WO2014162945A1 - Water soluble cutting fluid for fixed abrasive grain wire saw, ingot cutting method using same, and substrate for electronic material obtained by means of same - Google Patents

Water soluble cutting fluid for fixed abrasive grain wire saw, ingot cutting method using same, and substrate for electronic material obtained by means of same Download PDF

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Publication number
WO2014162945A1
WO2014162945A1 PCT/JP2014/058497 JP2014058497W WO2014162945A1 WO 2014162945 A1 WO2014162945 A1 WO 2014162945A1 JP 2014058497 W JP2014058497 W JP 2014058497W WO 2014162945 A1 WO2014162945 A1 WO 2014162945A1
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Prior art keywords
fixed abrasive
cutting
wire saw
water
ingot
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PCT/JP2014/058497
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French (fr)
Japanese (ja)
Inventor
清史 鈴木
慎也 ▲高▼梨
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パレス化学株式会社
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Application filed by パレス化学株式会社 filed Critical パレス化学株式会社
Priority to KR1020157030570A priority Critical patent/KR20160018470A/en
Priority to JP2015510027A priority patent/JP5802863B2/en
Priority to CN201480020233.6A priority patent/CN105121614B/en
Publication of WO2014162945A1 publication Critical patent/WO2014162945A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
    • C10M2207/046—Hydroxy ethers
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/10—Carboxylix acids; Neutral salts thereof
    • C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/108—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2219/00—Organic non-macromolecular compounds containing sulfur, selenium or tellurium as ingredients in lubricant compositions
    • C10M2219/10—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring
    • C10M2219/104—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring containing sulfur and carbon with nitrogen or oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2219/00—Organic non-macromolecular compounds containing sulfur, selenium or tellurium as ingredients in lubricant compositions
    • C10M2219/10—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring
    • C10M2219/104—Heterocyclic compounds containing sulfur, selenium or tellurium compounds in the ring containing sulfur and carbon with nitrogen or oxygen in the ring
    • C10M2219/106—Thiadiazoles
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2010/00—Metal present as such or in compounds
    • C10N2010/02—Groups 1 or 11
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/18—Anti-foaming property
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/32—Wires, ropes or cables lubricants

Definitions

  • the present invention relates to a water-soluble cutting solution for a fixed abrasive wire saw used for cutting a silicon ingot, an ingot cutting method using the same, and an electronic material substrate obtained thereby.
  • wafers for substrates for electronic materials have been obtained by cutting with a band saw or wire saw using loose abrasive grains.
  • a band saw or wire saw using loose abrasive grains.
  • slurry adheres to the cut wafer, and the cleaning load in the subsequent process is high.
  • the present invention provides a water-soluble cutting solution for a fixed abrasive wire saw with less foaming and high cutting performance, an ingot cutting method using the same, and a substrate for electronic materials obtained thereby.
  • the present inventors have conducted extensive research and, as a result, (a) an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol has been obtained.
  • the water-soluble cutting liquid contained it was found that even when used for a fixed abrasive wire saw, it is possible to cut with less foaming and high cutting performance, and the present invention has been achieved.
  • the present invention contains an alkylene adduct of (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by the following chemical formula (1):
  • the present invention relates to a water-soluble cutting liquid for abrasive wire saws.
  • R represents the same or different alkylene group having 1 to 4 carbon atoms
  • m1 + m2 + n1 + n2 represents the total number of added moles of the alkylene adduct and is an integer of 1 or more.
  • the present invention provides an ingot cutting method characterized in that a wafer which is a substrate for electronic materials is obtained by cutting an ingot with a fixed abrasive wire saw using the water-soluble cutting liquid for fixed abrasive wire saw, and The present invention relates to an electronic material substrate obtained by the cutting method.
  • a water-soluble cutting solution for a fixed abrasive wire saw with low foaming and high cutting performance a method for cutting an ingot using the same, and a substrate for electronic materials obtained thereby. I can do it.
  • the alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol as component (a) used in the water-soluble cutting solution for fixed abrasive wire saws according to the present invention has the following chemical formula: It has the structure shown by (1).
  • R represents the same or different alkylene group having 1 to 4 carbon atoms
  • m1 + m2 + n1 + n2 represents the total number of added moles of the alkylene adduct and is an integer of 1 or more.
  • the alkylene oxide added to 2,4,7,9-tetramethyl-5-decyne-4,7-diol may be any alkylene oxide having 1 to 4 carbon atoms. Specifically, ethylene oxide alone or both ethylene oxide and propylene oxide are particularly preferable.
  • the four alkylene groups (—OR—) in the chemical formula (1) are the same as long as each is an alkylene group having 1 to 4 carbon atoms. Although it may be present or different, it is preferred that the four alkylene groups are either ethylene alone or both ethylene and propylene, and it is particularly preferred that all four alkylene groups are ethylene.
  • the total number of added moles of the alkylene adduct is 1 mole or more, preferably 1 to 20 moles, and more preferably 4 to 12 moles.
  • the added alkylene adduct is an ethylene oxide simple substance, 4 to 12 mol of ethylene oxide is preferable, 4 to 8 mol is more preferable, and 4 to 6 mol is particularly preferable.
  • the added alkylene adduct is ethylene oxide or propylene oxide, 4 to 8 mol of ethylene oxide and 2 to 4 mol of propylene oxide are preferable.
  • the component (a) one type may be used alone, or two or more types may be used in combination.
  • the amount of the component (a) to be added is 0.01 to 5.0% by weight with respect to the water-soluble cutting solution. % Is preferable, and 0.05 to 2.0% by weight is more preferable.
  • the added amount of (a) is less than 0.01% by weight, the defoaming effect is small, and the dynamic surface tension of the water-soluble cutting liquid is high, so that the water-soluble cutting liquid is difficult to enter the processing point and tends to deteriorate the cutting quality.
  • the amount exceeds 5.0% by weight it may be difficult to achieve a blending balance in which the water-soluble cutting liquid exhibits a defoaming effect.
  • the water-soluble cutting liquid for fixed abrasive wire saws preferably contains the following components (b), (c) and (d) in addition to the component (a).
  • the lubricity between the fixed abrasive wire and the workpiece can be controlled, and the tool life of the fixed abrasive wire is improved.
  • the component (b) is preferably at least one of carboxylic acid, mercaptobenzothiazole, benzothiazolylthioacetic acid and benzothiazolylthiopropionic acid.
  • the carboxylic acid only needs to have one or more COOH groups.
  • a component can be used individually by 1 type and can also use 2 or more types together.
  • the component (c) is preferably at least one of amine, sodium hydroxide and potassium hydroxide, more preferably an amine.
  • amines include monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, dicyclohexylamine, trimethylolpropane poly (oxypropylene) triamine, N, N-bis (2hydroxyethyl)- Examples include alkylene adducts of N-cyclohexylamine and metaxylenediamine.
  • one type may be used alone, or two or more types may be used in combination.
  • the component (b) and the component (c) can be contained in any ratio as long as they are soluble in water.
  • the component (c) is neutralized or more than the component (b).
  • the total sum of the component (b) and the component (c) is desirably 5% by weight or less.
  • the component (d) is preferably at least one of glycol, polyalkylene glycol, glycol ether, polyalkylene glycol ether, glycerin and an alkylene adduct of glycerin.
  • the glycol only needs to have two OH groups, and examples include monoethylene glycol, diethylene glycol, triethylene glycol, monopropylene glycol, dipropylene glycol, tripropylene glycol, and hexylene glycol. Examples thereof include polyethylene glycol, polypropylene glycol, polyoxyethylene polyoxypropylene copolymer, and polyoxyethylene polyoxybutylene copolymer.
  • glycol ether examples include diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, and diethylene glycol monohexyl ether.
  • polyoxyalkylene glycol ether examples include polyoxyethylene monomethyl ether, polyoxypropylene monomethyl ether, and monobutyl ether of a polyoxyethylene polyoxypropylene copolymer.
  • alkylene adduct of glycerin examples include ethylene adduct, propylene adduct and ethylene propylene copolymer adduct of glycerin.
  • component (d) one type may be used alone, or two or more types may be used in combination. Although content of (d) component should just be soluble in water, Preferably it is 70 weight% or less.
  • the water-soluble cutting liquid for fixed abrasive wire saws may contain a rust preventive, preservative, fragrance, dye or the like, if necessary.
  • the substrate for electronic materials with good quality can be obtained by cutting the ingot with a fixed abrasive wire saw using the water-soluble cutting solution for fixed abrasive wire saw according to the present invention.
  • the wire serving as the bus bar may be made of iron or stainless steel, copper-plated or platinum-plated.
  • the abrasive grains fixed to the wire commercially available abrasive grains can be used, but diamond and boron nitride are preferred.
  • electrodeposition using a metal such as nickel or resin bonding using a resin is preferable.
  • the cutting machine used in the present invention is not particularly limited as long as it is a commercially available multi-wire saw machine, and a multi-wire saw machine dedicated to a fixed abrasive wire saw is preferable.
  • the ingot used in the present invention is not particularly limited as long as it is an ingot manufactured for an electronic material substrate.
  • silicon, sapphire, crystal, quartz, silicon carbide, lithium tantalate, gallium nitride, and gallium arsenide An ingot having a high purity obtained by crystal growth or the like is preferably used.

Abstract

Provided are a water soluble cutting fluid for a fixed abrasive grain wire saw that has little foaming and high cutting performance, an ingot cutting method using the same, and a substrate for electronic material obtained by means of the same. The water soluble cutting fluid for a fixed abrasive grain wire saw is characterized by containing (a) an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol as shown in chemical formula (1). Also provided are an ingot cutting method characterized by cutting an ingot by means of the fixed abrasive grain wire saw using the water soluble cutting fluid for a fixed abrasive grain wire saw and obtaining wafers that are electronic material substrates as well as a substrate for electronic material obtained by this cutting method.

Description

固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法及びそれによって得られた電子材料用基板Water-soluble cutting liquid for fixed abrasive wire saw, ingot cutting method using the same, and substrate for electronic material obtained thereby
　本発明は、シリコンインゴットを切断するために用いられる固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法及びそれによって得られた電子材料用基板に関する。 The present invention relates to a water-soluble cutting solution for a fixed abrasive wire saw used for cutting a silicon ingot, an ingot cutting method using the same, and an electronic material substrate obtained thereby.
　従来から、電子材料用基板のウェハーは、遊離砥粒を用いたバンドソーやワイヤーソーによる切断によって得られている。しかし、遊離砥粒を用いた切断では、切断したウェハーにスラリーが付着し、後工程での洗浄負荷が高く、また、使用液から遊離砥粒、スラッジ、切断液を分離することが難しく、リサイクル性が悪いという問題がある。 Conventionally, wafers for substrates for electronic materials have been obtained by cutting with a band saw or wire saw using loose abrasive grains. However, when cutting with loose abrasive grains, slurry adheres to the cut wafer, and the cleaning load in the subsequent process is high. Also, it is difficult to separate loose abrasive grains, sludge, and cutting liquid from the working liquid, and recycling There is a problem that the nature is bad.
　これらの問題に対し、ワイヤーに電着やレジンボンドを用いて砥粒を固定させた固定砥粒ワイヤーソーが開発され、洗浄工程の簡素化や切断液とスラッジを分離することでリサイクル性が向上するという利点を有している。この固定砥粒ワイヤーソーを用いて電子材料用基板であるウェハーを切断する際に使用される切断液として、水や例えば特許文献１及び２において水溶性切断液が提案されている。 In response to these problems, a fixed-abrasive wire saw in which abrasive particles are fixed to the wire using electrodeposition or resin bond has been developed, and the recyclability is improved by simplifying the cleaning process and separating the cutting fluid and sludge. Has the advantage of As cutting fluid used when cutting the wafer which is a substrate for electronic materials using this fixed abrasive wire saw, water and water-soluble cutting fluid are proposed in patent documents 1 and 2, for example.
特開２００３－８２３３４号公報JP 2003-82334 A 特開２００９－５７４２３号公報JP 2009-57423 A
　しかしながら、近年、品質面及び切断速度向上のため、ワイヤー速度が速くなってきており、特許文献１及び２に開示されているような水溶性切断液を用いて電子材料用基板となるインゴットを切断すると、使用している水溶性切断液が泡立ち、品質の良いウェハーを得ることが出来ないという問題がある。 However, in recent years, the wire speed has been increased in order to improve quality and cutting speed, and an ingot that becomes a substrate for electronic materials is cut using a water-soluble cutting liquid as disclosed in Patent Documents 1 and 2. Then, there is a problem that the water-soluble cutting liquid used is foamed and a wafer with good quality cannot be obtained.
　そこで、本発明は、泡立ちが少なく、切断性能が高い固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法及びそれによって得られた電子材料用基板を提供するものである。 Therefore, the present invention provides a water-soluble cutting solution for a fixed abrasive wire saw with less foaming and high cutting performance, an ingot cutting method using the same, and a substrate for electronic materials obtained thereby.
　以上の目的を達成するために、本発明者らは、鋭意研究を重ねた結果、（ａ）２，４，７，９－テトラメチル－５－デシン－４，７－ジオールのアルキレン付加物を含有する水溶性切断液を用いることによって、固定砥粒ワイヤーソーに用いる場合であっても、泡立ちが少なく、切断性能が高い切断が可能であることを見出し、本発明に至った。すなわち、本発明は、下記化学式（１）で示される（ａ）２，４，７，９－テトラメチル－５－デシン－４，７－ジオールのアルキレン付加物を含有することを特徴とする固定砥粒ワイヤーソー用水溶性切断液に関する。 In order to achieve the above object, the present inventors have conducted extensive research and, as a result, (a) an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol has been obtained. By using the water-soluble cutting liquid contained, it was found that even when used for a fixed abrasive wire saw, it is possible to cut with less foaming and high cutting performance, and the present invention has been achieved. That is, the present invention contains an alkylene adduct of (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by the following chemical formula (1): The present invention relates to a water-soluble cutting liquid for abrasive wire saws.
Figure JPOXMLDOC01-appb-C000002
 （ただし、Ｒはそれぞれ同一または異なる炭素数１～４のアルキレン基を示し、ｍ１＋ｍ２＋ｎ１＋ｎ２はアルキレン付加物の総付加モル数を示し、１以上の整数である。）
Figure JPOXMLDOC01-appb-C000002
 (However, R represents the same or different alkylene group having 1 to 4 carbon atoms, and m1 + m2 + n1 + n2 represents the total number of added moles of the alkylene adduct and is an integer of 1 or more.)
　また、本発明は、上記固定砥粒ワイヤーソー用水溶性切断液を用いて固定砥粒ワイヤーソーによりインゴットを切断して電子材料用基板であるウェハーを得ることを特徴とするインゴットの切断方法、及びその切断方法によって得られた電子材料用基板に関する。 Further, the present invention provides an ingot cutting method characterized in that a wafer which is a substrate for electronic materials is obtained by cutting an ingot with a fixed abrasive wire saw using the water-soluble cutting liquid for fixed abrasive wire saw, and The present invention relates to an electronic material substrate obtained by the cutting method.
　以上のように、本発明によれば、泡立ちが少なく、切断性能が高い固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法及びそれによって得られた電子材料用基板を提供することが出来る。 As described above, according to the present invention, there are provided a water-soluble cutting solution for a fixed abrasive wire saw with low foaming and high cutting performance, a method for cutting an ingot using the same, and a substrate for electronic materials obtained thereby. I can do it.
　本発明に係る固定砥粒ワイヤーソー用水溶性切断液に用いられる（ａ）成分である２，４，７，９－テトラメチル－５－デシン－４，７－ジオールのアルキレン付加物は、下記化学式（１）で示される構造を有する。 The alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol as component (a) used in the water-soluble cutting solution for fixed abrasive wire saws according to the present invention has the following chemical formula: It has the structure shown by (1).
Figure JPOXMLDOC01-appb-C000003
 （ただし、Ｒはそれぞれ同一または異なる炭素数１～４のアルキレン基を示し、ｍ１＋ｍ２＋ｎ１＋ｎ２はアルキレン付加物の総付加モル数を示し、１以上の整数である。）
Figure JPOXMLDOC01-appb-C000003
 (However, R represents the same or different alkylene group having 1 to 4 carbon atoms, and m1 + m2 + n1 + n2 represents the total number of added moles of the alkylene adduct and is an integer of 1 or more.)
　上記化学式（１）において、２，４，７，９－テトラメチル－５－デシン－４，７－ジオールに付加されるアルキレンオキサイドとしては、炭素数１～４のアルキレンオキサイドであればよく、具体的には、エチレンオキサイド単体、又はエチレンオキサイド及びプロピレンオキサイドの双方が特に好ましい。
　また、付加されるアルキレンオキサイドは、ランダム重合で付加されるため、上記化学式（１）の４つのアルキレン基（－ＯＲ－）は、それぞれが炭素数１～４のアルキレン基であれば、同一であっても異なっていてもよいが、４つのアルキレン基がエチレン単体、又はエチレン及びプロピレンの双方のいずれかであることが好ましく、４つのアルキレン基全てがエチレンであることが特に好ましい。
　上記化学式（１）において、アルキレン付加物の付加モル数は、総量として１モル以上であるが、１～２０モルが好ましく、４～１２モルがより好ましい。特に、付加されたアルキレン付加物がエチレンオキサイド単体の場合には、エチレンオキサイド４～１２モルが好ましく、４～８モルがより好ましく、４～６モルが特に好ましい。また、付加されたアルキレン付加物がエチレンオキサイド及びプロピレンオキサイドの場合には、エチレンオキサイド４～８モル及びプロピレンオキサイド２～４モルが好ましい。 In the above chemical formula (1), the alkylene oxide added to 2,4,7,9-tetramethyl-5-decyne-4,7-diol may be any alkylene oxide having 1 to 4 carbon atoms. Specifically, ethylene oxide alone or both ethylene oxide and propylene oxide are particularly preferable.
In addition, since the alkylene oxide to be added is added by random polymerization, the four alkylene groups (—OR—) in the chemical formula (1) are the same as long as each is an alkylene group having 1 to 4 carbon atoms. Although it may be present or different, it is preferred that the four alkylene groups are either ethylene alone or both ethylene and propylene, and it is particularly preferred that all four alkylene groups are ethylene.
In the chemical formula (1), the total number of added moles of the alkylene adduct is 1 mole or more, preferably 1 to 20 moles, and more preferably 4 to 12 moles. In particular, when the added alkylene adduct is an ethylene oxide simple substance, 4 to 12 mol of ethylene oxide is preferable, 4 to 8 mol is more preferable, and 4 to 6 mol is particularly preferable. Further, when the added alkylene adduct is ethylene oxide or propylene oxide, 4 to 8 mol of ethylene oxide and 2 to 4 mol of propylene oxide are preferable.
　（ａ）成分は、１種を単独で用いることも２種以上を併用することもできるが、（ａ）成分の添加量としては、水溶性切断液に対して０．０１～５．０重量％が好ましく、０．０５～２．０重量％がより好ましい。（ａ）の添加量が０．０１重量％未満では、消泡効果が少なく、水溶性切断液の動的表面張力が高いために水溶性切断液が加工点まで入りにくく切断品質を悪化させる傾向となり、５．０重量％を超えると、水溶性切断液が消泡効果を示すような配合バランスが取りづらい場合がある。 As the component (a), one type may be used alone, or two or more types may be used in combination. The amount of the component (a) to be added is 0.01 to 5.0% by weight with respect to the water-soluble cutting solution. % Is preferable, and 0.05 to 2.0% by weight is more preferable. When the added amount of (a) is less than 0.01% by weight, the defoaming effect is small, and the dynamic surface tension of the water-soluble cutting liquid is high, so that the water-soluble cutting liquid is difficult to enter the processing point and tends to deteriorate the cutting quality. When the amount exceeds 5.0% by weight, it may be difficult to achieve a blending balance in which the water-soluble cutting liquid exhibits a defoaming effect.
　本発明に係る固定砥粒ワイヤーソー用水溶性切断液には、上記（ａ）成分のほかに、下記に示す（ｂ）、（ｃ）及び（ｄ）成分を含有させることが好ましい。（ｂ）、（ｃ）及び（ｄ）成分を含有させることにより、固定砥粒ワイヤーと加工物との間の潤滑性をコントロールすることができ、固定砥粒ワイヤーの工具寿命が向上する。 The water-soluble cutting liquid for fixed abrasive wire saws according to the present invention preferably contains the following components (b), (c) and (d) in addition to the component (a). By including the components (b), (c) and (d), the lubricity between the fixed abrasive wire and the workpiece can be controlled, and the tool life of the fixed abrasive wire is improved.
　本発明において、（ｂ）成分は、カルボン酸、メルカプトベンゾチアゾール、ベンゾチアゾリルチオ酢酸及びベンゾチアゾリルチオプロピオン酸の少なくとも１種以上であることが好ましい。カルボン酸としては、ＣＯＯＨ基を１つ以上有していればよく、例えば、カプリル酸、カプロン酸、ラウリン酸、オレイン酸、クエン酸、マレイン酸、フマル酸、アジピン酸、イソフタル酸、リンゴ酸、酒石酸、ドデカン二酸及びセバシン酸などが挙げられる。（ｂ）成分は、１種を単独で用いることも２種以上を併用することもできる。 In the present invention, the component (b) is preferably at least one of carboxylic acid, mercaptobenzothiazole, benzothiazolylthioacetic acid and benzothiazolylthiopropionic acid. The carboxylic acid only needs to have one or more COOH groups. For example, caprylic acid, caproic acid, lauric acid, oleic acid, citric acid, maleic acid, fumaric acid, adipic acid, isophthalic acid, malic acid, Examples include tartaric acid, dodecanedioic acid, and sebacic acid. (B) A component can be used individually by 1 type and can also use 2 or more types together.
　また、（ｃ）成分は、アミン、水酸化ナトリウム及び水酸化カリウムの少なくとも１種以上であることが好ましく、アミンがより好ましい。アミンとしては、モノエタノールアミン、ジエタノールアミン、トリエタノールアミン、モノイソプロパノールアミン、ジイソプロパノールアミン、トリイソプロパノールアミン、ジシクロヘキシルアミン、トリメチロールプロパンポリ（オキシプロピレン）トリアミン、Ｎ，Ｎ－ビス（２ヒドロキシエチル）－Ｎ－シクロヘキシルアミン及びメタキシレンジアミンのアルキレン付加物などが挙げられる。（ｃ）成分は、１種を単独で用いることも２種以上を併用することもできる。 The component (c) is preferably at least one of amine, sodium hydroxide and potassium hydroxide, more preferably an amine. Examples of amines include monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, dicyclohexylamine, trimethylolpropane poly (oxypropylene) triamine, N, N-bis (2hydroxyethyl)- Examples include alkylene adducts of N-cyclohexylamine and metaxylenediamine. As the component (c), one type may be used alone, or two or more types may be used in combination.
　（ｂ）成分と（ｃ）成分は、それぞれ水に可溶すれば任意の割合で含有することが出来るが、好ましくは（ｂ）成分に対し（ｃ）成分が中和もしくはそれ以上であり、（ｂ）成分と（ｃ）成分との総和が５重量％以下であることが望ましい。 The component (b) and the component (c) can be contained in any ratio as long as they are soluble in water. Preferably, the component (c) is neutralized or more than the component (b). The total sum of the component (b) and the component (c) is desirably 5% by weight or less.
　また、（ｄ）成分は、グリコール、ポリアルキレングリコール、グリコールエーテル、ポリアルキレングリコールエーテル、グリセリン及びグリセリンのアルキレン付加物の少なくとも１種以上であることが好ましい。グリコールは、ＯＨ基を２つ有すれば良く、例えば、モノエチレングリコール、ジエチレングリコール、トリエチレングリコール、モノプロピレングリコール、ジプロピレングリコール、トリプロピレングリコール及びヘキシレングリコールなどが挙げられ、ポリアルキレングリコールとしては、例えばポリエチレングリコール、ポリプロピレングリコール、ポリオキシエチレンポリオキシプロピレンの共重合体及びポリオキシエチレンポリオキシブチレンの共重合体が挙げられる。グリコールエーテルとしては、例えばジエチレングリコールモノメチルエーテル、ジエチレングリコールモノブチルエーテル及びジエチレングリコールモノヘキシルエーテルなどが挙げられる。ポリオキシアルキレングリコールエーテルとしては、例えばポリオキシエチレンモノメチルエーテル、ポリオキシプロピレンモノメチルエーテル及びポリオキシエチレンポリオキシプロピレン共重合体のモノブチルエーテルが挙げられる。グリセリンのアルキレン付加物としては、例えばグリセリンのエチレン付加物、プロピレン付加物及びエチレンプロピレン共重合付加物が挙げられる。（ｄ）成分は、１種を単独で用いることも２種以上を併用することもできる。（ｄ）成分の含有量は、水に可溶していればよいが、好ましくは７０重量％以下である。 In addition, the component (d) is preferably at least one of glycol, polyalkylene glycol, glycol ether, polyalkylene glycol ether, glycerin and an alkylene adduct of glycerin. The glycol only needs to have two OH groups, and examples include monoethylene glycol, diethylene glycol, triethylene glycol, monopropylene glycol, dipropylene glycol, tripropylene glycol, and hexylene glycol. Examples thereof include polyethylene glycol, polypropylene glycol, polyoxyethylene polyoxypropylene copolymer, and polyoxyethylene polyoxybutylene copolymer. Examples of the glycol ether include diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, and diethylene glycol monohexyl ether. Examples of the polyoxyalkylene glycol ether include polyoxyethylene monomethyl ether, polyoxypropylene monomethyl ether, and monobutyl ether of a polyoxyethylene polyoxypropylene copolymer. Examples of the alkylene adduct of glycerin include ethylene adduct, propylene adduct and ethylene propylene copolymer adduct of glycerin. As the component (d), one type may be used alone, or two or more types may be used in combination. Although content of (d) component should just be soluble in water, Preferably it is 70 weight% or less.
　また、本発明に係る固定砥粒ワイヤーソー用水溶性切断液は、必要に応じて、防錆剤、防腐剤、香料、染料などを添加してもよい。 Moreover, the water-soluble cutting liquid for fixed abrasive wire saws according to the present invention may contain a rust preventive, preservative, fragrance, dye or the like, if necessary.
　本発明に係る固定砥粒ワイヤーソー用水溶性切断液を用いて固定砥粒ワイヤーソーによりインゴットを切断することで、品質の良い電子材料用基板を得ることができる。 The substrate for electronic materials with good quality can be obtained by cutting the ingot with a fixed abrasive wire saw using the water-soluble cutting solution for fixed abrasive wire saw according to the present invention.
　本発明に用いる固定砥粒ワイヤーソーにおいて、母線となるワイヤーは、鉄製でもステンレス製でも良く、銅メッキされたもの、白金メッキされたものでもよい。ワイヤーに固着する砥粒としては、市販されている砥粒を用いることが出来るが、好ましくはダイヤモンド、窒化ホウ素である。ワイヤーに砥粒を固着させるには、ニッケルなどの金属による電着や樹脂を用いた樹脂接着が好ましい。 In the fixed abrasive wire saw used in the present invention, the wire serving as the bus bar may be made of iron or stainless steel, copper-plated or platinum-plated. As the abrasive grains fixed to the wire, commercially available abrasive grains can be used, but diamond and boron nitride are preferred. In order to fix the abrasive grains to the wire, electrodeposition using a metal such as nickel or resin bonding using a resin is preferable.
　また、本発明に用いる切断機としては、市販に販売されているマルチワイヤーソー加工機であれば特に限定はなく、好ましくは固定砥粒ワイヤーソー専用のマルチワイヤーソー加工機が望ましい。 Further, the cutting machine used in the present invention is not particularly limited as long as it is a commercially available multi-wire saw machine, and a multi-wire saw machine dedicated to a fixed abrasive wire saw is preferable.
　また、本発明に用いるインゴットとしては、電子材料用基板のために製造されたインゴットであれば特に限定はなく、例えばシリコン、サファイア、水晶、石英、炭化ケイ素、リチウムタンタレート、窒化ガリウム及びガリウムヒ素などを結晶成長させ高純度化したインゴットが好ましく用いられる。 The ingot used in the present invention is not particularly limited as long as it is an ingot manufactured for an electronic material substrate. For example, silicon, sapphire, crystal, quartz, silicon carbide, lithium tantalate, gallium nitride, and gallium arsenide An ingot having a high purity obtained by crystal growth or the like is preferably used.
　上記のとおり、固定砥粒ワイヤーソーによりインゴットから電子材料用基板であるウェハーを切断する際に、本発明に係る固定砥粒ワイヤーソー用水溶性切断液を用いることで、泡立ちが少なく、また、切断性能を向上させることが可能となる。 As described above, when cutting a wafer which is a substrate for electronic materials from an ingot with a fixed abrasive wire saw, by using the water-soluble cutting liquid for fixed abrasive wire saw according to the present invention, there is less foaming and cutting The performance can be improved.
　次に、本発明に係る固定砥粒ワイヤーソー用水溶性切断液の実施例について説明するが、本発明はこれにより限定されるものではない。まず、表１及び表２に示す各成分の配合量に従って、これらを常法により混合することで、実施例１乃至実施例９に係る固定砥粒ワイヤーソー用水溶性切断液、並びに比較例１乃至比較例４に係る固定砥粒ワイヤーソー用水溶性切断液を得た。 Next, examples of the water-soluble cutting solution for fixed abrasive wire saw according to the present invention will be described, but the present invention is not limited thereto. First, according to the compounding quantity of each component shown in Table 1 and Table 2, these are mixed by a conventional method, The water-soluble cutting liquid for fixed abrasive wire saws which concern on Example 1 thru | or Example 9, and Comparative Example 1 thru | or A water-soluble cutting liquid for a fixed abrasive wire saw according to Comparative Example 4 was obtained.
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000005
　（泡立ち試験）
　次に、切断中の泡立ちを想定して、実施例１乃至実施例９に係る固定砥粒ワイヤーソー用水溶性切断液、及び比較例１乃至比較例４に係る固定砥粒ワイヤーソー用水溶性切断液を有栓式１００ｍｌメスシリンダーに５０ｍｌ入れ、有栓した後、激しくシェイクし、その直後の初期泡立ち量及び泡立ちが消えるまでの消泡時間を確認した。その結果を表３に示す。なお、安定性は、２５℃で１週間静置し、○：１週間分離・沈殿なし、△：４日以上、１週間未満で分離・沈殿発生、×：４日未満で分離・沈殿発生とした。 (Bubbling test)
Next, assuming foaming during cutting, the water-soluble cutting liquid for fixed abrasive wire saws according to Examples 1 to 9 and the water-soluble cutting liquid for fixed abrasive wire saws according to Comparative Examples 1 to 4 Was put into a stoppered 100 ml graduated cylinder, sealed, and shaken vigorously, and the initial foaming amount immediately after that and the defoaming time until foaming disappeared were confirmed. The results are shown in Table 3. In addition, the stability is left at 25 ° C. for 1 week, ○: no separation / precipitation for 1 week, Δ: separation / precipitation occurs in 4 days or more, less than 1 week, ×: separation / precipitation occurs in less than 4 days did.
Figure JPOXMLDOC01-appb-T000006
Figure JPOXMLDOC01-appb-T000006
　表３から、比較例２の切断液は安定性が悪く、比較例３及び４の切断液では、泡立ちが多く消泡時間も６０秒を越えてしまったことがわかる。それに対して、本発明に係る固定砥粒ワイヤーソー用水溶性切断液は、泡立ちが少なく良好なことがわかる。なお、安定性の悪い比較例２は、分離した（ａ）成分が装置、配管内に付着し、汚染を引き起こしたり、切断液から（ａ）成分が取り除かれることにより切断品質が悪化し、切断液として使用することが困難である。 From Table 3, it can be seen that the cutting liquid of Comparative Example 2 has poor stability, and the cutting liquids of Comparative Examples 3 and 4 have much foaming and the defoaming time has exceeded 60 seconds. On the other hand, it turns out that the water-soluble cutting liquid for fixed-abrasive wire saws according to the present invention is good with less foaming. In Comparative Example 2 with poor stability, the separated component (a) adheres to the apparatus and piping, causing contamination, and the cutting quality deteriorates due to removal of the component (a) from the cutting fluid. It is difficult to use as a liquid.
　（切断試験）
　次に実施例１乃至実施例９に係る固定砥粒ワイヤーソー用水溶性切断液、並びに比較例１乃至比較例４に係る固定砥粒ワイヤーソー用水溶性切断液を使用し、表４の条件で切断試験を行い、切断したウェハーの断面曲線の最大谷高さ（ＰＶ）を測定した。結果を表５に示す。 (Cutting test)
Next, using the water-soluble cutting solution for fixed abrasive wire saws according to Examples 1 to 9 and the water-soluble cutting solution for fixed abrasive wire saws according to Comparative Examples 1 to 4, cutting was performed under the conditions shown in Table 4. A test was performed and the maximum valley height (PV) of the cross-sectional curve of the cut wafer was measured. The results are shown in Table 5.
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000008
Figure JPOXMLDOC01-appb-T000008
　表５から、比較例１及び２の切断液ではインゴットを切断することができず、比較例３及び４の切断液では、ＰＶの値が大きく良好な断面を形成できていないことがわかる。それに対して、本実施例に係る固定砥粒ワイヤーソー用水溶性切断液は、ＰＶの値が小さく切断性能が良好なことがわかる。 From Table 5, it can be seen that the ingots cannot be cut with the cutting fluids of Comparative Examples 1 and 2, and the cutting fluids of Comparative Examples 3 and 4 have a large PV value and cannot form a good cross section. On the other hand, it can be seen that the water-soluble cutting liquid for fixed abrasive wire saws according to this example has a small PV value and good cutting performance.

Claims (7)

  1. 　下記化学式（１）で示される（ａ）２，４，７，９－テトラメチル－５－デシン－４，７－ジオールのアルキレン付加物を含有することを特徴とする固定砥粒ワイヤーソー用水溶性切断液。
    Figure JPOXMLDOC01-appb-C000001
     （ただし、Ｒはそれぞれ同一または異なる炭素数１～４のアルキレン基を示し、ｍ１＋ｍ２＋ｎ１＋ｎ２はアルキレン付加物の総付加モル数を示し、１以上の整数である。）     Water-soluble for fixed-abrasive wire saw characterized by containing an alkylene adduct of (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by the following chemical formula (1) Cutting fluid.
    Figure JPOXMLDOC01-appb-C000001
     (However, R represents the same or different alkylene group having 1 to 4 carbon atoms, and m1 + m2 + n1 + n2 represents the total number of added moles of the alkylene adduct and is an integer of 1 or more.)
  2. 　前記（ａ）のアルキレン付加物の総付加モル数が、４～１２モルであることを特徴とする請求項１記載の固定砥粒ワイヤーソー用水溶性切断液。 The water-soluble cutting solution for a fixed abrasive wire saw according to claim 1, wherein the total number of added moles of the alkylene adduct (a) is 4 to 12 moles.
  3. 　前記（ａ）の含有量が、０．０１～５．０重量％であることを特徴とする請求項１又は２記載の固定砥粒ワイヤーソー用水溶性切断液。 The water-soluble cutting solution for a fixed abrasive wire saw according to claim 1 or 2, wherein the content of (a) is 0.01 to 5.0% by weight.
  4. 　さらに、（ｂ）カルボン酸、メルカプトベンゾチアゾール、ベンゾチアゾリルチオ酢酸及びベンゾチアゾリルチオプロピオン酸の少なくとも１種以上と、（ｃ）アミン、水酸化ナトリウム及び水酸化カリウムの少なくとも１種以上とを含有することを特徴とする請求項１乃至３いずれか記載の固定砥粒ワイヤーソー用水溶性切断液。 And (b) at least one or more of carboxylic acid, mercaptobenzothiazole, benzothiazolylthioacetic acid and benzothiazolylthiopropionic acid, and (c) at least one or more of amine, sodium hydroxide and potassium hydroxide. The water-soluble cutting liquid for fixed abrasive wire saws according to any one of claims 1 to 3, which is contained.
  5. 　さらに、（ｄ）グリコール、ポリアルキレングリコール、グリコールエーテル、ポリアルキレングリコールエーテル、グリセリン及びグリセリンのアルキレン付加物の少なくとも１種以上を含有することを特徴とする請求項１乃至４いずれか記載の固定砥粒ワイヤーソー用水溶性切断液。 The fixed abrasive according to any one of claims 1 to 4, further comprising (d) at least one of glycol, polyalkylene glycol, glycol ether, polyalkylene glycol ether, glycerin and an alkylene adduct of glycerin. Water-soluble cutting solution for grain wire saws.
  6. 　請求項１乃至５いずれか記載の固定砥粒ワイヤーソー用水溶性切断液を用いて、固定砥粒ワイヤーソーによりインゴットを切断して電子材料用基板を得ることを特徴とするインゴットの切断方法。 A method for cutting an ingot, characterized in that the substrate for electronic materials is obtained by cutting the ingot with a fixed abrasive wire saw using the water-soluble cutting solution for fixed abrasive wire saw according to any one of claims 1 to 5.
  7. 　請求項６記載のインゴットの切断方法によって得られたことを特徴とする電子材料用基板。 An electronic material substrate obtained by the ingot cutting method according to claim 6.
PCT/JP2014/058497 2013-04-05 2014-03-26 Water soluble cutting fluid for fixed abrasive grain wire saw, ingot cutting method using same, and substrate for electronic material obtained by means of same WO2014162945A1 (en)

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