TW201626527A - 具有改良接觸引腳之平坦無引腳封裝 - Google Patents

具有改良接觸引腳之平坦無引腳封裝 Download PDF

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Publication number
TW201626527A
TW201626527A TW104138611A TW104138611A TW201626527A TW 201626527 A TW201626527 A TW 201626527A TW 104138611 A TW104138611 A TW 104138611A TW 104138611 A TW104138611 A TW 104138611A TW 201626527 A TW201626527 A TW 201626527A
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Taiwan
Prior art keywords
pins
package
lead frame
central support
support structure
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TW104138611A
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English (en)
Inventor
瑞桑 基特那諾
帕拉奇 普尼亞珀
艾克加洽 肯阿南太儂
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微晶片科技公司
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Publication of TW201626527A publication Critical patent/TW201626527A/zh

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    • H—ELECTRICITY
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    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

根據本發明之一實施例，一種用於一積體電路(IC)裝置之引腳架可包括：一中心支撐結構，用於安裝一IC晶片；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結構。該複數個接針中之每一接針可包含一微坑。

Description

具有改良接觸引腳之平坦無引腳封裝 相關專利申請案
本申請案主張於2014年11月20日提出申請之共同擁有之美國臨時專利申請案第62/082,357號之優先權，該美國臨時專利申請案特此出於所有目的以引用方式併入本文中。
本發明係關於積體電路封裝，特定而言係關於針對積體電路之所謂的平坦無引腳封裝。
平坦無引腳封裝係指具有經整合接針以用於表面安裝至一印刷電路板(PCB)的一種類型之積體電路(IC)封裝。平坦無引腳有時可被稱為微引腳架(MLF)。平坦無引腳封裝(舉例而言，包含四側平坦無引腳(QFN)及雙側平坦無引腳(DFN))提供一經囊封IC組件與一外部電路之間的實體及電連接(例如，連接至一印刷電路板(PCB))。
一般而言，用於一平坦無引腳封裝之接觸接針不延伸超出封裝之邊緣。接針通常由一單引腳架形成，該單引腳架包含用於IC之晶粒之一中心支撐結構。引腳架及IC囊封於通常由塑膠製成之一外殼中。每一引腳架可係引腳架之一矩陣之部分，該矩陣經模製以囊封數個個別IC裝置。通常，該矩陣經鋸切開以藉由切割穿過引腳架之任何接合部件而將個別IC裝置分離。鋸切或切割程序亦曝露沿著封裝之邊緣之 接觸接針。
一旦經鋸切，裸露之接觸接針可為回流焊接提供不良連接或不提供連接。接觸接針之經曝露面可不提供用以提供一可靠連接之充分可潤濕側面。回流焊接係用於將表面安裝組件附接至一PCB之一較佳方法，其意欲熔融焊料且加熱鄰接表面而不使電組件過熱，且藉此減小對該等組件之損壞之風險。
因此，改良用於一回流焊接程序(其用以將平坦無引腳封裝安裝至一外部電路)的平坦無引腳接觸接針之可潤濕表面之一程序或方法可提供一QFN或其他平坦無引腳封裝中之一IC之經改良電效能及機械效能。
根據本發明之一實施例，一種用於一積體電路(IC)裝置之引腳架可包括：一中心支撐結構，其用於安裝一IC晶片；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結構。該複數個接針中之每一接針可包含一微坑。每一接針之該微坑可毗鄰該棒條安置。在某些實施例中，該引腳架可用於一個四側平坦無引腳IC封裝。在某些實施例中，該引腳架可用於一個雙側平坦無引腳IC封裝。該引腳架可包含用於製造多個IC裝置之排列成一矩陣之大量中心支撐結構。在某些實施例中，每一微坑可自該棒條之一第一側延伸至該棒條之一第二側。每一微坑可以一方形形狀蝕刻至該等各別接針中。每一微坑可以各邊具有大約0.14mm之一長度之一方形形狀蝕刻至該等各別接針中。每一微坑可蝕刻至該各別接針之全高度之大約一半之一深度。
根據本發明之一實施例，一種用於在一平坦無引腳封裝中製造一積體電路(IC)裝置之方法可包含：將一IC晶片安裝至一引腳架之一中心支撐結構上；將該IC晶片接合至該引腳架之至少某些接針；囊封 該引腳架及該經接合IC晶片從而形成一IC封裝；及藉由在與該複數個接針之該等微坑相交之一組切割線處鋸切穿過該經囊封引腳架而切割該IC封裝使其擺脫該棒條。該引腳架可包含：一中心支撐結構；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結構。該複數個接針中之每一接針可包含一微坑。沿著該組切割線鋸切可曝露該複數個接針中之每一者之一端面且留下自該IC封裝之底部表面延伸至具有該等接針之該等經曝露端面之一側表面的該等微坑之一部分。在某些實施例中，該方法可包含：執行一隔離切割以在不將該IC封裝與該引腳架分離之情況下將該IC封裝之個別接針隔離，及在該隔離切割之後執行該等經隔離個別接針之一電路測試。某些實施例可包含使用線接合將該IC晶片接合至該複數個接針中之至少某些接針。某些實施例可包含在切割該IC封裝使其擺脫該棒條之前，電鍍包含該等微坑之該複數個接針在該IC封裝之一底部表面上經曝露之部分。
根據本發明之另一實施例，一種用於將一平坦無引腳封裝中之一積體電路(IC)裝置安裝至一印刷電路板(PCB)上之方法可包含：將一IC晶片安裝至一引腳架之一中心支撐結構上；將該IC晶片接合至該複數個接針中之至少某些接針；囊封該引腳架及該經接合IC晶片從而形成一IC封裝；藉由在與該複數個接針之該等微坑相交之一組切割線處鋸切穿過該經囊封引腳架而切割該IC封裝使其擺脫該棒條；及使用一回流焊接方法將該平坦無引腳IC封裝附接至該PCB以將該IC封裝之該複數個接針接合至該PCB上之各別接觸點。沿著該組切割線鋸切可曝露該複數個接針中之每一者之一端面且留下自該IC封裝之底部表面延伸至具有該等接針之該等經曝露端面之一側表面的該等微坑之一部分。該引腳架可包含：一中心支撐結構；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結 構。該複數個接針中之每一接針可包含一微坑。該方法之某些實施例可包含：執行一隔離切割以在不將該IC封裝與該棒條分離之情況下將該IC封裝之個別接針隔離，及在該隔離切割之後執行該等經隔離個別接針之一電路測試。該方法之某些實施例可包含使用線接合將該IC晶片接合至該複數個接針中之至少某些接針。該方法之某些實施例可提供該等接針之該經曝露表面之大約60%之內圓角高度。該方法之某些實施例可包含在切割該IC封裝使其擺脫該棒條之前，電鍍包含該等微坑之該複數個接針在該IC封裝之一底部表面上經曝露之部分。
根據本發明之某些實施例，一種在一平坦無引腳封裝中之積體電路(IC)裝置可包含：一IC晶片，其安裝至一引腳架之一中心支撐結構上且與該引腳架囊封在一起以形成具有一底部面及四個邊之一IC封裝；一組接針，其具有沿著該IC封裝之該四個邊之一下部邊緣曝露之面；及一微坑，其在該組接針之每一者中，沿著該IC封裝之該底部面之一周界安置且延伸至該組接針之該等經曝露面中。面對包含該微坑之該複數個接針中之每一者之經曝露部分的至少一底部可被電鍍。在某些實施例中，該複數個接針可以大約60%之內圓角高度附接至一印刷電路板。
10‧‧‧平坦無引腳封裝/封裝/典型四側平坦無引腳封裝/四側平坦無引腳封裝/積體電路裝置
12‧‧‧印刷電路板
14a‧‧‧接觸接針/銅接觸接針/接針
14b‧‧‧接觸接針
16‧‧‧晶粒
18‧‧‧引腳架/經囊封引腳架
20‧‧‧囊封件
20a‧‧‧焊料
20b‧‧‧經改良焊接連接
22‧‧‧底部
24‧‧‧面/經曝露面/裸銅面
26‧‧‧熱墊
28‧‧‧印刷電路板
30‧‧‧引腳
32‧‧‧銲珠
40‧‧‧引腳架矩陣/矩陣
42a‧‧‧引腳架/毗鄰引腳架
42b‧‧‧引腳架/毗鄰引腳架
42c‧‧‧引腳架
42d‧‧‧引腳架
44‧‧‧中心支撐結構
46‧‧‧接針
48‧‧‧棒條
50‧‧‧微坑
52‧‧‧底部表面/底部面
54‧‧‧經曝露面
60‧‧‧經囊封積體電路裝置/積體電路裝置/經分離積體電路裝置
62‧‧‧塑膠/塑膠模製
64‧‧‧熱墊/印刷電路板
66‧‧‧引腳
68‧‧‧銲珠
70‧‧‧鋸
w s ‧‧‧鋸切寬度
圖1係展示根據本發明之教示穿過安裝於一印刷電路板(PCB)上之一平坦無引腳封裝之一實施例之一剖面側視圖之一示意圖。
圖2A係以一側視圖與仰視圖展示一典型QFN封裝之部分之一圖像。圖2B展示沿著藉由鋸切穿過一經囊封引腳架而曝露之QFN封裝之邊緣之銅接觸接針之面之一放大視圖。
圖3係展示在一回流焊接程序未能提供至一PCB之充分機械連接及電連接之後的一典型QFN封裝之一圖像。
圖4A及圖4B係展示在一平坦無引腳封裝中併入有本發明之教示 且具有高可潤濕側面以供用於回流焊接中之一經封裝IC裝置之一部分視圖之圖像。
圖5A及圖5B係展示在藉由一回流焊接程序安裝至一PCB之後的一典型QFN封裝之一等角視圖之圖式。
圖6A及圖6B係展示包含可用以實踐本發明之教示之多個引腳架之一引腳架矩陣之圖式。
圖7A及圖7B係展示併入有本發明之教示之兩個毗鄰引腳架之複數個接針之一部分之圖式。
圖8A至圖8D展示併入有本發明之教示的可用以實踐本發明之教示之微坑及接針之各種實施例。
圖9A及圖9B係展示併入有本發明之教示之一經囊封IC裝置之一等角視圖之圖式。
圖10A及圖10B係展示根據本發明之教示以塑膠囊封且藉由一回流焊接程序附接至一PCB之IC裝置之一等角視圖之圖式。
圖11係圖解說明用於在併入有本發明之教示之一平坦無引腳封裝中製造一IC裝置之一實例性方法之一流程圖。
圖12圖解說明可用以實踐本發明之教示之一實例性程序。
圖1係一側視圖，其展示穿過經安裝於一印刷電路板(PCB)12上之一平坦無引腳封裝10之一剖視圖。封裝10包含接觸接針14a、14b，晶粒16，引腳架18及囊封件20。晶粒16可包含任何積體電路，無論其被稱為一IC、一晶片及/或一微晶片。晶粒16可包含經安置於半導體材料(諸如矽)之一基板上之一組電子電路。
如圖1中所展示，接觸接針14a係其中焊料20a未保持被附接至接觸接針14a之經曝露面之一失敗之回流程序的原因；藉由鋸切封裝10使其擺脫一引腳架矩陣(圖6中更詳細地展示，且在下文論述)而形成 之接觸接針14a之裸露的銅面可促成此等失敗。相比而言，接觸接針14b展示藉由一成功之回流程序形成之一經改良焊接連接20b。此經改良連接提供電連通及機械支撐兩者。接觸接針14b的面可能在回流程序之前已被電鍍(例如，藉助鍍錫)。
圖2A係以一側視圖與仰視圖展示一典型QFN封裝10之部分之一圖像。圖2B展示沿著藉由鋸切穿過經囊封引腳架18而曝露之QFN封裝10之邊緣之銅接觸接針14a之面24之一放大視圖。如圖2A中所展示，接觸接針14a之底部22被電鍍(例如，藉助鍍錫)，但經曝露面24係裸銅。
圖3係在一回流焊接程序未能提供至一PCB 12之充分機械連接及電連接之後之一典型QFN封裝10之一圖像。如圖3中所展示，接觸接針14a之裸銅面24在回流焊接之後可提供不良連接或不提供連接。接觸接針14a之經曝露面24可不提供用以提供一可靠連接的充分可潤濕側面。
圖4A及圖4B係展示在鋸切穿過經囊封引腳架18之後之一典型QFN封裝10之一等角視圖的圖式。每一接觸接針14a之底部22皆被電鍍(例如，藉助鍍錫)，但每一接觸接針之經曝露面24由於鋸切程序所致未被電鍍。在諸多QFN封裝10中，存在一額外經電鍍中心表面，諸如熱墊26。
圖5A及圖5B係展示在藉由一回流焊接程序安裝至一PCB 28之後之一典型QFN封裝10之一等角視圖的圖式。PCB包含藉由銲珠32機械連接且電連接至接觸接針14a的引腳30。如圖5A及圖5B中所展示，銲珠32僅覆蓋經曝露面24的一小部分。如上文所論述，此可係由於接針14a之不充分的可潤濕側面。
圖6A及圖6B係展示包含可用以實踐本發明之教示之多個引腳架42a、42b、42c、42d之一引腳架矩陣40的圖式。如所展示，每一引腳架42可包含一中心支撐結構44、自該中心支撐結構延伸之複數個接針 46，及連接該複數個接針且遠離該中心支撐結構之一或多個棒條48。引腳架42可包含一金屬結構，該金屬結構提供透過接針46與安裝至中心支撐結構44之一IC裝置(圖6A及圖6B中未展示)進行之電連通並且為該IC裝置提供機械支撐。在某些應用中，一IC裝置可經膠合至中心支撐結構44。在某些實施例中，IC裝置可被稱為一晶粒。在某些實施例中，晶粒或IC裝置上之墊或接觸點可藉由接合(例如，線接合、球形接合、楔形接合、柔性接合、熱音波接合或任何其他適當接合技術)連接至各別接針。在某些實施例中，引腳架42可藉由蝕刻或衝壓來製造。
圖7A及圖7B係展示兩個毗鄰引腳架42a、42b之該複數個接針46之一部分的圖式。如圖7A及圖7B中所展示，接針46可各自包含一微坑50。在本發明之某些實施例中，微坑50可經蝕刻至接針46中。在圖7A及圖7B之實施例中，微坑50可係一邊具有大約0.14mm之長度的方形，且微坑50係安置於棒條48之相對側上。在某些實施例中，兩個相對微坑50可經安置，使得中心距棒條48之邊緣間隔大約0.075mm。在某些實施例中，相對微坑50之中心可經安置成隔開大約0.3mm。圖8A至圖8D展示可用以實踐本發明之教示之微坑50及接針44的各種實施例。
圖9A及圖9B係展示以塑膠62封裝且併入有本發明之教示之一經囊封IC裝置60之一等角視圖的圖式。接針46之底部表面52及熱墊64已經電鍍有錫以產生呈一平坦無引腳封裝之一IC裝置60，該封裝具有高可潤濕側面以供在回流焊接中使用，從而提供一經改良焊接連接，諸如圖1中所展示之接觸接針14b處的焊接連接。如所展示，IC裝置60可包括一四側平坦無引腳封裝。在其他實施例中，IC裝置60可包括一個雙側平坦無引腳封裝，或其中引腳並不大大延伸超出封裝之邊緣且經構形以將IC表面安裝至一PCB的任何其他封裝(例如，任何微引腳架(MLT))。
如圖9A及圖9B中所展示，微坑50連同接針46之底部表面52一起被電鍍。儘管接針46之經曝露面54可包含某種裸銅，但微坑50在IC裝置60之邊上提供一經電鍍表面。微坑50之經電鍍表面提供增加之可潤濕側面且因此可在IC裝置60與一PCB之間提供經改良電連接及/或機械連接。在替代實施例中，可能根本不電鍍微坑50及/或底部表面52。在此等實施例中，微坑50之實體形狀可允許焊料流至微坑50中且甚至不存在電鍍之情況下改良連接。
圖10A及圖10B係展示以塑膠62囊封且藉由一回流焊接程序附接至一PCB 64之IC裝置60之一等角視圖之圖式。如圖10A及圖10B中所展示，IC裝置60之接針46藉由銲珠68連接至PCB 64上之引腳66。與圖5B中所展示之IC裝置10相比而言，銲珠68沿著接針46之經曝露面54向上延伸。銲珠68沿著經曝露面54向上之較大實體程度可在IC裝置60與PCB 64之間提供經改良機械連接及/或電連接。
圖11係圖解說明用於在併入有本發明之教示之一平坦無引腳封裝中製造一IC裝置之一實例性方法100之一流程圖。方法100可提供用於將IC裝置安裝至一PCB之經改良連接。
步驟102可包含背面研磨已經在其上產生一IC裝置之一半導體晶圓。典型之半導體或IC製造可使用大約750μm厚之晶圓。此厚度可在高溫處理期間提供抵抗翹曲的穩定性。相比而言，一旦完成IC裝置，大約50μm至75μm之一厚度可係較佳的。背面研磨(亦稱為背面精磨(backlap)或晶圓薄化)可自與IC裝置相對之晶圓之側移除材料。
步驟104可包含鋸切及/或切割晶圓，以將一IC晶片與經形成於同一晶圓上之其他組件分離。
步驟106可包含將IC晶片(或晶粒)安裝於一引腳架之一中心支撐結構上。該IC晶粒可藉由膠合或任何其他適當方法由中心支撐結構附接。
在步驟108處，IC晶粒可經連接至個別接針且自引腳架之中心支撐結構延伸。在某些實施例中，晶粒或IC裝置上之墊及/或接觸點可藉由接合(例如，線接合、球形接合、楔形接合、柔性接合、熱音波接合或任何其他適當接合技術)來連接至各別接針。
在步驟110處，IC裝置及引腳架可經囊封以形成一總成。在某些實施例中，此包含模製至一塑膠殼中。若使用一塑膠模製，則可跟隨一後模製固化步驟，以使外殼硬化及/或凝固。
步驟112可包含一化學去毛刺及一電鍍程序，以覆蓋連接接針之經曝露底部區域。如上文所論述，電鍍之步驟可以不被併入於本發明之所有實施例中。在包含電鍍之實施例中，亦可電鍍接針中之微坑。
步驟114可包含執行一隔離切割。隔離切割可包含鋸切穿過每一封裝之接針，以將該等接針彼此電隔離。
一旦完成隔離切割，步驟116可包含IC裝置之一測試及標記。可藉由更改各種步驟之次序、添加步驟及/或消除步驟來改變方法100。舉例而言，可在不執行IC裝置之一隔離切割及/或測試的情況下，根據本發明之教示來產生平坦無引腳IC封裝。一般技術者將能夠在不背離本發明之範疇或意圖的情況下，使用此等教示來開發替代方法。
步驟118可包含一單粒化切割，以在其中引腳架42係引腳架42a、42b等之一矩陣40之部分的實施例中，將IC裝置與棒條、引腳架及/或其他附近IC裝置分離。單粒化切割可穿過引腳架42之接針46的微坑50來進行。
圖12圖解說明可用於步驟118處之一單粒化切割之一項實施例之一程序。圖12係展示沿著以塑膠模製62囊封之棒條48切割穿過接針46之鋸70之等角視圖之一示意性圖式。在步驟116中的任何測試及/或標記之後，穿過全封裝進行寬度w f之一單粒化切割，如圖11中所展示。鋸切寬度w s足夠寬以與微坑50相交，但並非如此寬以致完全消除微坑 50。因此，在完成單粒化切割之後，微坑50之剩餘部分將自如圖9A及圖9B中所展示之接針46的底部面52延伸至經曝露面54。
步驟120可包含將經分離IC裝置60(在其封裝中)附接至一PCB 64或其他安裝裝置。在某些實施例中，IC裝置可使用一回流焊接程序附接至一PCB。圖10A及圖10B展示已安裝於一印刷電路板上且藉由一回流焊接程序附接之一IC裝置之接針區域之一等角視圖。本發明提供之微坑50可將可潤濕側面或內圓角高度增加至60%且滿足(舉例而言)汽車消費者要求。因此，根據本發明之各種教示，可改良一平坦無引腳裝置之「可潤濕側面」且藉由一回流焊接程序製作之每一焊接接點可在視覺及/或效能測試期間提供經改良效能及/或增加之接收率。
相比而言，用於一平坦無引腳積體電路封裝之一習用製造程序針對一回流焊接程序可使接針連接不具有充分可潤濕表面。即便在將封裝與引腳架或矩陣分離之前經曝露接針被電鍍，一典型程序中所使用之最後之鋸切步驟亦僅留下接針之經曝露面上之裸銅。
10‧‧‧平坦無引腳封裝/封裝/典型四側平坦無引腳封裝/四側平坦無引腳封裝/積體電路裝置
12‧‧‧印刷電路板
14a‧‧‧接觸接針/銅接觸接針/接針
14b‧‧‧接觸接針
16‧‧‧晶粒
18‧‧‧引腳架/經囊封引腳架
20‧‧‧囊封件
20a‧‧‧焊料
20b‧‧‧經改良焊接連接

Claims (20)

  1. 一種用於一積體電路(IC)裝置之引腳架，該引腳架包括：一中心支撐結構，用於安裝一IC晶片；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結構；其中該複數個接針中之每一接針包含一微坑。
  2. 如請求項1之引腳架，進一步包括毗鄰該棒條安置之每一接針之該微坑。
  3. 如請求項1之引腳架，其中該引腳架係用於一個四側平坦無引腳IC封裝。
  4. 如請求項1之引腳架，其中該引腳架係用於一個雙側平坦無引腳IC封裝。
  5. 如請求項1之引腳架，其中該引腳架包含用於製造多個IC裝置之經排列成一矩陣的大量中心支撐結構。
  6. 如請求項1之引腳架，其中該引腳架包含用於製造多個IC裝置之經排列成一矩陣的大量中心支撐結構；且其中每一微坑自該棒條之一第一側延伸至該棒條之一第二側。
  7. 如請求項1之引腳架，其中每一微坑係以一方形形狀蝕刻至該等各別接針中。
  8. 如請求項1之引腳架，其中每一微坑係以各邊具有大約0.14mm之一長度之一方形形狀蝕刻至該等各別接針中。
  9. 如請求項1之引腳架，其中每一微坑經蝕刻至該各別接針之全高度之大約一半之一深度。
  10. 一種用於在一平坦無引腳封裝中製造一積體電路(IC)裝置之方 法，該方法包括：將一IC晶片安裝至一引腳架之一中心支撐結構上，該引腳架包含：該中心支撐結構；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結構；其中該複數個接針中之每一接針包含一微坑；將該IC晶片接合至該複數個接針中之至少某些接針；囊封該引腳架及該經接合IC晶片，從而形成一IC封裝；及藉由在與該複數個接針之該等微坑相交之一組切割線處鋸切穿過該經囊封引腳架來切割該IC封裝使其擺脫該棒條，從而曝露該複數個接針中之每一者之一端面，且留下自該IC封裝之底部表面延伸至具有該等接針之該等經曝露端面之一側表面之該等微坑的一部分。
  11. 如請求項10之方法，進一步包括：執行一隔離切割，以在不將該IC封裝與該引腳架分離的情況下，將該IC封裝之個別接針隔離；及在該隔離切割之後，執行該等經隔離個別接針之一電路測試。
  12. 如請求項10之方法，進一步包括使用線接合將該IC晶片接合至該複數個接針中之至少某些接針。
  13. 如請求項10之方法，進一步包括在切割該IC封裝使其擺脫該棒條之前，電鍍包含該等微坑之該複數個接針於該IC封裝之一底部表面上經曝露的部分。
  14. 一種用於將一平坦無引腳封裝中之一積體電路(IC)裝置安裝至一印刷電路板(PCB)上之方法，該方法包括： 將一IC晶片安裝至一引腳架之一中心支撐結構上，該引腳架包含：該中心支撐結構；複數個接針，其自該中心支撐結構延伸；及一棒條，其連接該複數個接針且遠離該中心支撐結構；其中該複數個接針中之每一接針包含一微坑；將該IC晶片接合至該複數個接針中之至少某些接針；囊封該引腳架及該經接合IC晶片從而形成一IC封裝；及藉由在與該複數個接針之該等微坑相交之一組切割線處鋸切穿過該經囊封引腳架來切割該IC封裝使其擺脫該棒條，從而曝露該複數個接針中之每一者之一端面，且留下自該IC封裝之底部表面延伸至具有該等接針之該等經曝露端面之一側表面之該等微坑的一部分；及使用一回流焊接方法來將該平坦無引腳IC封裝附接至該PCB，以將該IC封裝之該複數個接針接合至該PCB上之各別接觸點。
  15. 如請求項14之方法，進一步包括：執行一隔離切割，以在不將該IC封裝與該棒條分離的情況下，將該IC封裝之個別接針隔離；及在該隔離切割之後，執行該等經隔離個別接針之一電路測試。
  16. 如請求項14之方法，進一步包括使用線接合將該IC晶片接合至該複數個接針中之至少某些接針。
  17. 如請求項14之方法，其中該回流焊接程序提供該等接針之該經曝露表面之大約60%的內圓角高度。
  18. 如請求項14之方法，進一步包括在切割該IC封裝使其擺脫該棒條之前，電鍍包含該等微坑之該複數個接針於該IC封裝之一底 部表面上經曝露的部分。
  19. 一種在一平坦無引腳封裝中之積體電路(IC)裝置，其包括：一IC晶片，其經安裝至一引腳架之一中心支撐結構上且與該引腳架囊封在一起，以形成具有一底部面及四個邊之一IC封裝；一組接針，其具有沿著該IC封裝之該四個邊之一下部邊緣曝露的面；及一微坑，其在該組接針之每一者中，係沿著該IC封裝之該底部面之一周界安置且延伸至該組接針之該等經曝露面中；其中面對包含該微坑之該複數個接針中之每一者之經曝露部分的至少一底部經電鍍。
  20. 如請求項19之IC裝置，其中該複數個接針係以大約60%之內圓角高度附接至一印刷電路板。
TW104138611A 2014-11-20 2015-11-20 具有改良接觸引腳之平坦無引腳封裝 TW201626527A (zh)

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