TW201627544A - 獨立式氮化鎵基板、發光元件及此等之製造方法 - Google Patents
獨立式氮化鎵基板、發光元件及此等之製造方法 Download PDFInfo
- Publication number
- TW201627544A TW201627544A TW104120459A TW104120459A TW201627544A TW 201627544 A TW201627544 A TW 201627544A TW 104120459 A TW104120459 A TW 104120459A TW 104120459 A TW104120459 A TW 104120459A TW 201627544 A TW201627544 A TW 201627544A
- Authority
- TW
- Taiwan
- Prior art keywords
- gallium nitride
- free
- substrate
- standing
- nitride substrate
- Prior art date
Links
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 661
- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 656
- 239000000758 substrate Substances 0.000 title claims abstract description 582
- 238000004519 manufacturing process Methods 0.000 title claims description 72
- 239000013078 crystal Substances 0.000 claims abstract description 541
- 239000002245 particle Substances 0.000 claims abstract description 325
- 238000000034 method Methods 0.000 claims abstract description 122
- 239000000463 material Substances 0.000 claims abstract description 50
- 239000010410 layer Substances 0.000 claims description 272
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 155
- 239000002346 layers by function Substances 0.000 claims description 70
- 239000004065 semiconductor Substances 0.000 claims description 42
- 239000002019 doping agent Substances 0.000 claims description 41
- 230000015572 biosynthetic process Effects 0.000 claims description 33
- 238000005245 sintering Methods 0.000 claims description 30
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 13
- 238000007716 flux method Methods 0.000 claims description 13
- 229910052733 gallium Inorganic materials 0.000 claims description 13
- 238000002834 transmittance Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 description 42
- 230000006870 function Effects 0.000 description 37
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 35
- 239000006061 abrasive grain Substances 0.000 description 34
- 238000000227 grinding Methods 0.000 description 29
- 239000010455 vermiculite Substances 0.000 description 28
- 229910052902 vermiculite Inorganic materials 0.000 description 28
- 235000019354 vermiculite Nutrition 0.000 description 28
- 229910003460 diamond Inorganic materials 0.000 description 25
- 239000010432 diamond Substances 0.000 description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- 238000012545 processing Methods 0.000 description 24
- 238000001354 calcination Methods 0.000 description 21
- 239000002994 raw material Substances 0.000 description 21
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 17
- 239000011787 zinc oxide Substances 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 238000005498 polishing Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- 239000011777 magnesium Substances 0.000 description 14
- 239000012299 nitrogen atmosphere Substances 0.000 description 14
- 239000011734 sodium Substances 0.000 description 14
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000395 magnesium oxide Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 238000004020 luminiscence type Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000002002 slurry Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- 230000007547 defect Effects 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- -1 AlF 3 Chemical class 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 229910052594 sapphire Inorganic materials 0.000 description 8
- 239000010980 sapphire Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 239000011575 calcium Substances 0.000 description 7
- 239000002612 dispersion medium Substances 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 7
- 239000012071 phase Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 238000001771 vacuum deposition Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000001513 hot isostatic pressing Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000001451 molecular beam epitaxy Methods 0.000 description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 229910052793 cadmium Inorganic materials 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 5
- 238000007606 doctor blade method Methods 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000001027 hydrothermal synthesis Methods 0.000 description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000001887 electron backscatter diffraction Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000002490 spark plasma sintering Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052712 strontium Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XQQWBPOEMYKKBY-UHFFFAOYSA-H trimagnesium;dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[O-]C([O-])=O.[O-]C([O-])=O XQQWBPOEMYKKBY-UHFFFAOYSA-H 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 3
- FWIQGIQRNBVZEN-UHFFFAOYSA-N 4-ethoxy-2-(2-ethoxy-2-oxoethyl)-2-hydroxy-4-oxobutanoic acid Chemical compound CCOC(=O)CC(O)(C(O)=O)CC(=O)OCC FWIQGIQRNBVZEN-UHFFFAOYSA-N 0.000 description 3
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000000280 densification Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002609 medium Substances 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- SXAMGRAIZSSWIH-UHFFFAOYSA-N 2-[3-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,2,4-oxadiazol-5-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NOC(=N1)CC(=O)N1CC2=C(CC1)NN=N2 SXAMGRAIZSSWIH-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- 229910016569 AlF 3 Inorganic materials 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 238000003556 assay Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910001425 magnesium ion Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 239000001263 FEMA 3042 Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- NZMKIFMOEMHAFW-UHFFFAOYSA-N chlorane Chemical compound Cl.Cl.Cl.Cl.Cl.Cl.Cl.Cl NZMKIFMOEMHAFW-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000010335 hydrothermal treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- MQBKFPBIERIQRQ-UHFFFAOYSA-N magnesium;cyclopenta-1,3-diene;cyclopentane Chemical compound [Mg+2].C=1C=C[CH-]C=1.[CH-]1[CH-][CH-][CH-][CH-]1 MQBKFPBIERIQRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000004621 scanning probe microscopy Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 1
- 229940033123 tannic acid Drugs 0.000 description 1
- 235000015523 tannic acid Nutrition 0.000 description 1
- 229920002258 tannic acid Polymers 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Led Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013260868 | 2013-12-18 | ||
JP2014071342 | 2014-03-31 | ||
JP2014199217A JP5770905B1 (ja) | 2013-12-18 | 2014-09-29 | 窒化ガリウム自立基板、発光素子及びそれらの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201627544A true TW201627544A (zh) | 2016-08-01 |
TWI563133B TWI563133B (enrdf_load_stackoverflow) | 2016-12-21 |
Family
ID=54187194
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104120459A TW201627544A (zh) | 2013-12-18 | 2015-06-25 | 獨立式氮化鎵基板、發光元件及此等之製造方法 |
TW105136228A TWI662163B (zh) | 2013-12-18 | 2015-06-25 | Free-standing gallium nitride substrate, light-emitting element, and manufacturing method thereof |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105136228A TWI662163B (zh) | 2013-12-18 | 2015-06-25 | Free-standing gallium nitride substrate, light-emitting element, and manufacturing method thereof |
Country Status (2)
Country | Link |
---|---|
JP (2) | JP5770905B1 (enrdf_load_stackoverflow) |
TW (2) | TW201627544A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116364819A (zh) * | 2023-05-31 | 2023-06-30 | 江西兆驰半导体有限公司 | 发光二极管外延片及其制备方法、led |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105830237B (zh) * | 2013-12-18 | 2019-09-06 | 日本碍子株式会社 | 发光元件用复合基板及其制造方法 |
CN107208312B (zh) | 2015-01-29 | 2019-10-01 | 日本碍子株式会社 | 自立基板、功能元件及其制造方法 |
WO2017057271A1 (ja) | 2015-09-30 | 2017-04-06 | 日本碍子株式会社 | エピタキシャル成長用配向アルミナ基板 |
JP6681406B2 (ja) * | 2015-09-30 | 2020-04-15 | 日本碍子株式会社 | エピタキシャル成長用配向アルミナ基板 |
CN108349823B (zh) | 2015-11-16 | 2021-06-01 | 日本碍子株式会社 | 取向烧结体的制造方法 |
EP3421648B1 (en) | 2016-02-25 | 2023-01-25 | NGK Insulators, Ltd. | Polycrystalline gallium nitride self-supported substrate and light emitting element using the same |
JP6688109B2 (ja) | 2016-02-25 | 2020-04-28 | 日本碍子株式会社 | 面発光素子、外部共振器型垂直面発光レーザー、および面発光素子の製造方法 |
JP6812413B2 (ja) * | 2016-03-29 | 2021-01-13 | 日本碍子株式会社 | 自立基板および積層体 |
JP6639317B2 (ja) * | 2016-04-21 | 2020-02-05 | 日本碍子株式会社 | 13族元素窒化物結晶の製造方法および種結晶基板 |
JP6846913B2 (ja) * | 2016-11-11 | 2021-03-24 | 日本碍子株式会社 | 広波長域発光素子および広波長域発光素子の作製方法 |
TWI621249B (zh) | 2017-03-27 | 2018-04-11 | 英屬開曼群島商錼創科技股份有限公司 | 微型發光二極體及顯示面板 |
TWI632673B (zh) * | 2017-07-11 | 2018-08-11 | 錼創科技股份有限公司 | 微型發光元件與顯示裝置 |
US11309455B2 (en) | 2017-08-24 | 2022-04-19 | Ngk Insulators, Ltd. | Group 13 element nitride layer, free-standing substrate and functional element |
DE112017007796B4 (de) | 2017-08-24 | 2023-09-14 | Ngk Insulators, Ltd. | Schichten eines Kristalls aus einem Nitrid eines Elements der Gruppe 13, selbsttragende Substrate, funktionelle Vorrichtungen und Verbundsubstrate |
JP6854903B2 (ja) | 2017-08-24 | 2021-04-07 | 日本碍子株式会社 | 13族元素窒化物層、自立基板および機能素子 |
WO2019039189A1 (ja) | 2017-08-24 | 2019-02-28 | 日本碍子株式会社 | 13族元素窒化物層、自立基板および機能素子 |
JP7185123B2 (ja) * | 2017-12-26 | 2022-12-07 | 日亜化学工業株式会社 | 光学部材及び発光装置 |
JP7147644B2 (ja) * | 2019-03-18 | 2022-10-05 | 豊田合成株式会社 | Iii族窒化物半導体の製造方法 |
DE112020005284T5 (de) * | 2019-11-21 | 2022-08-11 | Ngk Insulators, Ltd. | Kristallschicht eines nitrids eines elements der gruppe 13, freistehendes substrat und funktionelles element |
CN111607825A (zh) * | 2020-06-02 | 2020-09-01 | 无锡吴越半导体有限公司 | 衬底、基于所述衬底的自支撑GaN单晶及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3410863B2 (ja) * | 1995-07-12 | 2003-05-26 | 株式会社東芝 | 化合物半導体装置及び化合物半導体発光装置 |
JP3864870B2 (ja) * | 2001-09-19 | 2007-01-10 | 住友電気工業株式会社 | 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法 |
US7221037B2 (en) * | 2003-01-20 | 2007-05-22 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing group III nitride substrate and semiconductor device |
JP2004359495A (ja) * | 2003-06-04 | 2004-12-24 | Ngk Insulators Ltd | エピタキシャル膜用アルミナ基板 |
JP4341702B2 (ja) * | 2007-06-21 | 2009-10-07 | 住友電気工業株式会社 | Iii族窒化物系半導体発光素子 |
JP4981602B2 (ja) * | 2007-09-25 | 2012-07-25 | パナソニック株式会社 | 窒化ガリウム基板の製造方法 |
JP2009091175A (ja) * | 2007-10-04 | 2009-04-30 | Sumitomo Electric Ind Ltd | GaNエピタキシャル基板、半導体デバイス、GaNエピタキシャル基板及び半導体デバイスの製造方法 |
US9012253B2 (en) * | 2009-12-16 | 2015-04-21 | Micron Technology, Inc. | Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods |
-
2014
- 2014-09-29 JP JP2014199217A patent/JP5770905B1/ja not_active Expired - Fee Related
-
2015
- 2015-06-24 JP JP2015126714A patent/JP2016001738A/ja active Pending
- 2015-06-25 TW TW104120459A patent/TW201627544A/zh unknown
- 2015-06-25 TW TW105136228A patent/TWI662163B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116364819A (zh) * | 2023-05-31 | 2023-06-30 | 江西兆驰半导体有限公司 | 发光二极管外延片及其制备方法、led |
CN116364819B (zh) * | 2023-05-31 | 2023-12-15 | 江西兆驰半导体有限公司 | 发光二极管外延片及其制备方法、led |
Also Published As
Publication number | Publication date |
---|---|
TWI563133B (enrdf_load_stackoverflow) | 2016-12-21 |
JP2016001738A (ja) | 2016-01-07 |
JP5770905B1 (ja) | 2015-08-26 |
TW201708635A (zh) | 2017-03-01 |
JP2015199635A (ja) | 2015-11-12 |
TWI662163B (zh) | 2019-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI662163B (zh) | Free-standing gallium nitride substrate, light-emitting element, and manufacturing method thereof | |
CN105830237B (zh) | 发光元件用复合基板及其制造方法 | |
US9548418B2 (en) | Gallium nitride self-supported substrate, light-emitting device and manufacturing method therefor | |
JP6480398B2 (ja) | 多結晶窒化ガリウム自立基板及びそれを用いた発光素子 | |
US10707373B2 (en) | Polycrystalline gallium nitride self-supported substrate and light emitting element using same | |
WO2014192911A1 (ja) | 窒化ガリウム自立基板、発光素子及びそれらの製造方法 | |
CN108779578B (zh) | 包含多晶第13族元素氮化物的自立基板和使用该自立基板的发光元件 | |
CN105658849B (zh) | 氮化镓自立基板、发光元件及它们的制造方法 |