TW201518059A - 具有改良的環氧數脂封膠材料的模具 - Google Patents
具有改良的環氧數脂封膠材料的模具 Download PDFInfo
- Publication number
- TW201518059A TW201518059A TW103123091A TW103123091A TW201518059A TW 201518059 A TW201518059 A TW 201518059A TW 103123091 A TW103123091 A TW 103123091A TW 103123091 A TW103123091 A TW 103123091A TW 201518059 A TW201518059 A TW 201518059A
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- resin
- cavity
- resistant member
- resin pressure
- Prior art date
Links
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130079056A KR20150005290A (ko) | 2013-07-05 | 2013-07-05 | Emc 플로우를 개선한 몰드 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201518059A true TW201518059A (zh) | 2015-05-16 |
Family
ID=52436960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103123091A TW201518059A (zh) | 2013-07-05 | 2014-07-04 | 具有改良的環氧數脂封膠材料的模具 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015015473A (ko) |
KR (1) | KR20150005290A (ko) |
TW (1) | TW201518059A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111452305B (zh) * | 2020-05-29 | 2022-02-11 | 江苏华海诚科新材料股份有限公司 | 一种环氧模塑料大颗粒试验模具及其试验方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290633A (ja) * | 1988-09-28 | 1990-03-30 | Nec Corp | 半導体装置用樹脂封止金型 |
JP2614031B2 (ja) * | 1995-04-20 | 1997-05-28 | 九州日本電気株式会社 | 半導体チップの樹脂封止金型 |
JP2005310831A (ja) * | 2004-04-16 | 2005-11-04 | Nec Electronics Corp | 樹脂封止装置 |
JP2012138517A (ja) * | 2010-12-27 | 2012-07-19 | Toyota Motor Corp | 半導体装置の製造装置 |
JP5328837B2 (ja) * | 2011-05-19 | 2013-10-30 | 力成科技股▲分▼有限公司 | 非アレイバンプのフリップチップモールドの構造体 |
-
2013
- 2013-07-05 KR KR20130079056A patent/KR20150005290A/ko not_active Application Discontinuation
-
2014
- 2014-07-04 TW TW103123091A patent/TW201518059A/zh unknown
- 2014-07-07 JP JP2014139382A patent/JP2015015473A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20150005290A (ko) | 2015-01-14 |
JP2015015473A (ja) | 2015-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20150126360A (ko) | 수지 몰드 금형, 수지 몰드 장치, 수지 몰드 방법, 및 수지 몰드 금형의 평가 방법 | |
JP2008004570A (ja) | 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置の製造装置、および樹脂封止型半導体装置 | |
JP2000208540A (ja) | 薄型半導体チップスケ―ル・パッケ―ジを密封する方法 | |
JPH0336741A (ja) | 樹脂封止タイプの半導体デバイス用樹脂封止装置 | |
CN102856217A (zh) | 用于模塑半导体器件的装置和方法 | |
TWI256117B (en) | Resin-sealed semiconductor device and method of manufacturing the same | |
JP2006324401A5 (ko) | ||
TW201518059A (zh) | 具有改良的環氧數脂封膠材料的模具 | |
JP2009152507A (ja) | 樹脂封止金型および半導体パッケージの樹脂封止成形方法 | |
JP2003007951A (ja) | リードフレームおよび樹脂封止型半導体装置の製造方法 | |
CN108198769B (zh) | 电子元器件制造设备 | |
JP5148445B2 (ja) | 半導体装置の製造方法及び半導体装置の製造装置 | |
KR102407742B1 (ko) | 수지 성형된 리드 프레임의 제조 방법, 수지 성형품의 제조 방법 및 리드 프레임 | |
KR100608356B1 (ko) | 반도체 칩 패키지 몰딩 방법 | |
KR100251863B1 (ko) | 반도체패키지 제조용 쓰루게이트금형의 구조 및 이를 이용한 반도체패키지의 제조 방법 | |
JPH04132234A (ja) | 樹脂封止型半導体集積回路の樹脂封止装置 | |
JPH0936157A (ja) | 半導体パッケージの成形装置および成形方法 | |
KR102071561B1 (ko) | 반도체 패키지용 몰딩 장치 | |
CN110544637B (zh) | 一种半导体器件模封方法及用于该模封方法的封装模具 | |
CN209691721U (zh) | 半导体封装模具及半导体元件 | |
JPS60182142A (ja) | 半導体装置の樹脂封止用金型 | |
KR101488527B1 (ko) | 반도체 디바이스 제조용 몰드를 이용한 반도체 디바이스의 제조 방법 | |
TWI420623B (zh) | 避免回包在基板條上之模封方法與模具 | |
CN207719148U (zh) | 一种智能芯片组合模块半导体封装模具 | |
JPH02163953A (ja) | 半導体装置 |