343A (en) * | 2012-02-27 | 2013-09-11 | 三星钻石工业股份有限公司 | Scribing wheel, scribing apparatus, and method for manufacturing scribing wheel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI682906B (en) | 2020-01-21 |
| CN105936093A (en) | 2016-09-14 |
| TW201632478A (en) | 2016-09-16 |
| JP6641885B2 (en) | 2020-02-05 |
| JP2016159626A (en) | 2016-09-05 |
| KR101648010B1 (en) | 2016-08-17 |
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