TW201530641A - 半導體晶圓的製造方法 - Google Patents

半導體晶圓的製造方法 Download PDF

Info

Publication number
TW201530641A
TW201530641A TW103134433A TW103134433A TW201530641A TW 201530641 A TW201530641 A TW 201530641A TW 103134433 A TW103134433 A TW 103134433A TW 103134433 A TW103134433 A TW 103134433A TW 201530641 A TW201530641 A TW 201530641A
Authority
TW
Taiwan
Prior art keywords
wafer
grinding
steel wire
abrasive grains
semiconductor wafer
Prior art date
Application number
TW103134433A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Kobayashi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of TW201530641A publication Critical patent/TW201530641A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
TW103134433A 2013-10-22 2014-10-02 半導體晶圓的製造方法 TW201530641A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013218853A JP6079554B2 (ja) 2013-10-22 2013-10-22 半導体ウェーハの製造方法

Publications (1)

Publication Number Publication Date
TW201530641A true TW201530641A (zh) 2015-08-01

Family

ID=52992491

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134433A TW201530641A (zh) 2013-10-22 2014-10-02 半導體晶圓的製造方法

Country Status (3)

Country Link
JP (1) JP6079554B2 (ja)
TW (1) TW201530641A (ja)
WO (1) WO2015059868A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109129028A (zh) * 2017-06-15 2019-01-04 北京天科合达半导体股份有限公司 一种高效的碳化硅晶片的加工方法
TWI685030B (zh) * 2015-08-07 2020-02-11 日商信越半導體股份有限公司 半導體晶圓的製造方法
TWI769677B (zh) * 2021-01-25 2022-07-01 華矽創新股份有限公司 半導體晶圓之製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108714978B (zh) * 2018-07-05 2024-01-09 青岛高测科技股份有限公司 一种晶硅切棱磨倒一体机
CN110154256A (zh) * 2019-07-03 2019-08-23 青岛高测科技股份有限公司 一种切方切棱磨抛一体机
CN112428463B (zh) * 2020-11-19 2022-01-07 上海中欣晶圆半导体科技有限公司 一种晶棒线切割加工过程中断线复旧的方法
JP7072180B1 (ja) * 2021-12-20 2022-05-20 有限会社サクセス 半導体結晶ウェハの製造方法および製造装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001054850A (ja) * 1999-08-11 2001-02-27 Osaka Diamond Ind Co Ltd 固定砥粒ワイヤーソーによる硬脆材料の切断加工法
JP2002124490A (ja) * 2000-08-03 2002-04-26 Sumitomo Metal Ind Ltd 半導体ウェーハの製造方法
JP2008161992A (ja) * 2006-12-28 2008-07-17 Asahi Diamond Industrial Co Ltd 被加工部材の切断方法およびウェハの製造方法
JP2013082020A (ja) * 2011-10-06 2013-05-09 Sharp Corp ワーク切断方法、半導体基板の製造方法、半導体基板およびワイヤソー装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685030B (zh) * 2015-08-07 2020-02-11 日商信越半導體股份有限公司 半導體晶圓的製造方法
CN109129028A (zh) * 2017-06-15 2019-01-04 北京天科合达半导体股份有限公司 一种高效的碳化硅晶片的加工方法
TWI769677B (zh) * 2021-01-25 2022-07-01 華矽創新股份有限公司 半導體晶圓之製造方法

Also Published As

Publication number Publication date
JP6079554B2 (ja) 2017-02-15
JP2015082539A (ja) 2015-04-27
WO2015059868A1 (ja) 2015-04-30

Similar Documents

Publication Publication Date Title
TW201530641A (zh) 半導體晶圓的製造方法
TWI494981B (zh) 改進的微研磨方法
US7250368B2 (en) Semiconductor wafer manufacturing method and wafer
JP5494552B2 (ja) 両頭研削方法及び両頭研削装置
JP5538253B2 (ja) 半導体ウェハの製造方法
CN1265439C (zh) 具有改良局部平整度的半导体晶片及其制造方法
US20090311863A1 (en) Method for producing semiconductor wafer
US20120315739A1 (en) Manufacturing method for semiconductor wafer
TWI610358B (zh) 鏡面硏磨晶圓的製造方法
JP2009302409A (ja) 半導体ウェーハの製造方法
US20090311949A1 (en) Method for producing semiconductor wafer
JP2011077413A (ja) シリコンウェハーの製造方法
JP2014083611A (ja) 砥石およびそれを用いた研削・研磨装置
JP2016139751A (ja) サファイア基板の研磨方法及び得られるサファイア基板
JP2012094559A (ja) 硬脆性ウェーハの平坦化加工方法および平坦化加工用パッド
JP2010021394A (ja) 半導体ウェーハの製造方法
TWI427690B (zh) 雙面化學研磨半導體晶圓的方法
KR102098260B1 (ko) 워크의 양두연삭방법
KR20150073214A (ko) 연마물의 제조 방법
WO2018193758A1 (ja) ウェーハの両面研磨方法および両面研磨装置
JP7168113B1 (ja) ウェーハの両面研磨方法
JP7285507B1 (ja) 半導体結晶ウェハの研削加工方法
JP2010153844A (ja) 活性層用ウェーハの製造方法
JP2018148042A (ja) ウェーハの製造方法
JP2023091249A (ja) 半導体結晶ウェハの製造方法および製造装置