TW201614396A - Developing apparatus - Google Patents

Developing apparatus

Info

Publication number
TW201614396A
TW201614396A TW104123483A TW104123483A TW201614396A TW 201614396 A TW201614396 A TW 201614396A TW 104123483 A TW104123483 A TW 104123483A TW 104123483 A TW104123483 A TW 104123483A TW 201614396 A TW201614396 A TW 201614396A
Authority
TW
Taiwan
Prior art keywords
developing solution
substrate
solution nozzle
cup module
developing
Prior art date
Application number
TW104123483A
Other languages
English (en)
Other versions
TWI618991B (zh
Inventor
Masahiro Fukuda
Taro Yamamoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201614396A publication Critical patent/TW201614396A/zh
Application granted granted Critical
Publication of TWI618991B publication Critical patent/TWI618991B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
TW104123483A 2014-07-23 2015-07-21 顯影裝置 TWI618991B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-150169 2014-07-23
JP2014150169 2014-07-23
JP2015-098358 2015-05-13
JP2015098358A JP6447354B2 (ja) 2014-07-23 2015-05-13 現像装置

Publications (2)

Publication Number Publication Date
TW201614396A true TW201614396A (en) 2016-04-16
TWI618991B TWI618991B (zh) 2018-03-21

Family

ID=55166676

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104123483A TWI618991B (zh) 2014-07-23 2015-07-21 顯影裝置

Country Status (5)

Country Link
US (1) US9625821B2 (zh)
JP (1) JP6447354B2 (zh)
KR (1) KR102232635B1 (zh)
CN (1) CN105319873B (zh)
TW (1) TWI618991B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6752081B2 (ja) 2016-08-12 2020-09-09 東京エレクトロン株式会社 接液ノズルの洗浄方法及び洗浄装置
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置
US10929765B2 (en) 2016-12-15 2021-02-23 Nec Corporation Content-level anomaly detection for heterogeneous logs
JP6798390B2 (ja) * 2017-03-30 2020-12-09 東京エレクトロン株式会社 現像方法、現像装置及び記憶媒体
KR102000019B1 (ko) * 2017-04-28 2019-07-18 세메스 주식회사 액 공급 유닛, 기판 처리 장치, 기판 처리 방법
KR102435194B1 (ko) 2017-11-17 2022-08-24 삼성디스플레이 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2843134B2 (ja) * 1990-09-07 1999-01-06 東京エレクトロン株式会社 塗布装置および塗布方法
JP3530639B2 (ja) * 1995-08-04 2004-05-24 オリンパス株式会社 精密洗浄方法
JPH1041267A (ja) * 1996-07-19 1998-02-13 Kaijo Corp 基板の洗浄・乾燥装置
JP3566475B2 (ja) * 1996-12-03 2004-09-15 東京エレクトロン株式会社 処理装置
JP3445937B2 (ja) * 1998-06-24 2003-09-16 東京エレクトロン株式会社 多段スピン型基板処理システム
JP3912920B2 (ja) * 1998-12-10 2007-05-09 大日本スクリーン製造株式会社 現像装置
JP3652559B2 (ja) * 1999-08-20 2005-05-25 東京エレクトロン株式会社 液処理装置及びその方法
JP3813887B2 (ja) * 2002-03-01 2006-08-23 東京エレクトロン株式会社 現像処理方法及び現像処理装置
US6955485B2 (en) * 2002-03-01 2005-10-18 Tokyo Electron Limited Developing method and developing unit
JP4369325B2 (ja) * 2003-12-26 2009-11-18 東京エレクトロン株式会社 現像装置及び現像処理方法
JP4343050B2 (ja) * 2004-07-15 2009-10-14 東京エレクトロン株式会社 現像処理装置及びその方法
JP2008041722A (ja) * 2006-08-02 2008-02-21 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4900117B2 (ja) * 2007-07-30 2012-03-21 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP5442969B2 (ja) * 2008-07-28 2014-03-19 株式会社Ｓｏｋｕｄｏ 基板処理ユニット、基板処理装置およびノズルの位置制御方法
JP4893799B2 (ja) 2009-10-23 2012-03-07 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP5454407B2 (ja) * 2010-07-23 2014-03-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5698487B2 (ja) * 2010-09-29 2015-04-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP5293790B2 (ja) * 2011-09-22 2013-09-18 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5104994B2 (ja) * 2011-12-21 2012-12-19 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
TWI544291B (zh) * 2012-05-22 2016-08-01 斯克林半導體科技有限公司 顯像處理裝置
JP5841493B2 (ja) * 2012-05-22 2016-01-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 現像処理装置

Also Published As

Publication number Publication date
US20160026086A1 (en) 2016-01-28
KR102232635B1 (ko) 2021-03-25
JP2016029703A (ja) 2016-03-03
TWI618991B (zh) 2018-03-21
CN105319873B (zh) 2020-02-11
US9625821B2 (en) 2017-04-18
KR20160012076A (ko) 2016-02-02
CN105319873A (zh) 2016-02-10
JP6447354B2 (ja) 2019-01-09

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