TW201504205A - 固定硏磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板 - Google Patents

固定硏磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板 Download PDF

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TW201504205A
TW201504205A TW103112107A TW103112107A TW201504205A TW 201504205 A TW201504205 A TW 201504205A TW 103112107 A TW103112107 A TW 103112107A TW 103112107 A TW103112107 A TW 103112107A TW 201504205 A TW201504205 A TW 201504205A
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fixed abrasive
water
cutting fluid
soluble cutting
ingot
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Kiyofumi Suzuki
Shinya Takanashi
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Palace Chemical Co Ltd
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    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
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    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
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    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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    • C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
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    • C10M2219/00—Organic non-macromolecular compounds containing sulfur, selenium or tellurium as ingredients in lubricant compositions
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    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
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    • C10N2040/00—Specified use or application for which the lubricating composition is intended
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Abstract

本發明提供一種起泡少、切削性能高之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。 一種固定研磨粒線鋸用水溶性切削液，其含有化學式(1)表示之(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇(2,4,7,9-tetramethyl-5-decyne-4,7-diol)之伸烷基(alkylene)加成物。又，一種鑄錠之切削方法及由該切削方法所得之電子材料用基板，該鑄錠之切削方法，係使用上述固定研磨粒線鋸用水溶性切削液，藉由固定研磨粒線鋸切削鑄錠而獲得作為電子材料基板之晶圓。

Description

固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板
本發明係關於一種用以切削矽鑄錠之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。
先前以來，電子材料用基板之晶圓係藉由使用有游離研磨粒之利用帶鋸(band saw)或線鋸之切削而獲得。然而，使用有游離研磨粒之切削存在如下問題：漿料附著於經切削之晶圓，後續步驟中之洗淨負荷高，又，不易自使用液將游離研磨粒、沈澱物(sludge)、切削液分離，再利用性差。
針對該等問題，開發出利用電鍍或樹脂黏合劑將研磨粒固定於線上之固定研磨粒線鋸，具有簡化洗淨步驟、或藉由將切削液與沈澱物分離而提高再利用性之優點。作為使用該固定研磨粒線鋸切削為電子材料用基板之晶圓時所使用之切削液，提出了水或例如專利文獻1及2中之水溶性切削液。
專利文獻1：日本特開2003-82334號公報
專利文獻2：日本特開2009-57423號公報
然而，近年來，為了提高品質方面及切削速度，而使線速度逐步加快，存在如下問題：若使用如專利文獻1及2所揭示之水溶性切削液切削成為電子材料用基板之鑄錠，則所使用之水溶性切削液會起泡，而無法獲得品質良好之晶圓。
因此，本發明提供一種起泡少、切削性能高之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。
為了達成以上目的，本發明人等努力進行反覆研究，結果發現藉由使用含有(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇(2,4,7,9-tetramethyl-5-decyne-4,7-diol)之伸烷基(alkylene)加成物之水溶性切削液，即便在用於固定研磨粒線鋸時，亦可進行起泡少、切削性能高之切削，從而完成本發明。即，本發明係關於一種固定研磨粒線鋸用水溶性切削液，其特徵在於：含有下述化學式(1)表示之(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇之伸烷基加成物。
(其中，R表示分別相同或不同之碳數1~4之伸烷基，m1+m2+n1+n2表示伸烷基加成物之總加成莫耳數，為1以上之整數)
又，本發明係關於一種鑄錠之切削方法、及由該切削方法所得之電子材料用基板，該鑄錠之切削方法之特徵在於：使用上述固定研磨粒線鋸用水溶性切削液，藉由固定研磨粒線鋸切削鑄錠而獲得作為電子材料用基板之晶圓。
如上所述，根據本發明，可提供一種起泡少、切削性能高之固定研磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板。
本發明之固定研磨粒線鋸用水溶性切削液中使用之(a)成 分即2,4,7,9-四甲基-5-癸炔-4,7-二醇之伸烷基加成物具有下述化學式(1)表示之結構。
(其中，R表示分別相同或不同之碳數1~4之伸烷基，m1+m2+n1+n2表示伸烷基加成物之總加成莫耳數，為1以上之整數)
於上述化學式(1)中，作為加成於2,4,7,9-四甲基-5-癸炔-4,7-二醇上之環氧烷，只要為碳數1~4之環氧烷即可，具體而言，尤佳為環氧乙烷單體、或環氧乙烷及環氧丙烷兩者。
又，所加成之環氧烷係以無規聚合加成，因此若上述化學式(1)之4個伸烷基(-OR-)均為碳數1~4之伸烷基，則可相同或不同，較佳為4個伸烷基為乙烯單體、或乙烯及丙烯兩者中任一者，尤佳為4個伸烷基均為乙烯。
於上述化學式(1)中，伸烷基加成物之加成莫耳數以總量計為1莫耳以上，較佳為1~20莫耳，更佳為4~12莫耳。尤其是，於所加成之伸烷基加成物為環氧乙烷單體時，較佳為環氧乙烷4~12莫耳，更佳為4~8莫耳， 尤佳為4~6莫耳。又，於所加成之伸烷基加成物為環氧乙烷及環氧丙烷時，較佳為環氧乙烷4~8莫耳及環氧丙烷2~4莫耳。
(a)成分可單獨使用1種，亦可併用2種以上，作為(a)成分之添加量，相對於水溶性切削液，較佳為0.01~5.0重量%，更佳為0.05~2.0重量%。若(a)之添加量未達0.01重量%，則消泡效果小、水溶性切削液之動態表面張力較高，因此存在水溶性切削液難以進入加工部位而使切削品質惡化之傾向，若超過5.0重量%，則存在水溶性切削液難以獲得如顯示消泡效果之調配平衡之情況。
本發明之固定研磨粒線鋸用水溶性切削液，較佳為除了上述(a)成分，亦含有下述所示之(b)、(c)及(d)成分。藉由含有(b)、(c)及(d)成分，可控制固定研磨粒線與加工物之間之潤滑性，提高固定研磨粒線之工具壽命。
於本發明中，(b)成分較佳為羧酸、巰基苯并噻唑、苯并噻唑基硫代乙酸(benzothiazolylthio acetic acid)及苯并噻唑基硫代丙酸(benzothiazolylthio propionic acid)中之至少1種以上。作為羧酸，只要具有1個以上之COOH基即可，例如可列舉：辛酸、己酸、月桂酸、油酸、檸檬酸、順丁烯二酸、反丁烯二酸、己二酸、間苯二甲酸、蘋果酸、酒石酸、十二烷二酸及癸二酸等。(b)成分可單獨使用1種，亦可併用2種以上。
又，(c)成分較佳為胺、氫氧化鈉及氫氧化鉀中之至少1種以上，更佳為胺。作為胺，可列舉：單乙醇胺、二乙醇胺、三乙醇胺、單異丙醇胺、二異丙醇胺、三異丙醇胺、二環己基胺、三羥甲基丙烷聚(氧化丙烯)三胺、N,N-雙(2羥基乙基)-N-環己基胺及間二甲苯二胺 (metaxylenediamine)之伸烷基加成物等。(c)成分可單獨使用1種，亦可併用2種以上。
關於(b)成分與(c)成分，若均可溶於水，則可以任意比例含有，較佳為(c)成分為將(b)成分中和之量或為該量以上，較理想的是(b)成分與(c)成分之總和為5重量%以下。
又，(d)成分較佳為二醇、聚伸烷基二醇(polyalkylene glycol)、二醇醚、聚伸烷基二醇醚、甘油及甘油之伸烷基加成物中之至少1種以上。二醇只要具有2個OH基即可，例如可列舉：單乙二醇、二乙二醇、三乙二醇、單丙二醇、二丙二醇、三丙二醇及己二醇等，作為聚伸烷基二醇，例如可列舉：聚乙二醇、聚丙二醇、聚氧乙烯聚氧丙烯之共聚物及聚氧乙烯聚氧丁烯之共聚物。作為二醇醚，例如可列舉：二乙二醇單甲醚、二乙二醇單丁醚及二乙二醇單己醚等。作為聚氧伸烷基二醇醚，例如可列舉：聚氧乙烯單甲醚、聚氧丙烯單甲醚及聚氧乙烯聚氧丙烯共聚物之單丁醚。作為甘油之伸烷基加成物，例如可列舉：甘油之乙烯加成物、丙烯加成物及乙烯丙烯共聚合加成物。(d)成分可單獨使用1種，亦可併用2種以上。(d)成分之含量只要可溶於水即可，較佳為70重量%以下。
又，本發明之固定研磨粒線鋸用水溶性切削液，亦可視需要添加防銹劑、防腐劑、香料、染料等。
使用本發明之固定研磨粒線鋸用水溶性切削液，藉由固定研磨粒線鋸切削鑄錠，藉此可獲得品質良好之電子材料用基板。
於用於本發明之固定研磨粒線鋸中，成為母線之線可為鐵製或不鏽鋼製，亦可為經鍍銅者、經鍍鉑者。作為固著於線上之研磨粒，可 使用市售之研磨粒，較佳為金剛石、氮化硼。為了將研磨粒固著於線上，較佳為利用鎳等金屬之電鍍或使用樹脂之樹脂接著。
又，作為用於本發明之切削機，只要為市場上販售之多線鋸加工機，則並無特別限定，較佳為固定研磨粒線鋸專用多線鋸加工機。
又，作為用於本發明之鑄錠，只要為用以製造電子材料用基板之鑄錠，則並無特別限定，例如較佳為使用使矽、藍寶石、水晶、石英、碳化矽、鉭酸鋰、氮化鎵及砷化鎵等結晶成長並高純度化而成之鑄錠。
如上所述，於藉由固定研磨粒線鋸自鑄錠切削作為電子材料銅基板之晶圓時，藉由使用本發明之固定研磨粒線鋸用水溶性切削液，可使起泡少，又，可提高切削性能。
實施例
繼而，對本發明之固定研磨粒線鋸用水溶性切削液之實施例進行說明，但本發明並不限定於此。首先，依據表1及表2表示之各成分之調配量，藉由常法將該等混合，藉此獲得實施例1至實施例9之固定研磨粒線鋸用水溶性切削液、以及比較例1至比較例4之固定研磨粒線鋸用水溶性切削液。
(起泡試驗)
其次，假定切削中之起泡，將50ml之實施例1至實施例9之固定研磨粒線鋸用水溶性切削液、及比較例1至比較例4之固定研磨粒線鋸用水溶性切削液添加至有栓式100ml量筒中，塞住栓後，劇烈搖晃，確認剛搖晃後之初期起泡量及起泡消失為止之消泡時間。將其結果示於表3。再者，穩定性係於25℃靜置1週而判定，○：於1週無分離、沈澱，△：於4日以 上且未達1週發生分離、沈澱，×：於未達4日發生分離、沈澱。
根據表3可知，比較例2之切削液之穩定性較差，比較例3 及4之切削液之起泡較多，消泡時間亦超過60秒。相對於此，可知本發明之固定研磨粒線鋸用水溶性切削液之起泡較少，較良好。再者，穩定性較差之比較例2中，已分離之(a)成分會附著於裝置、配管內而引起污染，或者因自切削液去除(a)成分而使切削品質惡化，從而難以用作切削液。
(切削試驗)
其次，使用實施例1至實施例9之固定研磨粒線鋸用水溶性切削液、以及比較例1至比較例4之固定研磨粒線鋸用水溶性切削液，於表4之條件進行切削試驗，測定經切削之晶圓之剖面曲線的最底部高度(PV)。將結果示於表5。
根據表5可知，比較例1及2之切削液無法切削鑄錠，比較例3及4之切削液的PV值較大，無法形成良好剖面。相對於此，可知本實施例之固定研磨粒線鋸用水溶性切削液之PV值較小，切削性能良好。

Claims (7)

  1. 一種固定研磨粒線鋸用水溶性切削液，含有下述化學式(1)表示之(a)2,4,7,9-四甲基-5-癸炔-4,7-二醇(2,4,7,9-tetramethyl-5-decyne-4,7-diol)之伸烷基(alkylene)加成物， (其中，R表示分別相同或不同之碳數1~4之伸烷基，m1+m2+n1+n2表示伸烷基加成物之總加成莫耳數，為1以上之整數)。
  2. 如申請專利範圍第1項之固定研磨粒線鋸用水溶性切削液，其中，該(a)之伸烷基加成物之總加成莫耳數為4~12莫耳。
  3. 如申請專利範圍第1或2項之固定研磨粒線鋸用水溶性切削液，其中，該(a)之含量為0.01~5.0重量%。
  4. 如申請專利範圍第1至3項中任一項之固定研磨粒線鋸用水溶性切削液，其進而含有(b)羧酸、巰基苯并噻唑、苯并噻唑基硫代乙酸(benzothiazolylthio acetic acid)及苯并噻唑基硫代丙酸(benzothiazolylthio propionic acid)中之至少1種以上，及(c)胺、氫氧化鈉及氫氧化鉀中之至少1種以上。
  5. 如申請專利範圍第1至4項中任一項之固定研磨粒線鋸用水溶性切削 液，其進而含有(d)二醇、聚伸烷基二醇(polyalkylene glycol)、二醇醚、聚伸烷基二醇醚、甘油及甘油之伸烷基加成物中之至少1種以上。
  6. 一種鑄錠之切削方法，使用申請專利範圍第1至5項中任一項之固定研磨粒線鋸用水溶性切削液，藉由固定研磨粒線鋸切削鑄錠而獲得電子材料用基板。
  7. 一種電子材料用基板，係藉由申請專利範圍第6項之鑄錠之切削方法而獲得。
TW103112107A 2013-04-05 2014-04-01 固定硏磨粒線鋸用水溶性切削液、使用其之鑄錠的切削方法及由其所得之電子材料用基板 TWI613188B (zh)

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