TW201737267A - Anisotropic sheet comprising conductive particles mixed different kind of particles - Google Patents
Anisotropic sheet comprising conductive particles mixed different kind of particles Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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Abstract
Description
本發明關於一種包括混合有異種粒子的導電粒子之各向異性導電片，更詳細地，包括具有物理混合高導電性金屬和磁性粒子形式的導電粒子的各向異性導電片。The present invention relates to an anisotropic conductive sheet comprising conductive particles mixed with heterogeneous particles, and more particularly, an anisotropic conductive sheet having conductive particles in the form of physically mixed highly conductive metals and magnetic particles.
通常，在完成製造半導體器件之後，爲了判斷該半導體器件是否不良而執行電氣測試。具體而言，透過由測試裝置對作爲檢測對象的半導體器件發送測試信號來判定半導體器件是否出現短路。Generally, after completion of manufacturing a semiconductor device, electrical testing is performed in order to judge whether the semiconductor device is defective. Specifically, it is determined whether or not a short circuit occurs in the semiconductor device by transmitting a test signal to the semiconductor device to be detected by the test device.
為了實現上述方法，需要電連接測試裝置和半導體器件，而測試插座其間產生中介作用。圖1爲最近一般使用的各向異性導電片形式的測試插座的組成的截面圖。參照圖1，各向異性導電片10包括絕緣支撐部11、和沿絕緣支撐部11的面方向相互隔開的多個導電部12。絕緣支撐部11可以由支撐部件13固定。導電部12形成在與測試目標裝置20的端子21相對應的位置，且被配置成使得多個導電粒子P在絕緣彈性材料中沿絕緣支撐部11的厚度方向排列。各向異性導電片10設置在測試裝置30的上部。測試裝置30的接墊31和測試目標裝置20的端子21分別沿導電部12的上下方向接觸，在導電部12中的導電粒子P相互接觸，以形成導電狀態。在這種狀態下，若由測試裝置30的接墊31發送測試信號，則該測試信號經過導電部12傳達到測試目標裝置20的端子21，從而能夠執行電氣測試。In order to implement the above method, it is necessary to electrically connect the test device and the semiconductor device, and the test socket has an intermediary effect therebetween. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing the composition of a test socket in the form of an anisotropic conductive sheet which has been generally used recently. Referring to Fig. 1, an anisotropic conductive sheet 10 includes an insulating support portion 11 and a plurality of conductive portions 12 spaced apart from each other in the surface direction of the insulating support portion 11. The insulating support portion 11 can be fixed by the support member 13. The conductive portion 12 is formed at a position corresponding to the terminal 21 of the test target device 20, and is configured such that the plurality of conductive particles P are arranged in the thickness direction of the insulating support portion 11 in the insulating elastic material. The anisotropic conductive sheet 10 is disposed at an upper portion of the test device 30. The pads 31 of the test device 30 and the terminals 21 of the test target device 20 are respectively in contact with the upper and lower directions of the conductive portion 12, and the conductive particles P in the conductive portion 12 are in contact with each other to form a conductive state. In this state, if the test signal is transmitted from the pad 31 of the test apparatus 30, the test signal is transmitted to the terminal 21 of the test target device 20 via the conductive portion 12, so that the electrical test can be performed.
通常，上述各向異性導電片10透過下面的過程製成。首先，準備設置成彼此面對的上模具和下模具。在上模具和下模具與導電部12的設置模式對應地形成有強磁體部分。將薄片成形用材料插入到上模具與下模具之間。薄片成形用材料形成爲具有導電粒子P分散在流動的彈性聚合物材料中的形式。在上模具的上端和下模具的下端設置有一對電磁鐵，若使該電磁鐵運作，則沿薄片成形用材料的厚度方向形成強磁性。由於該磁場而導電粒子P在上模具和下模具的強磁體部分沿厚度方向取向。在一般的各向異性導電片10中，作爲導電部12的導電粒子P使用將高導電性金屬鍍在磁性芯粒子表面上而成的粒子。Generally, the above anisotropic conductive sheet 10 is formed by the following process. First, the upper mold and the lower mold which are disposed to face each other are prepared. A strong magnet portion is formed corresponding to the arrangement mode of the upper mold and the lower mold and the conductive portion 12. A sheet forming material is inserted between the upper mold and the lower mold. The sheet forming material is formed in a form having the conductive particles P dispersed in the flowing elastic polymer material. A pair of electromagnets are provided at the upper end of the upper mold and the lower end of the lower mold, and when the electromagnet is operated, strong magnetism is formed along the thickness direction of the sheet forming material. Due to the magnetic field, the conductive particles P are oriented in the thickness direction in the strong magnet portions of the upper and lower molds. In the general anisotropic conductive sheet 10, as the conductive particles P of the conductive portion 12, particles obtained by plating a highly conductive metal on the surface of the magnetic core particles are used.
當作爲導電粒子P使用鍍金的粒子時，在所述製備過程的施加磁性的步驟中，磁性芯粒子可以被磁化。即，在磁性芯粒子的兩側形成較強的N極和S極，因此，如圖2所示，有可能發生鄰接的導電部12相互短路（short）的現象。並且，需要在磁性芯粒子表面上鍍高導電性金屬的工藝，而當高導電性金屬磨損時，導電粒子的電特性降低，從而在測試時測試目標裝置的端子與測試裝置的接墊之間的電流路徑形成高電阻值，導致障礙。另一方面，作爲導電金屬可以使用將兩種以上的金屬混合而成的合金，但在這種情況下，導電金屬自身失去磁化特性，因此，當採用上述的製備方法時，雖然施加磁場，也無法使導電粒子適當地沿厚度方向排列。When gold-plated particles are used as the conductive particles P, the magnetic core particles may be magnetized in the step of applying magnetism in the preparation process. That is, since the strong N pole and the S pole are formed on both sides of the magnetic core particle, as shown in FIG. 2, there is a possibility that the adjacent conductive portions 12 are short-circuited with each other. Moreover, a process of plating a highly conductive metal on the surface of the magnetic core particles is required, and when the highly conductive metal is worn, the electrical characteristics of the conductive particles are lowered, thereby testing the terminal of the target device and the pad of the test device during the test. The current path forms a high resistance value, causing an obstacle. On the other hand, as the conductive metal, an alloy obtained by mixing two or more kinds of metals may be used, but in this case, the conductive metal itself loses magnetization characteristics, and therefore, when the above-described preparation method is employed, although a magnetic field is applied, It is impossible to arrange the conductive particles appropriately in the thickness direction.
所欲解決之技術問題： 本發明是爲了解決上述現有技術的問題而提出的，其目的在於提供一種各向異性導電片，該各向異性導電片無需在導電粒子上形成高導電性鍍層，也能夠呈現優異的電特性。Technical Problem to be Solved: The present invention has been made to solve the above problems of the prior art, and an object thereof is to provide an anisotropic conductive sheet which does not need to form a highly conductive plating layer on conductive particles. Can exhibit excellent electrical properties.
本發明的另一目的在於提供一種製備工藝簡單、成本低的各向異性導電片。Another object of the present invention is to provide an anisotropic conductive sheet which is simple in preparation process and low in cost.
本發明的再一目的在於在各向異性導電片的製備過程中去除導電部之間的短路現象。It is still another object of the present invention to remove the short circuit phenomenon between the conductive portions during the preparation of the anisotropic conductive sheet.
技術手段： 爲達到上述目的，根據本發明的一實施例，提供一種各向異性導電片，用以電連接測試目標裝置的端子與測試裝置的接墊，該各向異性導電片的特徵在於包括多個導電部，沿厚度方向形成於絕緣支撐部中，且包括多個導電粒子，各該導電粒子分別實現爲將高導電性金屬和磁性粒子混合而成的混合粒子。Technical Means: In order to achieve the above object, according to an embodiment of the present invention, an anisotropic conductive sheet is provided for electrically connecting a terminal of a test target device and a pad of a test device, the anisotropic conductive sheet being characterized by including The plurality of conductive portions are formed in the insulating support portion in the thickness direction, and include a plurality of conductive particles, and each of the conductive particles is realized as a mixed particle obtained by mixing a highly conductive metal and magnetic particles.
混合在各該導電粒子中的該磁性粒子中的至少一些粒子可以相互接觸。At least some of the magnetic particles mixed in each of the conductive particles may be in contact with each other.
在該導電粒子中的至少一些粒子可以是將鍍金層形成在該混合粒子表面上而成的。At least some of the particles in the conductive particles may be formed by forming a gold plating layer on the surface of the mixed particles.
該磁性粒子可以由鐵磁材料製成。The magnetic particles may be made of a ferromagnetic material.
功效： 根據本發明，構成各向異性導電片的導電部的導電粒子同時具有高導電性和磁性的特性，且其製備過程也可以簡化。Efficacy: According to the present invention, the conductive particles constituting the conductive portion of the anisotropic conductive sheet have both high conductivity and magnetic properties, and the preparation process thereof can be simplified.
並且，根據本發明，即使因各向異性導電片的反覆使用而使外表面磨損，也可以保持穩定的電流特性。Further, according to the present invention, even if the outer surface is worn by the reverse use of the anisotropic conductive sheet, stable current characteristics can be maintained.
另一方面，根據本發明，各向異性導電片的導電粒子在製備過程中只具有所需程度的磁力，因此可以防止導電部之間的短路現象。On the other hand, according to the present invention, the conductive particles of the anisotropic conductive sheet have only a desired degree of magnetic force in the preparation process, so that a short circuit phenomenon between the conductive portions can be prevented.
下面將參照附圖更充分地描述本發明，其中，在附圖中本發明的示例性實施例被示出。然而，本發明可以以許多不同的形式來實現，並且不應被解釋爲限於在此所闡述的實施例。在附圖中，爲了說明的簡明，與描述無關的部分被省略，並且相同的標號始終指示相同的元件。The invention will be described more fully hereinafter with reference to the accompanying drawings in which, However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. In the drawings, parts that are not related to the description are omitted for the sake of simplicity of the description, and the same reference numerals are used to refer to the same elements.
在整個說明書中，某一部分與另一部分相「連接」時，不僅包括 「直接連接」的情況，還包括在中間具備其他元件「間接連接」的情況。並且，當表述爲某部分 「包括」某結構要素時，除非有特別相反的記載，否則不表示排除其他結構要素，而是表示可進一步包括其他結構要素。In the entire specification, when one part is "connected" to another part, it includes not only the case of "direct connection" but also the case where other components are "indirectly connected" in the middle. Further, when a part is referred to as a "comprising" a structural element, unless otherwise specified, it does not mean that the other structural elements are excluded, but the other structural elements may be further included.
下面，參照附圖詳細說明本發明的實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
圖3爲示出根據本發明的一實施例的各向異性導電片的組成的截面圖。3 is a cross-sectional view showing the composition of an anisotropic conductive sheet according to an embodiment of the present invention.
參照圖3，根據一實施例的各向異性導電片100產生電連接測試目標裝置200（如半導體器件、PCB基板、FPCB等各種電子器件）的端子210和測試裝置300的接墊310的功能。Referring to FIG. 3, the anisotropic conductive sheet 100 according to an embodiment generates a function of electrically connecting the terminal 210 of the test target device 200 (such as various electronic devices such as a semiconductor device, a PCB substrate, an FPCB, etc.) and the pad 310 of the test device 300.
上述各向異性導電片100由絕緣支撐部110和沿絕緣支撐部110的面方向相互隔開的多個導電部120構成。The anisotropic conductive sheet 100 is composed of an insulating support portion 110 and a plurality of conductive portions 120 spaced apart from each other in the surface direction of the insulating support portion 110.
絕緣支撐部110產生使多個導電部120相互絕緣並支撐多個導電部120的功能。上述絕緣支撐部110由具有絕緣性且可彈性變形的彈性聚合物材料製成。彈性聚合物材料較佳爲具有交聯結構的聚合物材料。爲獲得交聯聚合物材料，可使用多種可固化的聚合物形成材料，具體地，可使用下列物質：共軛二烯類橡膠，例如是聚丁二烯橡膠、天然橡膠、聚異戊二烯橡膠、苯乙烯-丁二烯共聚物橡膠、丙烯腈-丁二烯共聚物橡膠等以及其氫添加劑；嵌段共聚物橡膠，例如是苯乙烯-丁二烯-二烯嵌段共聚物橡膠、苯乙烯-異戊二烯共聚物橡膠等以及其氫添加劑；氯丁二烯橡膠；胺酯橡膠；聚酯類橡膠；表氯醇橡膠；矽氧橡膠；亞乙烯-亞丙烯共聚物橡膠；亞乙烯-亞丙烯-二烯共聚物橡膠。較佳地，絕緣支撐部110可以由矽氧橡膠製成。The insulating support portion 110 generates a function of insulating the plurality of conductive portions 120 from each other and supporting the plurality of conductive portions 120. The above-described insulating support portion 110 is made of an elastic polymer material which is insulative and elastically deformable. The elastic polymer material is preferably a polymer material having a crosslinked structure. In order to obtain a crosslinked polymer material, a plurality of curable polymer forming materials may be used. Specifically, the following may be used: a conjugated diene-based rubber such as polybutadiene rubber, natural rubber, or polyisoprene. Rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, and the like, and hydrogen additive thereof; block copolymer rubber, for example, styrene-butadiene-diene block copolymer rubber, Styrene-isoprene copolymer rubber and the like and hydrogen additive thereof; chloroprene rubber; amine ester rubber; polyester rubber; epichlorohydrin rubber; oxime rubber; vinylidene-propylene copolymer rubber; Ethylene-propylene oxide-diene copolymer rubber. Preferably, the insulating support portion 110 may be made of neodymium oxide rubber.
另一方面，多個導電部120分別以等距間隔或更小的間隔形成在與檢測目標裝置200的各個端子210相對應的位置。各個導電部120形成爲沿其厚度方向延伸於絕緣支撐部110中。各個導電部120包括沿絕緣支撐部110的厚度方向取向的多個導電粒子121。On the other hand, the plurality of conductive portions 120 are respectively formed at positions corresponding to the respective terminals 210 of the detection target device 200 at equal intervals or smaller intervals. Each of the conductive portions 120 is formed to extend in the thickness direction of the insulating support portion 110. Each of the conductive portions 120 includes a plurality of conductive particles 121 oriented in the thickness direction of the insulating support portion 110.
圖4爲示出根據本發明的另一實施例的各向異性導電片的組成的截面圖。4 is a cross-sectional view showing the composition of an anisotropic conductive sheet according to another embodiment of the present invention.
首先，參照圖4的（a）部分，根據一實施例的導電粒子121分別實現爲具有混合高導電性金屬121a和磁性粒子121b的形式的混合粒子。由此，高導電性金屬121a和磁性粒子121b以相互熔接的狀態存在於一個導電粒子121中。雖然附圖中僅示出導電粒子121的外形，但高導電性金屬121a和磁性粒子121b在導電粒子121的內部中也以混合狀態存在。First, referring to part (a) of FIG. 4, the conductive particles 121 according to an embodiment are respectively realized as mixed particles having a form in which the highly conductive metal 121a and the magnetic particles 121b are mixed. Thereby, the highly conductive metal 121a and the magnetic particles 121b are present in one conductive particle 121 in a state of being welded to each other. Although only the outer shape of the conductive particles 121 is shown in the drawing, the highly conductive metal 121a and the magnetic particles 121b are also present in a mixed state in the interior of the conductive particles 121.
由於高導電性金屬121a和磁性粒子121b物理混合而形成一個導電粒子121，因而導電粒子121上保持高導電性金屬121a和磁性粒子121b的各個固有特性。Since the highly conductive metal 121a and the magnetic particles 121b are physically mixed to form one conductive particle 121, the respective characteristics of the highly conductive metal 121a and the magnetic particle 121b are maintained on the conductive particle 121.
在一個導電粒子121中高導電性金屬121a和磁性粒子121b的混合比可以被自由選擇。若高導電性金屬121a的比率更高，則導電粒子121的製造費用可以降低，且各向異性導電片100的電特性可以得到提高。另一方面，若磁性粒子121b的比率更高（例如，磁性粒子121b的比率達到50%以上），則如圖4的（b）部分所示，至少一些磁性粒子121b可以以相互接觸的形式存在。The mixing ratio of the highly conductive metal 121a and the magnetic particles 121b in one conductive particle 121 can be freely selected. If the ratio of the highly conductive metal 121a is higher, the manufacturing cost of the conductive particles 121 can be lowered, and the electrical characteristics of the anisotropic conductive sheet 100 can be improved. On the other hand, if the ratio of the magnetic particles 121b is higher (for example, the ratio of the magnetic particles 121b is 50% or more), as shown in part (b) of FIG. 4, at least some of the magnetic particles 121b may exist in contact with each other. .
另一方面，根據本發明的另一實施例，如圖4的（c）部分所示，導電粒子121可以形成爲具有將高導電性金屬121a和磁性粒子121b混合而成的粒子的表面上塗佈有鍍金層121c的形式。根據圖4的（c）部分所示的實施例，透過添加鍍金層121c來更加提高各個導電粒子121的導電性，因此，在測試時測試目標裝置的端子與測試裝置之間的電流特性也可以得到提高。On the other hand, according to another embodiment of the present invention, as shown in part (c) of FIG. 4, the conductive particles 121 may be formed to have a surface coated with particles in which the highly conductive metal 121a and the magnetic particles 121b are mixed. The cloth is in the form of a gold plated layer 121c. According to the embodiment shown in part (c) of FIG. 4, the conductivity of each of the conductive particles 121 is further improved by adding the gold plating layer 121c, and therefore, the current characteristics between the terminal of the test target device and the test device can be tested during the test. Improved.
根據一實施例，高導電性金屬121a可以由金（Au）、銀（Ag）、銅（Cu）、鋁（Al）、銠（Rh）、鋅（Zn）、鉬（Mo）、鈹（Be）、鎢（W）或這些金屬中至少一種的合金製成，而磁性粒子121b可以由鈷（Co）、鎳（Ni）、鐵（Fe）、ZrFe2、FeBe2、FeRh、MnZn、Ni3Mn、FeCo、FeNi、Ni2Fe、MnPt3、FePd、FePd3、Fe3Pt、FePt、CoPt、CoPt3及Ni3Pt中的至少一種物質製成。較佳地，高導電性金屬121a可以由銀（Ag）製成，而磁性粒子121b可以由鎳（Ni）、鈷（Co）、鐵（Fe）等鐵磁材料製成。另一方面，圖4的（c）部分示出的鍍金層121c可以由該高導電性金屬121a的種類中至少一種物質或與此不同的具有高導電性的物質製成，較佳地，由金（Au）、銠（Rh）、鉑（Pt）、銀（Ag）或鈀（Pd）等物質製成。According to an embodiment, the highly conductive metal 121a may be made of gold (Au), silver (Ag), copper (Cu), aluminum (Al), rhenium (Rh), zinc (Zn), molybdenum (Mo), bismuth (Be). ), tungsten (W) or an alloy of at least one of these metals, and the magnetic particles 121b may be composed of cobalt (Co), nickel (Ni), iron (Fe), ZrFe2, FeBe2, FeRh, MnZn, Ni3Mn, FeCo, It is made of at least one of FeNi, Ni2Fe, MnPt3, FePd, FePd3, Fe3Pt, FePt, CoPt, CoPt3, and Ni3Pt. Preferably, the highly conductive metal 121a may be made of silver (Ag), and the magnetic particles 121b may be made of a ferromagnetic material such as nickel (Ni), cobalt (Co), or iron (Fe). On the other hand, the gold plating layer 121c shown in part (c) of FIG. 4 may be made of at least one of the types of the highly conductive metal 121a or a substance having high conductivity different from that, preferably by Made of gold (Au), rhodium (Rh), platinum (Pt), silver (Ag) or palladium (Pd).
根據一實施例的導電粒子同時具有高導電性和磁性的特性，但無需經過形成鍍金層的過程等或選擇性地經過形成鍍金層的過程來製成，因此，與現有技術相比，可以簡化的方式製備。The conductive particles according to an embodiment have both high conductivity and magnetic properties, but are not required to be formed through a process of forming a gold plating layer or the like or selectively through a process of forming a gold plating layer, and thus can be simplified as compared with the prior art. The way to prepare.
圖5爲用於說明根據本發明的一實施例的導電粒子的製備方法的附圖。Fig. 5 is a view for explaining a method of producing conductive particles according to an embodiment of the present invention.
首先，參照圖5的（a）部分，將以一定比率混合高導電性金屬121a和磁性粒子121b而成的材料填充於用於製造導電粒子的模具510中，從上方施加壓力，以製成導電粒子121。First, referring to part (a) of Fig. 5, a material obtained by mixing the high-conductivity metal 121a and the magnetic particles 121b at a constant ratio is filled in a mold 510 for producing conductive particles, and pressure is applied from above to make a conductive Particle 121.
其次，參照圖5的（b）部分，也可以透過將含有高導電性金屬的樹脂520（例如，環氧樹脂等）和磁性粒子121b混合而塑造成球形來製備導電粒子121。Next, referring to part (b) of FIG. 5, the conductive particles 121 may be prepared by mixing a resin 520 containing a highly conductive metal (for example, an epoxy resin or the like) and magnetic particles 121b to form a spherical shape.
另一方面，根據參照圖4的（c）部分說明的實施例的導電粒子121是透過在以參照圖5的（a）部分和（b）部分說明的製備過程獲得的導電粒子121的表面上進一步塗覆鍍金層來得到的。On the other hand, the conductive particles 121 according to the embodiment explained with reference to part (c) of Fig. 4 are transmitted through the surface of the conductive particles 121 obtained by the preparation process explained with reference to parts (a) and (b) of Fig. 5. Further coated with a gold plating layer.
根據本發明的實施例，僅透過圖5的（a）部分和（b）部分所示的簡單的工藝可以製備導電粒子121，因此，與根據現有鍍金方式的製備過程相比，可以簡化工藝。According to the embodiment of the present invention, the conductive particles 121 can be prepared only by a simple process shown in parts (a) and (b) of FIG. 5, and therefore, the process can be simplified as compared with the preparation process according to the existing gold plating method.
而且，在導電粒子的外表面形成爲鍍金層的情況下，存在在反覆測試時鍍金層磨損而無法提供穩定的導電性的問題，但根據本發明的實施例的導電粒子121自身由高導電性金屬121a製成，因此無需形成鍍金層，可以擺脫上述問題。Further, in the case where the outer surface of the conductive particles is formed as a gold plating layer, there is a problem that the gold plating layer is worn at the time of the repeated test and the stable conductivity cannot be provided, but the conductive particles 121 according to the embodiment of the present invention itself are highly conductive. The metal 121a is formed, so that it is not necessary to form a gold plating layer, and the above problem can be eliminated.
並且，由於在導電粒子121中存在的磁性粒子121b的粒徑非常小，因此即使各個磁性粒子121b由於外部磁場被磁化，其磁力的大小也必然會較小。這優點將在下面說明。Further, since the particle diameter of the magnetic particles 121b existing in the conductive particles 121 is extremely small, even if the respective magnetic particles 121b are magnetized by the external magnetic field, the magnitude of the magnetic force is inevitably small. This advantage will be explained below.
圖6爲用於說明根據本發明的一實施例的各向異性導電片的製備方法的附圖。Fig. 6 is a view for explaining a method of producing an anisotropic conductive sheet according to an embodiment of the present invention.
參照圖6的（a）部分，首先，準備布置成彼此面對的上模具610和下模具620。在上模具610和下模具620根據導電部120的設置模式形成有強磁體部分611、621。Referring to part (a) of Fig. 6, first, an upper mold 610 and a lower mold 620 which are arranged to face each other are prepared. The upper mold 610 and the lower mold 620 are formed with strong magnet portions 611, 621 in accordance with the arrangement pattern of the conductive portion 120.
在上模具610的上端和下模具620的下端分別設置有電磁鐵612、622。Electromagnets 612, 622 are respectively disposed at the upper end of the upper mold 610 and the lower end of the lower mold 620.
在準備完模具時，將用於製備各向異性導電片100的薄片成形用材料600注入於上模具610與下模具620之間。薄片成形用材料600形成爲具有根據本發明的一實施例的導電粒子121分散在流動的彈性聚合物材料中的型態。When the mold is prepared, the sheet forming material 600 for preparing the anisotropic conductive sheet 100 is injected between the upper mold 610 and the lower mold 620. The sheet forming material 600 is formed in a form having the conductive particles 121 dispersed in the flowing elastic polymer material according to an embodiment of the present invention.
然後，使一對電磁鐵612、622運作而沿薄片成形用材料600的厚度方向形成強磁場。結果，如圖6的（b）部分所示，在薄片成形用材料600中導電粒子121以位於上模具610的強磁體部分611和下模具620的強磁體部分621之間的方式排列。Then, the pair of electromagnets 612, 622 are operated to form a strong magnetic field in the thickness direction of the sheet forming material 600. As a result, as shown in part (b) of FIG. 6, the conductive particles 121 are arranged in the sheet forming material 600 in such a manner as to be located between the ferromagnetic portion 611 of the upper mold 610 and the strong magnet portion 621 of the lower mold 620.
然後，以加熱等方法使成形用材料固化來完成製備各向異性導電片。Then, the forming material is cured by heating or the like to complete the preparation of the anisotropic conductive sheet.
在該製備過程中，透過由於一對電磁鐵612、622發生的磁場使導電粒子121的磁性粒子磁化，從而沿薄片成形用材料600的厚度方向取向，此時，若導電粒子121的磁力大到可吸引構成鄰接的導電部120的導電粒子121的程度，則如圖2所示，多個導電部120之間有可能發生短路現象。In the preparation process, the magnetic particles of the conductive particles 121 are magnetized by the magnetic field generated by the pair of electromagnets 612 and 622, and are oriented in the thickness direction of the sheet forming material 600. At this time, if the magnetic force of the conductive particles 121 is large. As the conductive particles 121 constituting the adjacent conductive portions 120 can be attracted, as shown in FIG. 2, a short circuit phenomenon may occur between the plurality of conductive portions 120.
然而，根據本發明的一實施例。導電粒子121中存在的磁性粒子的尺寸微細，因此，透過磁化使其磁力的大小僅僅是透過外部磁場使導電粒子121沿薄片成形用材料600的厚度方向取向的程度。即，其不到構成鄰接的導電部120的導電粒子121之間形成引力的程度，因此，能夠防止不同導電部120之間發生短路現象。However, according to an embodiment of the invention. Since the size of the magnetic particles present in the conductive particles 121 is fine, the magnetic force is transmitted through the magnetization so that the conductive particles 121 are oriented in the thickness direction of the sheet forming material 600 by the external magnetic field. In other words, since the attraction force is not formed between the conductive particles 121 constituting the adjacent conductive portions 120, it is possible to prevent a short circuit from occurring between the different conductive portions 120.
下面，參照圖7，透過實際實驗例說明根據本發明的一實施例的各向異性導電片的電流特性得到改善。Next, referring to Fig. 7, the current characteristics of the anisotropic conductive sheet according to an embodiment of the present invention will be described through actual experimental examples.
對透過使用參照圖1說明的一般各向異性導電片，並使用參照圖6說明的過程來製成的各向異性導電片100的導電部120，利用尺寸爲200㎛的探針電極700施加一定壓力並施加電流。The conductive portion 120 of the anisotropic conductive sheet 100 which is formed by using the general anisotropic conductive sheet described with reference to FIG. 1 and using the process described with reference to FIG. 6 is applied with a probe electrode 700 having a size of 200 μm. Pressure and apply current.
然後，對導電部120承受的最大電流量進行測量，結果，現有各向異性導電片承受了最大2.1A的電流，而根據本發明的一實施例的各向異性導電片承受了最大4.1A的電流。Then, the maximum amount of current that the conductive portion 120 is subjected to is measured, and as a result, the existing anisotropic conductive sheet is subjected to a current of at most 2.1 A, and the anisotropic conductive sheet according to an embodiment of the present invention is subjected to a maximum of 4.1 A. Current.
由此可知，本發明的各向異性導電片使測試目標裝置與測試裝置之間呈現穩定的電流特性。From this, it is understood that the anisotropic conductive sheet of the present invention exhibits stable current characteristics between the test target device and the test device.
上述的本發明的說明只是例示性的，只要是本發明所屬技術領域的普通技術人員，就能理解在不變更本發明的技術思想或必要特徵的情況下，也能輕易變形爲其他具體形態。The above description of the present invention has been described by way of example only, and it will be understood by those of ordinary skill in the art that the present invention can be easily modified to other specific forms without departing from the spirit and scope of the invention.
因此，以上所述的實施例在各方面僅是例示性的，但並不侷限於此。例如，作爲單一形態進行說明的各結構部件也能分散進行實施，同樣，使用分散的進行說明的結構部件也能以結合的形態進行實施。Therefore, the embodiments described above are merely illustrative in all aspects, but are not limited thereto. For example, each structural member described as a single form can also be dispersed and implemented, and similarly, the structural member described using the dispersion can be implemented in a combined form.
本發明的範圍是透過所附申請專利範圍來表示，而並非透過上述詳細的說明，而由申請專利範圍的意義、範圍及其均等概念導出的所有變更或變形的形態應解釋爲包括在本發明的範圍內。The scope of the present invention is defined by the scope of the appended claims, and is not intended to In the range.
10‧‧‧各向異性導電片
11‧‧‧絕緣支撐部
12‧‧‧導電部
13‧‧‧支撐部件
20‧‧‧測試目標裝置
21‧‧‧端子
30‧‧‧測試裝置
31‧‧‧接墊
100‧‧‧各向異性導電片
110‧‧‧絕緣支撐部
120‧‧‧導電部
121‧‧‧導電粒子
121a‧‧‧高導電性金屬
121b‧‧‧磁性粒子
121c‧‧‧鍍金層
200‧‧‧測試目標裝置
210‧‧‧端子
300‧‧‧測試裝置
310‧‧‧接墊
510‧‧‧模具
520‧‧‧樹脂
600‧‧‧薄片成形用材料
610‧‧‧上模具
611‧‧‧強磁體部分
612‧‧‧電磁鐵
620‧‧‧下模具
621‧‧‧強磁體部分
622‧‧‧電磁鐵
700‧‧‧探針電極
P‧‧‧導電粒子10‧‧‧Anisotropic conductive sheet
11‧‧‧Insulation support
12‧‧‧Electrical Department
13‧‧‧Support parts
20‧‧‧Test target device
21‧‧‧ terminals
30‧‧‧Testing device
31‧‧‧ pads
100‧‧‧ Anisotropic conductive sheet
110‧‧‧Insulation support
120‧‧‧Electrical Department
121‧‧‧ conductive particles
121a‧‧‧Highly conductive metal
121b‧‧‧Magnetic particles
121c‧‧‧ gold plating
200‧‧‧Test target device
210‧‧‧ terminals
300‧‧‧Testing device
310‧‧‧ pads
510‧‧‧Mold
520‧‧‧Resin
600‧‧‧Sheet forming materials
610‧‧‧Upper mold
611‧‧‧strong magnet section
612‧‧‧Electromagnet
620‧‧‧ Lower mold
621‧‧‧strong magnet section
622‧‧‧Electromagnet
700‧‧‧Probe electrode
P‧‧‧ conductive particles
圖1和圖2爲示出一般各向異性導電片的組成的截面圖。 圖3爲示出根據本發明的一實施例的各向異性導電片的組成的截面圖。 圖4爲示出根據本發明的另一實施例的各向異性導電片的組成的截面圖。 圖5爲用於說明根據本發明的一實施例的各向異性導電片的導電粒子的製備方法的附圖。 圖6爲用於說明根據本發明的一實施例的各向異性導電片的製備方法的附圖。 圖7爲用於說明根據本發明的一實施例的各向異性導電片的電流特性測定實例的附圖。1 and 2 are cross-sectional views showing the composition of a general anisotropic conductive sheet. 3 is a cross-sectional view showing the composition of an anisotropic conductive sheet according to an embodiment of the present invention. 4 is a cross-sectional view showing the composition of an anisotropic conductive sheet according to another embodiment of the present invention. Fig. 5 is a view for explaining a method of producing conductive particles of an anisotropic conductive sheet according to an embodiment of the present invention. Fig. 6 is a view for explaining a method of producing an anisotropic conductive sheet according to an embodiment of the present invention. Fig. 7 is a view for explaining an example of measurement of current characteristics of an anisotropic conductive sheet according to an embodiment of the present invention.
無no
13‧‧‧支撐部件 13‧‧‧Support parts
100‧‧‧各向異性導電片 100‧‧‧ Anisotropic conductive sheet
110‧‧‧絕緣支撐部 110‧‧‧Insulation support
120‧‧‧導電部 120‧‧‧Electrical Department
121‧‧‧導電粒子 121‧‧‧ conductive particles
200‧‧‧測試目標裝置 200‧‧‧Test target device
210‧‧‧端子 210‧‧‧ terminals
300‧‧‧測試裝置 300‧‧‧Testing device
310‧‧‧接墊 310‧‧‧ pads
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| ??10-2016-0041880 | 2016-04-05 |
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| JP2012188617A (en) * | 2011-03-14 | 2012-10-04 | Polymatech Co Ltd | Anisotropic conductive adhesion sheet, composition for forming the same, conduction connection structure of electronic component, and method of manufacturing anisotropic conductive adhesion sheet |
| JP5768676B2 (en) * | 2011-11-18 | 2015-08-26 | デクセリアルズ株式会社 | Anisotropic conductive film, manufacturing method thereof, connection structure and manufacturing method thereof |
| KR101468586B1 (en) * | 2013-07-16 | 2014-12-03 | 주식회사 아이에스시 | Conductive connector and manufacturing method of the same |
| KR20150079255A (en) * | 2013-12-31 | 2015-07-08 | 주식회사 아이에스시 | Sheet-form connector and electrical connector apparatus |
| JP5943019B2 (en) | 2014-02-26 | 2016-06-29 | 日立金属株式会社 | Conductive particles, conductive powder, conductive polymer composition and anisotropic conductive sheet |
| KR101572139B1 (en) * | 2014-05-29 | 2015-11-26 | 주식회사 아이에스시 | Connector and fabrication method of connector |
| KR101532393B1 (en) * | 2014-06-26 | 2015-07-01 | 주식회사 아이에스시 | Electrical test socket |
| KR101624689B1 (en) * | 2014-08-21 | 2016-05-26 | 주식회사 아이에스시 | Electrical connecting connector |
| KR101586340B1 (en) * | 2014-12-26 | 2016-01-18 | 주식회사 아이에스시 | Electrical test socket and fabrication method of conductive powder for electrical test socket |
-
2016
- 2016-04-05 KR KR1020160041880A patent/KR101959536B1/en active IP Right Grant
-
2017
- 2017-03-16 WO PCT/KR2017/002818 patent/WO2017175984A1/en active Application Filing
- 2017-03-16 CN CN201780034954.6A patent/CN109313953B/en active Active
- 2017-03-21 TW TW106109242A patent/TWI654627B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI820157B (en) * | 2018-06-25 | 2023-11-01 | 日商積水化學工業股份有限公司 | Conductive particles, conductive materials and connection structures |
| TWI725562B (en) * | 2018-10-05 | 2021-04-21 | 南韓商Ｉｓｃ股份有限公司 | Method of manufacturing conductive particles and conductive particles manufactured by the method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI654627B (en) | 2019-03-21 |
| KR20170114622A (en) | 2017-10-16 |
| CN109313953B (en) | 2020-06-26 |
| KR101959536B1 (en) | 2019-03-18 |
| WO2017175984A1 (en) | 2017-10-12 |
| CN109313953A (en) | 2019-02-05 |
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