TW201708373A - 紫外線可固化環氧/丙烯酸酯黏著劑組成物 - Google Patents
紫外線可固化環氧/丙烯酸酯黏著劑組成物 Download PDFInfo
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- TW201708373A TW201708373A TW105116517A TW105116517A TW201708373A TW 201708373 A TW201708373 A TW 201708373A TW 105116517 A TW105116517 A TW 105116517A TW 105116517 A TW105116517 A TW 105116517A TW 201708373 A TW201708373 A TW 201708373A
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- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- OBZOZTXBNNXIDG-UHFFFAOYSA-N o-(6-methylheptyl) ethanethioate Chemical compound CC(C)CCCCCOC(C)=S OBZOZTXBNNXIDG-UHFFFAOYSA-N 0.000 description 1
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- 150000002892 organic cations Chemical class 0.000 description 1
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- 125000000466 oxiranyl group Chemical group 0.000 description 1
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- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
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- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- AZJPTIGZZTZIDR-UHFFFAOYSA-L rose bengal Chemical compound [K+].[K+].[O-]C(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C1=C2C=C(I)C(=O)C(I)=C2OC2=C(I)C([O-])=C(I)C=C21 AZJPTIGZZTZIDR-UHFFFAOYSA-L 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
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- 150000003385 sodium Chemical class 0.000 description 1
- HRZFUMHJMZEROT-UHFFFAOYSA-L sodium disulfite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])(=O)=O HRZFUMHJMZEROT-UHFFFAOYSA-L 0.000 description 1
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- 229940001584 sodium metabisulfite Drugs 0.000 description 1
- 235000010262 sodium metabisulphite Nutrition 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
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- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XDLNRRRJZOJTRW-UHFFFAOYSA-N thiohypochlorous acid Chemical compound ClS XDLNRRRJZOJTRW-UHFFFAOYSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
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- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J137/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen; Adhesives based on derivatives of such polymers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
描述一種黏著劑組成物,其包含(甲基)丙烯酸四氫糠酯共聚物;環氧樹脂;聚醚多元醇;以及羥基官能性成膜聚合物。黏著劑可以在結構性及半結構性黏合應用中使用。
Description
本發明是關於結構性及半結構性黏合黏著劑、黏著劑物品、及用於製備該黏著劑及物品之方法。本發明進一步是關於含有一或多種用結構性黏合黏著劑黏合在一起之組分的製品。
結構性黏合膠帶可用於將一或多個基材彼此黏合。許多結構性黏合膠帶落在下列二個群組中之一:(1)熱可固化結構性黏合膠帶,及(2)紫外(UV)光可活化結構性黏合膠帶。如分類名稱所顯示的,熱可固化結構性黏合膠帶需要加熱以將膠帶的黏著劑組成物固化。UVi結構性黏合膠帶含有當暴露於紫外光時將開始固化的黏著劑組成物,其不需加熱固化。但熱可用於加速UVi結構性黏合膠帶的固化速率。
一般而言,自卷取下一長度的結構性黏合膠帶或一片模切膠帶,並使用手指壓力將其附著到第一基材。若為UVi結構性黏合膠帶,可使結構性黏合膠帶暴露於光化輻射,例如紫外光。然後,將第二基材與結構性黏合膠帶的暴露表面接觸,並施加壓力到基材一段
時間。接著使熱可固化結構性黏合膠帶及可選地UVi結構性黏合膠帶暴露於熱,然後讓總成冷卻。結果為經黏合之物品。
另外,習知UVi結構性黏合膠帶調配物具有高的冷流動性。冷流動是材料在非高溫下之潛變行為的指標。許多習知UVi膠帶材料具有非理想的高冷流動性,其在卷之捲繞張力及堆疊重量下導致顯著材料流動。其結果是,這些材料可能需要冷藏及/或特殊的包裝,以保持尺寸穩定的卷及模切部件。
此外,許多現有的結構性黏著劑組成物需要加熱以固化黏著劑組成物。在製造經黏合之物品的方法中,經黏合之物品必須經受加熱步驟以固化黏著劑組成物,也必須經受冷卻步驟以允許進一步處理及/或包裝經黏合之物品。從加工的觀點看來,無需加熱步驟之製造經黏合之物品的方法將是高度理想的。
所屬技術領域中需要的是從黏著劑組成物調配物形成的結構性黏著劑或黏合膠帶,其具有低溫黏合性能及/或可用於黏合具有不同熱膨脹係數的不同基材。此外,所屬技術領域中需要的是具有膠帶構造之UVi結構性黏合膠帶,其允許膠帶可從膠帶的一側被光活化。與UVi結構性黏合膠帶有關的一般基材無法被UV光穿透,因此在黏合經完全總成後無法行UV起始作用。
本揭露藉由發現一種具有改良的冷流動性及卓越黏著性質之新穎的結構性或半結構性黏著劑來解決一些以上討論的困難和問題。結構性黏合黏著劑具有所欲的強度及黏著性質。黏著劑是由光活
化(即當暴露於光源時起始固化)且不需要加熱固化。結構性黏合黏著劑可以在許多應用中使用,特別是用來作為將一或多個基材黏合在一起的黏著劑。
「半結構性黏著劑(Semi-structural Adhesive)」是指具有至少約0.75MPa、更佳地至少約1.0MPa、及最佳地至少約1.5MPa的重疊剪切強度之經固化的黏著劑。然而,該些具有特別高的重疊剪切強度之經固化的黏著劑被稱為結構性黏著劑(structural adhesive)。結構性黏著劑是指具有至少約3.5MPa、更佳地至少約5MPa、及最佳地至少約7MPa的重疊剪切強度之經固化的黏著劑。
在許多實施例中,這些黏著劑提供下列至少一者:1)重疊剪切值>5MPa、2)開裂值(塑膠對玻璃)>40N、及3)潛變<500%應變(使用本文所述之測試方法)。
本發明描述一種可固化的壓敏性黏著劑,其在固化時提供半結構性或結構性黏著劑,其中該壓敏黏著劑包含:a)(甲基)丙烯酸四氫糠酯共聚物;b)環氧樹脂;c)聚醚多元醇;d)羥基官能性成膜聚合物;以及(e)光催化劑。
黏著劑組成物部分地包含(甲基)丙烯酸四氫糠酯共聚物組分。除非另外指明,THF丙烯酸酯及甲基丙烯酸酯將縮寫為
THFA。更具體而言,黏著劑組成物包含(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸C1-C8酯、及可選地陽離子反應性官能性(甲基)丙烯酸酯之共聚物。
除了(甲基)丙烯酸四氫糠酯外,共聚物進一步包含(甲基)丙烯酸C1-C8烷基酯單體。可用的單體包括甲基、乙基、丙基、異丙基、丁基、戊基、己基、庚基、及辛基醇的丙烯酸酯及甲基丙烯酸酯,包括彼等之所有異構物、及混合物。醇較佳係選自C3-C6烷醇,且在某些實施例中,烷醇的莫耳平均碳數為C3-C6。已發現在此範圍內的共聚物具有足夠的與環氧樹脂組分之混溶性,其允許UVi SBT調配物具有有用的整體平衡之黏著劑性質,包括重疊剪切。
莫耳平均碳數可藉由加總每個烷醇(C1-8烷醇)的莫耳數乘以每個烷醇的碳數,並將該加總結果除以烷醇的總莫耳數來計算:Σα-ω[(烷醇莫耳數)×(烷醇碳原子數)]/烷醇α至ω之莫耳數。
此外,共聚物可含有陽離子反應性單體,即(甲基)丙烯酸酯單體具有陽離子反應性官能基。這類單體的實例包括,例如,丙烯酸環氧丙酯、甲基丙烯酸環氧丙酯、丙烯酸羥基乙酯、甲基丙烯酸羥基乙酯、甲基丙烯酸羥基丙酯、丙烯酸羥基丁酯、及(甲基)丙烯酸烷氧基矽基烷基酯,如丙烯酸三甲氧基矽基丙酯。
為了可聚合組成物的穩定性,共聚物基本上不含酸官能性單體,酸官能性單體的存在會在UV固化之前起始環氧樹脂的聚
合。出於同樣的原因,較佳的是共聚物不含任何胺官能性單體。再者,較佳的是共聚物不含具有足以抑制黏著劑組成物的陽離子固化之鹼性部分(moiety)的任何丙烯酸單體。
THFA共聚物通常包含以下聚合單體單元:a) 40至60wt.%、較佳地>50至60wt.%的(甲基)丙烯酸四氫糠酯;b) 40至60wt.%、較佳地40至50wt.%的(甲基)丙烯酸C1-C8(較佳地C3-C6)烷基酯單體;c) 0至10wt.%、較佳地1至5wt.%的陽離子反應性官能性單體;其中a)至c)的總和為100wt.%。
黏著劑組成物包含一或多種THFA丙烯酸酯共聚物,其量係取決於黏著劑的所欲性質而異。理想地,黏著劑組成物包含一或多種THFA丙烯酸酯共聚物,其量基於100份在黏著劑組成物中之單體/共聚物總重量計,係從15至50重量份、較佳地25至35重量份。
黏著劑包含一或多種環氧樹脂。可用於本揭露組成物之環氧樹脂或環氧化物可為具有至少一個可藉由開環進行聚合之環氧乙烷環的任何有機化合物,即平均環氧官能度大於一、且較佳地至少二。環氧化物可為單體或聚合、及脂族、環脂族、雜環、芳族、氫化、或其混合物。較佳的環氧化物每分子含有多於1.5個環氧基,且較佳地每分子含有至少2個環氧基。可用的材料一般具有約150至約10,000、且更一般地約180至約1,000的重量平均分子量。環氧樹脂的分子量通常經選擇以提供經固化之黏著劑的所欲性質。合適的環氧
樹脂包括具有末端環氧基團之線性聚合環氧化物(例如聚氧烷二醇的二環氧丙基醚)、具有環氧基骨架的聚合環氧化物(例如聚丁二烯聚環氧化物)、及具有側接環氧基之聚合環氧化物(例如甲基丙烯酸環氧丙酯聚合物或共聚物)、及其混合物。含環氧化物的材料包括具有以下通式的化合物:
其中R1是烷基、烷基醚、或芳基,且n是1至6。
該等環氧樹脂包括芳族環氧丙基醚(例如,如藉由使多元酚與過量的環氧氯丙烷反應製備者)、環脂族環氧丙基醚、氫化環氧丙基醚、及其混合物。這樣的多元酚可包括間苯二酚、兒茶酚、氫醌、及多核酚例如p,p'-二羥基二苄基、p,p'-二羥基二苯基、p,p'-二羥基苯基碸、p,p'-二羥基二苯基酮、2,2'-二羥基-1,1-二萘基甲烷、及下列的2,2'、2,3'、2,4'、3,3'、3,4'、及4,4'異構物:二羥基二苯基甲烷、二羥基二苯基二甲基甲烷、二羥基二苯基乙基甲基甲烷、二羥基二苯基甲基丙基甲烷、二羥基二苯基乙基苯基甲烷、二羥基二苯基丙基苯基甲烷、二羥基二苯基丁基苯基甲烷、二羥基二苯基甲苯基乙烷、二羥基二苯基甲苯基甲基甲烷、二羥基二苯基二環己基甲烷、及二羥基二苯基環己烷。
同樣可用的是多元酚甲醛縮合產物,以及聚環氧丙基醚,其僅含有環氧基或羥基作為反應性基團。可用的可固化環氧樹脂
亦敘述於各種出版物中,包括,例如,Lee及Nevill的「Handbook of Epoxy Resins」,McGraw-Hill Book Co.,New York(1967)、及Encyclopedia of Polymer Science and Technology,6,p.322(1986)。
所使用的環氧樹脂的選擇取決於其預定之最終用途。當黏合線(bond line)需要更大量的延展性時,具有撓化骨幹的環氧化物可能是所欲的。例如雙酚A的二環氧丙基醚及雙酚F的二環氧丙基醚之材料可提供當該等材料固化時達成之理想的結構性黏著劑性質,而該等環氧樹脂的氫化形式可用於與具有油性表面之基材相容。
可用於本揭露之市售環氧化物實例包括雙酚A的二環氧丙基醚(例如,以商品名稱EPON 828、EPON 1001、EPON 1004、EPON 2004、EPON 1510、及EPON 1310購自Momentive Specialty Chemicals,Inc.者、及以商品名稱D.E.R.331、D.E.R.332、D.E.R.334、及D.E.N.439購自Dow Chemical Co.者);雙酚F的二環氧丙基醚(例如以商品名稱ARALDITE GY 281購自Huntsman Corporation者);含有二環氧丙基環氧基官能性的聚矽氧樹脂;阻燃性環氧樹脂(例如以商品名稱DER 560購自Dow Chemical Co.之溴化雙酚型環氧樹脂);及1,4-丁二醇二環氧丙基醚。
可將具有至少一個環氧丙基醚末端部分(terminal portion)及較佳地飽和或不飽和環狀骨幹之含環氧基化合物可選地加到組成物中作為反應性稀釋劑。可出於各種目的加入反應性稀釋劑,例如幫助加工,例如,控制組成物的黏度以及在固化期間撓化經固化之組成物,及相容組成物中的材料。
這類稀釋劑的實例包括:環己烷二甲醇的二環氧丙基醚、間苯二酚的二環氧丙基醚、新戊二醇的對三級丁基苯基環氧丙基醚、新戊二醇的甲苯酚基環氧丙基醚、新戊二醇的二環氧丙基醚、三羥甲基乙烷的三環氧丙基醚、三羥甲基丙烷的三環氧丙基醚、三環氧丙基對胺基酚、N,N'-二環氧丙基苯胺、N,N,N’N’-四環氧丙基間伸茬基二胺、及植物油聚環氧丙基醚。反應性稀釋劑可以商品名稱HELOXY 107及CARDURA N10購自Momentive Specialty Chemicals,Inc.。組成物可含有韌化劑以幫助提供所欲的重疊剪切、抗剝離性、及衝擊強度。
黏著劑組成物理想地含有一或多種具有從約100至約1500之環氧當量的環氧樹脂。更理想地,黏著劑含有一或多種具有從約300至約1200之環氧當量的環氧樹脂。甚至更理想地,黏著劑含有二或更多種環氧樹脂,其中至少一種環氧樹脂具有從約300至約500的環氧當量,且至少一種環氧樹脂具有從約1000至約1200之環氧當量。
黏著劑組成物可包含一或多種環氧樹脂,其量係取決於結構性黏著劑層的所欲性質而異。理想地,黏著劑組成物包含一或多種環氧樹脂,其量基於100份在黏著劑組成物中之單體/共聚物總重量計,係從25至50重量份、較佳地35至45重量份。
黏著劑組成物進一步包含較低Mw、液體(在25℃下)羥基官能性聚醚(聚醚多元醇),其量相對於100份在黏著劑組成物中之單體/共聚物總重量為5至15份。
此類羥基官能性聚醚化合物的實例包括,但不限於,聚氧乙烯二醇及聚氧丙烯二醇;聚氧乙烯三醇、聚氧丙烯三醇、及聚氧化四亞甲基二醇。聚氧烷多元醇特別適合用於阻滯固化反應,使得黏著劑組成物的「開放時間(open time)」可增加。當用於本文時,用語「開放時間(open time)」是用於表示在黏著劑組成物已受照射之後的那段時間,在此期間,黏著劑組成物仍保持足夠的未固化以讓第二基材可與其黏合。
黏著劑組成物的開放時間理想地是在暴露於能量劑量為約1.6J/cm2之光化輻射之後至少2分鐘。然而,如果要被黏合在一起的一或二個基材可讓結構性黏著劑層所將暴露之輻射穿透,則開放時間不重要,因為在這種情況下,輻射暴露可在二個基材都已藉由黏著劑彼此附著之後,穿過該可穿透基材而作用。當總成的二個基材都是不透明時,黏著劑將在第二基材與其附著之前暴露於光化輻射。在這種情況下,至少2分鐘的開放時間是理想的,以允許結構性黏著劑層的合適操作性。
適合用於本發明的市售羥基官能性聚(伸烷氧基)化合物包括,但不限於,POLYMEGTM系列的聚氧化四亞甲基二醇(可購自Lyondellbasell,Inc.,Jackson,Tenn.)、TERATHANETM系列的聚氧化四亞甲基二醇(來自Invista,Newark,Del.);來自BASF Corp.(Charlotte,N.C.)之POLYTHFTM系列的聚氧化四亞甲基二醇;ARCOLTM系列的聚氧丙烯多元醇(來自Bayer MaterialScience.,Los
Angeles,Calif.)、及來自Dow Automotive Systems,Auburn Hills,MI之VORANOLTM系列的聚醚多元醇。
黏著劑層進一步含有至少一種羥基官能性成膜聚合物,其具有至少一個及理想地至少兩個羥基。另外,用語羥基官能性成膜聚合物不包括上述亦含有羥基的聚醚多元醇。理想地,成膜聚合物實質上不含其他含有「活性氫(active hydrogen)」之基團,例如胺基及巰基部分。另外,成膜聚合物也理想地實質上不含可為熱及/或光解不穩定的基團,使化合物在固化期間暴露於光化輻射及/或熱時不會分解。
含羥基的成膜聚合物含有二或更多個一級或二級脂族羥基(即羥基係直接與非芳族碳原子鍵結)。在一些實施例中,羥基官能性成膜聚合物具有至少0.01的羥基數。據信羥基參與與環氧樹脂的陽離子聚合。
羥基官能性成膜聚合物可選自苯氧基樹脂、乙烯-乙酸乙烯酯(EVA)共聚物(在25℃下為固體)、聚己內酯多元醇、聚酯多元醇、及在25℃下為固體之聚乙烯縮醛樹脂。羥基可位於聚合物或共聚物之末端,或可為側接。
已發現加入成膜聚合物至結構性黏著劑組成物改善了動態重疊剪切強度及/或降低黏著劑層的冷流動。
一類可用的含羥基成膜聚合物是含羥基的苯氧基樹脂。特別理想的是,苯氧基樹脂是那些由二-環氧丙基雙酚化合物之聚合衍生而得者。一般而言,苯氧基樹脂具有小於60,000之數量平均分子量、理想地在約20,000至約30,000之範圍內。適合用於本發明的市
售苯氧基樹脂包括,但不限於,可購自Inchem Corp.(Rock Hill,S.C.)之PAPHENTM PKHP-200、及SYNFACTM系列的聚氧烷基化雙酚A(來自Milliken Chemical,Spartanburg,S.C.)例如SYN FACTM 8009、773240、8024、8027、8026、8071、及8031;第二類可用的含羥基成膜聚合物是乙烯-乙酸乙烯酯(EVA)共聚物樹脂。EVA樹脂含有小量的自由羥基,且據信EVA共聚物係於陽離子聚合期間進一步去乙醯化。
合適的乙烯-乙酸乙烯酯共聚物樹脂包括,但不限於,含有至少約28重量百分比之乙酸乙烯酯之熱塑性乙烯-乙酸乙烯酯共聚物樹脂。在本發明的一個實施例中,乙烯-乙酸乙烯酯共聚物包含熱塑性共聚物,該熱塑性共聚物含有以共聚物重量計至少約28重量百分比之乙酸乙烯酯、理想地至少約40重量百分比之乙酸乙烯酯、更理想地至少約50重量百分比之乙酸乙烯酯、及甚至更理想地至少約60重量百分比之乙酸乙烯酯。在本發明的進一步實施例中,乙烯-乙酸乙烯酯共聚物所含有的乙酸乙烯酯之量的範圍為從約28至約99重量百分比的在共聚物中之乙酸乙烯酯、理想地從約40至約90重量百分比的乙酸乙烯酯、更理想地從約50至約90重量百分比的乙酸乙烯酯、及甚至更理想地從約60至約80重量百分比的乙酸乙烯酯。
可在本發明中使用的市售乙烯-乙酸乙烯酯共聚物的實例包括,但不限於,來自E.I.Du Pont de Nemours and Co.,Wilmington,Del.之Elvax系列,包括ELVAXTM 150、210、250、260、及265;ATEVATM系列(來自Celanese,Inc.,Irving,TX);來
自Bayer Corp.,Pittsburgh,Pa.之LEVAPRENTM 400,包括LEVAPRENTM 450、452、及456(45重量百分比的乙酸乙烯酯);LEVAPRENTM 500 HV(50重量百分比的乙酸乙烯酯);LEVAPRENTM 600 HV(60重量百分比的乙酸乙烯酯);LEVAPRENTM 700 HV(70重量百分比的乙酸乙烯酯);及LEVAPRENTM KA 8479(80重量百分比的乙酸乙烯酯),皆來自Lanxess Corp.。
額外可用的成膜聚合物包括可購自Dow Chemical,Midland,MI之TONETM的聚己內酯多元醇系列、來自Perstorp Inc.之CAPATM系列的聚己內酯多元醇、DESMOPHENTM系列的飽和聚酯多元醇(可得自Bayer Corporation,Pittsburg,Pa.)例如DESMOPHENTM 631A 75。
黏著劑層包含一或多種含羥基成膜聚合物樹脂,其量係取決於結構性黏著劑層的所欲性質而異。理想地,黏著劑組成物包含一或多種含羥基成膜聚合物樹脂,其量基於100份在黏著劑組成物中之單體/共聚物總重量計,係最高約25重量份。更理想地,黏著劑組成物包含一或多種成膜聚合物樹脂,其量基於100份在黏著劑組成物中之單體/共聚物總重量計,係從約10至約25重量份。甚至更理想地,本發明之結構性黏合膠帶的結構性黏著劑層包含一或多種成膜聚合物樹脂,其量基於100份在黏著劑組成物中之單體/共聚物總重量計,係15至約20重量份。
綜上所述,可固化黏著劑組成物包含:
a. 15至50份的THFA(甲基)丙烯酸酯共聚物;b. 25至50份的環氧樹脂組分;c. 5至15份的聚醚多元醇;d. 10至25份的羥基官能性成膜聚合物;其中a)至d)之總和為100重量份;及e. 相對於100份的a)至d),0.01至1份的陽離子光起始劑。
在許多實施例中,環氧樹脂的量高於THFA共聚物;環氧樹脂對丙烯酸酯聚合物的重量比為從1.1:1至5:1。
黏著劑組成物可進一步包含最高約50重量份(相對於100重量份的a)至d))、理想地最高約10百分比的各種添加劑,例如填料、穩定劑、塑化劑、膠黏劑、流動控制劑、固化速率阻滯劑、黏著促進劑(例如,矽烷及鈦酸鹽)、輔助劑、衝擊改質劑、可膨脹微球、導熱顆粒、導電顆粒、及類似者,例如二氧化矽、玻璃、黏土、滑石、顏料、著色劑、玻璃珠或泡、及抗氧化劑,以便減少結構性黏著劑層組成物的重量及/或成本、調節黏度、及/或提供額外加強或改質本發明之黏著劑組成物及物品的導熱性,使得更迅速或均勻的固化可以實現。添加劑的性質及其用量不應干擾可固化黏著劑的透射率。
黏著劑組成物可藉由組合(甲基)丙烯酸四氫糠酯共聚物與環氧樹脂、聚醚多元醇、羥基官能性成膜聚合物、及陽離子光起始劑,以及藉由光化輻射(較佳地UV)照射使該混合物光聚合來製備。
在一些實施例中,(甲基)丙烯酸酯共聚物係藉由單體混合物利用光或熱起始劑進行自由基聚合作用單獨製備。共聚物可藉由任何習知自由基聚合方法製備,包括溶液、輻射、塊狀、分散液、乳液、無溶劑、及懸浮方法。所得的黏著劑共聚物可以是無規或嵌段(共)聚合物。
可用於製備THFA共聚物的熱起始劑是當暴露於熱時產生自由基以起始單體混合物的(共)聚合之起始劑。合適的水溶性起始劑包括該些選自由過硫酸鉀、過硫酸銨、過硫酸鈉、及其混合物所組成之群組者;氧化還原起始劑,例如上述過硫酸鹽與還原劑(例如該等選自由偏亞硫酸氫鈉及亞硫酸氫鈉所組成之群組者)的反應產物;及4,4’-偶氮雙(4-氰基戊酸)、及其可溶性鹽(例如鈉鹽、鉀鹽)。合適的起始劑亦包括該些選自由下列所組成之群組者:偶氮化合物(例如VAZOTM 64(2,2’-偶氮雙(異丁腈))及VAZOTM 52(2,2’-偶氮雙(2,4-二甲基戊腈)),二者皆可購自E.I.du Pont de Nemours Co.)、過氧化物(例如苯甲醯基過氧化物及月桂醯基過氧化物)、及其混合物。較佳的油溶性熱起始劑是(2,2’-偶氮雙(異丁腈))。
當使用時,熱起始劑可佔從約0.05至約1重量份、較佳地約0.1至約0.5重量份,此係基於100重量份在壓敏黏著劑中之單體組分計。
可用的光起始劑包括苯偶姻醚,例如苯偶姻甲基醚及苯偶姻異丙基醚;經取代的苯乙酮,例如2,2-二甲氧基苯乙酮(市售品如IrgacureTM 651光起始劑(BASF,Ludwigshafen,Germany))、2,2-二
甲氧基-2-苯基-1-苯基乙酮(市售品如EsacureTM KB-1光起始劑(Sartomer Co.;West Chester,PA))、及二甲氧基羥基苯乙酮;經取代的α-酮醇,例如2-甲基-2-羥基丙醯苯;芳族磺醯氯,例如2-萘-磺醯氯;及光活性肟,例如1-苯基-1,2-丙二酮-2-(O-乙氧基-羰基)肟。其中特別較佳的是經取代的苯乙酮。
較佳的光起始劑是經歷Norrish I裂解而產生自由基之光活性化合物,起始可藉由將自由基添加至丙烯酸雙鍵進行。這樣的光起始劑較佳地以每100份單體混合物從0.1至1.0pbw之量存在。單體混合物及光起始劑可使用活化UV輻射照射以聚合單體組分。UV光源可以有兩種類型:1)相對低強度的光源,例如背光,其通常提供10mW/cm2或更低強度(如根據United States National Institute of Standards and Technology所認可之程序,例如使用Electronic Instrumentation & Technology,Inc.,Sterling,VA所製造之UvimapTM UM 365 L-S輻射計測量)之波長範圍280至400奈米的光,及2)相對高強度的光源,例如中壓汞燈,其通常提供大於10mW/cm2、較佳地在15及450mW/cm2之間之強度。例如,600mW/cm2之強度及約1秒的暴露時間可以成功地使用。強度範圍可從約0.1至約150mW/cm2、較佳地從約0.5至約100mW/cm2、及更佳地從約0.5至約50mW/cm2。
一般的溶液聚合方法是藉由下列進行:將單體、合適溶劑、及可選地鏈轉移劑添加至反應容器中,加入自由基起始劑,用氮氣吹掃,以及將反應容器保持在升高的溫度下(一般在約40至100℃
之範圍)直到反應完成(一般約1至24小時,取決於批量大小和溫度)。溶劑的實例是甲醇、四氫呋喃、乙醇、異丙醇、丙酮、甲基乙基酮、乙酸甲酯、乙酸乙酯、甲苯、二甲苯、及乙二醇烷基醚。該等溶劑可單獨使用或以其混合物使用。
聚合可在合適的溶劑存在下進行,或較佳地在無溶劑存在下進行,合適的溶劑例如乙酸乙酯、甲苯、及四氫呋喃,這些溶劑不與漿液聚合物的組分之官能基反應。
漿液聚合物技術包含部分地聚合單體以產生包含THFA(甲基)丙烯酸酯共聚物及未聚合單體的漿液聚合物。漿液聚合物組成物係經聚合到可用的塗佈黏度,其可與黏著劑組成物的其它組分組合,可選地經塗佈到基材(如膠帶背襯)上,並經進一步聚合。部分聚合提供THFA(甲基)丙烯酸酯溶質共聚物於一或多種溶劑單體中之可塗佈溶液。應理解的是,如果使用漿液聚合方法,額外的自由基起始劑是必要的,以在配混(compounding)後使溶劑單體完全聚合。
無溶劑的聚合方法,例如U.S.4,619,979及4,843,134(Kotnour等人)描述之連續自由基聚合方法;U.S.5,637,646(Ellis)描述使用批次反應器的基本絕熱聚合方法;及U.S.5,804,610(Hamer等人)描述之用於使經包裝的預黏著劑組成物聚合之方法,也可以用來製備聚合物。較佳地,第一共聚物係藉由絕熱批次聚合方法製備,其中在反應過程期間,任何到達或來自批次的能量交換的絕對值之總和將小於所釋放之總能量的約15%,能量是由聚合發生期間所發生之
對應聚合量之反應所釋放,如以引用方式併入本文中之U.S.5637646(Ellis)所述。
較佳地,組分之組合及光聚合係使用以引用方式併入本文中之WO9607522(Hamer等人)及U.S.5,804,610(Hamer等人)所述之用於使經包裝的預黏著劑組成物聚合之方法進行。
在Hamer的方法中,用來形成反應容器或器皿的包裝材料較佳地係由當與黏著劑組成物組合時不會實質上不利地影響所欲黏著劑特徵的材料製成。從黏著劑組成物及包裝材料的混合物產生的熱熔塗佈黏著劑,相較於單獨從黏著劑組成物產生的熱熔塗佈黏著劑,可具有改良的黏著劑性質。
在一些實施例中,反應混合物係經塗佈到載體帶材上、經片材覆蓋、以及進行聚合,其中載體帶材、片材、或兩者皆可用黏著劑熱熔塗佈。如果載體帶材及片材都是可熱熔塗佈的,所得到的複合物可直接送入熱熔塗佈機,或切割成較小條帶或片並送到熱熔塗佈機。如果在載體帶材或片材中僅有一者可用黏著劑熱熔塗佈,則在熱熔塗佈黏著劑之前,需先將不可塗佈實體除去。為了便於在不可塗佈實體除去後之處理,可將經聚合黏著劑折疊到其自身上,使得可塗佈實體實質上圍繞經塗佈黏著劑的主要表面。然後可將黏著劑帶材送入至熱熔塗佈機,或者也可以在熱熔塗佈之前,將其切割成較小條帶或片。
如果任一載體帶材或片材不可用黏著劑熱熔塗佈,其應經處理(若需要)以使黏著劑可容易地從其移除。這樣的處理包括聚矽氧離型塗層、聚氟聚醚塗層、及聚氟乙烯塗層例如TeflonTM。
若為所欲,可將鏈轉移劑加入到單體混合物,以產生具有所欲分子量的THFA共聚物。可用的鏈轉移劑實例包括但不限於該些選自由四溴化碳、醇、硫醇、及其混合物所組成之群組者。當存在時,較佳的鏈轉移劑是硫代乙酸異辛酯、及四溴化碳。
鏈轉移劑的使用量可使THFA共聚物在黏著劑的加工溫度(例如120℃)下具有0.75至3.0的tan δ。單體混合物可進一步包含最高約5重量份的鏈轉移劑(如果使用的話)、一般約0.01至約5重量份、較佳地約0.05重量份至約0.5重量份,此係基於100重量份之總單體混合物計。
可將黏著劑組成物的組分組合,並在升高但低到足以避免任何存在於黏著劑組成物中的光起始劑分解的溫度下、在合適的混合容器中混合。雖然混合時間可變化,但黏著劑組成物的組分理想地混合一段足以形成組分的均勻混合物的時間。
混合後,黏著劑組成物可藉由各種不同的方法來形成其最終形狀。例如,黏著劑組成物可使用加熱刮刀塗佈機塗佈到離型襯墊上以形成層。可替代地,黏著劑組成物的組分可在擠出機中配混,然後通過具有所欲形狀的模擠出以產生黏著劑的成形條狀物;也就是具有所欲橫截面形狀的條狀物。在進一步方法中,黏著劑組成物可經擠出為一團塊(mass),且在一對相隔預定距離且經馬達驅動的冷卻輥
之間遞送,以形成隨後可經壓延成所欲厚度的黏著劑組成物之結構性黏著劑層的平坦片材。
在批次方法中,黏著劑組成物是藉由在一或多個合適的容器中混合各種成分來製備,理想地容器無法被光化輻射穿透。液體組分(例如液體環氧樹脂及含羥基材料)可以在第一容器中,在足以液化組分的溫度下預混合。組分可同時或以任何順序依序添加;然而,理想的是在所有其他組分皆已充分混合後,再添加陽離子光起始劑。
在連續方法中,黏著劑組成物在擠出機(例如雙螺桿擠出機)中混合,該擠出機配備有下游埠、靜態混合器、及適當的輸出孔口(即膜模具、片材模具、形狀模具等),及適當地捲取輥和繞緊輥。捲取線速度可視輸出形式進行適當調整。
配混的黏著劑組成物可用陽離子光起始劑來固化。合適的光起始劑包括,但不限於,鎓鹽及陽離子有機金屬鹽(這二者皆描述於美國專利第5,709,948號)、及光可活化的有機金屬錯合物鹽,例如於以下描述者:美國專利第5,059,701號;第5,191,101號;以及第5,252,694號。
可用的鎓鹽包括重氮鹽,例如芳基重氮鹽;鹵鎓鹽,例如二芳基錪鹽;鋶鹽,例如三芳基鋶鹽;鹽,例如三芳基鹽;氧化鋶鹽,例如三芳基氧化鋶鹽;及其他各種類別鎓鹽,例如三芳基鏻鹽及鉀鹽,及哌喃(pyrylium)及硫基哌喃鹽。
合適的芳族錪錯合物鹽更完整地描述於美國專利第4,256,828號。在本發明的一個實施例中,所欲的芳族錪錯合物鹽是[(Ar)2I]+[PF6]-或[(Ar)2I]+[SbF6]-,其中Ar是相同或不同,且各包含具有從4至20個碳原子的芳族基團。
可用於本發明的芳族錪錯合物鹽在紫外光光譜區中是光敏的。然而,其可藉由用於已知可光解的有機鹵化合物之敏化劑敏化至近紫外光及可見光光譜範圍。示例性敏化劑包括有色芳族多環烴,如描述於美國專利第4,250,053號。應選擇合適的敏化劑,以不明顯干擾黏著劑組成物中之環氧樹脂的陽離子固化。
合適的鋶鹽包括經三芳基取代的鹽,例如三苯基鋶六氟銻酸鹽及對苯基(硫苯基)二苯基鋶六氟銻酸鹽是所欲的鋶鹽。其他可用於本發明的鋶鹽更完整地描述於U.S.5,256,828及4,173,476。可用於本發明的芳族鋶錯合物鹽在紫外光光譜區中一般而言是光敏的。然而,其可藉由一選定群組之敏化劑(例如描述於U.S.4,256,828及4,250,053中者)敏化至近紫外光及可見光光譜範圍。
如果敏化劑係與如上所述的鎓鹽組合使用,應選擇合適的敏化劑,以不明顯干擾黏著劑組成物中之環氧樹脂的陽離子固化。
在一些實施例中,敏化劑可用作為染料或指示劑,其1)識別黏著劑在連接器(connector)中的位置;2)參與固化反應;及3)產生反映固化開始的顏色變化。當在可固化組成物中作為顏色變化指示劑使用時,組成物可在對應於光起始劑(而非敏化劑)的λ最大值的
照射波長下固化。自起始劑釋放的初期酸與敏化劑反應,實現顏色變化。
據信合適的敏化劑包括在以下類別的化合物:酮、香豆素染料(例如酮-香豆素)、二苯并哌喃染料、吖啶染料、噻唑染料、噻染料、染料、氮染料、胺基酮染料、卟啉、芳族多環烴、對位經取代的胺基苯乙烯基酮化合物、胺基三芳基甲烷、部花青素、方酸菁(squarylium)染料、及吡啶鎓染料。酮(例如單酮或α-二酮)、酮香豆素、胺基芳基酮、及對位經取代的胺基苯乙烯基酮化合物是較佳的敏化劑。對於需要高度敏感性的應用,較佳係採用含有咯啶基部分的敏化劑。對於需要深度固化的應用(例如,其中該塗層或強化纖維使類似波長的輻射衰減),較佳係採用在所欲的光聚合照射波長下具有低於約1000、更佳地低於約100的消光係數之敏化劑。可替代地,也可使用在適當波長下展現漂白作用的敏化劑。在此反應中,敏化劑使組成物漂白,然後起始作用可進展通過材料的一或多層。
舉例來說,較佳的酮敏化劑類別具有下式:A-CO-(Y)b-B其中Y為CO或CR11R12,其中R11及R12可相同或不同,且可為氫、烷基、烷芳基、或芳烷基,b為一或零,且A及B可相同或不同且可為經取代的(具有一或多個非干擾性取代基)或未經取代的芳基、烷基、烷芳基、或芳烷基,或A及B可一起形成環狀結構,其可為經取代或未經取代的環脂族、芳族、雜芳族、或稠合芳族環。
上式之合適的酮包括單酮(b=0),例如2,2-、4,4-或2,4-二羥基二苯基酮、二-2-吡啶基酮、二-2-呋喃基酮、二-2-硫苯基酮、苯偶姻、茀酮、醌,例如,氯醌、2-氮雜-3-羧基-9-茀酮、及類似者、查耳酮、米其勒酮、2-氟-9-茀酮、2-氯硫代酮、苯乙酮、二苯基酮、1-或2-萘乙酮、9-乙醯蒽(9-acetylantracene)、2-、3-或9-乙醯菲、4-乙醯聯苯、丙醯苯、正丁醯苯、苯戊酮、2-、3-或4-乙醯吡啶、3-乙醯香豆素、及類似者。合適的二酮包括芳烷基二酮,例如蒽醌、菲醌、鄰、間及對二乙醯基苯、1,3-、1,4-、1,5-、1,6-、1,7-及1,8-二乙醯萘、1,5-、1,8-及9,10-二乙醯蒽、及類似者。合適的α-二酮(b=1且X=CO)包括2,3-丁二酮、2,3-戊二酮、2,3-己二酮、3,4-己二酮(3,4-hexanedionc)、2,3-庚二酮、3,4-庚二酮、2,3-辛二酮、4,5-辛二酮、二苯乙二酮、2,2'-、3,3'-及4,4'-二羥基二苯乙二酮、雙糠醯、二-3,3'-吲哚基乙二酮、2,3-烷二酮(樟腦醌)、1,2-環己二酮、1,2-萘醌、乙烷合萘醌、及類似者。
其他較佳的敏化劑包括孟加拉玫瑰紅、亞甲基紫、螢光素、伊紅黃、伊紅Y、乙基伊紅、伊紅藍、紅螢素黃摻合物、4',5'-二溴螢光素。
在鎓陽離子光起始劑中,鋶化合物的熱穩定性是較佳的。
另一類適合用於本發明的光起始劑包含光可活化之有機金屬錯合物鹽,例如於以下描述者:美國專利第5,059,701號;第
5,191,101號;以及第5,252,694號。這樣的有機金屬陽離子鹽具有下列通式:[(L1)(L2)Mm]+eX-其中Mm表示選自週期表IVB、VB、VIB、VIIB、及VIII族元素的金屬原子,理想地為Cr、Mo、W、Mn、Re、Fe、及Co;L1表示無、一個、或二個貢獻π電子的配位基,其中配位基可相同或不同,且各配位基可選自由經取代及未經取代的脂環及環狀不飽和化合物及經取代及未經取代的碳環芳族及雜環芳族化合物所組成之群組,各者皆能貢獻二至十二個π電子至金屬原子M的價殼。
理想地,L1係選自由下列所組成之群組:經取代及未經取代的η3-烯丙基、η5-環戊二烯基、η7-環庚三烯基化合物、及η6-芳族化合物、及具有2至4個稠環的化合物,該η6-芳族化合物係選自由η6-苯及經取代的η6-苯化合物(例如,二甲苯)所組成之群組,各者皆能貢獻3至8個π電子至Mm的價殼;L2表示無或1至3個貢獻偶數個σ電子的配位基,其中配位基可相同或不同,且各配位基可選自由下列所組成之群組:一氧化碳、亞硝鎓、三苯膦、三苯、及磷、砷及銻的衍生物,前提是由L1及L2貢獻至Mm的總電荷導致錯合物的淨殘餘正電荷為e;e為具有1或2之值的整數,即錯合物陽離子的殘餘電荷;且X為含鹵素的錯合物陰離子,如上所述。
合適的市售陽離子起始劑包括,但不限於,芳族鋶錯合物鹽FX-512TM(Minnesota Mining and Manufacturing Company,St.Paul,Minn.)、CD-1012TM、及CD-1010TM(Sartomer,Exton,Pa.);UVOXTM UVI-6976,其為芳族鋶錯合物鹽(Dow Chemical,Midland,Mi.);及IRGACURETM 261,其為陽離子有機金屬錯合物鹽(BASF Corporation,Florham Park,NJ)。
其中用於固化黏著劑組成物的陽離子光起始劑是茂金屬鹽催化劑,其可選地伴隨加速劑(accelerator),例如三級醇的草酸酯,如於美國專利第5,436,063號中所述,儘管此為可選的。可使用的草酸酯共催化劑包括該等描述於美國專利第5,252,694號中者。基於存在於組成物中的樹脂(THFA共聚物、環氧樹脂、聚醚多元醇、及成膜聚合物)的總重量計,促進劑可佔從約0.01至約5重量百分比、理想地從約0.1至約4重量百分比的結構性黏著劑層組成物。
黏著劑組成物包含一或多種陽離子光起始劑,其量係取決於光源及暴露程度而異。理想地,黏著劑組成物包含一或多種陽離子光起始劑,其量基於100份之黏著劑組成物總重量計,係0.1至1重量份。更理想地,本發明之結構性黏合膠帶的結構性黏著劑層包含一或多種光起始劑,其量基於100份之黏著劑組成物總重量計,係從約0.2至約0.5重量份。
固化、部分固化、或未固化的黏著劑組成物可被塗佈到基材上以形成黏著劑物品。例如,基材可為撓性或非撓性,且可由聚合材料、玻璃或陶瓷材料、金屬、或其組合形成。一些基材是聚合
膜,例如從下列製造者:聚烯烴(例如聚乙烯、聚丙烯、或其共聚物)、聚胺甲酸酯、聚乙酸乙烯酯、聚氯乙烯、聚酯(聚對苯二甲酸乙二酯或聚萘二甲酸乙二酯)、聚碳酸酯、聚(甲基)丙烯酸甲酯(PMMA)、乙烯-乙酸乙烯酯共聚物、及纖維素材料(例如乙酸纖維素、三乙酸纖維素、及乙基纖維素)。
其他基材是金屬箔、非織造材料(例如紙、布、非織造紗布)、發泡體(例如聚丙烯酸、聚乙烯、聚胺甲酸酯、氯丁二烯橡膠)、及類似者。對於一些基材而言,處理表面以改善對於交聯組成物、交聯組成物、或兩者的黏著性可能是理想的。這樣的處理包括,例如,施加底漆層、表面改質層(例如,電暈處理或表面磨損)、或二者。
在一些實施例中,黏著劑物品包含嵌入在黏著劑層中的非織造紗布。
在一些實施例中,基材是離型襯墊,以形成具有基材/黏著劑層/離型襯墊構造的黏著劑物品。黏著劑層可為固化、未固化、或部分固化。離型襯墊一般對可固化組成物具有低親和力。例示性離型襯墊可從紙(例如,牛皮紙)或其他類型的聚合材料來製備。一些離型襯墊塗佈有離型劑之外層,諸如含聚矽氧材料或含氟碳化物材料。
本揭露進一步提供黏合的方法,其包含下列步驟:提供一基材(或工件),該基材(或工件)在其一表面上具有一層可固化組成物;將該黏著劑層暴露於光化輻射(例如UV)以起始固化;以
及將該第一基材黏附到一第二基材(或工件);及可選地將該等經黏合之工件加熱。
藉由測量經黏合之樣品的重疊剪切強度判定對e-塗佈鋼板(「stl」)之黏著性。以1:1(v:v)的異丙醇及水的溶液擦拭經量測為25mm×50.8mm的基材試片,並讓其風乾。將離型襯墊從一12.7mm×25mm部分的黏著劑組成物之一側除去,並將組成物施加到一試片。除去第二離型襯墊,並將組成物暴露於微波源(0.9-1.2J/cm2 UVA,H燈泡,Heraeus Noblelight America,Gaithersburg,MD),如藉由UVICURE Plus積分輻射計(EIT,Inc.,Sterling,VA)所測量。將第二試片施加到經照射之樣品,從而封閉黏合。藉由施加靜態6kg負載
至樣品30至60秒的手段,使總成浸透(wet-out)。使樣品在測試之前在環境溫度和濕度下固化24小時。
使用INSTRON拉伸測試機型號5581(Instron Corp.,Canton,Ma),在環境溫度下進行動態重疊剪切測試。將測試樣品裝載至夾具中,並以每分鐘2.5mm操作十字頭,增加樣品之負載至失效。斷裂應力以MPa為單位記錄。
藉由測量經黏合之樣品的開裂強度判定塑膠對玻璃之黏著性。以1:1(v:v)的異丙醇及水的溶液擦拭經量測為22mm×28mm×4mm之由CRASTIN製成的塑膠測試片、及經量測為127mm×50mm×4mm之強化玻璃板,並讓其風乾。將離型襯墊從一22mm×28mm部分的黏著劑組成物除去,並將此部分施加到塑膠測試片。浸透是藉由施加1至3kg重量至測試片30秒的手段完成。除去第二離型襯墊,並將黏著劑部分暴露於微波源(0.9-1.2J/cm2 UVA,H燈泡,Heraeus Noblelight America,Gaithersburg,MD),如藉由UVICURE Plus積分輻射計(EIT,Inc.,Sterling,VA)所測量。將經照射樣本施加至強化玻璃板,並藉由施加6kg重量至經黏合之總成30至60秒來浸透。使總成在測試之前在環境條件下固化24小時。
將經固化總成垂直安裝(即該黏合的平面係呈垂直定向)於INSTRON拉伸測試機型號5565(INSTRON CORP.,Canton,MA)中。將70mm的槓桿臂垂直於該黏合的平面附著到塑膠測試片,
並以每分鐘2.5mm的速率向上拉(平行於該黏合的平面)。斷裂的最大值以N為單位記錄。
衰減全反射(ATR)測量是在NICOLET NEXUS 670 IR光譜儀(Thermo Fisher Scientific Inc.,Waltham,MA)上,利用MCT/A偵測器及SMART OMNI單反彈鍺(Ge)ATR配件進行。光譜係由在4000至650cm-1的範圍內解析度為四(數據間隔=2cm-1)的三十二次掃描組成。
在指定的固化程序(cure profile)之前(「起始(Initial)」)及之後(「暴露(Exposed)」)皆測量樣本之ATR光譜。對於「H燈泡、24小時、RT」樣本,除去頂部襯墊,並將黏著劑利用配備有H燈泡之FUSION LIGHT HAMMER 10(Heraeus Noblelight America,Gaithersburg,MD)以32fpm進行暴露二次。這相當於1 UVA、1 UVB、0.25 UVC、1.1 UVV的總暴露量(J/cm2),如藉由Power Puck® II輻射計(EIT,Inc.,Sterling,VA)所測量。再次施加離型襯墊,隨後使樣本保持在室溫下(約21℃)24小時之後進行ATR。
進行每一次ATR測量時,將離型襯墊從膠帶樣本的一側剝離。將所得黏著劑表面下壓以與Ge晶體保持良好接觸直到獲得光譜。之後,將樣本從Ge晶體剝離並用乙酸乙酯清洗晶體。
藉由比較相同組成物的「起始」與「暴露」光譜,監測910cm-1吸光度的大小作為環氧轉化的指標。如果910cm-1峰不變,
樣本被標識為未固化(U);如果該峰變小但仍然可見,則標識為部分固化(P);或如果沒有可辨識的峰存在,則標識為固化(C)。獲得並分析膠帶二面(正面及背面)的光譜,其中「正面(front)」是經直接照射之側而「背面(back)」是透過厚度暴露之側。
使用MCR 302流變儀(Anton Paar GmbH,Graz,Austria)測定組成物的潛變性能及尺寸穩定性。將各組成物之0.6mm厚樣本裝載在25mm平行板之間,並施加1N的法向力(FN)。施加1000Pa的恆定應力300秒,然後施加0Pa的恆定應力600秒。記錄在300秒的應變(γ300s)以表徵組成物的潛變行為(「冷流動(cold-flow)」),並以%應變表示。
使用MCR 302流變儀(ANTON PAAR GmbH,Graz,Austria),在振盪模式下操作測定丙烯酸共聚物的玻璃轉移溫度T g。將樣本裝載至8mm平行板上,並施加0.1N的法向力。樣本首先以每分鐘10℃從30℃冷卻至-50℃,同時應變(γ)從1%減少至0.01%,法向力(FN)從0.1N增加至0.5N。然後進行樣本分析,此時以每分鐘10℃從-50℃加熱至150℃,同時γ從0.01%增加至5%且FN從0.5N減少至0.05N。振盪頻率(F)在所有實驗中為1Hz。將對應tan(δ)主峰的溫度記錄為T g(單位為℃)。
方法1
藉由Karim之方法(US5721289)製備丙烯酸共聚物混合物。對於各組成物,將所有丙烯酸單體及0.04份IRGACURE 651光起始劑在玻璃瓶中混合。僅針對F1,額外添加29份EPON 828及10份EPON 1001F。用氮吹掃溶液,並使溶液在攪拌下暴露於UVA光,直到混合物的黏度適合於塗佈(500至5000cP)。製成具有100份上述漿液、0.2份IRGACURE 651、及任何剩餘組分(環氧樹脂及/或醇)的混合物。在二個0.050mm的經聚矽氧塗佈之聚(對苯二甲酸乙二酯)離型襯墊之間,以0.75mm的厚度塗佈混合物。此雙襯墊建構體的各側受到來自350BL螢光燈泡之1200mJ/cm2 UVA照射,如藉由UVIRAD低能量UV積分輻射計(EIT,Inc.,Sterling,VA)所測量。除去離型襯墊,接著進行後續配混。
方法2
藉由Hamer之方法(US5804610)製備丙烯酸共聚物。將丙烯酸單體、自由基光起始劑(IRGACURE 651)、及鏈轉移劑(IOTG)組合在琥珀色玻璃瓶中,並用手搖動混合來製備溶液。將溶液分成25克等分至基於乙烯乙酸乙烯酯之膜的熱密封隔室內,浸入16℃的水浴內,並使用UV光(UVA=4.7mW cm-2,每側8分鐘)聚合。
使用配備有50或250g容量加熱混合頭和捏揉元件之BRABENDER混合器(C.W.Brabender,Hackensack,NJ)製備組成物。在120至150℃的所欲混合溫度下操作混合器,並以100rpm操作捏揉元件。首先將丙烯酸共聚物加入,並使其混合數分鐘。將固體環氧樹脂及羥基官能性成膜聚合物加入,並使其混合直到均勻地分佈於整個混合物中。緩慢加入液體環氧樹脂、多元醇、及矽烷材料直到均勻分佈。讓所得的混合物攪拌幾分鐘,然後逐滴加入光酸產生劑。讓混合物攪拌數分鐘,然後將其轉移到鋁盤中,並使其冷卻。藉由使用液壓機(Carver Inc.,Wabash,IN),將材料團(mass of material)放在二個離型襯墊之間,並在加熱至95℃時壓製成0.6mm厚的膜。
表3列出的丙烯酸混合物係經製備以用於後續的熱熔配混實驗。樣本F1至F4是根據丙烯酸共聚物合成方法1製備。此方法代表由Karim所教示者(US5721289)。大致上,將丙烯酸單體、環氧樹脂、及自由基光起始劑組合並部分聚合成具有可塗佈黏度之漿液,從而得到丙烯酸混合物。樣本F5及F6是根據丙烯酸共聚物合成方法2製備。此方法代表由Hamer所教示者(US5804610)。大致上,將丙烯酸單體、自由基光起始劑、及鏈轉移劑組合,並將丙烯酸完全固化,從而得到丙烯酸混合物。
將來自表3之丙烯酸混合物進一步處理,以產生表4所列的環氧-丙烯酸組成物。藉由自Karim(US5721289)及Weglewski(US2002/0182955 A1)調適之熱熔配混程序來製備組成物。大致上,將丙烯酸混合物或彈性體、環氧樹脂、多元醇、熱塑性塑膠、矽烷、及光酸產生劑組合於加熱的混合器中,接著轉移至離型襯墊,並壓製成供後續評估/機械測試之用的所欲厚度。
a US5721289實例10
b US5721289實例4
c US2002/0182955 A1:[0073]說明書;組成物在配混時展現巨相分離,因此未進一步評估。
d US2002/0182955 A1:實例AE-1;組成物在塗佈時滲透離型襯墊,並展現不良成膜性質。
e 在指定的固化程序之後以ATR評估之固化一致性。環氧轉化係記錄為各表面的固化(C)、部分固化(P)、或未固化(U)。
製造併入不同熱塑性組分的進一步組成物(表5)。藉由上文詳述之相同熱熔配混程序製備組成物,接著轉移至離型襯墊,
並壓製成供後續評估/機械測試之用的所欲厚度。出乎意料的是,具有這些熱塑性塑膠之環氧-丙烯酸酯組成物顯示在負載下減少潛變(未固化),並保留一旦固化後可用的最終黏合強度。
製造其他組成物以研究丙烯酸組分加載的影響(表6)。藉由上文詳述之相同熱熔配混程序製備組成物,接著轉移至離型襯墊,並壓製成供後續評估/機械測試之用的所欲厚度。
表7列出的丙烯酸混合物係經製備以用於後續的熱熔配混實驗。彼等是根據丙烯酸共聚物合成方法2製備。大致上,將丙烯酸單體、自由基光起始劑、及鏈轉移劑組合,並將丙烯酸完全固化,從而得到丙烯酸混合物。
製造其中丙烯酸共聚物組成有所不同的組成物(表8)。藉由上文詳述之相同熱熔配混程序製備組成物,接著轉移至離型襯墊,並壓製成供後續評估/機械測試之用的所欲厚度。
藉由併入敏化劑/染料來製造組成物(表9)。藉由上文詳述之相同熱熔配混程序製備組成物,接著轉移至離型襯墊,並壓製成供後續評估/機械測試之用的所欲厚度。
Claims (24)
- 一種可固化組成物,其包含:a. 15至50份的(甲基)丙烯酸四氫糠酯共聚物;b. 25至50份的環氧樹脂組分;c. 5至15份的液體聚醚多元醇;d. 10至25份的羥基官能性成膜聚合物;其中a)至d)之總和為100重量份;以及e. 相對於100份的a)至d),0.1至1份的陽離子光起始劑。
- 如請求項1之可固化組成物,其中該(甲基)丙烯酸四氫糠酯共聚物包含a) 40至60wt.%、較佳地大於50至60wt.%的(甲基)丙烯酸四氫糠酯單體;b) 40至60wt.%、較佳地40至小於50wt.%的(甲基)丙烯酸C1-C8烷基酯單體;c) 0至10wt.%的陽離子反應性官能性(甲基)丙烯酸酯單體;其中a)至c)的總和為100wt.%。
- 如先前請求項中任一項之可固化組成物,其中環氧樹脂對丙烯酸酯聚合物的重量比為從1.1:1至5:1。
- 如先前請求項中任一項之可固化組成物,其中該環氧樹脂包含0.1至5wt.%之量的陽離子反應性(甲基)丙烯酸酯官能性單體。
- 如先前請求項中任一項之可固化組成物,其中該成膜聚合物係選自苯氧基樹脂、乙烯-乙酸乙烯酯(EVA)共聚物、聚己內酯多元醇、聚酯多元醇、及聚乙烯縮醛樹脂。
- 如先前請求項中任一項之可固化組成物,其中該陽離子光起始劑為鋶或錪鹽。
- 如先前請求項中任一項之可固化組成物,其中該環氧樹脂包含二或更多種環氧樹脂,其中至少一種環氧樹脂具有從約300至約500的環氧當量,且至少一種環氧樹脂具有從約1000至約1200之環氧當量。
- 如先前請求項中任一項之可固化組成物,其中該(甲基)丙烯酸四氫糠酯共聚物不具有酸官能性單體單元。
- 如先前請求項中任一項之可固化組成物,其中該(甲基)丙烯酸C1-C8烷基酯的莫耳平均碳數為3至6。
- 如先前請求項中任一項之可固化組成物,其中該(甲基)丙烯酸四氫糠酯共聚物為丙烯酸四氫糠酯/丙烯酸丁酯共聚物。
- 如先前請求項中任一項之可固化組成物,其包含:a. 25至35份的(甲基)丙烯酸四氫糠酯共聚物;b. 35至45份的環氧樹脂組分;c. 5至15份的聚醚多元醇;d. 10至25份的羥基官能性成膜聚合物;其中a)至d)之總和為100重量份;及e. 相對於100份的a)至d),0.1至1份的陽離子光起始劑。
- 如先前請求項中任一項之可固化組成物,其中該羥基官能性成膜聚合物係選自苯氧基樹脂、乙烯-乙酸乙烯酯(EVA)共聚物(在25℃下為固體)、聚己內酯多元醇、聚酯多元醇、及在25℃下為固體之聚乙烯縮醛樹脂。
- 如請求項12之可固化組成物,其中該羥基官能性成膜聚合物具有至少0.01之羥基數。
- 一種製備如先前請求項中任一項之黏著劑的方法,其包含以下步驟:a) 至少部分聚合(單體)之單體混合物,以產生(甲基)丙烯酸四氫 糠酯共聚物;b) 組合該共聚物與環氧樹脂、聚醚多元醇、羥基官能性成膜聚合物、陽離子光起始劑、及可選地額外的自由基光起始劑;c) 可選地塗布該混合物;d) 光聚合。
- 如請求項14之方法,其中步驟a)之單體混合物係經部分聚合成漿液共聚物組成物,其包含存於溶劑單體中之溶質(甲基)丙烯酸四氫糠酯共聚物。
- 如請求項14之方法,其中步驟a)之單體混合物係完全聚合成THA共聚物。
- 如先前請求項14至15中任一項之方法,其中b)組合之步驟是熔融摻合。
- 如請求項17之方法,其中熔融摻合之步驟係在擠出機中。
- 一種黏著劑物品,其包含基材及在該基材之表面上的一層如請求項1至13中任一項之可固化組成物。
- 如請求項19之黏著劑物品,其中該組成物已經部分固化。
- 如請求項19之黏著劑物品,其進一步包含離型襯墊。
- 一種黏合方法,其包含以下步驟:提供基材,該基材在其表面上具有一層如請求項1至13中任一項之可固化組成物;將該可固化黏著劑層暴露於光化輻射以起始固化;將該第一基材黏附到第二基材;及可選地將該等經黏合之基材加熱。
- 如請求項1至13中任一項之可固化組成物,其進一步包含敏化劑。
- 如請求項23之可固化組成物,其中該敏化劑係選自酮、香豆素染料、二苯并哌喃染料、吖啶染料、噻唑染料、噻染料、染料、氮染料、胺基酮染料、卟啉、芳族多環烴、對位經取代的胺基苯 乙烯基酮化合物、胺基三芳基甲烷、部花青素、方酸菁(squarylium)染料、及吡啶鎓染料。
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US8785517B2 (en) | 2011-05-25 | 2014-07-22 | 3M Innovative Properties Company | Pressure-sensitive adhesives with onium-epdxy crosslinking system |
CN103087640A (zh) * | 2011-11-08 | 2013-05-08 | 汉高股份有限公司 | 双固化粘合剂组合物及其用途以及粘合基底的方法 |
EP2931794A1 (en) | 2012-12-11 | 2015-10-21 | Adhesives Research, Inc. | Reactive film adhesive |
CN107683316A (zh) | 2015-06-04 | 2018-02-09 | 3M创新有限公司 | 将硬件粘结到车辆玻璃的方法 |
KR20180015215A (ko) * | 2015-06-04 | 2018-02-12 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Uv 경화성 에폭시/아크릴레이트 접착제 조성물 |
WO2017117163A1 (en) | 2015-12-30 | 2017-07-06 | 3M Innovative Properties Company | Dual stage structural bonding adhesive |
-
2016
- 2016-05-13 KR KR1020187000037A patent/KR20180015215A/ko unknown
- 2016-05-13 CN CN201680032350.3A patent/CN107709497B/zh active Active
- 2016-05-13 CN CN202010364933.4A patent/CN111500227B/zh active Active
- 2016-05-13 EP EP20173493.6A patent/EP3733808A1/en not_active Withdrawn
- 2016-05-13 WO PCT/US2016/032419 patent/WO2016195970A1/en active Application Filing
- 2016-05-13 JP JP2017562737A patent/JP6837443B2/ja active Active
- 2016-05-13 EP EP16736644.2A patent/EP3320053B1/en active Active
- 2016-05-13 US US15/574,877 patent/US10676655B2/en active Active
- 2016-05-26 TW TW105116517A patent/TWI713529B/zh not_active IP Right Cessation
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2020
- 2020-05-11 US US16/871,543 patent/US11370944B2/en active Active
- 2020-08-21 JP JP2020140322A patent/JP7012794B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI786141B (zh) * | 2017-06-30 | 2022-12-11 | 美商3M新設資產公司 | 可印刷可固化混合物及經固化組成物 |
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TWI713529B (zh) | 2020-12-21 |
US20200270492A1 (en) | 2020-08-27 |
KR20180015215A (ko) | 2018-02-12 |
EP3733808A1 (en) | 2020-11-04 |
CN107709497B (zh) | 2020-07-17 |
WO2016195970A1 (en) | 2016-12-08 |
JP6837443B2 (ja) | 2021-03-03 |
JP2018522967A (ja) | 2018-08-16 |
US10676655B2 (en) | 2020-06-09 |
EP3320053A1 (en) | 2018-05-16 |
US20180127625A1 (en) | 2018-05-10 |
EP3320053B1 (en) | 2020-06-17 |
CN107709497A (zh) | 2018-02-16 |
JP7012794B2 (ja) | 2022-01-28 |
JP2020200473A (ja) | 2020-12-17 |
CN111500227B (zh) | 2022-04-22 |
CN111500227A (zh) | 2020-08-07 |
US11370944B2 (en) | 2022-06-28 |
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