TWI752133B - cutter wheel - Google Patents
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- TWI752133B TWI752133B TW106142885A TW106142885A TWI752133B TW I752133 B TWI752133 B TW I752133B TW 106142885 A TW106142885 A TW 106142885A TW 106142885 A TW106142885 A TW 106142885A TW I752133 B TWI752133 B TW I752133B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明提供一種切刀輪,其可形成確實對基板咬入之高滲透且完好的劃線,藉此可分斷成端面強度優良之單位製品。 The present invention provides a cutter wheel which can form a highly permeable and perfect scribe line that can surely bite into a substrate, thereby being able to be divided into unit products with excellent end face strength.
本發明之切刀輪係於圓周面具有由彼此相交之2個斜面3a、3a構成之V字形刀尖脊線4,於該刀尖脊線4之全域以特定之節距P加工出槽部5,該槽部5與餘下之刀尖脊線部6交替形成,槽部5之深度5b為1~3μm,該槽部5之長度5a以槽部5之深度5b之3.5~8倍形成,刀尖脊線部6之長度6a以5~15μm形成,藉此可形成無傷痕且高滲透之劃線S。 The cutting wheel system of the present invention has a V-shaped cutting edge ridge line 4 formed by two inclined surfaces 3a and 3a intersecting with each other on the circumferential surface, and a groove portion is machined at a specific pitch P in the entire area of the cutting edge ridge line 4 5. The groove portion 5 is alternately formed with the remaining blade edge ridge line portions 6, the depth 5b of the groove portion 5 is 1-3 μm, and the length 5a of the groove portion 5 is formed by 3.5-8 times the depth 5b of the groove portion 5, The length 6a of the blade edge ridge portion 6 is formed at 5 to 15 μm, whereby a scratch-free and highly permeable scribe line S can be formed.
Description
本發明係關於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線(切槽)時所使用之切刀輪(亦稱為劃線輪)。The present invention relates to a cutter wheel (also referred to as a scribing wheel) used for processing a scribing line (grooving) for cutting on the surface of a brittle material substrate such as glass or a bonded substrate in which two brittle material substrates are bonded ).
先前,一般已知有一種方法,其係於分斷玻璃基板等脆性材料基板(以下亦稱為「基板」)之加工中,將切刀輪按壓於基板表面而形成劃線,其後,沿劃線自背面側施加外力使基板撓曲,藉此分斷為各單位基板者,例如揭示於專利文獻1中。 對脆性材料基板加工出劃線之切刀輪係使用切刀輪,其於直徑1~4 mm之圓板體之圓周面具有由彼此相交之2個斜面構成之V字形刀尖,於中心具備安裝用軸承孔。 作為上述切刀輪,有平順地精加工出刀尖脊線之切刀輪(以下將其稱為「普通切刀輪」),及於刀尖脊線以特定之節距設有槽部(缺口)之切刀輪(以下將其稱為「附槽之切刀輪」)。於後者之附槽之切刀輪中,一般將槽部之節距形成為例如20~200 μm,將沿槽部之刀尖脊線方向之長度以相對於槽之深度為1.5~2.5倍之比率形成。 一面參照圖3一面針對由該等切刀輪形成之劃線進行說明。圖3係顯示形成於基板之劃線之肋紋及垂直裂紋者,圖3(a)係沿劃線方向之剖視圖,圖3(b)係沿與劃線正交方向之剖視圖。 劃線S係由基板表面之切刀輪之咬入痕跡即塑性變形區域,及產生於塑性變形區域正下方且於基板W之厚度方向滲透之垂直裂紋8而形成。於垂直裂紋8之上部遍及特定之深度產生稱為肋紋7之特徵性痕跡。圖3之L1表示自基板W表面之肋紋量(深度),L2係表示自基板W表面之垂直裂紋量(滲透量)者。 利用普通切刀輪,雖可於劃線時形成完好之槽面,但另一方面,有對基板表面之咬入力較小而刀尖易滑動之缺點。相對於此,於刀尖脊線設有槽部(切口)之附槽之切刀輪中,藉由將槽部與刀尖脊線部(凸部)交替形成,而能夠以與普通切刀輪相比較高之劃線荷重咬入基板表面,可由上述肋紋或垂直裂紋有效地形成劃線。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第3787489號公報In the past, a method has been generally known in which a cutting wheel is pressed against the surface of the substrate to form a scribe line in the process of dividing a brittle material substrate such as a glass substrate (hereinafter also referred to as a "substrate"), and thereafter, a scribe line is formed along the surface of the substrate. The scribe line is disclosed in
然而,即使是上述附槽之切刀輪,液晶顯示面板等貼合基板之密封部正上方之劃線之加工仍有問題。 圖7及圖8係顯示分斷前之液晶顯示面板之母板者,其係將2片大面積玻璃基板W、W,即形成有驅動液晶之薄膜電晶體TFT(Thin Film Transistor)等電子元件之玻璃基板與形成有對向電極之玻璃基板,以形成複數個液晶注入區域11之方式經由密封部10貼合而形成。且,近年來,於該密封部10之正上方位置,對大面積玻璃基板W以切刀輪12加工出劃線S,於下個步驟中從劃線S分斷成單位製品。However, even with the above-mentioned grooved cutter wheel, there is still a problem in the processing of the scribe line just above the sealing portion of the liquid crystal display panel, etc., which is attached to the substrate. Figures 7 and 8 show the mother board of the liquid crystal display panel before splitting, which are two large-area glass substrates W and W, that is, electronic components such as thin film transistors (TFT (Thin Film Transistor)) that drive liquid crystals are formed The glass substrate and the glass substrate on which the counter electrode is formed are formed by bonding together through the
於該密封部10之正上方,使用切刀輪12對玻璃基板W加工出劃線S之情形時,若以先前之附槽之切刀輪,有因密封部10之素材所具有之彈性或因密封所致之基板的內部應力變化,而易於基板表面產生於水平方向延伸之不規則龜裂(水平裂紋),或無法充分形成垂直裂紋之問題。若垂直裂紋不充分,則於劃線時無法分斷,或於分斷面產生傷痕等破壞,因而發生端面強度劣化等問題,使得不良品之產生頻率變高。
When using the
因此,本發明之目的在於提供一種切刀輪,其對於玻璃等脆性材料基板之水平裂紋較少,可形成高滲透之劃線,藉此可分斷成端面強度優良之單位製品。 Therefore, the object of the present invention is to provide a cutter wheel which has less horizontal cracks on substrates of brittle materials such as glass, and can form highly permeable scribe lines, thereby being able to cut into unit products with excellent end face strength.
為解決上述問題,本發明係採取如下之技術方式。即,本發明之切刀輪係圓板狀之切刀輪,於圓周面具有由彼此相交之2個斜面構成之V字形刀尖脊線,以特定之節距對該刀尖脊線之全域加工出槽部,上述槽部與餘下之刀尖脊線部交替形成,且構成為上述槽部之深度以1~3μm形成,該槽部之長度以該槽部之深度之3.5~8倍形成,上述刀尖脊線部之長度以5~15μm形成。 In order to solve the above-mentioned problems, the present invention adopts the following technical means. That is, the cutter wheel of the present invention is a disc-shaped cutter wheel, and has a V-shaped blade edge ridge line composed of two inclined surfaces intersecting with each other on the circumferential surface, and the entire area of the blade edge ridge line is at a specific pitch. The grooves are machined, and the grooves and the remaining ridge lines of the cutting edge are alternately formed, and the depth of the grooves is formed at 1 to 3 μm, and the length of the grooves is formed by 3.5 to 8 times the depth of the grooves. , the length of the above-mentioned blade edge ridge line is formed with 5~15μm.
此處,較佳為將上述切刀輪之直徑設為1~5mm,將上述2個斜面相交之刀尖角度設為90~120°。 Here, it is preferable that the diameter of the cutter wheel is set to 1 to 5 mm, and the angle of the blade edge at which the two inclined surfaces intersect is set to be 90 to 120°.
根據如上構成之切刀輪,刀尖脊線部之邊緣咬入基板而形成較深的肋紋,且可形成分斷所需之高滲透之垂直裂紋。尤其於本發明中,由於將槽部之長度增長為該槽部之深度之3~8倍,故使荷重集中於刀尖脊線部,即使於垂直裂紋不易於基板滲透之條件下,亦可高滲透加工出劃線,且抑制水平裂紋之產生。藉此,可於下一裂斷步驟中以完好的分斷面進行裂斷,有可獲得端面強度優良之單位製品之效果。According to the cutter wheel constructed as above, the edge of the ridge line portion of the blade edge bites into the substrate to form deep ribs, and can form vertical cracks with high penetration required for cutting. Especially in the present invention, since the length of the groove portion is increased by 3 to 8 times the depth of the groove portion, the load is concentrated on the ridgeline portion of the cutting edge, and even under the condition that the vertical crack is not easy to penetrate the substrate, it can be High penetration processing to scribe lines, and inhibit the generation of horizontal cracks. Thereby, in the next breaking step, it is possible to break with an intact broken surface, and there is an effect that a unit product with excellent end face strength can be obtained.
以下基於圖式,對本發明之附槽切刀輪詳細說明。 圖1係顯示本發明之附槽之切刀輪A之側視圖,圖2係其前視圖。另,將圖1之以圓包圍之區域於該圖右上放大顯示。該附槽之切刀輪A係由工具特性優良之金屬材料,例如超硬合金或燒結金剛石、單結晶金剛石等製作,於圓板狀的主體1之中心具有安裝用軸承孔2,於圓周面形成有由彼此相交之左右斜面3a、3a構成之刀尖脊線4。附槽之切刀輪A之直徑D係選自2~4 mm者,但於本實施形態中,將直徑D設為2 mm。又,以左右斜面3a、3a相交之刀尖角度α為100°或105°、厚度為650 μm、軸承孔2之內徑為0.8 mm形成。 再者,本發明之附槽之切刀輪A係以特定之節距於刀尖脊線4之全域加工出槽部5…,藉由交替形成該槽部5與餘下之刀尖脊線6而構成。 根據本發明之附槽之切刀輪A之第1實施形態,將切刀輪全周275分割而形成槽部,將該槽部5之深度5b設為2.5μm,將槽部5之圓周方向之長度5a設為深度5b之約4.5倍之11.5 μm,將刀尖脊線部6之圓周方向之長度6a以12.5 μm形成。又,將2個斜面3a、3a相交之刀尖角度α設為100°。以下,將該第1實施形態之附槽之切刀輪設為No.1。 於第2實施形態中,槽部5之分割數、槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與輪No.1相同,將刀尖角度α設為105°。以下,將其設為輪No.2。 於第3實施形態中,槽部5之分割數為275,將該槽部5之深度5b設為3 μm,將槽部5之長度5a設為11.5 μm,將刀尖脊線部6之長度6a以12.5 μm形成。又,將刀尖角度α設為100°。以下,將其設為輪No.3。 於第4實施形態中,槽部5之分割數、槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與輪No.3相同,將刀尖角度α設為105°。以下,將其設為輪No.4。 於第1比較例中,槽部5之分割數為300,將該槽部5之深度5b設為3 μm,將槽部5之長度5a設為9 μm,將刀尖脊線部6之長度6a以8.5 μm形成。又,將刀尖角度α設為100°。以下,將其設為輪No.5。 於第2比較例中,槽部5之分割數、槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與輪No.5相同,將刀尖角度α設為105°。以下,將其設為輪No.6。 將如上構成之附槽之切刀輪A安裝於圖9所示之劃線裝置B之劃線頭13,一面按壓於載置於平台14上之玻璃基板W之表面一面使其相對直線移動,藉此於基板W之表面加工出分斷用劃線S。 此時,於上述之輪No.1~6之附槽之切刀輪A中,任一者皆如圖4、5所示,可於玻璃基板W形成肋紋,且可形成垂直裂紋。 圖4係顯示將輪No.1~6之各附槽之切刀輪A分別以0.05 MPa、0.06 MPa、0.07 MPa之劃線荷重,對玻璃基板W各進行複數次劃線試驗時之肋紋量L1及垂直裂紋量L2之平均值者。另,成為加工對象之玻璃基板W係使用厚度0.2 mm者。 再者,圖5係以曲線圖表示圖4之各數值資料者,圖5(a)係顯示自基板表面之肋紋深度者,圖5(b)係顯示自基板表面之包含肋紋之垂直裂紋之深度者。 又,圖6係以條形圖表示自各附槽之切刀輪A之劃線荷重之觀點來看之劃線形成區域者。 藉此,於本發明之輪No.1~6之附槽之切刀輪A中,檢測出最低42.99 μm至最高62.99 μm之較深的肋紋量L1。又,即使是垂直裂紋量L2,亦檢測出最低174.20 μm至最高190.12 μm之高滲透數值。由該試驗資料可知,確實於玻璃基板W形成肋紋,且形成分斷所需之垂直裂紋。 此處,由圖6可知,對於刀尖角度100°之No.1、3、5,由比較低之荷重形成肋紋,且產生垂直裂紋。但於比較例之No.5中,所有的區域之垂直裂紋皆比較淺,尤其於低荷重側之0.05 MPa下差異變大。因此認為,即使以相同荷重進行劃線,No.1、3更有效率地對基板傳遞荷重。 於本試驗條件下,此種傾向以刀尖角度100°尤其顯著,但在變更基板厚度等之劃線條件下,刀尖角度105°時亦發現相同傾向。 如此,藉由將槽部5之長度5a增長為槽部5之深度5b之3.5~8倍,則荷重集中於刀尖脊線部6之邊緣,即使於劃線區域之低荷重側亦可效率良好地形成較深的垂直裂紋,且不易因多餘荷重而產生水平裂紋。 通常,於密封上之劃線中,垂直裂紋不易因基板之內部應力之變化而進入,另一方面易產生水平裂紋。但以如圖4所示之劃線形成區域之0.05 MPa之比較低的劃線荷重,可容易地高滲透加工出劃線S。藉此,可抑制水平裂紋之產生,於下一裂斷步驟中能以完好的分斷面進行裂斷,可獲得端面強度優良之單位製品。 另,雖省略試驗資料之提示,但於具有與上述直徑2 mm之附槽之切刀輪A相同之刀尖構成之直徑3 mm之附槽之切刀輪、或直徑4 mm之附槽之切刀輪之情形時,亦可形成如與上述直徑2 mm之附槽之切刀輪A相仿之具有較深的肋紋與高滲透的垂直裂紋之完好的劃線。 上述之附槽之切刀輪A之槽部5之長度5a及深度5b之數值係作為最佳例而表示者,本發明不限於上述數值,可於以下之範圍內實施。即,可於槽部5之深度5b為1~3 μm、槽部5之長度5a為深度5b之3.5~8倍、刀尖脊線部之長度為5~15μm之範圍內實施。又,亦可容許刀尖角度α為90~120°之範圍內者。再者,槽部5之側面形狀亦可取代圖1所示之梯形狀,而設為V字形狀或圓弧形狀。 以上已針對本發明之代表性實施例進行說明,但本發明並非特定為上述實施形態,可於達成本發明之目的且不脫離申請專利範圍之範疇內適當修正、變更。 [產業上之可利用性] 本發明可較佳應用於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線時所使用之切刀輪。Hereinafter, the grooved cutter wheel of the present invention will be described in detail based on the drawings. Fig. 1 is a side view showing the grooved cutter wheel A of the present invention, and Fig. 2 is a front view thereof. In addition, the area enclosed by the circle in FIG. 1 is enlarged and displayed at the upper right of the figure. The cutter wheel A with grooves is made of metal materials with excellent tool properties, such as cemented carbide, sintered diamond, single crystal diamond, etc., and has a mounting bearing
1‧‧‧主體2‧‧‧軸承孔3a‧‧‧斜面4‧‧‧刀尖脊線5‧‧‧槽部5a‧‧‧槽部之長度5b‧‧‧槽部之深度6‧‧‧刀尖脊線部6a‧‧‧刀尖脊線部之長度7‧‧‧肋紋8‧‧‧垂直裂紋10‧‧‧密封部11‧‧‧液晶注入區域12‧‧‧切刀輪13‧‧‧劃線頭14‧‧‧平台A‧‧‧切刀輪B‧‧‧劃線裝置D‧‧‧直徑L1‧‧‧肋紋量L2‧‧‧垂直裂紋量S‧‧‧劃線W‧‧‧脆性材料基板α‧‧‧刀尖角度1‧‧‧
圖1係本發明之附槽之切刀輪之側視圖。 圖2係本發明之附槽之切刀輪之前視圖。 圖3(a)、(b)係顯示形成於脆性材料基板之劃線之剖視圖。 圖4係顯示使用本發明之附槽之切刀輪之劃線試驗資料之圖。 圖5(a)、(b)係以曲線圖表示圖4之數值資料之圖。 圖6以條形圖表示本發明之附槽之切刀輪之劃線形成區域之圖。 圖7係顯示成為加工對象之貼合基板之俯視圖。 圖8係圖6之剖視圖。 圖9係概略性顯示劃線裝置之前視圖。FIG. 1 is a side view of the grooved cutter wheel of the present invention. Figure 2 is a front view of the grooved cutter wheel of the present invention. 3(a) and (b) are cross-sectional views showing scribe lines formed on a brittle material substrate. FIG. 4 is a graph showing scribing test data using the grooved cutter wheel of the present invention. Figures 5(a) and (b) are graphs showing the numerical data of Figure 4 as graphs. FIG. 6 is a bar graph showing a scribe line forming area of the grooved cutter wheel of the present invention. FIG. 7 is a plan view showing a bonded substrate to be processed. FIG. 8 is a cross-sectional view of FIG. 6 . Fig. 9 is a schematic diagram showing a front view of the scribing device.
1:主體 1: main body
2:軸承孔 2: Bearing hole
5:槽部 5: Groove
5a:槽部之長度 5a: Length of groove
5b:槽部之深度 5b: Depth of groove
6:刀尖脊線部 6: Blade tip ridge line
6a:刀尖脊線部之長度 6a: The length of the ridge line of the blade tip
A:切刀輪 A: Cutter wheel
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JP2012006832A (en) * | 2005-07-06 | 2012-01-12 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel for brittle material, and method for scribing, apparatus for scribing, and tool for scribing each using the same |
CN105461207A (en) * | 2014-09-30 | 2016-04-06 | 三星钻石工业股份有限公司 | Cutting method and cutting device |
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JP3074143B2 (en) * | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
JP2989602B1 (en) * | 1999-01-28 | 1999-12-13 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
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