KR20160018470A - Water soluble cutting fluid for fixed abrasive grain wire saw, ingot cutting method using same, and substrate for electronic material obtained by means of same - Google Patents

Abstract

A water-soluble cutting liquid for use with a fixed abrasive wire having low foaming and high cutting performance, a method for cutting an ingot using the same, and a substrate for an electronic material obtained by the method. A water-soluble cutting liquid for immobilizing a fixed abrasive wire characterized by containing an alkylene adduct of (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by the formula (1) to be. A method for cutting an ingot, which is an electronic material substrate, is obtained by cutting an ingot by using a fixed abrasive wire element by using the water-soluble cutting fluid for the stationary abrasive wire, to be.

Description

TECHNICAL FIELD [0001] The present invention relates to a water-soluble cutting liquid for use with a fixed abrasive wire, a method for cutting an ingot using the same, and a substrate for an electronic material obtained by the method. BACKGROUND ART }

The present invention relates to a water-soluble cutting liquid for fixed abrasive grain wire saw used for cutting a silicon ingot, a method for cutting an ingot using the same, and a substrate for an electronic material obtained thereby.

Conventionally, a wafer of a substrate for an electronic material is obtained by cutting by a band saw or wire saw using free abrasive grains. However, in the cutting using the glass grain, it is difficult to separate the glass grain, sludge and cutting solution from the use solution, that the slurry adheres to the wafer to be cut, the cleaning load in the subsequent step is high and the recyclability .

To solve these problems, there has been developed a fixed abrasive wire element in which abrasive grains are fixed by using an electrodeposition or resin bond to the wire, thereby simplifying the cleaning process and separating the cutting liquid and the sludge, thereby improving the recyclability. As a cutting solution used for cutting a wafer which is a substrate for an electronic material using this fixed abrasive wire element, water, for example, an aqueous cutting solution in Patent Documents 1 and 2 has been proposed.

JP 2003-82334 A JP 2009-57423 A

However, in recent years, in order to improve the quality and the cutting speed, the wire speed is getting faster. When an ingot which is a substrate for an electronic material is cut using an aqueous cutting fluid as disclosed in Patent Documents 1 and 2, There is a problem that a water-soluble cutting liquid is foamed (that is, bubbles occur), and a wafer of good quality can not be obtained.

SUMMARY OF THE INVENTION Accordingly, the present invention provides a water-soluble cutting solution for use with a fixed abrasive wire having low foaming and high cutting performance, a method for cutting an ingot using the same, and a substrate for an electronic material obtained thereby.

DISCLOSURE OF THE INVENTION In order to achieve the above object, the inventors of the present invention have conducted intensive studies and have found that (a) an alkylene adduct of 2,4,7,9-tetramethyl- By using the water-soluble cutting solution, even when used in stationary abrasive wire parts, it was found that foaming was small and cutting with high cutting performance was possible, thus leading to the present invention. That is, the present invention relates to a process for producing an alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by the following formula (1) ≪ RTI ID = 0.0 > soluble < / RTI >

(1)

In the formula, R represents the same or different alkylene group of 1 to 4 carbon atoms, and m1 + m2 + n1 + n2 represents the number of moles of the total parts of the alkylene adducts and is an integer of 1 or more.

Further, according to the present invention, there is provided a method of cutting an ingot, which is a substrate for an electronic material, by cutting the ingot by using a fixed abrasive wire element using the water-soluble cutting solution for the stationary abrasive wire, And a substrate for an electronic material.

INDUSTRIAL APPLICABILITY As described above, according to the present invention, it is possible to provide a water-soluble cutting liquid for small-sized fixed abrasive wire with low foaming and high cutting performance, a method for cutting an ingot using the same, and a substrate for an electronic material obtained thereby.

The alkylene adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol, which is the component (a) used in the water-soluble cutting solution for the stationary abrasive wire according to the present invention, 1): < EMI ID =

(1)

In the formula, R represents the same or different alkylene group of 1 to 4 carbon atoms, and m1 + m2 + n1 + n2 represents the number of moles of the total parts of the alkylene adducts and is an integer of 1 or more.

In the above formula (1), the alkylene oxide to be added to the 2,4,7,9-tetramethyl-5-decyne-4,7-diol may be an alkylene oxide having 1 to 4 carbon atoms, , Ethylene oxide alone or both ethylene oxide and propylene oxide are particularly preferable.

Since the alkylene oxide added is added in the random polymerization, the four alkylene groups (-OR < - >) in the above formula (1) may be the same or different from each other if they are alkylene groups of 1 to 4 carbon atoms, It is particularly preferable that all of the four alkylene groups are ethylene, or both of ethylene and propylene, and all of the four alkylene groups are ethylene.

In the above formula (1), the addition mole number of the alkylene adduct is 1 mole or more as the total amount, but is preferably 1 to 20 moles, and more preferably 4 to 12 moles. In particular, when the added alkylene adduct is ethylene oxide alone, 4 to 12 moles of ethylene oxide is preferable, 4 to 8 moles is more preferable, and 4 to 6 moles is particularly preferable. Also, when the added alkylene adduct is ethylene oxide and propylene oxide, 4 to 8 moles of ethylene oxide and 2 to 4 moles of propylene oxide are preferred.

The amount of the component (a) added is preferably from 0.01 to 5.0% by weight, more preferably from 0.05 to 2.0% by weight based on the water-soluble cutting solution, Is more preferable. When the addition amount of the component (a) is less than 0.01% by weight, the defoaming effect is small and the dynamic surface tension of the water-soluble cutting solution is high, so that the water-soluble cutting solution tends to hardly enter the processing point, , There is a case that the water-soluble cutting fluid may have a poor balance of formulation such as exhibiting a defoaming effect.

The water-soluble cutting solution for immobilizing a fixed abrasive wire according to the present invention preferably contains the following components (b), (c) and (d) in addition to the component (a). By containing the components (b), (c) and (d), lubricity between the fixed abrasive wire and the workpiece can be controlled and the tool life of the fixed abrasive wire is improved.

In the present invention, the component (b) is preferably at least one or more selected from the group consisting of carboxylic acid, mercaptobenzothiazole, (benzothiazolylthio) acetic acid and (benzothiazolylthio) propionic acid. Examples of the carboxylic acid may include at least one COOH group, and examples thereof include carboxylic acids such as caprylic acid, caproic acid, lauric acid, oleic acid, citric acid, maleic acid, fumaric acid, adipic acid, isophthalic acid, malic acid, Diacids and sebacic acids. The component (b) may be used alone or in combination of two or more.

The component (c) is preferably at least one or more of amine, sodium hydroxide and potassium hydroxide, and more preferably an amine. Examples of the amine include monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, dicyclohexylamine, trimethylolpropane poly (oxypropylene) triamine, N, N- Bis (2-hydroxyethyl) -N-cyclohexylamine, and alkylene adducts of meta xylene dianimine. The component (c) may be used alone or in combination of two or more.

The component (b) and the component (c) may be contained in any proportion as long as they are soluble in water. Preferably, the component (c) is neutralized or higher relative to the component (b) (c) is not more than 5% by weight.

The component (d) is at least one or more selected from the group consisting of glycols, polyalkylene glycols, glycol ethers, polyalkylene glycol ethers, glycerin and alkylene adducts of glycerin desirable. Glycols may have two OH groups, for example, monoethylene glycol, diethylene glycol, triethylene glycol, monopropylene glycol, dipropylene glycol, tripropylene glycol Examples of the polyalkylene glycols include polyethylene glycol, polypropylene glycol, copolymers of polyoxyethylene polyoxypropylene, and polyoxyethylene polyoxyethylene And copolymers of butylenes. Examples of the glycol ether include diethylene glycol monomethyl ether, diethylene glycol monobutyl ether and diethylene glycol monohexyl ether. Examples of the polyoxyalkylene glycol ether include monobutyl ethers of polyoxyethylene monomethyl ether, polyoxypropylene monomethyl ether and polyoxyethylene polyoxypropylene copolymer. Examples of the alkylene adducts of glycerin include ethylene adducts, propylene adducts and ethylene propylene copolymer adducts of glycerin. The component (d) may be used alone or in combination of two or more. The content of the component (d) is not particularly limited, but it is preferably 70% by weight or less.

In addition, the water-soluble cutting solution for the stationary abrasive wire according to the present invention may contain an antirusting agent, a preservative, a perfume, a dye and the like, if necessary.

By cutting the ingot by the fixed abrasive wire piece using the water-soluble cutting solution for the stationary abrasive wire according to the present invention, it is possible to obtain a substrate for an electronic material having good quality.

In the fixed abrasive wire used in the present invention, the bus wire may be made of iron, stainless steel, copper plated or platinum plated. As the abrasive to be fixed to the wire, commercially available abrasive grains can be used, and preferably, diamond and boron nitride. In order to adhere the abrasive grains to the wire, electrodeposition with a metal such as nickel or resin bonding using a resin is preferable.

The cutting machine used in the present invention is not particularly limited as long as it is a commercially available multi-wire small-sized processing machine, and preferably a multi-wire small-sized processing machine for stationary abrasive wire cutting is preferable.

The ingot employed in the present invention is not particularly limited as long as it is an ingot produced for a substrate for electronic materials and may be silicon, To thereby obtain a high purity ingot is preferably used.

The use of the water-soluble cutting solution for the stationary abrasive wire according to the present invention at the time of cutting the wafer as the substrate for the electronic material from the ingot by the fixed abrasive wire element as described above can reduce foaming and improve the cutting performance It becomes possible.

Example

Next, an embodiment of the water-soluble cutting solution for the stationary abrasive wire which affects the present invention will be described, but the present invention is not limited thereto. First, according to the blending amounts of the respective components shown in Tables 1 and 2, the water-soluble cutting solution for the immobilizing abrasive wire of any one of Examples 1 to 9 and Comparative Examples 1 to 4 Thereby obtaining a water-soluble cutting solution for immobilizing the fixed abrasive wire.

(Foaming test)

Next, the water-soluble cutting solution for fixing the abrasive graining wire according to Examples 1 to 9 and the water-soluble cutting solution for fixing the abrasive graining wire according to Comparative Examples 1 to 4 were placed in 100 ml 50 ml was placed in a measuring cylinder, the cap was covered, and the mixture was shaken vigorously. The amount of initial foaming immediately after the foaming and the time of foaming until disappearance of foaming were confirmed. The results are shown in Table 3. The stability was evaluated at 25 占 폚 for one week.?: One week without separation and precipitation,?: With separation of less than four days and less than one week, precipitation occurred, and x: separation and precipitation occurred less than four days.

It can be seen from Table 3 that the cutting solution of Comparative Example 2 had poor stability and that the cutting solution of Comparative Examples 3 and 4 had many foams and the bubble time exceeded 60 seconds. On the other hand, the water-soluble cutting liquid for immobilizing a fixed abrasive wire according to the present invention has a low foaming and is good. In Comparative Example 2, in which the stability is poor, the separated component (a) adheres to the device and the pipe to cause contamination, or the component (a) is removed from the cut solution, thereby deteriorating the cutting quality. It is difficult.

(Cutting test)

Next, a cutting test was carried out under the conditions shown in Table 4, using the water-soluble cutting liquid for small-diameter fixed abrasive wire according to Examples 1 to 9 and the water-soluble cutting liquid for small-sized fixed abrasive wire according to Comparative Examples 1 to 4, The maximum peak to valley height (PV) of the section curves of the cut wafer was measured. The results are shown in Table 5.

From Table 5, it can be seen that it is not possible to cut the ingot in the cutting solution of Comparative Examples 1 and 2, and that in the cutting solution of Comparative Examples 3 and 4, the PV value is large and it is not possible to form a good cross section . On the other hand, the water-soluble cutting solution for fixed abrasive wire according to the present example has a small PV value and good cutting performance.

Claims (7)

A water-soluble cutting material for small-sized fixed abrasive grains characterized by containing an alkylene adduct of (a) 2,4,7,9-tetramethyl-5-decyne-4,7-diol represented by the following formula (1) liquid:
(1)

In the formula, R represents the same or different alkylene group having 1 to 4 carbon atoms, and m1 + m2 + n1 + n2 represents the number of moles of the total parts of the alkylene adducts and is an integer of 1 or more. The water-soluble cutting solution according to claim 1, wherein the total molar amount of the alkylene adduct of (a) is 4 to 12 moles. The water-soluble cutting solution according to claim 1 or 2, wherein the content of (a) is 0.01 to 5.0% by weight. (B) at least one of carboxylic acid, mercaptobenzothiazole, (benzothiazolylthio) acetic acid, and (benzothiazolylthio) propionic acid; and (c) An amine, sodium hydroxide, and potassium hydroxide. 5. The composition according to any one of claims 1 to 4, wherein (d) the alkyl of the glycol, the polyalkylene glycol, the glycol ether, the polyalkylene glycol ether, the glycerin and the glycerin, And further comprising at least one or more of the hydrogenated adducts and the hydrogenated adducts. A process for producing an ingot obtained by cutting an ingot with a fixed abrasive wire blank to obtain a substrate for an electronic material by using the water-soluble cutting liquid for the stationary abrasive wire according to any one of claims 1 to 5 Cutting method. A substrate for an electronic material, characterized by being obtained by the ingot cutting method according to claim 6.