TW201815504A - 用於三維結構物的雷射焊接裝置及方法 - Google Patents

用於三維結構物的雷射焊接裝置及方法 Download PDF

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Publication number
TW201815504A
TW201815504A TW106121201A TW106121201A TW201815504A TW 201815504 A TW201815504 A TW 201815504A TW 106121201 A TW106121201 A TW 106121201A TW 106121201 A TW106121201 A TW 106121201A TW 201815504 A TW201815504 A TW 201815504A
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dimensional structures
dimensional
dimensional structure
laser welding
laser
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TW106121201A
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TWI660803B (zh
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崔在濬
金秉祿
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科泰機械股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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Abstract

本發明提供如下的用於三維結構物的雷射焊接裝置及方法，即，除了如印刷電路板(PCB)基板、玻璃基板等整體呈平面形態的基板之外，根據客戶公司的要求，還可在彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)自動焊接電子元件，並且，可防止電子元件和三維結構物的排列不良及由此造成的焊接不良。

Description

用於三維結構物的雷射焊接裝置及方法
本發明涉及雷射焊接技術，更詳細地，涉及根據客戶公司的要求，也可在彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)上自動焊接電子元件的雷射焊接裝置及方法。
隨著電子產品的小型化及高功能化，從灰塵或濕氣、電、機械負荷等各種外部環境保護半導體晶片的半導體封裝的方式很難僅通過以往的焊接方式來實現輕薄短小化，因此使用雷射焊接方式。雷射焊接方式為將半導體晶片附著在載體基板或電路載帶之電路圖案上並利用雷射進行焊接的方式。
日本核准專利號第3303832號中公開了用於使半導體晶片的各個電極全部與配線基板相連接的雷射焊接技術。根據日本核准專利第3303832號，用於吸附半導體晶片的吸附頭部由雷射光束穿透過的玻璃構成，基座與珀耳帖元件相結合。整個半導體晶片通過雷射光束直接被加熱，從而會急劇加熱。配線基板通過與基座相結合的珀耳帖元件急劇加熱及急劇冷卻。
美國公開專利第2016/004938號涉及半導體晶片封裝，公開了為了在電路基板連接半導體晶片管芯而利用雷射的焊接技術。根據美國公開專利第2016/004938號，包括朝向半導體管芯照射雷射光束來使流量(flux)揮發並使泵(bump)和電路板之間電連接的泵回流步驟。
韓國核准專利第10-0913579號公開了如柔性印刷電路(FPC，Flexible Printed Circuit)、帶載封裝(TCP，Tape Carrier Package)及公共塊柔性印刷電路(CBF，Common Block Flexible Printed Circuit)、驅動器積體電路(Driver IC，Driver Integrated Circuit)的對驅動用電路基板進行焊接的裝置。根據韓國核准專利第10-0913579號，將要與驅動用電路基板焊接的基板移送到焊接工作位置及取出，並將驅動用電路基板焊接在基板上，藉以實現基於焊接工作的工站時間(tact time)的縮減及工作的高速化。
通常，為了將包括如半導體晶片的電子元件或積體電路(IC)、轉換器(TR)、電阻器件(R)及電容器(C)的裝置附著在印刷電路板而使用再流焊裝置。當前，再流焊裝置大致分為大量再流(mass reflow)裝置和雷射再流焊裝置。
大量再流焊裝置中，將附著有如焊球、焊盤或焊膏的焊接物質的多個基板設置於輸送帶並驅動輸送帶。基板根據所驅動的輸送帶通過具有紅外線加熱器(infrared heater)或陶瓷加熱器的加熱區間。此時，紅外線加熱器形成於輸送帶的上側和下側，紅外線加熱器對基板上的焊球施加熱量來將半導體器件附著在基板上。
根據大量再流焊裝置，電子元件或裝置在約50℃至約230~290℃之間的高熱條件下受到約210秒鐘(sec)的熱量。因 此，電子元件或裝置有可能受到熱量的損傷，由此，電子元件或裝置的特性或壽命會降低。並且，紅外線加熱器對焊球施加熱量來使電子元件或裝置與基板相結合需要3~10分鐘(min)左右的時間，從而並不存在經濟性。並且，大量再流焊工序中，在附著於基板的器件中，因對熱量脆弱的器件施加熱量而發生不良，對整個基板施加熱量，因此，會在基板上發生熱變形。
另一方面，汽車用頭燈最近被發光二極體(LED)所代替，發光二極體頭燈結構物的形態從平面變為三維形狀。其中，在焊接發光二極體的基板的形態呈階梯型、碗(bowl)型等不規則基板的情況下，當通過大量再流焊工序，使發光二極體與不規則基板相結合時，能量不均等地向各個部位傳遞並導致焊接不良，向基板整體施加熱能，因此，在基板整體中，發生熱變形的可能性變得更高。
除汽車用頭燈之外，焊接半導體晶片的基板的形態只要是三維不規則形態，則很難避免如上所述的大量再流焊工序的缺點。
因此，在基板的形態為三維或者在不規則的環境下，向各個焊接部位照射均勻的雷射光束，可簡單調節雷射光束的各個照射區域的雷射再流焊技術成為極為有用的解決方案。
即便如此，至今的雷射再流焊技術僅適用於在如手機、TV的裝置的印刷電路板、如玻璃基板的整體呈平面形態的基板。在基板不呈平面形態或者半導體器件附著的位置整體上不規則的情況下，很難通過以往的雷射焊接技術進行作業。
因此，需要在如圖1所示的三維結構物(例如，用於汽車尾燈或前燈的結構物)的各個部位有效焊接電子元件的新的雷 射焊接裝置和方法。
本發明基於如上所述的背景而提出，本發明提供如下的用於三維結構物的雷射焊接裝置及方法，即，除了如印刷電路板(PCB)基板、玻璃基板等整體呈平面形態的基板之外，還可在彎曲部分呈規則形態或不規則形態的三維結構物自動焊接電子元件。
並且，本發明提供可防止電子元件和三維結構物的排列不良及由此造成的焊接不良的用於三維結構物的雷射焊接裝置及方法。
可通過對以下的實施例進行的說明來容易理解本發明的其他目的。
為了實現如上所述的目的，本發明的三維結構物雷射焊接裝置包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。
本發明的三維結構物雷射焊接裝置包括：電子元件提供部，裝載並移送多個電子元件；三維結構物提供部，支撐並移送多個三維結構物；黏結物質塗敷部，在上述多個三維結構物上塗敷黏結物質；電子元件附著部，在上述多個三維結構物之塗敷有黏結物質的部分附著上述電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。
其中，根據客戶公司的要求，三維結構物可為彎曲部分呈規則形態或不規則形態的被附著物。尤其，三維結構物可為用於汽車尾燈或前燈的結構物。
本發明的三維結構物雷射焊接方法包括：在工作臺設置作為被附著物的多個三維結構物的步驟；借助工作臺移送部移送設置有上述多個三維結構物的工作臺的步驟；在上述多個三維結構物上塗敷黏結物質的步驟；在上述多個三維結構物之塗敷有黏結物質的部分拾取並附著電子元件的步驟；向附著於上述多個三維結構物的電子元件照射雷射來進行焊接的步驟。
本發明的用於三維結構物的雷射焊接裝置提供如下的效果：
第一、根據客戶公司的要求，也可在彎曲部分呈規則形態或不規則形態的三維結構物雷射焊接電子元件。
第二、可防止電子元件和三維結構物的排列不良、黏結物質塗敷不良及電子元件附著不良和焊接不良。
本發明的效果不侷限於如上所述的效果，並應理解為，包括可從本發明的詳細說明或申請專利範圍中所記載之發明的結構推論得到的所有效果。
30‧‧‧焊錫膏或非導電膠(NCP)
40‧‧‧電子元件
110‧‧‧三維結構物
120‧‧‧三維結構物
200‧‧‧雷射焊接裝置
210‧‧‧電子元件提供部
211‧‧‧托盤
212‧‧‧托盤移送部
220‧‧‧黏結物質塗敷部
221‧‧‧第一台架
222‧‧‧第一移送部
223‧‧‧分配器
230‧‧‧電子元件附著部
231‧‧‧第二台架
232‧‧‧第二移送部
233‧‧‧器件附著部
240‧‧‧雷射焊接部
241‧‧‧第三台架
242‧‧‧第三移送部
243‧‧‧雷射光束照射部
250‧‧‧三維結構物提供部
251‧‧‧工作臺
252‧‧‧工作臺移送部
261‧‧‧工作臺
262‧‧‧工作臺移送部
511‧‧‧設置部
512‧‧‧驅動軸
513‧‧‧驅動帶
514‧‧‧結合部
515‧‧‧支撐部
521‧‧‧第一馬達
522‧‧‧第二馬達
圖1為用於說明三維結構物的示意圖。
圖2為用於說明本發明的用於三維結構物的雷射焊接裝置的示意圖。
圖3為用於說明本發明的用於三維結構物的雷射焊 接裝置的動作的示意圖。
圖4為用於說明通過本發明的用於三維結構物的雷射焊接裝置來在三維結構物焊接電子元件的過程的示意圖。
圖5為用於說明提供呈不規則形態的三維結構物的三維結構物提供部的結構的示意圖。
圖6為用於說明通過本發明的用於三維結構物的雷射焊接方法的流程圖。
以下，參照附圖說明本發明。但是，本發明能夠以多種不同形式來實現，因此，不限定於在這裡說明的實施例。而且，為了明確說明本發明，在附圖中省略了與說明無關的部分，在整個說明書中，對類似的部分使用了類似的元件符號。
在整個說明書中，當某個部分與其他部分「連接(接續、接觸、結合)」時，其不僅包括「直接連接」的情況，也包括在此中間留有其他部件而「間接連接」的情況。並且，當某個部分「包括」某個結構要素時，除非有特別相反的記載，其意味著還可具有其他結構要素，而不是意味著其他結構要素除外。
本說明書中所使用的術語僅為了說明特定的實施例而被使用，並非意圖限定本發明。若在文脈上沒有明顯不同的意思，則單數形式表述包括複數形式表述。在本說明書中，「包括」或「具有」等術語是指在說明書中所記載的特徵、數目、步驟、動作、結構要素、部件或它們的組合的存在，而應理解為不預先排除一個或一個以上的其他特徵、數目、步驟、動作、結構要素、部件或它們的組合的存在或附加功能性。
如圖1所示，本發明的用於三維結構物的雷射焊接裝置可在彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)上雷射焊接電子元件。三維結構物為通過注塑成型來製造而成的注塑物。過去，以三維結構物的輕型錫進行焊接，但是，隨著製造業的模式逐漸變為智慧工廠(Smart Factory)化和大批量定制生產模式，本申請人考慮縮短製造時間和節省製造費用而開發用於三維結構物的雷射焊接裝置。
作為本發明的用於三維結構物的雷射焊接裝置200的一例，可包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。根據如上所述的實施例，可在額外的其他裝置中執行在多個三維結構物上塗敷黏結物質並在上述黏結物質上附著電子元件的工序。本發明的用於三維結構物的雷射焊接裝置200的三維結構物提供部通過額外的其他裝置來提供塗敷黏結物質並向雷射焊接位置移送在黏結物質上附著有電子元件的多個三維結構物的作用。
作為另一例，如圖2所示，本發明的用於三維結構物的雷射焊接裝置200可大致包括電子元件提供部210、三維結構物提供部250、黏結物質塗敷部220、電子元件附著部230及雷射焊接部240。
電子元件提供部210裝載並移送多個電子元件。電子元件包括半導體晶片、積體電路(IC)、發光二極體元件、電阻器、電容器、感應器、變壓器或繼電器中的至少一個。電子元件提供部 210可包括托盤211，裝載多個電子元件；托盤移送部212，於一方向上移送托盤211。
三維結構物提供部250支撐並移送多個三維結構物。多個三維結構物為彎曲部分呈規則形態或不規則形態的三維結構物(例如，用於汽車尾燈或前燈的結構物)。
三維結構物提供部250可包括：工作臺251，支撐多個三維結構物；工作臺移送部252，用於移送設置有多個三維結構物的工作臺。
例如，黏結物質塗敷部220在多個三維結構物上塗敷焊錫膏或非導電膠(NCP)。作為非導電膠的一例，可包括作為偶聯劑的N-甲基-3-氨丙基三甲氧基矽烷(N-methyl-3-amino propyltrimethoxysilane)、作為黏結性改進劑的聚酯丙烯酸酯(polyester acrylate)。
黏結物質塗敷部220可包括：分配器223，在設置於工作臺251的多個三維結構物上塗敷焊錫膏或非導電膠；第一移送部222，使分配器223沿著與托盤的移送方向垂直的方向相對於上述工作臺251進行上下移送；第一台架221，支撐第一移送部222。
黏結物質塗敷部220可包括檢測多個三維結構物和分配器的排列狀態及焊錫膏或非導電膠的塗敷狀態的第一監控部。第一監控部可包括控制部，上述控制部對電荷耦合器(CCD)攝像頭、捕捉影像的擷取板(capture board)、影像處理板、從影像處理板輸入的影像與基準影像進行比較，來判斷塗敷狀態是否正常或不良。
電子元件附著部230在多個三維結構物之塗敷有焊 錫膏或非導電膠的部分附著電子元件。電子元件包括半導體晶片、積體電路、發光二極體元件、電阻器、電容器、感應器、變壓器或繼電器中的至少一個
電子元件附著部230可包括：器件附著部233，從托盤211拾取電子元件來附著在多個三維結構物之塗敷有焊錫膏或非導電膠的部分；第二移送部232，使器件附著部233沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送；第二台架231，支撐第二移送部232。
上述電子元件附著部230可包括檢測多個三維結構物和電子元件的排列狀態及電子元件附著狀態的第二監控部。第二監控部可包括控制部，上述控制部對電荷耦合器攝像頭、捕捉影像的擷取板、影像處理板、從影像處理板輸入的影像與基準影像進行比較，來判斷排列狀態和電子元件附著狀態是否正常或不良。
雷射焊接部240向附著於多個三維結構物的電子元件照射面光源或線形態的雷射光束來進行焊接。作為一例，雷射焊接部240可包括：雷射光束照射部243；第三移送部242，使雷射光束照射部243沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送；第三台架241，支撐第三移送部242。
雷射光束照射部243可包括：向附著於多個三維結構物的電子元件輸出並照射雷射光束的雷射振盪器；將從雷射振盪器輸出之高斯形態的雷射轉換為能源均勻分佈的面光源的雷射光束成形部和光學系統。
雷射光束成形部可以為形成均勻的方形光束的光導向部。光導向部能夠以與光纖維具有0.2mm以上且0.5mm以下的 隔開距離的方式設置，光導向部的長度可為1.0m以上且1.5m以下。若光導向部的長度小於1.0m，則因在光導向部的內部發生閃射後所輸出的雷射的光均勻度下降而導致被附著物P的照射區域的溫度分佈不均勻。另一方面，若光導向部的長度為1.5m以上，則雖然雷射的光均勻度良好，但因光均勻化模組的總長度變長而導致製造費用上升，且不方便保管及移送光均勻化模組。
在光導向部與光纖維之間無需用於使雷射光束均勻的任何光學透鏡。光纖維的數值孔徑(NA)為0.2以上且0.3以下。由此，從光纖維射出的雷射光束全部入射於光導向部的內部。
光導向部由於使用作為使雷射穿過的介質的具有高透過率的母材，因此形成為剖面為四方形的正六面體，並在與使雷射穿過的光軸水準的側面形成全反射塗敷膜，在與上述光軸垂直的上部面和下部面形成無反射塗敷膜。由此，可防止穿過光導向部的雷射光束向外部損失的現象。
作為光學系統的一例，可以為對經過光導向部而發散的均勻的方形光束進行聚光的聚光透鏡和使所聚光的均勻的方形光束維持規定工作距離並發散的發散透鏡。可通過聚光透鏡和發散透鏡的曲率半徑組合來調節均勻的方形光束的大小和工作距離。
雷射焊接部240可包括檢測多個三維結構物和雷射焊接部的排列狀態及焊接狀態的第三監控部。第三監控部可包括控制部，上述控制部對電荷耦合器攝像頭、捕捉影像的擷取板、影像處理板、從影像處理板輸入的影像與基準影像進行比較，來判斷排列狀態和焊接狀態是否正常或不良。
作為雷射焊接部240的一例，隨著設置有多個三維結 構物的工作臺251被移送，並根據三維結構物的形態，可調節雷射的照射強度和照射區域。由此，在基板的形態為三維形態或不規則形態的情況下，也可在焊接部位照射均勻的雷射光束，並可通過調節雷射光束的各照射區域來容易地進行焊接。
圖3為用於說明用於呈規則形態的三維結構物的雷射焊接裝置的動作的示意圖。圖4為用於說明通過用於呈規則形態的三維結構物的雷射焊接裝置來在三維結構物焊接電子元件的過程的示意圖。
首先，參照圖3來進行說明，用於呈規則形態的三維結構物的雷射焊接裝置可包括：第一工作臺251及第二工作臺261，支撐多個三維結構物110；第一工作臺移送部252及第二工作臺移送部262，用於移送設置有多個三維結構物110的第一工作臺251及第二工作臺261。可根據客戶所要求的生產量，增加工作臺和工作臺移送部的設置台數。
如圖3所示，可與第一工作臺移送部252及第二工作臺移送部262分開地設置用來於一方向上移送裝載有多個電子元件之托盤211的托盤移送部212。托盤211裝載於托盤移送部212而被移送，使用完向外部排出。
第一工作臺251及第二工作臺261借助第一工作臺移送部252及第二工作臺移送部262而被移送並經過第一台架221。在第一台架221上設置有分配器223和第一移送部222，上述分配器223在多個三維結構物110上塗敷焊錫膏或非導電膠，上述第一移送部222使分配器233沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送。可在第一台架221上設置用來檢測多個 三維結構物110和分配器223的排列狀態及焊錫膏或非導電膠塗敷狀態的視覺模組。
當在多個三維結構物110上塗敷焊錫膏或非導電膠時，借助第一工作臺移送部252及第二工作臺移送部262移送第一工作臺251及第二工作臺261並經過第二台架231。在第二台架231上設置有器件附著部233和第二移送部232，上述器件附著部233從托盤211拾取電子元件來附著在多個三維結構物110之塗敷有焊錫膏或非導電膠的部分，上述第二移送部232使器件附著部233沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送。可在第二台架231上設置用來檢測多個三維結構物110和器件附著部233的排列狀態及電子元件附著狀態的視覺模組。
當在多個三維結構物110上附著電子元件時，借助第一工作臺移送部252及第二工作臺移送部262移送第一工作臺251及第二工作臺261並經過第三台架241。在第三台架241上設置有雷射光束照射部243和第三移送部242，上述雷射光束照射部243向附著於多個三維結構物110上的電子元件照射雷射光束，上述第三移送部242使雷射光束照射部243沿著與托盤的移送方向垂直的方向相對於工作臺251進行上下移送。可在第三台架241上設置用來檢測多個三維結構物110和雷射光束照射部243的排列狀態及焊接狀態的視覺模組。
參照圖4，借助分配器223在設置於工作臺251並借助工作臺移送部而被移送的多個三維結構物110上依次塗敷焊錫膏或非導電膠30，借助器件附著部233在焊錫膏或非導電膠30上附著電子元件40，借助雷射光束照射部243焊接電子元件40。
以上，在圖3和圖4中，說明利用提供呈規則形態的三維結構物的三維結構物提供部來雷射焊接電子元件的裝置及其焊接過程。
以下，參照圖5來說明提供呈不規則形態的三維結構物的三維結構物提供部的結構。
如圖5所示，三維結構物提供部包括：設置部511，用於設置呈不規則形態的多個三維結構物120；驅動軸512，與設置部511相連接；驅動帶513，與驅動軸512相連接；第一馬達521，使驅動帶513旋轉；結合部514，與驅動軸512相結合；支撐部515，以能夠使結合部514進行上下旋轉的方式與結合部514相結合；以及第二馬達522，與結合部514相連接，並使結合部514進行上下旋轉。
雖然未在圖5中示出，但本發明的三維結構物雷射焊接裝置可通過包括呈不規則形態的三維結構物、焊錫膏或非導電膠(NCP)、電子元件、用於存儲為了照射雷射光束而驅動第一馬達521和第二馬達522的工作設定檔的儲存部、根據工作設定檔驅動第一馬達521和第二馬達522的馬達驅動部而構成。
如圖6所示，在圖3和圖4中的用於三維結構物的雷射焊接裝置中實現的雷射焊接方法可大致包括裝載步驟、塗敷步驟、拾取及附著步驟、焊接步驟、卸載步驟。
裝載步驟包括在工作臺上設置作為被附著物的多個三維結構物的步驟S611。塗敷步驟包括借助工作臺移送部移送設置有多個三維結構物的工作臺的步驟S612和在多個三維結構物上塗敷黏結物質的步驟S613。作為一例，工作臺的移送距離、移送速度 及移送位置預先被設定並儲存於用於三維結構物的雷射焊接裝置的儲存部。但是，檢查工作臺是否被移送至所準確設定的移送位置，並為了修復錯位的位置而使用包括視覺模組的監控部。在步驟S613之後，可包括通過監控部來檢測焊錫膏或非導電膠塗敷狀態並判斷塗敷狀態是否正常或不良的步驟。
拾取及附著步驟包括借助工作臺移送部移送在多個三維結構物上塗敷有焊錫膏或非導電膠的工作臺的步驟S614和從托盤拾取電子元件來附著在焊錫膏或非導電膠上的步驟S615。作為一例，工作臺的移送距離、移送速度及移送位置預先被設定並儲存於儲存部。但是，檢查工作臺是否被移送至所準確設定的移送位置，並為了修復錯位的位置而使用包括視覺模組的監控部。在步驟S615之後，可包括通過監控部來檢測電子元件附著狀態並判斷電子元件附著狀態是否正常或不良的步驟。
焊接步驟包括借助工作臺移送部移送在多個三維結構物110上附著有電子元件的工作臺的步驟S616和通過向電子元件照射雷射光束來進行焊接的步驟S617。作為一例，工作臺的移送距離、移送速度及移送位置預先被設定並儲存於用於三維結構物的雷射焊接裝置的儲存部。但是，檢查工作臺是否被移送至所準確設定的移送位置，並為了修復錯位的位置而使用包括視覺模組的監控部。在步驟S617之後，可包括通過監控部來檢測焊接狀態並判斷焊接狀態是否正常或不良的步驟。
卸載步驟包括步驟S618，在上述步驟S618中，在多個三維結構物依次塗敷焊錫膏或非導電膠，在所塗敷的焊錫膏或非導電膠上附著電子元件，若結束雷射焊接，則從工作臺排出多個三 維結構物。
以上，舉例對本發明進行了說明，本發明所屬技術領域的普通技術人員可理解在不變更本發明的技術思想或必要特徵的情況下，可容易地將發明變形為其他具體形式。因此，應理解為以上所記述的實施例在所有方面上僅用於舉例，而不用於限定本發明。例如，能夠以分散的方式實施以單一形式說明的各結構要素，同樣也能夠以結合的形式實施以分散的方式說明的結構要素。
如前所述，以發明的最佳具體實施方式說明了發明的具體實施方式。
(產業上之可利用性)
本說明書的技術可利用於雷射焊接裝置。

Claims (18)

  1. 一種三維結構物雷射焊接裝置，包括：三維結構物提供部，提供多個三維結構物，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。
  2. 一種三維結構物雷射焊接裝置，包括：電子元件提供部，裝載並移送多個電子元件；三維結構物提供部，支撐並移送多個三維結構物；黏結物質塗敷部，在上述多個三維結構物上塗敷黏結物質；電子元件附著部，在上述多個三維結構物之塗敷有黏結物質的部分附著上述電子元件；雷射焊接部，向附著於上述多個三維結構物的電子元件照射雷射來進行焊接。
  3. 如請求項2之三維結構物雷射焊接裝置，其中，上述電子元件提供部包括：托盤，裝載上述多個電子元件；托盤移送部，於一方向上移送上述托盤。
  4. 如請求項1至3中任一項之三維結構物雷射焊接裝置，其中，上述三維結構物提供部包括：工作臺，支撐多個三維結構物；工作臺移送部，用於移送設置有上述多個三維結構物的上述工作臺。
  5. 如請求項4之三維結構物雷射焊接裝置，其中，上述多個三維 結構物為彎曲部分呈規則形態的被附著物。
  6. 如請求項1至3中任一項之三維結構物雷射焊接裝置，其中，上述三維結構物提供部包括：設置部，用於設置多個三維結構物；驅動軸，與上述設置部相連接；驅動帶，與上述驅動軸相連接；第一馬達，使上述驅動帶旋轉；結合部，與上述驅動軸相結合；支撐部，以能夠使上述結合部進行上下旋轉的方式與上述結合部相結合；第二馬達，與上述結合部相連接，並使上述結合部進行上下旋轉。
  7. 如請求項6之三維結構物雷射焊接裝置，其中，上述多個三維結構物為彎曲部分呈規則形態的被附著物。
  8. 如請求項4之三維結構物雷射焊接裝置，其中，上述黏結物質塗敷部包括：分配器，在設置於上述工作臺的多個三維結構物上塗敷焊錫膏或非導電膠(NCP)；第一移送部，使上述分配器沿著與上述托盤的移送方向垂直的方向相對於上述工作臺進行上下移送；第一台架，支撐上述第一移送部。
  9. 如請求項8之三維結構物雷射焊接裝置，其中，上述黏結物質塗敷部還包括檢測上述多個三維結構物和分配器的排列狀態及焊錫膏或非導電膠(NCP)的塗敷狀態的第一監控部。
  10. 如請求項4之三維結構物雷射焊接裝置，其中，上述電子元 件附著部包括：器件附著部，從上述托盤拾取(pickup)電子元件來附著在上述多個三維結構物之塗敷有焊錫膏或非導電膠的部分；第二移送部，使上述器件附著部沿著與上述托盤的移送方向垂直的方向相對於上述工作臺進行上下移送；第二台架，支撐上述第二移送部。
  11. 如請求項10之三維結構物雷射焊接裝置，其中，上述電子元件附著部還包括檢測上述多個三維結構物和器件附著部的排列狀態及電子元件的附著狀態的第二監控部。
  12. 如請求項1或2之三維結構物雷射焊接裝置，其中，上述雷射焊接部包括：雷射振盪器，向附著於上述多個三維結構物的電子元件輸出並照射雷射光束；雷射光束照射部，包括將從上述雷射振盪器輸出之高斯形態的雷射轉換為能源均勻分佈的面光源的雷射光束成形部和光學系統；第三移送部，使上述雷射光束照射部沿著與上述托盤的移送方向垂直的方向相對於上述工作臺進行上下移送；第三台架，支撐上述第三移送部。
  13. 如請求項12之三維結構物雷射焊接裝置，其中，上述雷射焊接部還包括檢測上述多個三維結構物和雷射光束照射部的排列狀態及焊接狀態的第三監控部。
  14. 如請求項1或2之三維結構物雷射焊接裝置，其中，上述多個三維結構物為用於汽車尾燈或前燈的結構物。
  15. 一種三維結構物雷射焊接方法，包括： 提供多個三維結構物的步驟，在上述多個三維結構物上塗敷有黏結物質並在上述黏結物質上附著有電子元件；向附著於上述多個三維結構物的電子元件照射雷射來進行焊接的步驟。
  16. 一種三維結構物雷射焊接方法，包括：在工作臺設置作為被附著物的多個三維結構物的步驟；借助工作臺移送部移送設置有上述多個三維結構物的工作臺的步驟；在上述多個三維結構物上塗敷黏結物質的步驟；在上述多個三維結構物之塗敷有黏結物質的部分拾取並附著電子元件的步驟；向附著於上述多個三維結構物的電子元件照射雷射來進行焊接的步驟。
  17. 如請求項16之三維結構物雷射焊接方法，其中，在上述多個三維結構物上塗敷黏結物質的步驟中，上述黏結物質為焊錫膏或非導電膠。
  18. 如請求項15或16之三維結構物雷射焊接方法，其中，上述多個三維結構物為用於汽車尾燈或前燈的結構物。
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