CN110352476B - 用于三维结构物的激光接合装置及方法 - Google Patents

用于三维结构物的激光接合装置及方法 Download PDF

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CN110352476B
CN110352476B CN201780079309.6A CN201780079309A CN110352476B CN 110352476 B CN110352476 B CN 110352476B CN 201780079309 A CN201780079309 A CN 201780079309A CN 110352476 B CN110352476 B CN 110352476B
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dimensional structures
laser
dimensional
electronic components
electronic component
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CN110352476A (zh
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崔在浚
金秉禄
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Laserssel Co Ltd
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Laserssel Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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Abstract

本发明提供如下的用于三维结构物的激光接合装置及方法，即，除了印制电路板(PCB)基板、玻璃基板等整体呈平面形态的基板之外，还可根据客户要求来在弯曲部分具有规则形状或不规则形状的三维结构物(例：汽车尾灯或前照灯用构造物)自动接合电子元器件，并且，可防止电子元器件与三维结构物的排列不合格以及由此引起的接合不合格。

Description

用于三维结构物的激光接合装置及方法
技术领域
本发明涉及激光接合技术，更详细地，涉及可根据客户要求来在弯曲部分具有规则形状或不规则形状的三维结构物(例：汽车尾灯或前照灯用构造物)自动接合电子元器件的激光接合装置及方法。
背景技术
随着电子产品的小型化及高功能化，在保护半导体芯片免受诸如灰尘、湿气、电、机械负荷等各种外部环境影响的半导体封装方式方面，仅通过以往的线接合方式来实现轻薄简小型化是有限的，因此使用激光接合方式。激光接合方式是将半导体芯片附着在载体基板或电路带的电路图案并利用激光来接合的方式。
日本授权专利号第3303832号中公开了一种用于将半导体芯片的每个电极一次性联接到配线基板的激光接合技术。在日本授权专利号第3303832号中，用于吸附半导体芯片的吸附头由透射激光束的玻璃构成，并且，操作台与珀尔贴器件相结合。半导体芯片通过激光束直接快速加热整个半导体芯片。配线基板通过结合在操作台的帕尔帖器件来被快速加热及快速冷却。
美国公开专利号第2016/004938号涉及半导体芯片封装，公开了一种为了在电路基板联接半导体芯片管芯而利用激光的接合技术。在美国公开专利号第2016/004938号中，包括使激光束朝向半导体管芯来挥发焊剂(flux)并电连接凸块(bump)和电路图案之间的凸块回流步骤。
韩国授权专利号第10-0913579号公开了用于接合柔性印刷电路(FlexiblePrinted Circuit，FPC)、带载封装(Tape Carrier Package，TCP)及共模柔性印刷电路(Common Block Flexible Printed Circuit，CBF)、驱动器集成电路(Driver IntegratedCircuit，Driver IC驱动芯片)等驱动用电路基板的装置。在韩国授权专利号第10-0913579号中，将接合驱动用电路基板的基板移送到接合作业位置并取出，同时将驱动用电路基板接合在基板，从而基于接合作业缩短了节拍时间(tact time)并实现作业的高速化。
一般情况下，为了将半导体芯片等电子元器件或包括集成电路(IC)、晶体管(TR)、电阻器件(R)及电容器(C)在内的设备附着在印刷电路板而使用回流装置。目前，回流装置大致分为质量回流(mass reflow)装置和激光回流装置。
质量回流(mass reflow)装置在传送带上放置多个附着有焊球、焊盘或焊膏等焊料的基板并驱动传送带。基板沿着所驱动的传送带并通过设置有红外线加热器(infraredheater)或陶瓷加热器加热区间。在此情况下，红外线加热器设置在传送带的上侧和下侧，红外线加热器对基板上的焊球施加热量来将半导体器件附着在基板。
在质量回流装置中，电子元器件或设备在约50℃至最高约230～290℃之间的高温下经受约210秒(sec)的热应力。因此，电子元器件或设备可能受到热损坏，由此，存在电子元器件或设备的特性或寿命下降的问题。并且，红外线加热器需要3～10分钟左右的时间来对焊球施加热量，以使电子元器件或设备与基板相连接，因此存在不经济的问题。并且，质量回流工序因还向附着在基板的器件中的热承受力差的器件施加热量而有可能导致不合格，由于对整个基板施加热量，因此存在会在基板上发生热变形的问题。
另一方面，近来，汽车前灯普遍采用发光二极管(LED)，而发光二极管前灯结构物的形状从平面形态到三维形态不等。其中，在接合发光二极管的基板的形状为台阶型、碗型(bowl)等的不规则基板的情况下，若通过质量回流工序来使发光二极管与不规则的基板相结合，则传递到各个部位的热能不均匀，很大程度将导致接合不合格，由于向整个基板施加热能，因此存在会在整个基板上发生热变形的可能性更高的问题。
除了汽车用前灯之外，若用于接合半导体芯片的基板的形状为三维不规则的，则难以避免如上所述的质量回流工序的缺点。
因此，在基板的形状为三维或不规则的条件下，按接合部位照射均质化的激光束并可轻松调节激光束的各个照射区域的激光回流技术将成为非常有用的解决方案。
尽管如此，目前为止的激光回流技术仅应用于整体上呈平面形态的基板，例如用于移动电话、电视(TV)等设备的印制电路板基板和玻璃基板。在基板未呈平面形态或者附着半导体器件的位置整体上不规则的情况下，将无法利用现有的激光接合装置来进行工作。
因此，实际上需要可在如图1所示的三维结构物(例：汽车尾灯或前照灯用构造物)按各部位有效接合电子元器件的新型激光接合装置和方法。
发明内容
技术问题
本发明在如上所述的背景下提出，本发明提供如下的用于三维结构物的激光接合装置及方法，即，除了印制电路板(PCB)基板、玻璃基板等的整体上呈平面形态的基板之外，还可根据客户要求来在弯曲部分具有规则形状或不规则形状的三维结构物自动接合电子元器件。
并且，本发明提供可防止电子元器件与三维结构物的排列不合格以及由此引起的接合不合格的用于三维结构物的激光接合装置及方法。
可从对以下实施例的说明中轻松了解本发明的其他目的。
技术方案
为了实现如上述所述的目的，本发明的三维结构物激光接合装置包括：三维结构物供给部，供给将粘结物质涂敷于多个三维结构物并在上述粘结物质附着有电子元器件的上述多个三维结构物；以及激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合。
本发明的三维结构物激光接合装置包括：电子元器件供给部，装载并移送多个电子元器件；三维结构物供给部，支撑并移送多个三维结构物；粘结物质涂敷部，将粘结物质涂敷于上述多个三维结构物；电子元器件附着部，将上述电子元器件附着于上述多个三维结构物的涂敷有粘结物质的部分；以及激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合。
其中，三维结构物可以是客户要求的在弯曲部分具有规则形状或不规则形状的被附着物。尤其，三维结构物可以是汽车尾灯或前照灯用构造物。
本发明的三维结构物激光接合方法包括：在工作台放置作为被附着物的多个三维结构物的步骤；通过工作台移送部来移送放置有上述多个三维结构物的工作台的步骤；将粘结物质涂敷于上述多个三维结构物的步骤；拾取电子元器件来附着在上述多个三维结构物的涂敷有粘结物质的部分的步骤；以及向附着于上述多个三维结构物的电子元器件照射激光来进行接合的步骤。
发明的效果
本发明的用于三维结构物的激光接合装置具有如下效果。
第一，还可根据客户要求来在弯曲部分具有规则形状或不规则形状的三维结构物激光接合电子元器件。
第二，可防止电子元器件与三维结构物的排列不合格、粘结物质涂敷不合格、电子元器件附着不合格以及接合不合格。
应理解的是，本发明的效果并不限定于上述效果，而是包括可从本发明的详细说明或发明保护范围中所记载的发明的结构推导出的所有效果。
附图说明
图1为用于说明三维结构物的例示图。
图2为用于说明本发明的用于三维结构物的激光接合装置的例示图。
图3为用于说明本发明的用于三维结构物的激光接合装置的动作的例示图。
图4为用于说明通过本发明的用于三维结构物的激光接合装置来在三维结构物接合电子元器件的过程的例示图。
图5为用于说明对形成不规则形状的三维结构物进行供给的三维结构物供给部的结构的例示图。
图6为用于说明本发明的用于三维结构物的激光接合方法的流程图。
最佳实施方式
以下，参照附图，对本发明进行说明。但是，本发明能够以多种不同实施方式来实现，因此，本发明并不限定于在此说明的实施例。而且，为了明确说明本发明，附图中省略了与说明无关的部分，在说明书全文中，对于类似的部分赋予了类似的附图标记。
在说明书全文中，当某一部分与另一部分“连接(联接、接触、结合)”时，这不仅包括“直接连接”的情况，而且还包括中间隔着另一部件“间接连接”的情况。并且，当某一部分“包括”某一结构要素时，除非另有说明，否则意味着还可设置有其他结构要素，并非排除其他结构要素。
在本说明书中使用的术语仅用于说明特定实施例，而并非限定本发明。除非在文脉上另有明确规定，否则单数表达包括复数表达。应理解的是，在本说明书中，“包括”或“具有”等术语用于指定记载于说明书中的特征、数字、步骤、动作、结构要素、部件或它们的组合的存在，而不是预先排除一个或更多其他特征或数字、步骤、动作、结构要素、部件或它们的组合的存在或附加可能性。
即使在如图1所示的三维结构物(例：汽车尾灯或前照灯用构造物)，本发明的用于三维结构物的激光接合装置也可激光接合电子元器件。三维结构物为通过注塑成型来制造的注塑物。过去利用三维结构物的焊接来进行接合，但是，随着制造业的模式逐渐变为智能工厂化(Smart Factory)及定制型大量生产，本申请人开发了缩短制造时间、减少制造费用的用于三维结构物的激光接合装置。
作为一例，本发明的用于三维结构物的激光接合装置200可包括：三维结构物供给部，供给将粘结物质涂敷于多个三维结构物并在上述粘结物质附着有电子元器件的上述多个三维结构物；以及激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合。根据该实施例，可在额外的其他装置中执行将粘结物质涂敷于多个三维结构物并将电子元器件附着于上述粘结物质的工序。本发明的用于三维结构物的激光接合装置200的三维结构物供给部起到在额外的其他装置涂敷粘结物质并将电子元器件附着于粘结物质的多个三维结构物移送到激光接合位置的作用。
作为另一例，如图2所示，本发明的用于三维结构物的激光接合装置200可大致包括电子元器件供给部210、三维结构物供给部250、粘结物质涂敷部220、电子元器件附着部230及激光接合部240。
电子元器件供给部210用于装载并移送多个电子元器件。电子元器件包括半导体芯片、集成电路、发光二极管器件、电阻器、电容器、电感器、变压器或继电器中的至少一种。电子元器件供给部210可包括：托盘211，用于装载多个电子元器件；以及托盘移送部212，沿着一方向移送托盘211。
三维结构物供给部250支撑并移送多个三维结构物。多个三维结构物为弯曲部分具有规则形状或不规则形状的三维结构物(例：汽车尾灯或前照灯用构造物)。
三维结构物供给部250可包括：工作台251，支撑多个三维结构物；以及工作台移送部252，移送放置有多个三维结构物的工作台。
粘结物质涂敷部220将焊锡膏或非导电性粘结剂(NCP)等涂敷于多个三维结构物。作为一例，非导电性粘结剂可包括作为偶联剂的N-甲基-3-氨基丙基三甲氧基硅烷(N-methyl-3-amino propyltrimethoxysilane)、作为粘合改进剂的聚酯丙烯酸酯(polyesteracrylate)。
粘结物质涂敷部220可包括：分配器223，向放置在工作台251的多个三维结构物涂敷焊锡膏或非导电性粘结剂；第一移送部222，沿着与托盘的移送方向垂直的方向并以相对于工作台251上下移动的方式移送分配器223；以及第一龙门架221，支撑第一移送部222。
粘结物质涂敷部220可包括第一监测部，上述第一监测部用于检测多个三维结构物与分配器的排列状态和焊锡膏或非导电性粘结剂的涂敷状态。第一监测部可包括：电荷耦合器件(CCD)摄像头；捕获板(capture board)，用于捕获影像；影像处理板；以及控制部，通过对从影像处理板输入的影像与基准影像进行比较来判断涂敷状态合格还是不合格。
电子元器件附着部230将电子元器件附着于多个三维结构物的涂敷有焊锡膏或非导电性粘结剂的部分。电子元器件包括半导体芯片、集成电路、发光二极管器件、电阻器、电容器、电感器、变压器或继电器中的至少一种。
电子元器件附着部230可包括：器件附着器233，从托盘211拾取电子元器件来附着在多个三维结构物的附着有焊锡膏或非导电性粘结剂的部分；第二移送部232，沿着与托盘的移送方向垂直的方向并以相对于工作台251上下移动的方式移送器件附着器233；以及第二龙门架231，支撑第二移送部232。
电子元器件附着部230可包括第二监测部，上述第二监测部用于检测多个三维结构物与电子元器件的排列状态和电子元器件附着状态。第二监测部可包括：电荷耦合器件摄像头；捕获板，用于捕获影像；影像处理板；以及控制部，通过对从影像处理板输入的影像与基准影像进行比较来判断排列状态和电子元器件附着状态合格还是不合格。
激光接合部240向附着于多个三维结构物的电子元器件照射面光源或线光源形态的激光束来进行接合。作为一例，激光接合部240包括：激光束照射部243；第三移送部242，沿着与托盘的移送方向垂直的方向并以相对于工作台251上下移动的方式移送激光束照射部243；以及第三龙门架241，支撑第三移送部242。
激光束照射部243可包括：激光振荡器，向附着于多个三维结构物的电子元器件输出并照射激光束；光束形成部和光学系统，将从上述激光振荡器输出的高斯激光转换为具有均匀的能量分布的面光源。
光束形成部可以是形成均质化的四边形光束的导光部。导光部以与光纤维保持0.2mm以上且0.5mm以下的间隔的方式设置而成，长度可以为1.0m以上且1.5m以下。若导光部的长度小于1.0m，则在导光部内部散射后输出的激光的光均质度下降，从而导致被附着物P的照射区域的温度分布不均匀。另一方面，若导光部的长度为1.5m以上，则激光的光均质度非常好，但是由于光均质化模块的总长度变长，从而导致制造费用增加，且不利于光均质化模块的保管和移送。
导光部与光纤维之间不需要任何用于使激光束变得均匀的光学透镜。光纤维的开口数(NA)为0.2以上且0.3以下。由此，从光纤维射出的激光束全部射入导光部内部。
导光部作为使激光通过的介质，使用具有高透过率的母材来形成剖面为四边形的直角平行六面体，在与激光通过的光轴平行的侧面形成全反射涂膜，在垂直于上述光轴的上部面和下部面形成无反射涂膜。由此，可防止通过导光部的激光束损失到外部。
作为一例，光学系统可以是集光透镜和发散透镜，上述集光透镜用于会聚通过导光部发散的均质化的四边形光束，并且，上述发散透镜使集光的均质化的四边形光束保持到规定工作距离并进行发散。可通过集光透镜和发散透镜的曲率半径组合来调节均质化的四边形光束的大小和工作距离。
激光接合部240可包括第三监测部，上述第三监测部用于检测多个三维结构物与激光接合部的排列状态和接合状态。第三监测部可包括：电荷耦合器件摄像头；捕获板，用于捕获影像；影像处理板；以及控制部，通过对从影像处理板输入的影像与基准影像进行比较来判断排列状态和接合状态合格还是不合格。
作为一例，在移送放置有多个三维结构物的工作台251被移送之后，激光接合部240可根据三维结构物的形状来调节激光的照射强度和照射区域。由此，即使基板的形状为三维或不规则的情况下，也可按接合部位照射均质化的激光束，可以轻松调节激光束的各个照射区域来进行接合。
图3为用于说明用于形成有规则形状的三维结构物的激光接合装置的动作的例示图，图4为用于说明通过用于形成有规则形状的三维结构物的激光接合装置来在三维结构物接合电子元器件的过程的例示图。
首先，参照图3进行说明，用于形成有规则形状的三维结构物的激光接合装置可包括：第一工作台251、第二工作台261，支撑多个三维结构物110；以及第一工作台移送部252、第二工作台移送部262，用于移送放置有多个三维结构物110的第一工作台251、第二工作台261。可根据客户要求的生产量来增加工作台和工作台移送部的安装数量。
如图3所示，将装载多个电子元器件的托盘211沿着一方向移送的托盘移送部212可与第一工作台移送部252、第二工作台移送部262分开设置。托盘211装载于托盘移送部212来被移送，在完成使用后向外部排出。
第一工作台251、第二工作台261由第一工作台移送部252、第二工作台移送部262来移送并通过第一龙门架221。在第一龙门架221设置分配器223和第一移送部222，上述分配器223向多个三维结构物110涂敷焊锡膏或非导电性粘结剂，上述第一移送部222沿着与托盘的移送方向垂直的方向并以相对于工作台251上下移动的方式移送分配器223。可在第一龙门架221设置监视模块，上述监视模块用于检测多个三维结构物110与分配器223的排列状态和焊锡膏或非导电性粘结剂涂敷状态。
若将焊锡膏或非导电性粘结剂涂敷于多个三维结构物110，则第一工作台251、第二工作台261由第一工作台移送部252、第二工作台移送部262移送并通过第二龙门架231。在第二龙门架231设置器件附着器233和第二移送部232，上述器件附着器233从托盘211拾取电子元器件来附着在多个三维结构物110的涂敷有焊锡膏或非导电性粘结剂的部分，上述第二移送部232沿着与托盘的移送方向垂直的方向并以相对于工作台251上下移动的方式移送器件附着器233。可在第二龙门架231设置监视模块，上述监视模块用于检测多个三维结构物110与器件附着器233的排列状态和电子元器件附着状态。
若电子元器件附着于多个三维结构物110，则第一工作台251、第二工作台261由第一工作台移送部252、第二工作台移送部262移送并通过第三龙门架241。在第三龙门架241设置激光束照射部243和第三移送部242，上述激光束照射部243向附着于多个三维结构物110的电子元器件照射激光束，上述第三移送部242沿着与托盘的移送方向垂直的方向并以相对于工作台251上下移动的方式移送激光束照射部243。可在第三龙门架241设置监视模块，上述监视模块用于检测多个三维结构物110与激光束照射部243的排列状态和接合状态。
参照图4，放置在工作台251并通过工作台移送部移送的多个三维结构物110依次通过分配器223、器件附着器233以及激光束照射部243，通过分配器来涂敷焊锡膏或非导电性粘结剂30，通过器件附着器233来将电子元器件40附着于焊锡膏或非导电性粘结剂30，通过激光束照射部243来接合电子元器件40。
目前为止，参照图3及图4，对利用供给形成有规则形状的三维结构物的三维结构物供给部来激光接合电子元器件的装置和接合过程进行了说明。
以下，参照图5，对供给形成不规则形状的三维结构物的三维结构物供给部的结构进行说明。
如图5所示，三维结构物供给部包括：放置部511，用于放置形成不规则形状的多个三维结构物120；驱动轴512，与放置部511相连接；驱动带513，与驱动轴512相连接；第一马达521，用于使驱动带513旋转；结合部514，与驱动轴512相结合；支撑部515，使结合部514以能够上下旋转的方式结合；以及第二马达522，与结合部514相连接，用于使结合部514上下旋转。
虽未在图5中示出，但是为了向形成不规则形状的三维结构物涂敷焊锡膏或非导电性粘结剂、附着电子元器件、照射激光束，本发明的三维结构物激光接合装置可包括：存储部，存储用于驱动第一马达521和第二马达522的作业文件；以及马达驱动部，根据作业文件来驱动第一马达521和第二马达522。
如图6所示，在图3及图4所示的用于三维结构物的激光接合装置中进行的激光接合方法可主要包括：装载步骤、涂敷步骤、拾取及附着步骤、接合步骤、卸载步骤。
装载步骤包括在工作台放置作为被附着物的多个三维结构物的步骤S611。涂敷步骤包括通过工作台移送部移送放置有多个三维结构物的工作台的步骤S612和将焊锡膏或非导电性粘结剂涂敷于多个三维结构物的步骤S613。作为一例，工作台的移送距离、移送速度及移送位置被预先设定并存储在用于三维结构物的激光接合装置的存储部。但是，为了检查工作台是否被准确移送到所设定的移送位置以及校正不正确的位置而使用包括监视模块的监测部。在步骤S613之后，可包括通过监测部检测焊锡膏或非导电性粘结剂涂敷状态来判断涂敷状态合格还是不合格的步骤。
拾取及附着步骤包括通过工作台移送部对将焊锡膏或非导电性粘结剂涂敷于多个三维结构物的工作台进行移送的步骤S614和通过从托盘拾取电子元器件来附着于焊锡膏或非导电性粘结剂的步骤S615。作为一例，工作台的移送距离、移送速度及移送位置被预先设定并存储在用于三维结构物的激光接合装置的存储部。但是，为了检查工作台是否被准确移送到所设定的移送位置以及校正不正确的位置而使用包括监视模块的监测部。在步骤S615之后，可包括通过监测部检测焊锡膏或非导电性粘结剂涂敷状态来判断涂敷状态合格还是不合格的步骤。
接合步骤包括通过工作台移送部对将电子元器件附着于多个三维结构物110的工作台进行移送的步骤S616和向电子元器件照射激光束的步骤S617。作为一例，工作台的移送距离、移送速度及移送位置被预先设定并存储在用于三维结构物的激光接合装置的存储部。但是，为了检查工作台是否被准确移送到所设定的移送位置以及校正不正确的位置而使用包括监视模块的监测部。在步骤S617之后，可包括通过监测部检测焊锡膏或非导电性粘结剂涂敷状态来判断涂敷状态合格还是不合格的步骤。
卸载步骤包括从工作台排出多个三维结构物的步骤S618，即，若依次完成将焊锡膏或非导电性粘结剂涂敷于多个三维结构物、将电子元器件附着于所涂敷的焊锡膏或非导电性粘结剂以及激光接合，则从工作台排出多个三维结构物。
以上所述的本发明的说明用于例示，本发明所属技术领域的普通技术人员可以理解，在不脱离本发明的技术思想或不改变必要的特征的情况下，能够轻松改变成其他具体实施方式。因此，应理解，以上所述的实施例在所有方面都是例示性的而非限定性的。例如，可分散实施以单一形式说明的各个结构要素，同样，也能够以结合形态实施分散说明的结构要素。
附图标记的说明
30：焊锡膏或非导电性粘结剂
40：电子元器件
110：三维结构物
200：用于三维结构物的激光接合装置
210：电子元器件供给部
211：托盘
212：托盘移送部
211：托盘
212：托盘移送部
220：粘结物质涂敷部
221：第一龙门架
222：第一移送部
223：分配器
230：电子元器件附着部
231：第二龙门架
232：第二移送部
233：器件附着器
240：激光接合部
241：第三龙门架
242：第三移送部
243：激光束照射部
251：第一工作台
252：第一工作台移送部
261：第二工作台
262：第二工作台移送部
具体实施方式
如上所述，以本发明的最佳实施方式详细记述了本发明的具体实施方式。
产业上的可利用性
本说明书中的技术可用于激光接合装置。

Claims (15)

1.一种三维结构物激光接合装置，其特征在于，包括：
三维结构物供给部，供给将粘结物质涂敷于多个三维结构物并在上述粘结物质附着有电子元器件的上述多个三维结构物；以及
激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合，
上述三维结构物供给部包括：
工作台，支撑多个三维结构物；以及
工作台移送部，移送放置有上述多个三维结构物的工作台，
上述多个三维结构物为弯曲部分具有规则形状的被附着物。
2.根据权利要求1所述的三维结构物激光接合装置，其特征在于，上述多个三维结构物为汽车尾灯或前照灯用构造物。
3.一种三维结构物激光接合装置，其特征在于，包括：
电子元器件供给部，装载并移送多个电子元器件；
三维结构物供给部，支撑并移送多个三维结构物；
粘结物质涂敷部，将粘结物质涂敷于上述多个三维结构物；
电子元器件附着部，将上述电子元器件附着于上述多个三维结构物的涂敷有粘结物质的部分；以及
激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合，
上述三维结构物供给部包括：
工作台，支撑多个三维结构物；以及
工作台移送部，移送放置有上述多个三维结构物的工作台，
上述多个三维结构物为弯曲部分具有规则形状的被附着物。
4.根据权利要求3所述的三维结构物激光接合装置，其特征在于，上述电子元器件供给部包括：
托盘，用于装载上述多个电子元器件；以及
托盘移送部，沿着一方向移送上述托盘。
5.根据权利要求3或4所述的三维结构物激光接合装置，其特征在于，上述多个三维结构物为汽车尾灯或前照灯用构造物。
6.根据权利要求4所述的三维结构物激光接合装置，其特征在于，上述粘结物质涂敷部包括：
分配器，向放置在上述工作台的多个三维结构物涂敷焊锡膏或非导电性粘结剂；
第一移送部，沿着与上述托盘的移送方向垂直的方向并以相对于上述工作台上下移动的方式移送上述分配器；以及
第一龙门架，支撑上述第一移送部。
7.根据权利要求6所述的三维结构物激光接合装置，其特征在于，上述粘结物质涂敷部还包括第一监测部，上述第一监测部用于检测上述多个三维结构物与分配器的排列状态和焊锡膏或非导电性粘结剂的涂敷状态。
8.根据权利要求4所述的三维结构物激光接合装置，其特征在于，上述电子元器件附着部包括：
器件附着器，从上述托盘拾取电子元器件来附着在上述多个三维结构物的涂敷有焊锡膏或非导电性粘结剂的部分；
第二移送部，沿着与上述托盘的移送方向垂直的方向并以相对于上述工作台上下移动的方式移送上述器件附着器；以及
第二龙门架，支撑上述第二移送部。
9.根据权利要求8所述的三维结构物激光接合装置，其特征在于，上述电子元器件附着部还包括第二监测部，上述第二监测部用于检测上述多个三维结构物与器件附着器的排列状态和电子元器件附着状态。
10.根据权利要求4所述的三维结构物激光接合装置，其特征在于，上述激光接合部包括：
激光振荡器，向附着于上述多个三维结构物的电子元器件输出并照射激光束；
激光束照射部，包括将从上述激光振荡器输出的高斯激光转换为具有均匀的能量分布的面光源的光束形成部和光学系统；
第三移送部，沿着与上述托盘的移送方向垂直的方向并以相对于上述工作台上下移动的方式移送上述激光束照射部；以及
第三龙门架，支撑上述第三移送部。
11.根据权利要求10所述的三维结构物激光接合装置，其特征在于，上述激光接合部还包括第三监测部，上述第三监测部用于检测上述多个三维结构物与激光束照射部的排列状态和接合状态。
12.一种三维结构物激光接合装置，其特征在于，包括：
三维结构物供给部，供给将粘结物质涂敷于多个三维结构物并在上述粘结物质附着有电子元器件的上述多个三维结构物；以及
激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合，
上述三维结构物供给部包括：
放置部，用于放置多个三维结构物；
驱动轴，与上述放置部相连接；
驱动带，与上述驱动轴相连接；
第一马达，用于使上述驱动带旋转；
结合部，与上述驱动轴相结合；
支撑部，使上述结合部以能够上下旋转的方式结合；以及
第二马达，与上述结合部相连接，用于使上述结合部上下旋转。
13.根据权利要求12所述的三维结构物激光接合装置，其特征在于，上述多个三维结构物为弯曲部分具有不规则形状的被附着物。
14.一种三维结构物激光接合装置，其特征在于，包括：
电子元器件供给部，装载并移送多个电子元器件；
三维结构物供给部，支撑并移送多个三维结构物；
粘结物质涂敷部，将粘结物质涂敷于上述多个三维结构物；
电子元器件附着部，将上述电子元器件附着于上述多个三维结构物的涂敷有粘结物质的部分；以及
激光接合部，向附着于上述多个三维结构物的电子元器件照射激光来进行接合，
上述三维结构物供给部包括：
放置部，用于放置多个三维结构物；
驱动轴，与上述放置部相连接；
驱动带，与上述驱动轴相连接；
第一马达，用于使上述驱动带旋转；
结合部，与上述驱动轴相结合；
支撑部，使上述结合部以能够上下旋转的方式结合；以及
第二马达，与上述结合部相连接，用于使上述结合部上下旋转。
15.根据权利要求14所述的三维结构物激光接合装置，其特征在于，上述多个三维结构物为弯曲部分具有不规则形状的被附着物。
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