TWI708065B - Test socket and conductive particle - Google Patents
Test socket and conductive particle Download PDFInfo
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- TWI708065B TWI708065B TW107130236A TW107130236A TWI708065B TW I708065 B TWI708065 B TW I708065B TW 107130236 A TW107130236 A TW 107130236A TW 107130236 A TW107130236 A TW 107130236A TW I708065 B TWI708065 B TW I708065B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
本發明是關於一種測試插座及一種導電顆粒,且具體而言,是關於被配置為防止導電顆粒與導電部分在測試製程期間分離的一種測試插座及一種導電顆粒。The present invention relates to a test socket and a conductive particle, and more specifically, to a test socket and a conductive particle configured to prevent the conductive particles from separating from the conductive part during the testing process.
一般而言,測試插座在測試製程期間用以檢查所製造元件是否具有缺陷或誤差。亦即,當執行電測試來檢查所製造元件(測試目標元件)是否具有缺陷或誤差時,不使測試目標元件與檢測裝置彼此直接接觸,而是經由測試插座彼此間接連接。其原因在於檢測裝置相對昂貴,且當與測試目標元件頻繁接觸而導致磨損或損壞從而需要用新的檢測裝置來替換時會產生困難及高成本。因此,可將測試插座可拆卸地附著至檢測裝置的上部側,且接著可藉由使測試目標元件與測試插座接觸而非使測試目標元件與檢測裝置接觸,來將待測試的測試目標元件電連接至檢測裝置。此後,自檢測裝置產生的電訊號可經由測試插座傳輸至測試目標元件。Generally speaking, the test socket is used during the test process to check whether the manufactured components have defects or errors. That is, when an electrical test is performed to check whether the manufactured component (test target component) has defects or errors, the test target component and the detection device are not directly contacted with each other, but are indirectly connected to each other via the test socket. The reason is that the detection device is relatively expensive, and when the frequent contact with the test target element causes wear or damage, which requires replacement with a new detection device, difficulties and high costs are generated. Therefore, the test socket can be detachably attached to the upper side of the detection device, and then the test target element to be tested can be electrically connected by contacting the test target element with the test socket instead of contacting the test target element with the detection device. Connect to the detection device. Thereafter, the electrical signal generated by the self-testing device can be transmitted to the test target component through the test socket.
參考圖1及圖2,測試插座100可置放於測試目標元件140與檢測裝置130之間,以便將測試目標元件140的端子141電連接至檢測裝置130的襯墊131。測試插座100包含:導電部分110,分別佈置在對應於測試目標元件140的端子141的位置處且在測試插座100的厚度方向上具有導電性,導電部分110中的每一者藉由在測試插座100的厚度方向上的彈性絕緣材料中佈置多個導電顆粒111而形成;以及絕緣支撐部分120,支撐導電部分110且使導電部分110彼此絕緣。在此情況下,測試插座100被配置為使得當將測試插座100置放於檢測裝置130上時,導電部分110可與檢測裝置130的襯墊131進行接觸,且使測試目標元件140可與測試插座100的導電部分110接觸。1 and 2, the
讓使用插入件(未繪示)轉移的測試目標元件140與測試插座100的導電部分110接觸且穩定置放於測試插座100上,且接著由檢測裝置130施加的電訊號經由導電部分110傳輸至測試目標元件140。以此方式,執行電測試。The
測試插座100的導電部分110藉由將導電顆粒111佈置於彈性絕緣材料中來形成,且可使測試目標元件140的端子141與導電部分110頻繁接觸。如上文所描述,當使測試目標元件140的端子141與導電部分110頻繁接觸時,分佈於彈性絕緣材料中的導電顆粒111可易於與彈性絕緣材料分離。特定而言,由於導電顆粒111具有球面形狀,故導電顆粒111可更易於與彈性絕緣材料分離。如上文所描述,若導電顆粒111分離,則測試插座100的導電性可能降低,且因此可對測試可靠性產生負面影響。The
根據由本申請案的申請人所申請的韓國專利登記第1339166號(公開日期:2013年12月9日)中所揭露的解決上述問題的技術,貫穿孔形成於導電顆粒中,且將周圍彈性絕緣材料填充於貫穿孔中以防止導電顆粒與導電部分分離。According to the technology for solving the above-mentioned problems disclosed in Korean Patent Registration No. 1339166 (Publication Date: December 9, 2013) filed by the applicant of this application, through holes are formed in conductive particles and the surrounding elastically insulated The material is filled in the through hole to prevent the conductive particles from separating from the conductive part.
相比於使用球面導電顆粒的情況,先前技術的此技術具有防止導電顆粒與導電部分分離的效果。然而,基本上,歸因於由導電金屬材料形成的導電顆粒與由矽酮橡膠形成且圍繞導電顆粒的彈性絕緣材料之間的材料差異,(在彈性絕緣材料與之進行接觸的導電顆粒的表面部分處的)界面黏著力較弱。Compared with the case of using spherical conductive particles, this technology of the prior art has the effect of preventing the conductive particles from being separated from the conductive portion. However, basically, due to the material difference between the conductive particles formed of a conductive metal material and the elastic insulating material formed of silicone rubber and surrounding the conductive particles, (on the surface of the conductive particles with which the elastic insulating material is in contact Part of the interface adhesion is weak.
提供本發明以解決上述問題。具體而言,本發明的目標為提供一種測試插座及一種導電顆粒,所述測試插座及所述導電顆粒被配置為藉由牢固地保持導電顆粒與周圍彈性絕緣材料之間的耦接而在測試製程期間使導電性保持在恆定水準。The present invention is provided to solve the above-mentioned problems. Specifically, the object of the present invention is to provide a test socket and a conductive particle, the test socket and the conductive particles are configured to be tested by firmly maintaining the coupling between the conductive particle and the surrounding elastic insulating material Keep the conductivity at a constant level during the manufacturing process.
為達成上述目標,本發明提供一種被配置為置放於測試目標元件與檢測裝置之間以將測試目標元件的端子電連接至檢測裝置的襯墊的測試插座,所述測試插座包含:多個導電部分,其中多個導電顆粒佈置於豎直方向上的彈性絕緣材料中,多個導電部分分別設置在對應於測試目標元件的端子的位置處;以及絕緣支撐部分,設置於多個導電部分之間且使多個導電部分彼此電絕緣,同時支撐多個導電部分,其中多個導電顆粒中的至少一者包含:主體,包含金屬材料且形成導電顆粒的外部;以及多個精細二氧化矽顆粒,牢固地耦接至多個導電部分的彈性絕緣材料,同時在以下狀態下與彈性絕緣材料接觸:多個精細二氧化矽顆粒的部分固定至主體的內部且多個精細二氧化矽顆粒的其他部分自主體突出。To achieve the above objective, the present invention provides a test socket configured to be placed between a test target element and a detection device to electrically connect the terminals of the test target element to the gasket of the detection device, the test socket comprising: A conductive part, wherein a plurality of conductive particles are arranged in an elastic insulating material in a vertical direction, and a plurality of conductive parts are respectively arranged at positions corresponding to the terminals of the test target element; and an insulating support part is arranged among the plurality of conductive parts The plurality of conductive parts are electrically insulated from each other while supporting the plurality of conductive parts, wherein at least one of the plurality of conductive particles includes: a main body including a metal material and forming the exterior of the conductive particles; and a plurality of fine silicon dioxide particles , Is firmly coupled to the elastic insulating material of the plurality of conductive parts, and is in contact with the elastic insulating material in the following state: the part of the plurality of fine silica particles is fixed to the inside of the main body and the other parts of the plurality of fine silica particles Stand out from the main body.
在測試插座中,多個精細二氧化矽顆粒可沿主體的整個表面均勻分佈。In the test socket, multiple fine silicon dioxide particles can be evenly distributed along the entire surface of the main body.
在測試插座中,可藉由使彈性絕緣材料自液態硬化來製造多個導電部分,其中多個導電顆粒在彈性絕緣材料的厚度方向上佈置,且精細二氧化矽顆粒可藉由在使彈性絕緣材料自液態硬化時誘發導電顆粒與彈性絕緣材料之間的強耦接來防止導電顆粒與彈性絕緣材料分離。In the test socket, a plurality of conductive parts can be made by hardening the elastic insulating material from the liquid state, wherein a plurality of conductive particles are arranged in the thickness direction of the elastic insulating material, and the fine silicon dioxide particles can be used to make the elastic insulation When the material hardens from the liquid state, a strong coupling between the conductive particles and the elastic insulating material is induced to prevent the conductive particles from separating from the elastic insulating material.
在測試插座中,高導電金屬與磁性物質可藉由使高導電金屬與磁性物質彼此混合或使高導電金屬與磁性物質彼此物理或化學接觸而在主體中彼此耦接。In the test socket, the highly conductive metal and the magnetic substance can be coupled in the main body by mixing the highly conductive metal and the magnetic substance with each other or physically or chemically contacting the highly conductive metal and the magnetic substance with each other.
在測試插座中,為凹形的且填充有彈性絕緣材料的凹口可設置於主體中,且精細二氧化矽顆粒可固定至凹口的內表面且自凹口的內表面突出,用於與填充於凹口中的彈性絕緣材料牢固耦接。In the test socket, a recess that is concave and filled with an elastic insulating material can be provided in the main body, and fine silicon dioxide particles can be fixed to the inner surface of the recess and protrude from the inner surface of the recess for contact with The elastic insulating material filled in the recess is firmly coupled.
為達成上述目標,本發明提供一種被配置為置放於測試目標元件與檢測裝置之間以將測試目標元件的端子電連接至檢測裝置的襯墊的測試插座,所述測試插座包含:多個導電部分,其中多個導電顆粒佈置於豎直方向上的彈性絕緣材料中,多個導電部分分別設置在對應於測試目標元件的端子的位置處;以及絕緣支撐部分,設置於多個導電部分之間且使多個導電部分彼此電絕緣,同時支撐多個導電部分,其中多個導電顆粒中的至少一者包含:主體,包含金屬材料且形成導電顆粒的外部;以及多個高耦接強度精細顆粒,牢固地耦接至多個導電部分的彈性絕緣材料,同時在以下狀態下與彈性絕緣材料接觸:多個高耦接強度精細顆粒的部分固定至主體的內部且多個高耦接強度精細顆粒的其他部分自主體突出,其中多個高耦接強度精細顆粒包含對彈性絕緣材料比對主體的金屬材料的黏著力更高的材料。To achieve the above objective, the present invention provides a test socket configured to be placed between a test target element and a detection device to electrically connect the terminals of the test target element to the gasket of the detection device, the test socket comprising: A conductive part, wherein a plurality of conductive particles are arranged in an elastic insulating material in a vertical direction, and a plurality of conductive parts are respectively arranged at positions corresponding to the terminals of the test target element; and an insulating support part is arranged among the plurality of conductive parts The plurality of conductive parts are electrically insulated from each other while supporting the plurality of conductive parts, wherein at least one of the plurality of conductive particles includes: a main body, which includes a metal material and forms the exterior of the conductive particles; and a plurality of high coupling strength fines Particles, an elastic insulating material firmly coupled to a plurality of conductive parts, while being in contact with the elastic insulating material in the following state: a plurality of high coupling strength fine particles are fixed to the inside of the main body and a plurality of high coupling strength fine particles The other part protrudes from the main body, in which a plurality of fine particles of high coupling strength include a material with higher adhesion to the elastic insulating material than to the metal material of the main body.
在測試插座中,多個高耦接強度精細顆粒可包含碳酸鈣。In the test socket, a plurality of high coupling strength fine particles may include calcium carbonate.
在測試插座中,多個高耦接強度精細顆粒可沿主體的整個表面均勻分佈。In the test socket, multiple fine particles of high coupling strength can be evenly distributed along the entire surface of the main body.
為達成上述目標,本發明提供用於測試插座中的導電顆粒,所述測試插座包含:多個導電部分,其中導電顆粒佈置於豎直方向上的彈性絕緣材料中,多個導電部分分別設置在對應於待進行電測試的測試目標元件的端子的位置處;以及絕緣支撐部分,設置於多個導電部分之間且使多個導電部分彼此電絕緣,同時支撐多個導電部分,其中設置於導電部分中的導電顆粒中的至少一者包含:主體,包含金屬材料且形成導電顆粒的外部;以及多個精細二氧化矽顆粒,牢固地耦接至彈性絕緣材料,同時在以下狀態下與彈性絕緣材料接觸:在多個精細二氧化矽顆粒的部分固定至主體的內部且多個精細二氧化矽顆粒的其他部分自主體突出。To achieve the above objective, the present invention provides conductive particles for testing sockets. The test socket includes: a plurality of conductive parts, wherein the conductive particles are arranged in an elastic insulating material in a vertical direction, and the plurality of conductive parts are respectively arranged in Corresponding to the position of the terminal of the test target element to be electrically tested; and an insulating support part, which is provided between the plurality of conductive parts and electrically insulates the plurality of conductive parts from each other, while supporting the plurality of conductive parts, wherein At least one of the conductive particles in the part includes: a main body, which includes a metal material and forms the exterior of the conductive particles; and a plurality of fine silica particles, which are firmly coupled to the elastic insulating material, and are simultaneously insulated from the elastic in the following state Material contact: The part of the multiple fine silica particles is fixed to the inside of the main body and the other parts of the multiple fine silicon dioxide particles protrude from the main body.
在導電顆粒中,多個精細二氧化矽顆粒可沿主體的整個表面均勻分佈。Among the conductive particles, a plurality of fine silica particles can be evenly distributed along the entire surface of the main body.
在導電顆粒中,高導電金屬與磁性物質可藉由使高導電金屬與磁性物質彼此混合或使高導電金屬與磁性物質彼此物理或化學接觸而在主體中彼此耦接。Among the conductive particles, the highly conductive metal and the magnetic substance can be coupled to each other in the body by mixing the highly conductive metal and the magnetic substance with each other or physically or chemically contacting the highly conductive metal and the magnetic substance with each other.
為達成上述目標,本發明提供用於測試插座中的導電顆粒,所述測試插座包含:多個導電部分,其中導電顆粒佈置於豎直方向上的彈性絕緣材料中,多個導電部分分別設置在對應於測試目標元件的端子的位置處;以及絕緣支撐部分,設置於多個導電部分之間且使多個導電部分彼此電絕緣,同時支撐多個導電部分,其中導電顆粒中的至少一者包含:主體,包含金屬材料且形成導電顆粒的外部;以及多個高耦接強度精細顆粒,牢固地耦接至多個導電部分的彈性絕緣材料,同時在以下狀態下與彈性絕緣材料接觸:多個高耦接強度精細顆粒的部分固定至主體的內部且多個高耦接強度精細顆粒的其他部分自主體突出,其中多個高耦接強度精細顆粒包含對彈性絕緣材料比對主體的金屬材料的黏著力更高的材料。To achieve the above objective, the present invention provides conductive particles for testing sockets. The test socket includes: a plurality of conductive parts, wherein the conductive particles are arranged in an elastic insulating material in a vertical direction, and the plurality of conductive parts are respectively arranged in Corresponding to the position of the terminal of the test target element; and an insulating support part, which is provided between the plurality of conductive parts and electrically insulates the plurality of conductive parts from each other, while supporting the plurality of conductive parts, wherein at least one of the conductive particles includes : The main body contains a metal material and forms the outer part of the conductive particles; and a plurality of high coupling strength fine particles, which are firmly coupled to the elastic insulating material of the plurality of conductive parts, and are in contact with the elastic insulating material in the following state: The part of the coupling strength fine particles is fixed to the inside of the main body and the other parts of the plurality of high coupling strength fine particles protrude from the main body, wherein the plurality of high coupling strength fine particles includes adhesion to the elastic insulating material than to the metal material of the main body Higher strength materials.
在導電顆粒中,多個高耦接強度精細顆粒可沿主體的整個表面均勻分佈。Among the conductive particles, a plurality of fine particles with high coupling strength may be uniformly distributed along the entire surface of the main body.
根據本發明,精細二氧化矽顆粒設置於導電顆粒的表面上以保證導電顆粒與彈性絕緣材料之間的強耦接,且因此即使當導電部分在測試製程期間受壓時,導電顆粒亦可不與導電部分分離,藉此使導電部分的導電性保持在恆定水準。According to the present invention, fine silicon dioxide particles are provided on the surface of the conductive particles to ensure strong coupling between the conductive particles and the elastic insulating material, and therefore even when the conductive part is pressed during the test process, the conductive particles may not interact with each other. The conductive parts are separated, thereby keeping the conductivity of the conductive parts at a constant level.
在下文中,將參考隨附圖式詳細描述本發明的測試插座。Hereinafter, the test socket of the present invention will be described in detail with reference to the accompanying drawings.
根據本發明,測試插座10置放於測試目標元件60與檢測裝置70之間以將測試目標元件60的端子61電連接至檢測裝置70的襯墊71。測試插座10包含導電部分20及絕緣支撐部分30。According to the present invention, the
導電部分20分別佈置在對應於測試目標元件60的端子61的位置處。導電部分20在測試插座10的表面方向上彼此間隔開,以使得導電部分20可在測試插座10的厚度方向上為導電的且可在垂直於測試插座10的厚度方向的表面方向上為不導電的。導電部分20藉由將多個導電顆粒21佈置於測試插座10的厚度方向上的彈性絕緣材料中而形成。當按壓導電部分20的上部表面時,導電部分20在測試插座10的厚度方向上受壓,同時在測試插座10的表面方向上擴展。The
較佳而言,導電部分20的彈性絕緣材料可包含具有交聯結構的聚合物質。各種可固化聚合物形成材料可用於獲得彈性絕緣材料。所述可固化聚合物形成材料的具體實例包含:共軛二烯橡膠(conjugated diene rubbers),諸如聚丁二烯橡膠(polybutadiene rubber)、天然橡膠、聚異戊二烯橡膠(polyisoprene rubber)、苯乙烯-丁二烯共聚物橡膠(styrene-butadiene copolymer rubber)以及丙烯腈-丁二烯共聚物橡膠(acrylonitrile-butadiene copolymer rubber),以及其氫化產物;嵌段共聚物橡膠(block copolymer rubber),諸如苯乙烯-丁二烯-二烯嵌段共聚物橡膠(styrene-butadiene-diene block copolymer rubber)及苯乙烯-異戊二烯嵌段共聚物橡膠(styrene-isoprene block copolymer rubber),以及其氫化產物;氯丁二烯橡膠(chloroprene rubber);胺基甲酸酯橡膠(urethane rubber);聚酯橡膠;表氯醇橡膠(epichlorohydrin rubber);矽酮橡膠(silicone rubber);乙烯-丙烯共聚物橡膠;以及乙烯-丙烯-二烯共聚物橡膠。Preferably, the elastic insulating material of the
當要求導電部分20具有耐候性時,可使用除共軛二烯橡膠之外的所列舉材料。特定而言,可根據成形性及電特性來使用矽酮橡膠。When the
矽酮橡膠可經由交聯或縮合自液體矽酮橡膠獲得。液體矽酮橡膠可較佳地在10-1 秒的變形速率下具有105 泊(poise)或小於105 泊的黏度。矽酮橡膠可為縮合固化矽酮橡膠、加成固化矽酮橡膠以及具有乙烯基或羥基的矽酮橡膠中的一者。矽酮橡膠的實例可包含二甲基矽酮生橡膠(dimethyl silicone raw rubber)、甲基乙烯基矽酮生橡膠(methyl vinyl silicone raw rubber)以及甲基苯基乙烯基矽酮生橡膠(methyl phenyl vinyl silicone raw rubber)。Silicone rubber can be obtained from liquid silicone rubber through crosslinking or condensation. Liquid silicone rubber may preferably be one having 105 poise at a strain rate of 10 -1 sec (Poise) or less than 105 poises viscosity. The silicone rubber may be one of condensation curing silicone rubber, addition curing silicone rubber, and silicone rubber having vinyl groups or hydroxyl groups. Examples of silicone rubber may include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, and methyl phenyl vinyl silicone raw rubber. vinyl silicone raw rubber).
導電顆粒21作為整體具有導電性,且電流可由於導電顆粒21而在導電部分20中流動。導電顆粒21包含於彈性絕緣材料中。The
導電顆粒21包含主體21a及精細二氧化矽顆粒21b。The
主體21a包含金屬材料且形成導電顆粒21的總的外部。主體21a可具有一般的球面形狀。然而,主體21a不限於此。舉例而言,主體21a可具有另一形狀,諸如管柱形狀、星形形狀或不規則形狀。The
主體21a包含磁性材料。磁性材料的具體實例可包含:磁性金屬(諸如鐵(iron;Fe)、鈷(cobalt;CO)、鎳(nickel;Ni)、鋁鎳、鐵氧體、釹材料(neodymium material;NdFeB)或釤磁體(samarium magnet;SmCo))的顆粒;金屬合金的顆粒;含有金屬中的任一者的顆粒;藉由製備此類顆粒作為核心顆粒且用諸如金、銀、鈀或銠的高導電金屬來塗佈核心顆粒所形成的顆粒;藉由製備非磁性金屬顆粒、諸如玻璃珠的無機材料顆粒或聚合物顆粒作為核心顆粒且用諸如鎳或鈷的導電磁性金屬來塗佈核心顆粒所形成的顆粒。在所列舉的實例中,包含鎳顆粒作為核心顆粒且塗佈有具有高導電性的金的顆粒可為較佳的。The
另外,主體21a可包含合金,其中將諸如鐵、鈷或鎳的磁性物質與諸如金、銀或銅的高導電金屬進行混合,或可藉由使磁性物質與高導電金屬進行物理或化學接觸來製備。In addition, the
精細二氧化矽顆粒21b小於主體21a且具有粒形形狀。精細二氧化矽顆粒21b的化學式為SiO2
。相比於金屬材料,精細二氧化矽21b關於彈性絕緣材料的矽酮橡膠而具有較高黏結強度。亦即,精細二氧化矽顆粒21b與矽酮橡膠之間的界面黏著力較高,且因此一旦精細二氧化矽顆粒21b耦接至矽酮橡膠,則精細二氧化矽顆粒21b不容易與矽酮橡膠分離。The fine
精細二氧化矽顆粒21b的部分掩蔽於主體21a的表面中以便牢固地固定至主體21a,且精細二氧化矽顆粒21b的其他部分自主體21a突出。自主體21a突出的精細二氧化矽顆粒21b與彈性絕緣材料進行接觸且牢固地耦接至彈性絕緣材料。精細二氧化矽顆粒21b沿主體21a的整個表面均勻分佈。然而,精細二氧化矽顆粒21b並未完全覆蓋主體21a的表面,以使得相鄰導電顆粒21的表面可彼此進行電接觸。另外,附著至導電顆粒21的精細二氧化矽顆粒21b彼此間隔開。Part of the
另外,若精細二氧化矽顆粒21b的數目增加,則導電性可降低,但可藉由經由對精細二氧化矽顆粒21b的數目進行有效調節來改良精細二氧化矽顆粒21b與彈性絕緣材料之間的黏著力,以提高測試插座10的使用壽命。In addition, if the number of fine
絕緣支撐部分30支撐導電部分20且使導電部分20彼此絕緣以防止電流在導電部分20之間流動。絕緣支撐部分30可包含與導電部分20的彈性絕緣材料相同的材料。舉例而言,絕緣支撐部分30可包含矽酮橡膠。然而,絕緣支撐部分30不限於此。舉例而言,絕緣支撐部分30可包含與導電部分20中所包含的材料不同的材料。The insulating
現將參考圖5及圖6描述製造本發明的測試插座10的方法。The method of manufacturing the
首先,藉由將具有磁特性的導電顆粒21分散於液體彈性絕緣材料中來製備具有流動性的形成材料20A。接著,如圖5中所繪示,將形成材料20A填充於模具的空腔中,且與此同時,在框架板40處於上部模具50的鐵磁性部分52與對應的下部模具55的鐵磁性部分57之間的狀態下將框架板40置放於模具中。接著,例如,將一對電磁體(未繪示)置放於上部模具50的鐵磁性物質51的上部表面上及下部模具55的鐵磁性物質56的下部表面上,且操作此對電磁體以使得可在形成材料20A的厚度方向上施加具有非均勻強度分佈的平行磁場。亦即,在形成材料20A的厚度方向上施加在上部模具50的鐵磁性部分52與對應的下部模具55的鐵磁性部分57之間具有相對較高磁性強度的平行磁場。First, a
因此,如圖6中所繪示,分散於形成材料20A中的導電顆粒21在上部模具50的鐵磁性部分52與對應的下部模具55的鐵磁性部分57之間的待形成為導電部分20的區域中聚結,且與此一起,導電顆粒21在形成材料20A的厚度方向上佈置。Therefore, as shown in FIG. 6, the
另外,在此狀態下,使形成材料20A硬化,藉此製造測試插座10,所述測試插座包含:導電部分20,佈置於上部模具50的鐵磁性部分52與對應的下部模具55的鐵磁性部分57之間,導電顆粒21在導電顆粒21佈置於彈性絕緣材料的厚度方向上的狀態下密集地填充於導電部分20中;以及絕緣支撐部分30,圍繞導電部分20設置且不含有或幾乎不含有導電顆粒21。In addition, in this state, the forming
當如上文所描述地製造測試插座10時,精細二氧化矽顆粒21b在彈性絕緣材料的硬化製程期間誘發導電顆粒21與彈性絕緣材料之間的強耦接。因此,即使導電部分20在測試目標元件60的測試製程中受壓時,亦可防止導電顆粒21之間的滑裂。When the
另外,即使在導電部分20受壓時,亦可保持導電顆粒21與彈性絕緣材料之間的強耦接,且因此可使導電性保持在恆定水準。In addition, even when the
另外,由於精細二氧化矽顆粒21b對諸如矽酮橡膠的彈性絕緣材料具有高黏著力,故導電顆粒21可不易與導電部分20分離,且可改良測試插座10的使用壽命。In addition, since the fine
根據本發明的實施例,測試插座10具有以下操作效果。According to the embodiment of the present invention, the
首先,在將測試插座10置放於檢測裝置70上之後,將測試目標元件60置放於測試插座10上。此時,藉由測試目標元件60的端子61對測試插座10的導電部分20進行壓縮,且因此導電部分20變得導電。接著,電訊號可經由導電部分20自檢測裝置70傳輸至測試目標元件60,藉此執行測試。First, after placing the
在本發明的測試插座10中,設置於導電顆粒21上的精細二氧化矽顆粒21b誘發導電顆粒21與矽酮橡膠(亦即彈性絕緣材料)之間的牢固耦接,且因此可使導電性保持在恆定水準。In the
另外,在先前技術中,當彈性絕緣材料在高溫環境中擴展時,導電顆粒之間的接觸表面始終彼此分離。然而,根據本發明的實施例,精細二氧化矽顆粒21b所附著至的導電顆粒21能夠保持二氧化矽與彈性絕緣材料之間的強耦接,且因此即使在彈性絕緣材料擴展時,亦可保持導電顆粒21與彈性絕緣材料之間的接觸。亦即,即使在高溫環境中亦可保持更穩定的電接觸。In addition, in the prior art, when the elastic insulating material is expanded in a high-temperature environment, the contact surfaces between the conductive particles are always separated from each other. However, according to the embodiment of the present invention, the
另外,根據本發明,儘管鍍覆層形成於導電顆粒21的主體21a上以獲得高導電性,但精細二氧化矽顆粒21b可不經鍍覆且保持在暴露狀態下。In addition, according to the present invention, although a plating layer is formed on the
可如下來修改本發明的測試插座10。The
在本發明中,導電顆粒21藉由將精細二氧化矽顆粒21b附著至主體21a來設置。然而,此為非限制性實例。舉例而言,可使用對彈性絕緣材料比對主體21a的金屬材料的黏著力更高的不同材料的高耦接強度精細顆粒。高耦接強度精細顆粒可包含碳酸鈣、磷酸鈣、氧化鋁、氧化鈦或類似者。另外,可僅使用精細二氧化矽顆粒或精細碳酸鈣顆粒,或主體21a可藉由混合不同材料來形成。In the present invention, the
如上文所描述,由於附著至主體21a的表面的精細顆粒保持其固有特性,故精細顆粒可完好地保持對彈性絕緣材料的黏著。As described above, since the fine particles attached to the surface of the
另外,精細二氧化矽顆粒21b形成於具有上述實施例中的球面形狀的主體21a的表面上。然而,如圖7中所繪示,多個凹口22'可形成於導電顆粒21的主體21a'的表面中,且精細二氧化矽顆粒21b'可形成於凹口22'的內表面上。亦即,導電顆粒21'牢固地耦接至彈性絕緣材料,此是因為將彈性絕緣材料填充於凹口22'中,且除此之外,由於設置於凹口22'的內表面上的精細二氧化矽顆粒21b,故導電顆粒21'可更牢固地耦接至彈性絕緣材料。In addition, fine
雖然已繪示且在上文描述本發明的較佳實施例,但本發明不限於其實施例或修改的實例,且可在不脫離本發明的範疇的情況下作出各種其他修改及變化。Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to its embodiments or modified examples, and various other modifications and changes can be made without departing from the scope of the present invention.
10、100‧‧‧測試插座20、110‧‧‧導電部分20A‧‧‧形成材料21、21'、111‧‧‧導電顆粒21a、21a'‧‧‧主體21b、21b'‧‧‧二氧化矽顆粒22'‧‧‧凹口30、120‧‧‧絕緣支撐部分40‧‧‧框架板50‧‧‧上部模具51、56‧‧‧鐵磁性物質52、57‧‧‧鐵磁性部分55‧‧‧下部模具60、140‧‧‧測試目標元件61、141‧‧‧端子70、130‧‧‧檢測裝置71、131‧‧‧襯墊10、100‧‧‧Test socket 20,110‧‧‧
圖1為示出先前技術的測試插座的視圖。 圖2為示出圖1中所繪示的測試插座的操作狀態的視圖。 圖3為示出根據本發明的實施例的測試插座的視圖。 圖4為示出圖3中所繪示的測試插座的導電顆粒的視圖。 圖5及圖6為示出製造根據本發明的測試插座的方法的視圖。 圖7為示出根據本發明的另一實施例的導電顆粒的視圖。Fig. 1 is a view showing a test socket of the prior art. FIG. 2 is a view showing the operating state of the test socket depicted in FIG. 1. Fig. 3 is a view showing a test socket according to an embodiment of the present invention. 4 is a view showing conductive particles of the test socket depicted in FIG. 3. 5 and 6 are views showing a method of manufacturing the test socket according to the present invention. FIG. 7 is a view showing conductive particles according to another embodiment of the present invention.
21‧‧‧導電顆粒 21‧‧‧Conductive particles
21a‧‧‧主體 21a‧‧‧Subject
21b‧‧‧二氧化矽顆粒 21b‧‧‧Silica particles
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CN110726918B (en) * | 2019-09-25 | 2022-04-05 | 苏州韬盛电子科技有限公司 | Semiconductor chip test coaxial socket with impedance matching structure and preparation method thereof |
KR102387745B1 (en) * | 2020-06-23 | 2022-05-19 | (주)하이그레이드 | Method of reconstructing damaged silicone rubber socket |
KR102342480B1 (en) * | 2020-08-21 | 2021-12-23 | (주)티에스이 | Test socket and test apparatus having the same |
KR102707149B1 (en) * | 2021-12-13 | 2024-09-19 | 주식회사 티에프이 | Rubber socket for testing semiconductor package and conductive member for the same |
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KR20190024070A (en) | 2019-03-08 |
CN111051894A (en) | 2020-04-21 |
CN111051894B (en) | 2023-02-21 |
WO2019045426A1 (en) | 2019-03-07 |
TW201920973A (en) | 2019-06-01 |
KR101976703B1 (en) | 2019-05-09 |
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