TWI752133B - cutter wheel - Google Patents

cutter wheel Download PDF

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Publication number
TWI752133B
TWI752133B TW106142885A TW106142885A TWI752133B TW I752133 B TWI752133 B TW I752133B TW 106142885 A TW106142885 A TW 106142885A TW 106142885 A TW106142885 A TW 106142885A TW I752133 B TWI752133 B TW I752133B
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Taiwan
Prior art keywords
cutter wheel
substrate
groove portion
length
depth
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TW106142885A
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Chinese (zh)
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TW201825418A (en
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地主貴裕
阿部浩
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日商三星鑽石工業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

本發明提供一種切刀輪,其可形成確實對基板咬入之高滲透且完好的劃線,藉此可分斷成端面強度優良之單位製品。 The present invention provides a cutter wheel which can form a highly permeable and perfect scribe line that can surely bite into a substrate, thereby being able to be divided into unit products with excellent end face strength.

本發明之切刀輪係於圓周面具有由彼此相交之2個斜面3a、3a構成之V字形刀尖脊線4,於該刀尖脊線4之全域以特定之節距P加工出槽部5,該槽部5與餘下之刀尖脊線部6交替形成,槽部5之深度5b為1~3μm,該槽部5之長度5a以槽部5之深度5b之3.5~8倍形成,刀尖脊線部6之長度6a以5~15μm形成,藉此可形成無傷痕且高滲透之劃線S。 The cutting wheel system of the present invention has a V-shaped cutting edge ridge line 4 formed by two inclined surfaces 3a and 3a intersecting with each other on the circumferential surface, and a groove portion is machined at a specific pitch P in the entire area of the cutting edge ridge line 4 5. The groove portion 5 is alternately formed with the remaining blade edge ridge line portions 6, the depth 5b of the groove portion 5 is 1-3 μm, and the length 5a of the groove portion 5 is formed by 3.5-8 times the depth 5b of the groove portion 5, The length 6a of the blade edge ridge portion 6 is formed at 5 to 15 μm, whereby a scratch-free and highly permeable scribe line S can be formed.

Description

切刀輪cutter wheel

本發明係關於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線(切槽)時所使用之切刀輪(亦稱為劃線輪)。The present invention relates to a cutter wheel (also referred to as a scribing wheel) used for processing a scribing line (grooving) for cutting on the surface of a brittle material substrate such as glass or a bonded substrate in which two brittle material substrates are bonded ).

先前,一般已知有一種方法,其係於分斷玻璃基板等脆性材料基板(以下亦稱為「基板」)之加工中,將切刀輪按壓於基板表面而形成劃線,其後,沿劃線自背面側施加外力使基板撓曲,藉此分斷為各單位基板者,例如揭示於專利文獻1中。 對脆性材料基板加工出劃線之切刀輪係使用切刀輪,其於直徑1~4 mm之圓板體之圓周面具有由彼此相交之2個斜面構成之V字形刀尖,於中心具備安裝用軸承孔。 作為上述切刀輪,有平順地精加工出刀尖脊線之切刀輪(以下將其稱為「普通切刀輪」),及於刀尖脊線以特定之節距設有槽部(缺口)之切刀輪(以下將其稱為「附槽之切刀輪」)。於後者之附槽之切刀輪中,一般將槽部之節距形成為例如20~200 μm,將沿槽部之刀尖脊線方向之長度以相對於槽之深度為1.5~2.5倍之比率形成。 一面參照圖3一面針對由該等切刀輪形成之劃線進行說明。圖3係顯示形成於基板之劃線之肋紋及垂直裂紋者,圖3(a)係沿劃線方向之剖視圖,圖3(b)係沿與劃線正交方向之剖視圖。 劃線S係由基板表面之切刀輪之咬入痕跡即塑性變形區域,及產生於塑性變形區域正下方且於基板W之厚度方向滲透之垂直裂紋8而形成。於垂直裂紋8之上部遍及特定之深度產生稱為肋紋7之特徵性痕跡。圖3之L1表示自基板W表面之肋紋量(深度),L2係表示自基板W表面之垂直裂紋量(滲透量)者。 利用普通切刀輪,雖可於劃線時形成完好之槽面,但另一方面,有對基板表面之咬入力較小而刀尖易滑動之缺點。相對於此,於刀尖脊線設有槽部(切口)之附槽之切刀輪中,藉由將槽部與刀尖脊線部(凸部)交替形成,而能夠以與普通切刀輪相比較高之劃線荷重咬入基板表面,可由上述肋紋或垂直裂紋有效地形成劃線。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第3787489號公報In the past, a method has been generally known in which a cutting wheel is pressed against the surface of the substrate to form a scribe line in the process of dividing a brittle material substrate such as a glass substrate (hereinafter also referred to as a "substrate"), and thereafter, a scribe line is formed along the surface of the substrate. The scribe line is disclosed in Patent Document 1, for example, by applying an external force from the back side to deflect the substrate, thereby dividing the substrate into each unit substrate. The cutter wheel is used for the scribing of the brittle material substrate. The cutter wheel has a V-shaped cutting edge composed of two inclined surfaces intersecting with each other on the circumferential surface of the circular plate body with a diameter of 1-4 mm. Bearing holes for mounting. As the above-mentioned cutter wheel, there are cutter wheels (hereinafter referred to as "ordinary cutter wheels") that smoothly finish the ridge line of the blade edge, and those provided with grooves (notches) at a specific pitch on the ridge line of the blade edge. ) of the cutter wheel (hereinafter referred to as the "cutter wheel with grooves"). In the latter cutter wheel with grooves, the pitch of the grooves is generally formed to be, for example, 20 to 200 μm, and the length along the ridge line of the edge of the grooves is 1.5 to 2.5 times the depth of the grooves. ratio formation. The scribe lines formed by these cutter wheels will be described with reference to FIG. 3 . Fig. 3 shows ribs and vertical cracks formed in the scribe line of the substrate, Fig. 3(a) is a sectional view along the scribe line direction, and Fig. 3(b) is a sectional view along the direction orthogonal to the scribe line. The scribe line S is formed by the bite mark of the cutter wheel on the substrate surface, that is, the plastic deformation area, and the vertical crack 8 generated right below the plastic deformation area and penetrated in the thickness direction of the substrate W. Characteristic marks called ribs 7 are produced over a specific depth above the vertical cracks 8 . L1 of FIG. 3 represents the rib amount (depth) from the substrate W surface, and L2 represents the vertical crack amount (penetration amount) from the substrate W surface. Using a common cutter wheel can form a perfect groove surface when scribing. On the other hand, in the cutter wheel with grooves provided with grooves (cuts) on the ridgeline of the cutting edge, by alternately forming the grooves and the ridgeline parts (convex parts) of the cutting edge, it is possible to use the same as that of ordinary cutters. The higher scribing load of the wheel ratio bites into the surface of the substrate, and the scribing lines can be effectively formed by the above-mentioned ribs or vertical cracks. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent No. 3787489

然而,即使是上述附槽之切刀輪,液晶顯示面板等貼合基板之密封部正上方之劃線之加工仍有問題。 圖7及圖8係顯示分斷前之液晶顯示面板之母板者,其係將2片大面積玻璃基板W、W,即形成有驅動液晶之薄膜電晶體TFT(Thin Film Transistor)等電子元件之玻璃基板與形成有對向電極之玻璃基板,以形成複數個液晶注入區域11之方式經由密封部10貼合而形成。且,近年來,於該密封部10之正上方位置,對大面積玻璃基板W以切刀輪12加工出劃線S,於下個步驟中從劃線S分斷成單位製品。However, even with the above-mentioned grooved cutter wheel, there is still a problem in the processing of the scribe line just above the sealing portion of the liquid crystal display panel, etc., which is attached to the substrate. Figures 7 and 8 show the mother board of the liquid crystal display panel before splitting, which are two large-area glass substrates W and W, that is, electronic components such as thin film transistors (TFT (Thin Film Transistor)) that drive liquid crystals are formed The glass substrate and the glass substrate on which the counter electrode is formed are formed by bonding together through the sealing portion 10 so as to form a plurality of liquid crystal injection regions 11 . In addition, in recent years, the scribe line S is processed by the cutter wheel 12 on the large-area glass substrate W at the position just above the sealing portion 10, and is divided into unit products from the scribe line S in the next step.

於該密封部10之正上方,使用切刀輪12對玻璃基板W加工出劃線S之情形時,若以先前之附槽之切刀輪,有因密封部10之素材所具有之彈性或因密封所致之基板的內部應力變化,而易於基板表面產生於水平方向延伸之不規則龜裂(水平裂紋),或無法充分形成垂直裂紋之問題。若垂直裂紋不充分,則於劃線時無法分斷,或於分斷面產生傷痕等破壞,因而發生端面強度劣化等問題,使得不良品之產生頻率變高。 When using the cutter wheel 12 to machine the scribe line S on the glass substrate W just above the sealing portion 10, if the cutter wheel with grooves is used before, there may be elasticity due to the material of the sealing portion 10 or Due to the change in the internal stress of the substrate due to sealing, irregular cracks (horizontal cracks) extending in the horizontal direction on the surface of the substrate are likely to occur, or vertical cracks cannot be sufficiently formed. If the vertical crack is insufficient, it will not be able to be split during scribing, or damage such as scratches will occur on the split surface, resulting in problems such as deterioration of the strength of the end face, and the frequency of defective products will increase.

因此,本發明之目的在於提供一種切刀輪,其對於玻璃等脆性材料基板之水平裂紋較少,可形成高滲透之劃線,藉此可分斷成端面強度優良之單位製品。 Therefore, the object of the present invention is to provide a cutter wheel which has less horizontal cracks on substrates of brittle materials such as glass, and can form highly permeable scribe lines, thereby being able to cut into unit products with excellent end face strength.

為解決上述問題,本發明係採取如下之技術方式。即,本發明之切刀輪係圓板狀之切刀輪,於圓周面具有由彼此相交之2個斜面構成之V字形刀尖脊線,以特定之節距對該刀尖脊線之全域加工出槽部,上述槽部與餘下之刀尖脊線部交替形成,且構成為上述槽部之深度以1~3μm形成,該槽部之長度以該槽部之深度之3.5~8倍形成,上述刀尖脊線部之長度以5~15μm形成。 In order to solve the above-mentioned problems, the present invention adopts the following technical means. That is, the cutter wheel of the present invention is a disc-shaped cutter wheel, and has a V-shaped blade edge ridge line composed of two inclined surfaces intersecting with each other on the circumferential surface, and the entire area of the blade edge ridge line is at a specific pitch. The grooves are machined, and the grooves and the remaining ridge lines of the cutting edge are alternately formed, and the depth of the grooves is formed at 1 to 3 μm, and the length of the grooves is formed by 3.5 to 8 times the depth of the grooves. , the length of the above-mentioned blade edge ridge line is formed with 5~15μm.

此處,較佳為將上述切刀輪之直徑設為1~5mm,將上述2個斜面相交之刀尖角度設為90~120°。 Here, it is preferable that the diameter of the cutter wheel is set to 1 to 5 mm, and the angle of the blade edge at which the two inclined surfaces intersect is set to be 90 to 120°.

根據如上構成之切刀輪,刀尖脊線部之邊緣咬入基板而形成較深的肋紋,且可形成分斷所需之高滲透之垂直裂紋。尤其於本發明中,由於將槽部之長度增長為該槽部之深度之3~8倍,故使荷重集中於刀尖脊線部,即使於垂直裂紋不易於基板滲透之條件下,亦可高滲透加工出劃線,且抑制水平裂紋之產生。藉此,可於下一裂斷步驟中以完好的分斷面進行裂斷,有可獲得端面強度優良之單位製品之效果。According to the cutter wheel constructed as above, the edge of the ridge line portion of the blade edge bites into the substrate to form deep ribs, and can form vertical cracks with high penetration required for cutting. Especially in the present invention, since the length of the groove portion is increased by 3 to 8 times the depth of the groove portion, the load is concentrated on the ridgeline portion of the cutting edge, and even under the condition that the vertical crack is not easy to penetrate the substrate, it can be High penetration processing to scribe lines, and inhibit the generation of horizontal cracks. Thereby, in the next breaking step, it is possible to break with an intact broken surface, and there is an effect that a unit product with excellent end face strength can be obtained.

以下基於圖式,對本發明之附槽切刀輪詳細說明。 圖1係顯示本發明之附槽之切刀輪A之側視圖,圖2係其前視圖。另,將圖1之以圓包圍之區域於該圖右上放大顯示。該附槽之切刀輪A係由工具特性優良之金屬材料,例如超硬合金或燒結金剛石、單結晶金剛石等製作,於圓板狀的主體1之中心具有安裝用軸承孔2,於圓周面形成有由彼此相交之左右斜面3a、3a構成之刀尖脊線4。附槽之切刀輪A之直徑D係選自2~4 mm者,但於本實施形態中,將直徑D設為2 mm。又,以左右斜面3a、3a相交之刀尖角度α為100°或105°、厚度為650 μm、軸承孔2之內徑為0.8 mm形成。 再者,本發明之附槽之切刀輪A係以特定之節距於刀尖脊線4之全域加工出槽部5…,藉由交替形成該槽部5與餘下之刀尖脊線6而構成。 根據本發明之附槽之切刀輪A之第1實施形態,將切刀輪全周275分割而形成槽部,將該槽部5之深度5b設為2.5μm,將槽部5之圓周方向之長度5a設為深度5b之約4.5倍之11.5 μm,將刀尖脊線部6之圓周方向之長度6a以12.5 μm形成。又,將2個斜面3a、3a相交之刀尖角度α設為100°。以下,將該第1實施形態之附槽之切刀輪設為No.1。 於第2實施形態中,槽部5之分割數、槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與輪No.1相同,將刀尖角度α設為105°。以下,將其設為輪No.2。 於第3實施形態中,槽部5之分割數為275,將該槽部5之深度5b設為3 μm,將槽部5之長度5a設為11.5 μm,將刀尖脊線部6之長度6a以12.5 μm形成。又,將刀尖角度α設為100°。以下,將其設為輪No.3。 於第4實施形態中,槽部5之分割數、槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與輪No.3相同,將刀尖角度α設為105°。以下,將其設為輪No.4。 於第1比較例中,槽部5之分割數為300,將該槽部5之深度5b設為3 μm,將槽部5之長度5a設為9 μm,將刀尖脊線部6之長度6a以8.5 μm形成。又,將刀尖角度α設為100°。以下,將其設為輪No.5。 於第2比較例中,槽部5之分割數、槽部5之長度5a及深度5b、刀尖脊線部6之長度6a與輪No.5相同,將刀尖角度α設為105°。以下,將其設為輪No.6。 將如上構成之附槽之切刀輪A安裝於圖9所示之劃線裝置B之劃線頭13,一面按壓於載置於平台14上之玻璃基板W之表面一面使其相對直線移動,藉此於基板W之表面加工出分斷用劃線S。 此時,於上述之輪No.1~6之附槽之切刀輪A中,任一者皆如圖4、5所示,可於玻璃基板W形成肋紋,且可形成垂直裂紋。 圖4係顯示將輪No.1~6之各附槽之切刀輪A分別以0.05 MPa、0.06 MPa、0.07 MPa之劃線荷重,對玻璃基板W各進行複數次劃線試驗時之肋紋量L1及垂直裂紋量L2之平均值者。另,成為加工對象之玻璃基板W係使用厚度0.2 mm者。 再者,圖5係以曲線圖表示圖4之各數值資料者,圖5(a)係顯示自基板表面之肋紋深度者,圖5(b)係顯示自基板表面之包含肋紋之垂直裂紋之深度者。 又,圖6係以條形圖表示自各附槽之切刀輪A之劃線荷重之觀點來看之劃線形成區域者。 藉此,於本發明之輪No.1~6之附槽之切刀輪A中,檢測出最低42.99 μm至最高62.99 μm之較深的肋紋量L1。又,即使是垂直裂紋量L2,亦檢測出最低174.20 μm至最高190.12 μm之高滲透數值。由該試驗資料可知,確實於玻璃基板W形成肋紋,且形成分斷所需之垂直裂紋。 此處,由圖6可知,對於刀尖角度100°之No.1、3、5,由比較低之荷重形成肋紋,且產生垂直裂紋。但於比較例之No.5中,所有的區域之垂直裂紋皆比較淺,尤其於低荷重側之0.05 MPa下差異變大。因此認為,即使以相同荷重進行劃線,No.1、3更有效率地對基板傳遞荷重。 於本試驗條件下,此種傾向以刀尖角度100°尤其顯著,但在變更基板厚度等之劃線條件下,刀尖角度105°時亦發現相同傾向。 如此,藉由將槽部5之長度5a增長為槽部5之深度5b之3.5~8倍,則荷重集中於刀尖脊線部6之邊緣,即使於劃線區域之低荷重側亦可效率良好地形成較深的垂直裂紋,且不易因多餘荷重而產生水平裂紋。 通常,於密封上之劃線中,垂直裂紋不易因基板之內部應力之變化而進入,另一方面易產生水平裂紋。但以如圖4所示之劃線形成區域之0.05 MPa之比較低的劃線荷重,可容易地高滲透加工出劃線S。藉此,可抑制水平裂紋之產生,於下一裂斷步驟中能以完好的分斷面進行裂斷,可獲得端面強度優良之單位製品。 另,雖省略試驗資料之提示,但於具有與上述直徑2 mm之附槽之切刀輪A相同之刀尖構成之直徑3 mm之附槽之切刀輪、或直徑4 mm之附槽之切刀輪之情形時,亦可形成如與上述直徑2 mm之附槽之切刀輪A相仿之具有較深的肋紋與高滲透的垂直裂紋之完好的劃線。 上述之附槽之切刀輪A之槽部5之長度5a及深度5b之數值係作為最佳例而表示者,本發明不限於上述數值,可於以下之範圍內實施。即,可於槽部5之深度5b為1~3 μm、槽部5之長度5a為深度5b之3.5~8倍、刀尖脊線部之長度為5~15μm之範圍內實施。又,亦可容許刀尖角度α為90~120°之範圍內者。再者,槽部5之側面形狀亦可取代圖1所示之梯形狀,而設為V字形狀或圓弧形狀。 以上已針對本發明之代表性實施例進行說明,但本發明並非特定為上述實施形態,可於達成本發明之目的且不脫離申請專利範圍之範疇內適當修正、變更。 [產業上之可利用性] 本發明可較佳應用於在玻璃等脆性材料基板或將2片脆性材料基板貼合之貼合基板之表面加工出分斷用劃線時所使用之切刀輪。Hereinafter, the grooved cutter wheel of the present invention will be described in detail based on the drawings. Fig. 1 is a side view showing the grooved cutter wheel A of the present invention, and Fig. 2 is a front view thereof. In addition, the area enclosed by the circle in FIG. 1 is enlarged and displayed at the upper right of the figure. The cutter wheel A with grooves is made of metal materials with excellent tool properties, such as cemented carbide, sintered diamond, single crystal diamond, etc., and has a mounting bearing hole 2 in the center of the disc-shaped main body 1, and on the circumferential surface The blade edge ridge line 4 which consists of the left and right inclined surfaces 3a and 3a which cross each other is formed. The diameter D of the cutter wheel A with grooves is selected from 2 to 4 mm, but in this embodiment, the diameter D is set to 2 mm. In addition, the angle α of the cutting edge where the left and right slopes 3a and 3a intersect is 100° or 105°, the thickness is 650 μm, and the inner diameter of the bearing hole 2 is 0.8 mm. Furthermore, the grooved cutter wheel A of the present invention processes the grooves 5 . . . in the entire area of the ridgeline 4 of the cutting edge at a specific pitch, by alternately forming the grooves 5 and the remaining ridgelines 6 of the cutting edge and constitute. According to the first embodiment of the grooved cutter wheel A of the present invention, the entire circumference of the cutter wheel is divided into 275 to form the groove portion, the depth 5b of the groove portion 5 is set to 2.5 μm, and the circumferential direction of the groove portion 5 is set to 2.5 μm. The length 5a was set to 11.5 μm which is about 4.5 times the depth 5b, and the length 6a in the circumferential direction of the blade edge ridge portion 6 was formed to be 12.5 μm. In addition, the cutting edge angle α at which the two inclined surfaces 3a and 3a intersect is set to 100°. Hereinafter, the cutter wheel with grooves of the first embodiment is referred to as No. 1. In the second embodiment, the number of divisions of the groove 5, the length 5a and depth 5b of the groove 5, and the length 6a of the edge ridge 6 are the same as those of wheel No. 1, and the edge angle α is set to 105°. Hereinafter, this is referred to as wheel No. 2. In the third embodiment, the number of divisions of the groove portion 5 is 275, the depth 5b of the groove portion 5 is 3 μm, the length 5a of the groove portion 5 is 11.5 μm, and the length of the edge ridge portion 6 is 6a is formed at 12.5 μm. In addition, the cutting edge angle α is set to 100°. Hereinafter, this is referred to as wheel No. 3. In the fourth embodiment, the number of divisions of the groove 5, the length 5a and depth 5b of the groove 5, and the length 6a of the edge ridge 6 are the same as those of wheel No. 3, and the edge angle α is set to 105°. Hereinafter, this is referred to as wheel No. 4. In the first comparative example, the number of divisions of the groove portion 5 was 300, the depth 5b of the groove portion 5 was 3 μm, the length 5a of the groove portion 5 was 9 μm, and the length of the edge ridge portion 6 was 6a is formed at 8.5 μm. In addition, the cutting edge angle α is set to 100°. Hereinafter, this is referred to as wheel No. 5. In the second comparative example, the number of divisions of the groove 5, the length 5a and depth 5b of the groove 5, and the length 6a of the edge ridge 6 were the same as those of wheel No. 5, and the edge angle α was set to 105°. Hereinafter, this is referred to as wheel No. 6. The cutter wheel A with grooves constructed as above is installed on the scribing head 13 of the scribing device B shown in FIG. Thereby, the scribe line S for division is processed on the surface of the board|substrate W. At this time, any of the grooved cutter wheels A of the above-mentioned wheel Nos. 1 to 6, as shown in FIGS. 4 and 5 , can form ribs on the glass substrate W and can form vertical cracks. Fig. 4 shows the ribs of the glass substrate W when the cutting wheel A with grooves of wheel Nos. 1 to 6 is subjected to a scribing test of 0.05 MPa, 0.06 MPa and 0.07 MPa for several times. The average value of the amount L1 and the vertical crack amount L2. In addition, the glass substrate W used as a processing object used the thing of thickness 0.2 mm. Furthermore, Fig. 5 is a graph showing the numerical data of Fig. 4, Fig. 5(a) shows the depth of the rib from the surface of the substrate, and Fig. 5(b) shows the vertical direction including the rib from the surface of the substrate The depth of the crack. In addition, FIG. 6 is a bar graph which shows the scribe line formation area from the viewpoint of the scribe line load of each grooved cutter wheel A. As shown in FIG. As a result, in the grooved cutter wheels A of the wheel Nos. 1 to 6 of the present invention, the deep rib amount L1 ranging from a minimum of 42.99 μm to a maximum of 62.99 μm was detected. In addition, even in the vertical crack amount L2, high penetration values ranging from the lowest 174.20 μm to the highest 190.12 μm were detected. From this test data, it can be seen that ribs are definitely formed on the glass substrate W, and vertical cracks required for breaking are formed. Here, as can be seen from FIG. 6 , with respect to Nos. 1, 3, and 5 with a cutting edge angle of 100°, a rib was formed by a relatively low load, and a vertical crack was generated. However, in No. 5 of the comparative example, the vertical cracks in all regions are relatively shallow, and the difference becomes large especially at 0.05 MPa on the low-load side. Therefore, it is considered that Nos. 1 and 3 transmit the load to the substrate more efficiently even when scribing is performed with the same load. Under the test conditions, this tendency is particularly remarkable at a blade angle of 100°, but the same tendency is also found at a blade angle of 105° under scribing conditions such as changing the thickness of the substrate. In this way, by increasing the length 5a of the groove portion 5 to 3.5 to 8 times the depth 5b of the groove portion 5, the load is concentrated on the edge of the edge of the blade edge ridge portion 6, and the efficiency can be achieved even on the low-load side of the scribing area. Deep vertical cracks are well formed, and horizontal cracks are not easily generated due to excess load. Generally, in the scribe line on the seal, vertical cracks are less likely to enter due to changes in the internal stress of the substrate, and on the other hand, horizontal cracks are prone to occur. However, with a relatively low scribe line load of 0.05 MPa in the scribe line forming region as shown in FIG. 4, the scribe line S can be easily processed with high penetration. In this way, the occurrence of horizontal cracks can be suppressed, and in the next breaking step, the fracture can be carried out with a perfect split surface, and a unit product with excellent end face strength can be obtained. In addition, although the indication of the test data is omitted, in the case of a cutter wheel with a groove with a diameter of 3 mm, or a cutter wheel with a groove with a diameter of 4 mm, which has the same cutting edge as the cutting wheel A with a groove with a diameter of 2 mm above In the case of the cutter wheel, a perfect score line with deep ribs and highly penetrated vertical cracks can also be formed, similar to the above-mentioned cutter wheel A with a groove of 2 mm in diameter. The above numerical values of the length 5a and the depth 5b of the groove portion 5 of the grooved cutter wheel A are shown as the best examples, and the present invention is not limited to the above numerical values, and can be implemented within the following ranges. That is, the depth 5b of the groove portion 5 is 1 to 3 μm, the length 5a of the groove portion 5 is 3.5 to 8 times the depth 5b, and the length of the edge ridge portion is 5 to 15 μm. In addition, it is acceptable that the edge angle α is within the range of 90° to 120°. In addition, the side surface shape of the groove part 5 may be replaced with the trapezoidal shape shown in FIG. 1, and may be a V-shape or a circular arc shape. The representative embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and appropriate modifications and changes can be made within the scope of achieving the object of the present invention without departing from the scope of the patent application. [Industrial Applicability] The present invention can be preferably applied to a cutter wheel used for processing a scribing line for cutting on the surface of a brittle material substrate such as glass or a laminated substrate in which two brittle material substrates are bonded .

1‧‧‧主體2‧‧‧軸承孔3a‧‧‧斜面4‧‧‧刀尖脊線5‧‧‧槽部5a‧‧‧槽部之長度5b‧‧‧槽部之深度6‧‧‧刀尖脊線部6a‧‧‧刀尖脊線部之長度7‧‧‧肋紋8‧‧‧垂直裂紋10‧‧‧密封部11‧‧‧液晶注入區域12‧‧‧切刀輪13‧‧‧劃線頭14‧‧‧平台A‧‧‧切刀輪B‧‧‧劃線裝置D‧‧‧直徑L1‧‧‧肋紋量L2‧‧‧垂直裂紋量S‧‧‧劃線W‧‧‧脆性材料基板α‧‧‧刀尖角度1‧‧‧Main body 2‧‧‧Bearing hole 3a‧‧‧Chamfer 4‧‧‧Cut ridge line 5‧‧‧Slot 5a‧‧‧Length of groove 5b‧‧‧Depth of groove 6‧‧‧ Blade ridge 6a‧‧‧Length of blade ridge 7‧‧‧Ribbon8‧‧‧Vertical crack 10‧‧‧Sealing part 11‧‧‧LCD injection area 12‧‧‧Cutter wheel 13‧ ‧‧Scribing head 14‧‧‧Platform A‧‧‧Cutter wheel B‧‧‧Scribing device D‧‧‧Diameter L1‧‧‧Rib length L2‧‧‧Vertical crack amount S‧‧‧Scribing W ‧‧‧Brittle material substrateα‧‧‧Tool tip angle

圖1係本發明之附槽之切刀輪之側視圖。 圖2係本發明之附槽之切刀輪之前視圖。 圖3(a)、(b)係顯示形成於脆性材料基板之劃線之剖視圖。 圖4係顯示使用本發明之附槽之切刀輪之劃線試驗資料之圖。 圖5(a)、(b)係以曲線圖表示圖4之數值資料之圖。 圖6以條形圖表示本發明之附槽之切刀輪之劃線形成區域之圖。 圖7係顯示成為加工對象之貼合基板之俯視圖。 圖8係圖6之剖視圖。 圖9係概略性顯示劃線裝置之前視圖。FIG. 1 is a side view of the grooved cutter wheel of the present invention. Figure 2 is a front view of the grooved cutter wheel of the present invention. 3(a) and (b) are cross-sectional views showing scribe lines formed on a brittle material substrate. FIG. 4 is a graph showing scribing test data using the grooved cutter wheel of the present invention. Figures 5(a) and (b) are graphs showing the numerical data of Figure 4 as graphs. FIG. 6 is a bar graph showing a scribe line forming area of the grooved cutter wheel of the present invention. FIG. 7 is a plan view showing a bonded substrate to be processed. FIG. 8 is a cross-sectional view of FIG. 6 . Fig. 9 is a schematic diagram showing a front view of the scribing device.

1:主體 1: main body

2:軸承孔 2: Bearing hole

5:槽部 5: Groove

5a:槽部之長度 5a: Length of groove

5b:槽部之深度 5b: Depth of groove

6:刀尖脊線部 6: Blade tip ridge line

6a:刀尖脊線部之長度 6a: The length of the ridge line of the blade tip

A:切刀輪 A: Cutter wheel

Claims (2)

一種切刀輪,其係圓板狀之切刀輪,於圓周面具有由彼此相交之2個斜面構成之V字形刀尖脊線,以特定之節距對該刀尖脊線之全域加工出槽部,上述槽部與餘下之刀尖脊線部交替形成,且上述槽部之深度以1~3μm形成,該槽部之長度以該槽部之深度之3.5~8倍形成,上述刀尖脊線部之長度以5~15μm形成。 A cutter wheel, which is a disc-shaped cutter wheel, and has a V-shaped cutter tip ridge line formed by two inclined surfaces intersecting with each other on the circumferential surface, and the entire area of the cutter tip ridge line is machined at a specific pitch. The grooves are formed alternately with the remaining edge ridges, the depth of the grooves is 1 to 3 μm, and the length of the grooves is 3.5 to 8 times the depth of the grooves. The length of the ridge line portion is formed to be 5 to 15 μm. 如請求項1之切刀輪,其中上述切刀輪之直徑為1~5mm,上述2個斜面相交之刀尖角度為90~120°。 As claimed in claim 1, the cutter wheel, wherein the diameter of the cutter wheel is 1~5mm, and the angle of the cutting edge at the intersection of the two inclined surfaces is 90~120°.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012006832A (en) * 2005-07-06 2012-01-12 Mitsuboshi Diamond Industrial Co Ltd Scribing wheel for brittle material, and method for scribing, apparatus for scribing, and tool for scribing each using the same
CN105461207A (en) * 2014-09-30 2016-04-06 三星钻石工业股份有限公司 Cutting method and cutting device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074143B2 (en) * 1995-11-06 2000-08-07 三星ダイヤモンド工業株式会社 Glass cutter wheel
JP2989602B1 (en) * 1999-01-28 1999-12-13 三星ダイヤモンド工業株式会社 Glass cutter wheel
JP3787489B2 (en) 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 Method and apparatus for breaking brittle substrate
KR20120068976A (en) * 2004-02-02 2012-06-27 미쓰보시 다이야몬도 고교 가부시키가이샤 Scribing method and cutting method for fragile material substrate
JP5156080B2 (en) * 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 Method for scribing bonded substrates
JP5479424B2 (en) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 Scribing wheel for brittle material, scribing device and scribing tool for brittle material substrate using the same
TWI511939B (en) * 2012-03-28 2015-12-11 Mitsuboshi Diamond Ind Co Ltd A scribing line, a scribing device, a scribing method, a manufacturing method for a display panel, and a display panel
CN108481580B (en) * 2012-07-27 2020-10-23 二和钻石工业股份有限公司 Scribing wheel with precise structure groove
JP2014188729A (en) * 2013-03-26 2014-10-06 Mitsuboshi Diamond Industrial Co Ltd Scribing wheel, scribing device, and method of manufacturing scribing wheel
CN105143120A (en) * 2013-06-27 2015-12-09 日本电气硝子株式会社 Method for scribing tempered glass plate and method for cutting tempered glass plate
JP2015048260A (en) * 2013-08-30 2015-03-16 三星ダイヤモンド工業株式会社 Scribing wheel, holder unit, and scribing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012006832A (en) * 2005-07-06 2012-01-12 Mitsuboshi Diamond Industrial Co Ltd Scribing wheel for brittle material, and method for scribing, apparatus for scribing, and tool for scribing each using the same
CN105461207A (en) * 2014-09-30 2016-04-06 三星钻石工业股份有限公司 Cutting method and cutting device

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