TWI752132B - cutter wheel - Google Patents
cutter wheel Download PDFInfo
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- TWI752132B TWI752132B TW106142883A TW106142883A TWI752132B TW I752132 B TWI752132 B TW I752132B TW 106142883 A TW106142883 A TW 106142883A TW 106142883 A TW106142883 A TW 106142883A TW I752132 B TWI752132 B TW I752132B
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- cutter wheel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明提供一種即使是以較小之劃線荷重亦可形成高滲透且完好之劃線而分斷成端面強度優良之單位製品的切刀輪。 本發明之切刀輪係於圓周面具有由彼此相交之2個斜面3a、3a構成之V字形刀尖脊線4,於該刀尖脊線4之全域以特定之節距P加工出槽部5,將該槽部5與餘下之刀尖脊線部6交替形成,且藉由將節距P設為100~200 μm,將槽部5之長度5a設為3~10 μm,將槽部5之深度5b設為1~3 μm,能夠以較小荷重形成高滲透之劃線S。The present invention provides a cutter wheel that can form a highly permeable and intact scribe line even with a small scribe line load and can be divided into unit products with excellent end face strength. The cutting wheel system of the present invention has a V-shaped cutting edge ridge line 4 formed by two inclined surfaces 3a and 3a intersecting with each other on the circumferential surface, and a groove portion is machined at a specific pitch P in the entire area of the cutting edge ridge line 4 5. The grooves 5 and the remaining edge ridges 6 are alternately formed, and by setting the pitch P to be 100 to 200 μm and the length 5a of the groove 5 to 3 to 10 μm, the grooves The depth 5b of 5 is set to 1 to 3 μm, and a scribe line S with high penetration can be formed with a small load.
Description
本發明係關於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線(切槽)時所使用之切刀輪(亦稱為劃線輪)。The present invention relates to a cutter wheel (also referred to as a scribing wheel) used for processing a scribing line (grooving) for cutting on the surface of a brittle material substrate such as glass or a bonded substrate in which two brittle material substrates are bonded ).
先前,一般已知有一種方法,其係於分斷玻璃基板等脆性材料基板(以下亦稱為「基板」)之加工中,將切刀輪按壓於基板表面而形成劃線,其後,沿劃線自背面側施加外力使基板撓曲,藉此分斷為各單位基板者,例如揭示於專利文獻1中。 對脆性材料基板加工出劃線之切刀輪係使用切刀輪,其於圓周面具有由彼此相交之2個斜面構成之V字形刀尖,於中心具備安裝用軸承孔。 作為上述切刀輪,有平順地精加工出刀尖脊線之切刀輪(以下亦將其稱為「普通切刀輪」),及於刀尖脊線以特定之節距設有槽部(缺口)之切刀輪(以下亦將其稱為「附槽之切刀輪」)。 一面參照圖3一面針對由該等切刀輪形成之劃線進行說明。圖3係顯示形成於基板之劃線之肋紋及垂直裂紋裂紋者,圖3(a)係沿劃線方向之剖視圖,圖3(b)係沿與劃線正交方向之剖視圖。 劃線S係由基板表面之切刀輪之咬入痕跡即塑性變形區域,及產生於塑性變形區域正下方且於基板W之厚度方向滲透之垂直裂紋8而形成。於垂直裂紋8之上部遍及特定之深度產生稱為肋紋7之特徵性痕跡。圖3之L1表示自基板W表面之肋紋量(深度),L2係表示自基板W表面之垂直裂紋量(滲透深度)者。 利用普通切刀輪,雖可於劃線時形成完好之槽面,但另一方面,有對基板表面之咬入力較小而刀尖易滑動之缺點。因此,由基板之端面自內側開始劃線之情形時,不易於劃線開始後立即產生垂直裂紋,又,若為形成較深之垂直裂紋而增大劃線荷重,則於基板表面產生在水平方向延伸之不規則龜裂,或於槽部產生傷痕,使得不良品之產生頻率變高。 相對於此,於刀尖脊線設有槽部(切口)之切刀輪中,槽部與刀尖脊線部(凸部)係交替形成。藉此,與普通切刀輪相比可對基板施加較高之劃線荷重,可由充分深之垂直裂紋形成劃線,且可抑制向不規則方向裂開或水平裂紋之產生。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第3787489號公報In the past, a method has been generally known in which a cutting wheel is pressed against the surface of the substrate to form a scribe line in the process of dividing a brittle material substrate such as a glass substrate (hereinafter also referred to as a "substrate"), and thereafter, a scribe line is formed along the surface of the substrate. The scribe line is disclosed in
近年來,由於將玻璃基板分斷加工而得之液晶面板等單位製品之小型化及精密化,而要求切斷面之端面強度優良之高精度之分斷。因此,需要能以更小之劃線荷重加工出高滲透之完好的劃線之附槽之切刀輪。 尤其如圖6、7所示,在將2片玻璃基板W、W經由密封部10貼合、且具有由該密封部10區分成格子狀之複數個液晶注入區域11之貼合基板中,於密封部10之正上方,使用切刀輪12於玻璃基板W加工出劃線S之情形時,有因密封部10之彈性等而使得切刀輪12之咬入變差,而於通常之劃線荷重下無法充分形成肋紋或垂直裂紋之問題。又,若增大劃線荷重,則玻璃基板W之撓曲變大,於基板表面產生在水平方向延伸之不規則龜裂,或於槽部產生傷痕等破損,使得不良品之產生頻率變高。
In recent years, due to the miniaturization and precision of unit products such as liquid crystal panels obtained by cutting glass substrates, high-precision cutting with excellent end surface strength of the cut surface is required. Therefore, there is a need for a grooved cutter wheel capable of producing a high penetration, sound scribe with a lower scribe load. In particular, as shown in FIGS. 6 and 7 , in a bonded substrate having a plurality of liquid
因此,本發明之目的係提供一種切刀輪,其即使以小於先前之劃線荷重,亦可對玻璃等脆性材料基板形成高滲透之完好的劃線,藉此可分斷成端面強度優良之單位製品。 Therefore, the object of the present invention is to provide a cutter wheel, which can form a highly permeable and intact scribe line on a brittle material substrate such as glass even with a lower scribing load than the previous scribing load. unit product.
為解決上述問題,本發明係講求如下之技術方法。即,本發明係圓板狀之切刀輪,於圓周面具有由彼此相交之2個斜面所成之V字形刀尖脊線,以特定之節距對該刀尖脊線之全域加工出槽部,且上述槽部與餘下之刀尖脊線部交替形成,且以上述節距為100~200μm、上述槽部之長度為3~10μm、上述槽部之深度為1~3μm之範圍而構成。 In order to solve the above-mentioned problems, the present invention requires the following technical methods. That is, the present invention is a circular plate-shaped cutter wheel with a V-shaped cutting edge ridge line formed by two inclined surfaces intersecting with each other on the circumferential surface, and the entire area of the cutting edge ridge line is machined at a specific pitch. The grooves and the remaining edge ridges are alternately formed, and the pitch is 100 to 200 μm, the length of the grooves is 3 to 10 μm, and the depth of the grooves is in the range of 1 to 3 μm. .
此處,較佳為將上述切刀輪之直徑設為1~5mm,將上述2個斜面相交之刀尖角度設為90~120°。 Here, it is preferable that the diameter of the cutter wheel is set to 1 to 5 mm, and the angle of the blade edge at which the two inclined surfaces intersect is set to be 90 to 120°.
於本發明之切刀輪中,藉由以上述條件構成,即使為以較低之劃線荷重亦可確實咬入基板而形成肋紋,且形成分斷所需要之高滲透之垂直裂紋。藉此,可於裂斷時以無傷痕之完好的分斷面進行裂斷,可獲得端面強度優良之單位製品。 In the cutter wheel of the present invention, by being constituted under the above-mentioned conditions, even with a low scribing load, it is possible to reliably bite into the substrate to form ribs, and to form vertical cracks with high penetration required for slicing. Thereby, it can be fractured with an intact fractured surface without scratches, and a unit product with excellent end face strength can be obtained.
尤其,於經由密封部將2片玻璃基板貼合之貼合基板中,於密封部正上方對玻璃基板加工出劃線之情形時,有如下效果:不受密封部存在之影響,能以較小之劃線荷重加工出具有較深肋紋與高滲透之垂直裂紋之劃線,可於端面強度優良之分斷面進行裂斷。 In particular, in a bonded substrate in which two glass substrates are bonded through a sealing portion, when a scribe line is processed on the glass substrate just above the sealing portion, the following effects are obtained: it is not affected by the presence of the sealing portion and can be more A small scribing load produces a scribing line with deep ribs and high penetration vertical cracks, which can be broken at the subsection with excellent end face strength.
於本發明中,較佳為以上述槽部之深度之3倍鄰近值之尺寸形成上述槽部之長度。 藉此,刀尖脊線部向基板咬入與槽部之底部之抑制咬入可平衡良好地作用,可有效地形成具有高滲透之垂直裂紋之劃線。In this invention, it is preferable to form the length of the said groove part with the dimension which is three times the adjacent value of the depth of the said groove part. As a result, the bite of the ridge line of the blade edge into the substrate and the bite inhibition of the bottom of the groove can be well balanced, and a scribe line with a high penetration vertical crack can be effectively formed.
以下,基於圖式針對本發明之附槽之切刀輪詳細說明。 圖1係顯示本發明之附槽之切刀輪A之立體圖,圖2係其側視圖及前視圖。該附槽之切刀輪A係由工具特性優良之金屬材料、例如超硬合金或燒結金剛石、單結晶金剛石等製作,於圓板狀主體1之中心之具有安裝用軸承孔2,於圓周面形成有由彼此相交之左右斜面3a、3a構成之刀尖脊線4。附槽之切刀輪A之直徑D係選自1~5 mm者,但於本實施形態中,以直徑D為2 mm、左右斜面3a、3a相交之刀尖角度α為105°形成,且以厚度為650 μm、軸承孔2之內徑為0.8 mm形成。 再者,本發明之附槽之切刀輪A係以特定之節距P於刀尖脊線4之全域加工出槽部5…,且藉由交替形成該槽部5與餘下之刀尖脊線6而構成。 於本實施例中,將槽部5之節距P設為0.126 mm,以槽部5之深度5b為1.5 μm、槽部5之圓周方向之長度5a為槽部5之深度5b的約3倍之4.4μm形成。該情形時,刀尖脊線部6之圓周方向之長度6a為自節距P減去槽部5之長度5a之尺寸。另,於圖式中,為易於理解,將而槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與實際尺寸之比率不同地表示。 於直徑2 mm之切刀輪中,可藉由將其全周50分割而獲得槽部5之126 μm尺寸之節距P。以式表示如下: P=πD/n 其中,D為切刀輪之直徑(mm),n為切刀輪全周之分割數。 又,用以獲得期望之節距P之尺寸0.126 mm之分割數n為: P=πD/P ,於例如直徑3 mm之切刀輪中,用以獲得期望之節距P之尺寸0.126 mm之分割數由上述計算式得出為約75分割。 同樣地,於直徑4 mm之切刀輪中,用以獲得期望之節距P之尺寸0.126 mm之分割數約為100分割。 將如上構成之附槽之切刀輪A安裝於圖8所示之劃線裝置B之劃線頭13,一面按壓於載置於平台14上之基板W之表面一面使其相對直線移動,藉此於基板W表面加工出分斷用劃線S。 此時,於本發明之附槽之切刀輪A中,藉由以上述構成為條件,如圖4所示,即使在不易於基板形成垂直裂紋之劃線低荷重般之條件下,亦可確實咬入基板W,可形成分斷所需要之高滲透之垂直裂紋。 圖4係顯示準備上述50分割之附槽之切刀輪A,及具有與該附槽之切刀輪A同為2 mm直徑、同為105°刀尖角度之附槽之切刀輪分別5分割、200分割、600分割者,以0.02、0.03及0.04 MPa之劃線荷重,對玻璃基板W各進行複數次劃線試驗時之肋紋量L1、及垂直裂紋量L2之平均值者。另,將5分割、200分割及600分割時之槽部5之長度5a及深度5b設為與50分割之附槽之切刀輪A相同。又,5分割、200分割及600分割時之節距分別計算後為1256 μm、31.4 μm、10.5 μm。又,成為加工對象之玻璃基板W係使用厚度0.2 mm之單板。 再者,圖5係以曲線圖表示圖4之各數值資料者,圖5(a)係顯示自基板表面之肋紋深度者,圖5(b)係顯示自基板表面之包含肋紋之垂直裂紋之深度者。 藉此,於本發明之50分割之附槽之切刀輪A中,於0.02 MPa之較低劃線荷重區域,檢測出與其他者相比最深之30 μm以上之肋紋量L1。且,雖為0.02 MPa之較低劃線荷重,但垂直裂紋量L2較其他更大,檢測出141.46 μm之數值。由該試驗資料可知,即使為0.02 MPa之低劃線荷重,亦確實地於玻璃基板W形成肋紋,且形成分斷所需要之高滲透之垂直裂紋。藉此,於裂斷時不會使基板大幅撓曲,能以完好的分斷面進行裂斷,且可獲得端面強度優良之單位製品。 尤其在經由密封部將2片玻璃基板貼合之貼合基板中,於密封部正上方對玻璃基板加工出劃線之情形時,可不受密封部存在之影響,以較小之劃線荷重加工出較深之垂直裂紋,而極其有效。 又,由於槽部相對於脊線之長度之比例較小,故可有效地形成較深之垂直裂紋並同時抑制端面強度降低。 另,雖省略試驗資料之提示,但在具有與上述直徑2 mm之附槽之切刀輪A相同之槽的深度與長度、且以相同槽節距經75分割之直徑3 mm的附槽之之切刀輪,或經100分割之直徑4 mm的附槽之切刀輪之情形下,亦可形成具有如與上述直徑2 mm的附槽之切刀輪A相仿的深度之肋紋與高滲透垂直裂紋之完好的劃線。 上述之附槽之切刀輪A之槽部5之節距P,及槽部5之長度5a及深度5b之數值係作為最佳例而表示者,本發明不限於上述數值,可於以下之範圍內實施。即,可於節距P為100~200 μm、槽部5之長度5a為3~10 μm、深度5b為1~3 μm之範圍內實施。又,刀尖角度α亦非特定為105°,可容許90~120°之範圍內者。再者,槽部5之側面形狀亦可取代圖示之梯形狀,而設為V字形狀或圓弧形狀。 以上已針對發明之代表性實施例進行說明,但本發明並非特定為上述實施形態,可於達成本發明之目的且不脫離申請專利範圍之範疇內適當修正、變更。 [產業上之可利用性] 本發明可較佳應用於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線時使用之切刀輪。Hereinafter, the grooved cutter wheel of the present invention will be described in detail based on the drawings. FIG. 1 is a perspective view showing a grooved cutter wheel A of the present invention, and FIG. 2 is a side view and a front view thereof. The grooved cutter wheel A is made of a metal material with excellent tool properties, such as superhard alloy, sintered diamond, single crystal diamond, etc., and has a mounting bearing
1‧‧‧主體2‧‧‧軸承孔3a‧‧‧斜面4‧‧‧刀尖脊線5‧‧‧槽部5a‧‧‧槽部之長度5b‧‧‧槽部之深度6‧‧‧刀尖脊線部6a‧‧‧刀尖脊線部之長度7‧‧‧肋紋8‧‧‧垂直裂紋10‧‧‧密封部11‧‧‧液晶注入區域12‧‧‧切刀輪13‧‧‧劃線頭14‧‧‧平台A‧‧‧附槽之切刀輪B‧‧‧劃線裝置D‧‧‧直徑L1‧‧‧肋紋量L2‧‧‧垂直裂紋量P‧‧‧節距S‧‧‧劃線W‧‧‧基板α‧‧‧刀尖角度1‧‧‧
圖1係本發明之附槽之切刀輪之立體圖。 圖2(a)、(b)係本發明之附槽之切刀輪之側視圖與前視圖。 圖3(a)、(b)係顯示形成於脆性材料基板之劃線之剖視圖。 圖4係顯示使用分割數不同之附槽之切刀輪之劃線試驗資料之圖。 圖5(a)、(b)係以曲線圖表示圖4之數值資料之圖。 圖6係顯示成為加工對象之貼合基板之俯視圖。 圖7係圖6之剖視圖。 圖8係概略性顯示劃線裝置之前視圖。FIG. 1 is a perspective view of the cutter wheel with grooves of the present invention. Figures 2(a) and (b) are side and front views of the grooved cutter wheel of the present invention. 3(a) and (b) are cross-sectional views showing scribe lines formed on a brittle material substrate. FIG. 4 is a graph showing the data of the scribing test using the cutter wheel with grooves with different division numbers. Figures 5(a) and (b) are graphs showing the numerical data of Figure 4 as graphs. FIG. 6 is a plan view showing a bonded substrate to be processed. FIG. 7 is a cross-sectional view of FIG. 6 . FIG. 8 is a schematic diagram showing the front view of the scribing device.
1‧‧‧主體 1‧‧‧Subject
3a‧‧‧斜面 3a‧‧‧Slope
5‧‧‧槽部 5‧‧‧Slots
5a‧‧‧槽部之長度 5a‧‧‧Length of groove
5b‧‧‧槽部之深度 5b‧‧‧Depth of groove
6‧‧‧刀尖脊線部 6‧‧‧Ridge of blade tip
6a‧‧‧刀尖脊線部之長度 6a‧‧‧Length of the ridge line of the blade tip
D‧‧‧直徑 D‧‧‧diameter
P‧‧‧節距 P‧‧‧ pitch
α‧‧‧刀尖角度 α‧‧‧Tool nose angle
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JP2012006832A (en) * | 2005-07-06 | 2012-01-12 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel for brittle material, and method for scribing, apparatus for scribing, and tool for scribing each using the same |
CN105461207A (en) * | 2014-09-30 | 2016-04-06 | 三星钻石工业股份有限公司 | Cutting method and cutting device |
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JP3074143B2 (en) * | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
TW308581B (en) * | 1995-11-06 | 1997-06-21 | Mitsuboshi Diamond Kogyo Kk | |
JP2989602B1 (en) * | 1999-01-28 | 1999-12-13 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
JP3787489B2 (en) | 2000-10-02 | 2006-06-21 | 三星ダイヤモンド工業株式会社 | Method and apparatus for breaking brittle substrate |
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KR20120068976A (en) * | 2004-02-02 | 2012-06-27 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Scribing method and cutting method for fragile material substrate |
KR101307277B1 (en) * | 2004-07-16 | 2013-09-11 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Cutter wheel and method of manufacturing the same, manual scribing tool, and scribing device |
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