CN109129028A - 一种高效的碳化硅晶片的加工方法 - Google Patents
一种高效的碳化硅晶片的加工方法 Download PDFInfo
- Publication number
- CN109129028A CN109129028A CN201710450127.7A CN201710450127A CN109129028A CN 109129028 A CN109129028 A CN 109129028A CN 201710450127 A CN201710450127 A CN 201710450127A CN 109129028 A CN109129028 A CN 109129028A
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- CN
- China
- Prior art keywords
- polishing
- processing method
- silicon carbide
- skive
- wafer
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201710450127.7A CN109129028B (zh) | 2017-06-15 | 2017-06-15 | 一种高效的碳化硅晶片的加工方法 |
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CN201710450127.7A CN109129028B (zh) | 2017-06-15 | 2017-06-15 | 一种高效的碳化硅晶片的加工方法 |
Publications (2)
Publication Number | Publication Date |
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CN109129028A true CN109129028A (zh) | 2019-01-04 |
CN109129028B CN109129028B (zh) | 2021-11-12 |
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CN201710450127.7A Active CN109129028B (zh) | 2017-06-15 | 2017-06-15 | 一种高效的碳化硅晶片的加工方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111515792A (zh) * | 2020-04-28 | 2020-08-11 | 福建晶安光电有限公司 | 一种适合石墨烯生长的衬底材料及其制作方法 |
CN113182938A (zh) * | 2021-03-01 | 2021-07-30 | 燕山大学 | 金刚石复相材料表面的加工方法 |
CN113601376A (zh) * | 2021-08-10 | 2021-11-05 | 山西烁科晶体有限公司 | 碳化硅双面抛光中单面抛光速率的测定方法 |
CN115338694A (zh) * | 2022-07-01 | 2022-11-15 | 金华博蓝特新材料有限公司 | 一种双面抛光晶片的加工方法 |
CN116435175A (zh) * | 2023-05-19 | 2023-07-14 | 河北同光半导体股份有限公司 | 一种应用于碳化硅单晶衬底的加工方法 |
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CN106378671A (zh) * | 2016-12-08 | 2017-02-08 | 中国电子科技集团公司第四十六研究所 | 一种大尺寸的CdS单晶片的减薄工艺 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111515792A (zh) * | 2020-04-28 | 2020-08-11 | 福建晶安光电有限公司 | 一种适合石墨烯生长的衬底材料及其制作方法 |
CN113182938A (zh) * | 2021-03-01 | 2021-07-30 | 燕山大学 | 金刚石复相材料表面的加工方法 |
CN113601376A (zh) * | 2021-08-10 | 2021-11-05 | 山西烁科晶体有限公司 | 碳化硅双面抛光中单面抛光速率的测定方法 |
CN115338694A (zh) * | 2022-07-01 | 2022-11-15 | 金华博蓝特新材料有限公司 | 一种双面抛光晶片的加工方法 |
CN115338694B (zh) * | 2022-07-01 | 2024-02-02 | 金华博蓝特新材料有限公司 | 一种双面抛光晶片的加工方法 |
CN116435175A (zh) * | 2023-05-19 | 2023-07-14 | 河北同光半导体股份有限公司 | 一种应用于碳化硅单晶衬底的加工方法 |
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Application publication date: 20190104 Assignee: Shenzhen Reinvested Tianke Semiconductor Co.,Ltd. Assignor: TANKEBLUE SEMICONDUCTOR Co.,Ltd.|BEIJING TIANKE HEDA NEW MATERIAL CO.,LTD.|XINJIANG TANKEBLUE SEMICONDUCTOR Co.,Ltd. Contract record no.: X2023990000677 Denomination of invention: An Efficient Processing Method for Silicon Carbide Wafers Granted publication date: 20211112 License type: Common License Record date: 20230725 |
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