CN105936093A - Scribing method - Google Patents

Abstract

The invention uses a common wheel so as to enable surface damage of a base to be minimized and the cutting face of the base is nice. According to the invention, in order to cut the base, the common wheel is used for forming a scribing line on the upper surface of the base, so that the common wheel moves forward on the base in a manner that the generating plastic deformation depth of the surface of the base deepens or shallows intermittently while forming scribing lines.

Description

Scribe line forming method

Technical field

The present invention relates to a kind of in order to cut off LCD (Liquid Crystal Display, LCDs) panel, semiconductor die Line (scribe line) forming method of the fragile materials such as sheet, glass, pottery.

Background technology

In order to using the substrate of the raw sheet as fragile materials such as LCD, semiconductor wafer, glass, potteries with institute's phase The size hoped is cut to several piece, and uses the wheel (wheel) processed by diamond or diamond to base before cutting Plate pressurizes, thus forms horizontal stroke and perpendicular line.

For the kind of the wheel used when line is formed, there are Thief zone wheel and ordinary wheel.Thief zone wheel is as according to Fig. 4 As shown in, processing tooth or groove 14 in the periphery of wheel 13, if using this Thief zone to take turns, then can be formed in line Time, make vertical crack permeate deeper relative to substrate thickness.Thereby, it is possible to successfully carry out the substrate after line is formed Cut-out operation.If it is, use Thief zone wheel, vertical crack can be made to expand to the 80～90% of substrate thickness Left and right.But, on the other hand, in the case of employing Thief zone wheel, the stress of line forming portion branch residual high pressure, Thus easily produce fragment when cutting off the operation of substrate.

Such as, as it is shown in figure 5, the wheel 13 at Thief zone wheel forms groove 14, when placed substrate is formed line Time, if the interval between groove 14 and the groove 14 relevant to the point of a knife of wheel 13 is set to A, groove 14 is set to C, will The border of A Yu C is set to B, then the distribution of the scoring load to substrate that each position of A, B, C produces, becomes Fig. 5 The curve shown in the latter half.

It is, when taking turns 13 rotation, apply stronger scoring load at the point of a knife boundary member i.e. B with groove 14. And, at the forming part i.e. C of groove 14, become the state without scoring load, thus load distribution line is greatly reduced.

According to described load distribution figure, in employing the delineation operation of substrate of Thief zone wheel, it may occur that pole is not advised The concentration phenomenon of stress then.Therefore, after line is formed, substrate cutting process cannot be cut to straight line, also can Occur section unsmooth and the situation of partial cut face generation damage.Thus as a result, under the quality of the substrate cut off Fall.

And, at the position that line intersects, produce unwanted crackle because of shearing force and the concentration of stress, cut off The corner of substrate easily produce defect or be full of cracks.

In order to solve described problem, if use not for Thief zone wheel, namely take turns periphery slotless 14 Fig. 6 that The ordinary wheel (normal wheel) 3 of sample forms line, then wheel 3 becomes uniform to the compressive load of substrate, but crackle Length of penetration shoals.It is, as it is shown in fig. 7, vertical crack only penetrates into 1/10th left sides of the thickness t of substrate 1 Right.

In order to make vertical crack permeate to the thickness direction of substrate 1, and carry out make use of broken strip (break bar) etc. to cause Pressure or the cutting operation of bending stress.In the case of Gai, when crackle extends to thickness direction from the front end of checking, difficult To ensure the rectilinear propagation of vertical direction, section 24 is formed as a result, lead in the way of deviateing to the left and right as shown in Figure 7 Cause quality is bad.

On the other hand, in the case of the ordinary wheel 3 being not affected by groove processing for point of a knife, the surface of substrate is applied uniform Load, be not susceptible to as Thief zone wheel as stress concentrate or unbalanced stress cause bad.

Therefore, the breakage at the position that line intersects is fewer than Thief zone wheel, and vertical crack is shallower as described, thus cuts Bad worry is there is during disconnected substrate.

[background technology document]

[patent documentation]

[patent documentation 1] Ebrean Registered Patent publication 10-0573986

[patent documentation 2] Ebrean Registered Patent publication 10-1365049

Summary of the invention

[inventing problem to be solved]

The present invention is in order to solve described problem and to invent, and it is an object of the invention to the substrate in order to produce high-quality and produces Product, and use ordinary wheel to make the damage of substrate surface and minimize, and deeper crackle can be produced and supply described general The logical shortcoming taken turns and the advantage only adopting Thief zone wheel.

Another object of the present invention is to the plastic deformation degree of depth of the substrate that control is caused by ordinary wheel, and make vertical crack shape Become deeper.

A further object of the present invention is that the position making line intersect will not produce the damage of substrate.

A further object of the present invention is to utilize servomotor, makes wheel change the plastic deformation degree of depth of substrate, nothing Which kind of brittle base all can be controlled and form optimal line by opinion.

[solving the technological means of problem]

It is a kind of Scribe line forming method in order to solve the main composition of the present invention of described purpose, it is characterised in that: in order to cut Disconnected substrate and form line at the upper surface of substrate, use ordinary wheel, with moulding of the substrate surface that caused by described ordinary wheel The mode that property deforming depth deepens off and on or shoals, advancing divides a word with a hyphen at the end of a line forms line.

It is another feature that: cross the intersection of existing line at follow-up described ordinary wheel, make by rear The plastic deformation degree of depth of the substrate that continuous described ordinary wheel causes is formed more shallow than described existing line.

A further feature of the present disclosure is: uncrossed position of ruling in described substrate, makes to be caused by described ordinary wheel The plastic deformation depth down of substrate.

A further feature of the present disclosure is: the plastic deformation degree of depth of the substrate caused by described ordinary wheel is substrate thickness The degree of depth of 10%～20%.

A further feature of the present disclosure is: described intersection, the plasticity of substrate that caused by follow-up described ordinary wheel Deforming depth is below 2 μm.

It is a feature of the present invention that: the part beyond described cross point, the plasticity of substrate that caused by described ordinary wheel becomes The shape degree of depth is 2～5 μm.

A further feature of the present disclosure is: the plastic deformation degree of depth of substrate being configured to be caused by described ordinary wheel is by servo electricity Motivation controls.

[effect of invention]

Generally, if using ordinary wheel, then only can produce substrate thickness about 10% vertical crack, but according to this Bright, have the advantage that, i.e. take turns comparably with Thief zone, until about 80% generation vertical crack of substrate thickness.

And, in accordance with the invention it is possible to the high-quality substrate that the section of producing substrate to be cut off is the most smooth.

And, according to the present invention, under the accurate control of servomotor, it is possible at random control the plastic deformation of substrate The degree of depth, it is possible to cut off the most impaired for any fragile material.

And, according to the present invention, even if the intersection of the line easily producing damage also can not be impaired cut off, It is thus possible to reduce the loss of substrate and contribute to material and save.

Accompanying drawing explanation

Fig. 1 is the figure of the delineation operation that the present invention is described.

Fig. 2 be illustrate in order to by substrate cutting be desired size use wheel implement delineation operation figure.

Fig. 3 is the figure of another embodiment of explanatory diagram 1.

Fig. 4 is to represent the figure that Thief zone is taken turns.

Fig. 5 is figure Thief zone wheel being described to the scoring load of substrate.

Fig. 6 is the figure representing ordinary wheel.

Fig. 7 is the figure illustrating to implement fracture after the delineation having carried out utilizing ordinary wheel.

Detailed description of the invention

Hereinafter, based on accompanying drawing, the present invention is described in detail.

Fig. 1 be illustrate to utilize wheel 3 the upper surface of substrate 1 carry out delineating under handling situations, caused by wheel 3 The figure of the plastic deformation degree of depth of substrate 1.Delineation operation is the step carried out in the stage before the cut-out of substrate 1, and is to make Form the operation of line at substrate 1 with wheel 3.

As illustrated, according to the present invention, carry out delineating operation when making the wheel 3 upper surface at substrate 1 divide a word with a hyphen at the end of a line Time, make the plastic deformation degree of depth degree of depth of origin-location (substrate do not recover to after being pressed) of substrate 1 the deepest or Relatively shallowly permeate.The regulation of the described plastic deformation degree of depth can be by under the rising of the precision of the wheel 3 that make use of servomotor The control of fall action and realize.

Important reason for this is that of the degree of depth of the plastic deformation area of substrate, if it is possible to know the plastic deformation degree of depth, then can Knowing ultimate value, this ultimate value can make the degree of depth of the vertical crack of substrate be formed deeply to greatest extent.Therefore, according to The present invention, forms line even with ordinary wheel, it is also possible to make the Depth Expansion of vertical crack of substrate to substrate thickness 80%.

Fig. 1 takes turns the part of the shallower entrance of the degree of depth of 3, as shown in Figure 2, is the intersection of line 5 overlap of substrate 1 The part of point 2.At this cross point 2, easily produce parts against wear or easily produce irregular splitting.Thus, exist At this cross point 2, make the plastic deformation depth as shallow of the substrate 1 caused by wheel 3, so that cracking or tiny breakage etc. are damaged The generation of wound minimizes.

In the past, the plastic deformation degree of depth is substrate thickness about the 10% of the substrate caused by wheel is made.In the present invention, by taking turns The plastic deformation degree of depth is substrate thickness more than the 10% of the substrate 1 that 3 cause.

In the present invention, make to be caused by wheel 3 more than the 10% of the thickness that the plastic deformation degree of depth is substrate 1 of substrates 1 deep Degree, if to the degree of depth give scope, then be set to substrate 1 thickness 10%～about 20% the degree of depth.Deep if this Below degree, then cannot successfully cut off, more than this degree of depth, then may also appear in and produce on the thickness direction of substrate 1 The situation of raw undesired crackle, and unwanted power consumption increase, thus owe preferably.In specific embodiment, by general The plastic deformation degree of depth of the substrate 1 that logical wheel 3 causes is preferably about 2～5 μm.If being in this scope, then can Vertical crack is imparted to about the 80% of substrate thickness, the section polish of substrate is obtained attractive in appearance.

Fig. 3 is other embodiments of the plastic deformation degree of depth of the wheel 3 of Fig. 1 substrate 1 when dividing a word with a hyphen at the end of a line.

As illustrated, wheel 3 track of the plastic deformation degree of depth of substrates 1 caused become to rule 5 cross point 2 For the wavy of summit or depict the variously-shaped track such as trapezoidal shape, mountain shape as.

Can be according to the characteristic of fragile material, or according to wanting the size of substrate cut off, before wheel 3 arrival cross points 2, Grasp in advance because the surface of substrate is caused damage to regulate and set the track of line by its peripheral position.Take turns about by described The regulation of the plastic deformation degree of depth of the substrate 1 that 3 cause, it is possible to utilize accurate control of the work of servomotor to regulate.

Therefore, at all events planting the fragile material of material, or in the case of which kind of size substrate 1 is cut to, passing through Regulate the plastic deformation degree of depth of substrates 1 caused by wheel 3, it is possible to substrate 1 is not formed with causing damage have attractive in appearance The line of section.

On the other hand, it is possible to replace the control of the plastic deformation degree of depth of the substrate 1 caused by wheel 3, and utilize wheel 3 to base The stressed change of plate 1 forms line.But, in the case of being somebody's turn to do, because wheel 3 only provides stressed change to substrate 1 Change, so the plastic deformation degree of depth of substrate 1 cannot correctly be controlled.If correctly knowing the substrate 1 caused by wheel 3 The plastic deformation degree of depth, then the damage that can know substrate 1 clearly is to produce because of the plastic deformation degree of depth of which kind of degree, Only then there is the shortcoming that cannot correctly know in plus-pressure.Therefore, the moulding the substrate caused by wheel when line is formed Property deforming depth is controlled the most positively preventing the damage of substrate.

More than as, in accordance with the invention it is possible to the damage that use ordinary wheel makes the surface to substrate is Min., and make The section of substrate becomes attractive in appearance, and, make the breakage of the intersection of line also minimize.

Further, when delineating operation, it is possible to use ordinary wheel to make the vertical crack of substrate deepen, additionally it is possible to suitable Carry out the cut-out of substrate sharply, and prevent the worst: the end portion at the section of substrate produces chip or breakage And section becomes rough.

[explanation of symbol]

1 substrate

2 cross points

3 take turns

5 line

14 grooves

Claims (7)

1. a Scribe line forming method, it is characterised in that: form line in order to cut off substrate at the upper surface of substrate,

Using ordinary wheel, the plastic deformation degree of depth of the substrate surface to be caused by described ordinary wheel deepens off and on or becomes Shallow mode, advancing divides a word with a hyphen at the end of a line forms line.

Scribe line forming method the most according to claim 1, it is characterised in that:

Cross the intersection of existing line at follow-up described ordinary wheel, make to be caused by follow-up described ordinary wheel The plastic deformation degree of depth of substrate formed more shallow than described existing line.

Scribe line forming method the most according to claim 1 and 2, it is characterised in that:

Described substrate is rule uncrossed position, make the plastic deformation degree of depth of the substrate caused by described ordinary wheel Deepen.

Scribe line forming method the most according to claim 1 and 2, it is characterised in that:

The degree of depth of the plastic deformation degree of depth is substrate thickness 10%～the 20% of the substrate caused by described ordinary wheel.

Scribe line forming method the most according to claim 2, it is characterised in that:

Described intersection, the plastic deformation degree of depth of substrate that caused by follow-up described ordinary wheel be 2 μm with Under.

Scribe line forming method the most according to claim 2, it is characterised in that:

Part beyond described cross point, the plastic deformation degree of depth of substrate that caused by described ordinary wheel be 2～5 μm。

Scribe line forming method the most according to claim 1, it is characterised in that:

The plastic deformation degree of depth of substrate being configured to be caused by described ordinary wheel is by servomotor control.