MY177479A - Water-soluble cutting fluid for fixed abrasive grain wire saw, method for cutting ingot using cutting fluid, and substrate for electronic material obtained by cutting method - Google Patents

Water-soluble cutting fluid for fixed abrasive grain wire saw, method for cutting ingot using cutting fluid, and substrate for electronic material obtained by cutting method

Info

Publication number
MY177479A
MY177479A MYPI2015702982A MYPI2015702982A MY177479A MY 177479 A MY177479 A MY 177479A MY PI2015702982 A MYPI2015702982 A MY PI2015702982A MY PI2015702982 A MYPI2015702982 A MY PI2015702982A MY 177479 A MY177479 A MY 177479A
Authority
MY
Malaysia
Prior art keywords
cutting
cutting fluid
abrasive grain
wire saw
fixed abrasive
Prior art date
Application number
MYPI2015702982A
Inventor
Kiyofumi Suzuki
Shinya Takanashi
Original Assignee
Palace Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51658243&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY177479(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Palace Chemical Co Ltd filed Critical Palace Chemical Co Ltd
Publication of MY177479A publication Critical patent/MY177479A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
    • C10M2207/046—Hydroxy ethers
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/10—Carboxylix acids; Neutral salts thereof
    • C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/108—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2219/00—Organic non-macromolecular compounds containing sulfur, selenium or tellurium as ingredients in lubricant compositions
    • C10M2219/10—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring
    • C10M2219/104—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring containing sulfur and carbon with nitrogen or oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2219/00—Organic non-macromolecular compounds containing sulfur, selenium or tellurium as ingredients in lubricant compositions
    • C10M2219/10—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring
    • C10M2219/104—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring containing sulfur and carbon with nitrogen or oxygen in the ring
    • C10M2219/106—Thiadiazoles
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/02—Groups 1 or 11
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/18—Anti-foaming property
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/32—Wires, ropes or cables lubricants

Abstract

Provided are a water-soluble cutting fluid for fixed abrasive grain wire saw which generates a small volume of foam and exhibits high cutting performance, a method for cutting an ingot using the cutting fluid, and a substrate for electronic material obtained by the cutting method. Disclosed is a water-soluble cutting fluid for fixed abrasive grain wire saw containing (a) an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by Chemical Formula (1). In addition, disclosed are a method for cutting an ingot including cutting an ingot with a fixed abrasive grain wire saw using the water-soluble cutting fluid for fixed abrasive grain wire saw to obtain a wafer that is a substrate for electronic material, and a substrate for electronic material obtained by the cutting method.
MYPI2015702982A 2013-04-05 2014-03-26 Water-soluble cutting fluid for fixed abrasive grain wire saw, method for cutting ingot using cutting fluid, and substrate for electronic material obtained by cutting method MY177479A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013079313 2013-04-05

Publications (1)

Publication Number Publication Date
MY177479A true MY177479A (en) 2020-09-16

Family

ID=51658243

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702982A MY177479A (en) 2013-04-05 2014-03-26 Water-soluble cutting fluid for fixed abrasive grain wire saw, method for cutting ingot using cutting fluid, and substrate for electronic material obtained by cutting method

Country Status (6)

Country Link
JP (1) JP5802863B2 (en)
KR (1) KR20160018470A (en)
CN (1) CN105121614B (en)
MY (1) MY177479A (en)
TW (1) TWI613188B (en)
WO (1) WO2014162945A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6860266B2 (en) * 2017-03-17 2021-04-14 出光興産株式会社 Brittle material processing liquid
CN109022115A (en) * 2017-06-12 2018-12-18 天津工业大学 A kind of silicon crystal multi-wire saw water-base cutting fluid

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698294A (en) * 1980-01-09 1981-08-07 Honda Motor Co Ltd Water-soluble cutting oil
JPH02305894A (en) * 1989-05-19 1990-12-19 Nkk Corp Oil for cold rolling of steel sheet
JP2000263452A (en) * 1999-03-12 2000-09-26 Osaka Diamond Ind Co Ltd Super-abrasive grain wire saw
JP2002093647A (en) * 2000-09-13 2002-03-29 Tdk Corp Method of manufacturing rare earth magnet
JP4497767B2 (en) 2001-09-06 2010-07-07 ユシロ化学工業株式会社 Water-soluble machining fluid composition for fixed abrasive wire saw
JP2009057423A (en) 2007-08-30 2009-03-19 Kyodo Yushi Co Ltd Water-soluble machining oil agent for fixed abrasive grain wire saw
TWI416291B (en) * 2008-07-11 2013-11-21 Hon Hai Prec Ind Co Ltd Method for processing an aspheric lens mold
CN102257091B (en) * 2008-12-20 2014-01-22 嘉柏微电子材料股份公司 Cutting fluid composition for wiresawing
JP5464055B2 (en) * 2009-06-02 2014-04-09 日信化学工業株式会社 Water-based cutting fluid and water-based cutting agent
JP2012230929A (en) * 2009-08-28 2012-11-22 Sumco Corp Solar cell silicon wafer and manufacturing method thereof
KR20120061821A (en) * 2009-08-31 2012-06-13 산요가세이고교 가부시키가이샤 Water-soluble cutting fluid for slicing silicon ingots
JP2011102362A (en) * 2009-11-11 2011-05-26 Haruo Okahara Coolant for cutting crystal silicon and method for cutting crystal silicon by using the same
JP5678898B2 (en) * 2011-01-28 2015-03-04 新東工業株式会社 Polygonal column member grinding / polishing apparatus and grinding / polishing method
MY156441A (en) * 2011-10-24 2016-02-26 Palace Chemical Co Ltd Water-soluble cutting fluid for fixed-abrasive-grain wire saw, cutting method using the same, and recycling method therefor
JP6204029B2 (en) * 2013-03-06 2017-09-27 出光興産株式会社 Aqueous processing fluid

Also Published As

Publication number Publication date
JP5802863B2 (en) 2015-11-04
KR20160018470A (en) 2016-02-17
TW201504205A (en) 2015-02-01
WO2014162945A1 (en) 2014-10-09
TWI613188B (en) 2018-02-01
JPWO2014162945A1 (en) 2017-02-16
CN105121614A (en) 2015-12-02
CN105121614B (en) 2020-04-17

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