TW201518059A - 具有改良的環氧數脂封膠材料的模具 - Google Patents

具有改良的環氧數脂封膠材料的模具 Download PDF

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Publication number
TW201518059A
TW201518059A TW103123091A TW103123091A TW201518059A TW 201518059 A TW201518059 A TW 201518059A TW 103123091 A TW103123091 A TW 103123091A TW 103123091 A TW103123091 A TW 103123091A TW 201518059 A TW201518059 A TW 201518059A
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TW
Taiwan
Prior art keywords
mold
resin
cavity
resistant member
resin pressure
Prior art date
Application number
TW103123091A
Other languages
English (en)
Chinese (zh)
Inventor
Ki-Chan Kim
Seok-Yoon Hong
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201518059A publication Critical patent/TW201518059A/zh

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW103123091A 2013-07-05 2014-07-04 具有改良的環氧數脂封膠材料的模具 TW201518059A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130079056A KR20150005290A (ko) 2013-07-05 2013-07-05 Emc 플로우를 개선한 몰드

Publications (1)

Publication Number Publication Date
TW201518059A true TW201518059A (zh) 2015-05-16

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ID=52436960

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103123091A TW201518059A (zh) 2013-07-05 2014-07-04 具有改良的環氧數脂封膠材料的模具

Country Status (3)

Country Link
JP (1) JP2015015473A (ko)
KR (1) KR20150005290A (ko)
TW (1) TW201518059A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111452305B (zh) * 2020-05-29 2022-02-11 江苏华海诚科新材料股份有限公司 一种环氧模塑料大颗粒试验模具及其试验方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290633A (ja) * 1988-09-28 1990-03-30 Nec Corp 半導体装置用樹脂封止金型
JP2614031B2 (ja) * 1995-04-20 1997-05-28 九州日本電気株式会社 半導体チップの樹脂封止金型
JP2005310831A (ja) * 2004-04-16 2005-11-04 Nec Electronics Corp 樹脂封止装置
JP2012138517A (ja) * 2010-12-27 2012-07-19 Toyota Motor Corp 半導体装置の製造装置
JP5328837B2 (ja) * 2011-05-19 2013-10-30 力成科技股▲分▼有限公司 非アレイバンプのフリップチップモールドの構造体

Also Published As

Publication number Publication date
KR20150005290A (ko) 2015-01-14
JP2015015473A (ja) 2015-01-22

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