TW202248406A - Processing fluid, processing fluid composition, and brittle material processing fluid composition - Google Patents

Abstract

The present invention relates to a processing fluid comprising the following wherein component (A), component (B), and component (C) are incorporated in prescribed contents: component (A): a compound that exhibits a cloud point for its 1 mass% aqueous solution of 20-50 DEG C, that does not have an acetylene group, and that contains a copolymer segment of ethylene oxide and an alkylene oxide other than ethylene oxide; component (B): a compound that exhibits a cloud point for its 1 mass% aqueous solution of greater than 50 DEG C and not more than 80 DEG C, that does not have an acetylene group, and that contains a copolymer segment of ethylene oxide and an alkylene oxide other than ethylene oxide; component (C): at least one selection from the group consisting of acetylene glycols having an HLB value of 4 to 12 and alkylene oxide adducts on acetylene glycols having an HLB value of 4 to 12; and component (D): water.

Description

Processing fluid, composition for processing fluid, and composition for processing fluid for brittle materials

The present invention relates to processing fluid, composition for processing fluid, and composition for processing fluid for brittle materials.

Background technique In the manufacture of semiconductor products, it is very important to cut silicon ingots of brittle materials with high precision. From the perspective of processing accuracy and productivity, wire saws are generally used in the cutting of silicon ingots. In addition, wire saw processing is also used in the processing of materials such as ceramics, quartz, sapphire, and glass. Generally speaking, regarding the processing method using a wire saw, there are: the free abrasive method, which is to supply free abrasive grains to the sliding part of the wire rod and the workpiece while processing; and the fixed abrasive method, which is used for The wire surface is pre-fixed with abrasive grains for processing. In addition, in order to improve the machining efficiency during cutting, suppress the friction between the workpiece and the tool for machining the workpiece, reduce the frictional heat generated by machining, prolong the effect of tool life, and remove chips, etc., in the line of the two methods Machining fluid (coolant) is used in sawing. The working fluids used in the aforementioned applications include: oil-based working fluids mainly composed of mineral oil, animal and vegetable oils, synthetic oils, etc.; and water-based working fluids formulated with a compound having surface activity to impart water solubility. In recent years, water-soluble processing fluids have been used from the viewpoint of safety and environmental problems during operation.

For example, Patent Document 1 discloses a water-soluble cutting fluid for silicon ingot slices, which is characterized in that: as an essential component, it contains a polyoxyalkylene adduct with a number average molecular weight of 500 or less and a specific structure, and a carbon number (including The carbon of the carbonyl group) is an aliphatic carboxylic acid or a salt thereof with a valence of 4 to 10 or 2. Patent Document 2 discloses a water-soluble machining fluid composition for fixed abrasive wire saws, which is characterized in that it is used for cutting rare earth magnets, and contains glycols and carboxylic acids in predetermined amounts, and is dissolved in water to display A basic compound and water (however, the total of these components is 100 parts by weight). A brittle material processing fluid is disclosed in Patent Document 3, which contains, in predetermined amounts, selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and acetylene glycol with an HLB value of 4 to 12. One or more of the group consisting of oxyalkylene adducts; non-ionic surfactants, which are ethylene oxide adducts with an HLB value of 6 or more and an ethylene oxide addition mole number of 5 or more in the molecular structure, and does not have an ethynyl group; and a carboxylic acid. Prior art literature patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2011-68884 Patent Document 2: Japanese Unexamined Patent Publication No. 2003-82335 Patent Document 3: Japanese Patent Laid-Open No. 2018-154762

Summary of the invention The problem to be solved by the invention Generally speaking, the aforementioned two wire saw processing methods use a multi-wire saw device because a plurality of silicon wafers are cut out from the aforementioned silicon ingot at one time. In the multi-wire saw device, one wire is wound around each groove of two or more guide rollers engraved with a plurality of grooves at fixed intervals, and each wire is held in parallel at a constant tension. Then, when the cutting process is performed, each guide roller is rotated, and while the machining liquid sprayed from the nozzle etc. is attached to the wire, the wire is moved in one direction or two directions, and the silicon ingot is pressed against the attached machining fluid. The liquid wire is cut. The machining fluid used in the wire saw processing is put into a groove provided in the wire saw device, supplied from the groove to a nozzle in the processing chamber by a pump provided in the wire saw device, and is discharged from the nozzle. The machining fluid ejected from the nozzle is supplied aiming at the machining gap (the gap between the wire rod and the silicon ingot), used for lubrication of the machining gap, etc., and then returned to the groove. In this way, during the cutting process of the silicon ingot, the processing fluid circulates in the wire saw device. During the cutting process, the machining fluid may be violently scattered due to the high-speed rotation of the guide roller accompanying the increase in the linear speed of the wire rod, resulting in foaming of the machining fluid. Furthermore, during the cutting process, since the machining fluid flows down into the groove portion located at the lower part of the wire saw device, the machining fluid in the groove may foam violently and overflow from the groove. Furthermore, there is also the problem that the fine dust produced in the cutting process promotes the foaming of the machining fluid, and the wire saw and the cut wafers are seriously polluted by the dust, resulting in a heavy load for cleaning them. Bigger problem. Also, for example, in recent years, in the field of producing silicon wafers from silicon ingots, it is required to further improve productivity, cut off in a shorter time than the free abrasive method, and use thinner wire tools. For reasons such as yield rate, the fixed abrasive method is more and more commonly used.

Therefore, in addition to the moderate lubricity required in the past for the machining fluid, if the foaming when using the machining fluid can be suppressed and the cleanliness of powder chips can be improved, the production can be more stable and the machining accuracy can be improved. Also, as described above, in recent years, water-soluble processing fluids have been demanded. Therefore, there is a need for a machining fluid with a better balance of lubricity, defoaming properties, and cleaning properties.

The present invention was made in view of the above problems, and an object of the present invention is to provide a machining fluid excellent in lubricity, defoaming property, and cleaning property. means to solve problems

As a result of research by the present inventors, it was found that a machining fluid containing water and specified components, and the content of each component satisfies the specified range can solve the aforementioned problems. Each embodiment of the present invention was completed based on the above research results. That is, according to each embodiment of the present invention, the following [1] to [17] are provided. [1] A machining fluid comprising: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid. [2] The machining fluid as described in [1] above, wherein the content of component (A) is 0.200% by mass or less based on 100% by mass of the total amount of the machining fluid. [3] The machining fluid described in [1] or [2] above, wherein the content of the component (C) is 0.100% by mass or less based on 100% by mass of the total amount of the machining fluid. [4] The processing fluid described in any one of [1] to [3] above, wherein component (A) is a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, and contains ethylene oxide and The copolymerization site of propylene oxide, and does not have ethynyl groups. [5] The processing fluid described in any one of [1] to [4] above, wherein component (B) is a compound having a cloud point of 1% by mass aqueous solution of greater than 50°C and lower than 80°C, and contains ethylene oxide and The copolymerization site of propylene oxide, and does not have ethynyl groups. [6] The machining fluid described in any one of [1] to [5] above, wherein the ratio [(A)/(B)] of the content of component (A) to the content of component (B) is expressed by mass ratio 1.00 or more. [7] The machining fluid described in any one of [1] to [6] above, wherein the ratio of the total content of component (A) and component (B) to the content of component (C) [(A) + (B )/(C)] is 1.00 or more in mass ratio. [8] The machining fluid described in any one of [1] to [7] above, wherein the content of component (D) is 95.000 mass % or more and 99.979 mass % based on 100 mass % of the total amount of the machining liquid the following. [9] The working fluid according to any one of [1] to [8] above, which has a pH of 3.0 to 9.0. [10] The machining fluid described in any one of [1] to [9] above, which is used when machining a workpiece made of a brittle material with a wire rod. [11] The machining fluid as described in [10] above, wherein the wire rod is a fixed abrasive wire rod. [12] The machining fluid as described in [10] or [11] above, wherein the brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass. [13] A method of manufacturing the machining fluid described in any one of the aforementioned [1] to [12], comprising at least preparing the following components: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The foregoing manufacturing method is prepared in the following manner to obtain the machining fluid: Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid. [14] A composition for machining fluid, comprising: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more. [15] A method for producing the composition for processing fluids for brittle materials as described in [14] above, comprising at least blending the following components: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The aforementioned manufacturing method is formulated in the following manner to obtain the composition for machining fluid: Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more. [16] A brittle material processing fluid composition, comprising: an additive mixture containing the following components (A)~(C), and component (D): water; Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ; In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture. [17] A method for producing the brittle material processing fluid composition as described in [16] above, comprising at least preparing an additive mixture containing the following components (A) to (C), and component (D): water; Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ; The aforementioned manufacturing method is formulated in the following manner to obtain the brittle material processing fluid composition: In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture. Invention effect

According to the present invention, it is possible to provide a working fluid excellent in lubricity, defoaming properties, and cleaning properties.

form for carrying out the invention [processing fluid] A working fluid according to an embodiment of the present invention includes: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid. A machining fluid that satisfies all the aforementioned requirements, and has an excellent balance of lubricity, defoaming, and cleaning properties.

Also, in this specification, unless otherwise specified, the so-called "alkylene oxide (hereinafter also referred to as "AO") adduct" includes not only a compound to which monomeric alkylene oxide is added, but also a compound to which a plurality of alkylene oxides are added. , That is, polyoxyalkylene compounds. Hereinafter, the "ethylene oxide (hereinafter also abbreviated as "EO") adduct" and "propylene oxide (hereinafter also abbreviated as "PO") adduct" are also the same. In addition, the "HLB value" used in this specification means the value of HLB (Hydrophilic-Lipophilic Balance) calculated by the Griffin method. In addition, in this specification, the lower limit and the upper limit described stepwise about a preferable numerical range (for example, the range of content, etc.) can be combined independently, respectively. For example, with regard to the corresponding numerical range, the description of the lower limit of "preferably 10 or more, more preferably 20 or more, and more preferably 30 or more" and "preferably 90 or less, more preferably 80 or less" can also be included. , more preferably less than 60", after combining the "preferable lower limit (10)" and "even better upper limit (60)", set the appropriate range as "10 or more and 60 or less ". Similarly, after combining "an even better lower limit value (30)" and "preferable upper limit value (90)", the appropriate range may be set to "more than 30 and less than 90". Similarly, for example, "10-60" and "30-90" can also be set from the description of "preferably 10-90, more preferably 20-80, and still more preferably 30-60". In addition, unless otherwise stated, when "10-90" is simply stated about a preferable numerical range, it means the range of 10-90. Moreover, similarly, each of the numerical range to be satisfied and the preferable numerical range described step by step may be combined. For example, when the numerical range to be satisfied is more than 5 and less than 100, it is also possible to set the appropriate range as "Above 5 and below 60". Similarly, after combining the "preferable lower limit value (10)" and the upper limit value "100" to be satisfied, the appropriate range may be set as "more than 10 and less than 100". The combination of the numerical ranges and preferred numerical ranges that should be satisfied is the same as the combination of the aforementioned preferred numerical ranges. The numerical ranges and preferred numerical ranges are abbreviated as "5~100", "preferably 10~ 90" can also be combined in the same way. Each component contained in the machining fluid will be described below.

＜Ingredient (A)＞ Component (A) is a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and oxyalkylene other than ethylene oxide, and does not have an ethynyl group, and is preferably a 1% by mass aqueous solution The compound whose cloud point is not less than 20°C and not more than 50°C contains copolymerization sites of ethylene oxide and propylene oxide and does not have an ethynyl group. If the cloud point of the 1 mass % aqueous solution of component (A) is less than 20 degreeC, the solubility of component (A) to water will fall. On the other hand, the cloud point of a 1% by mass aqueous solution of component (A) that is greater than 50°C and below 80°C corresponds to component (B) described later, but when the aforementioned working fluid does not contain component (A), the working fluid Reduced lubricity. Therefore, from the viewpoint of obtaining a machining fluid with excellent lubricity, the cloud point of a 1% by mass aqueous solution of component (A) is preferably 22°C or higher, preferably 25°C or higher, more preferably 30°C or higher, and even more preferably 35°C or higher. °C or higher, preferably lower than 49°C, preferably lower than 48°C, more preferably lower than 47°C, even more preferably lower than 46°C. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, there are no special restrictions on their combinations. For example, regarding one aspect of component (A), the cloud point of a 1% by mass aqueous solution of component (A) should preferably be above 22°C and below 49°C, preferably 25°C Above 48°C, more preferably above 30°C and below 47°C, still more preferably above 35°C and below 46°C. In addition, the cloud point value of the 1 mass % aqueous solution of a component (A) is the value measured using the method described in the Example mentioned later.

The compound containing ethylene oxide and an oxyalkylene oxide other than ethylene oxide in the component (A) and having no ethynyl group may be a copolymer selected from EO and AO other than EO, or polyoxyethylene One or more of the group consisting of alkylene alkyl ethers.

The copolymer of EO and AO other than EO in component (A) is a copolymer of EO and AO other than EO described later, and the addition state of EO and AO other than EO can be random addition or block addition. In any of the compositions, random addition and block addition can also be mixed, but it is preferably a block addition copolymer. Regarding AO other than EO in component (A), examples include alkylene oxides having 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-butylene oxide, and 2,3-butylene oxide. alkenes, 1,3-butylene oxide, tetrahydrofuran. Regarding the copolymer of EO and AO other than EO in component (A), it is preferably a copolymer of EO and PO, more preferably a block copolymer of EO and PO (also known as "having a polyethylene glycol unit and a poly A block copolymer of propylene glycol units"), and more preferably a triblock copolymer of EO and PO (also known as "a triblock copolymer having polyethylene glycol units and polypropylene glycol units"). In addition, regarding the triblock copolymer of EO and PO, it may be a triblock copolymer (EO/PO/EO type) in which the terminal block is composed of EO and the middle block is composed of PO, or the terminal block may be A triblock copolymer composed of PO and a middle block composed of EO (so-called reverse type. PO/EO/PO type).

The polyoxyethylene alkylene alkyl ether of the component (A) includes EO and AO adducts other than EO of alcohols, preferably EO and PO adducts of alcohols. The alcohol may, for example, be an aliphatic alcohol having 1 to 24 carbon atoms. From the viewpoint of the balance between hydrophilicity and lipophilicity, the carbon number of the alcohol is preferably 1-14, preferably 1-10, more preferably 1-6, still more preferably 1-4, still more preferably 1 Or 2, and then more preferably 1. The aliphatic alcohol is preferably a primary alcohol or a secondary alcohol, preferably a primary alcohol. Moreover, it may be a straight chain, a branched chain, or a ring, but it is preferably a straight chain. As for the aliphatic alcohol, for example, methanol, ethanol, propanol, isopropanol, butanol, isobutanol, 2-methyl-2-butanol, pentanol, isoamyl alcohol, hexanol, 3-methyl alcohol, 1-pentanol, heptanol, 2-heptanol, 3-heptanol, octanol, 2-ethylhexanol, nonanol, decanol, undecyl alcohol, dodecanol, tridecanol, isodecaol Saturated aliphatic alcohols such as triol, myristyl alcohol, pentadecyl alcohol, hexadecanol, heptadecanol, stearyl alcohol, isostearyl alcohol, nonadecanol, and eicosanol; Unsaturated aliphatic alcohols such as dienyl alcohol, tridecenyl alcohol, tetradecenyl alcohol, hexadecenyl alcohol, oleyl alcohol, eicosyl alcohol, linolenic alcohol; ethyl cyclohexanol, propyl cyclohexanol, octyl Cycloaliphatic alcohols such as cyclohexanol, nonylcyclohexanol, and adamantanol.

Regarding AO other than the aforementioned EO in the polyoxyethylene alkylene alkyl ether of the component (A), examples include alkylene oxides having 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-Butene oxide, 2,3-Butene oxide, 1,3-Butene oxide, Tetrahydrofuran. Among them, PO is the best. In addition, in the polyoxyethylene alkylene alkyl ether of the component (A), at the copolymerization site of the aforementioned EO and AO other than EO, the addition mode of the EO and AO other than EO may be random addition and In any of block additions, random addition and block addition may be mixed.

Furthermore, the aforementioned polyoxyethylene alkylene alkyl ethers can be synthesized by adding EO and AO to the aforementioned alcohols, and the addition of EO and AO to alcohols can be carried out by known methods, and can also be carried out without or in the presence of a catalyst. Under normal pressure or under increased pressure, it can be carried out in one or more stages.

In addition, in the copolymerization site of EO and AO other than EO in the component (A), the content of the structural unit derived from EO is preferably 15 mol% or more, based on 100 mol% of the total amount of structural units constituting the copolymerization site. It is preferably more than 20 mol%, more preferably more than 25 mol%, and preferably less than 85 mol%, preferably less than 80 mol%, more preferably less than 75 mol%.

Also, from the viewpoint of improving lubricity, the mass average molecular weight (Mw) of component (A) is preferably 500 or more, preferably 1,000 or more, more preferably 1,500 or more, and still more preferably 2,000 or more. On the other hand, the mass average molecular weight (Mw) of component (A) is preferably 10,000 or less, preferably 9,000 or less, more preferably 8,000 or less, and still more preferably Below 6,000. In addition, the value of this mass average molecular weight (Mw) is the value measured using the method described in the Example mentioned later.

Component (A) may be used individually by 1 type, and may use it in combination of 2 or more types.

The content of component (A) is 0.010 mass % or more based on 100 mass % of the total amount of the aforementioned machining fluid. If the content is less than 0.010% by mass, the machining fluid has poor lubricity. Therefore, from the viewpoint of improving the lubricity of the machining fluid, based on 100% by mass of the total amount of the aforementioned machining fluid, the content of component (A) should be at least 0.015% by mass, preferably at least 0.020% by mass, and more preferably at least 0.020% by mass. It is 0.025 mass % or more, still more preferably 0.030 mass % or more, still more preferably 0.035 mass % or more. On the other hand, from the viewpoint of improving the defoaming properties of the working liquid, the content of component (A) is preferably 0.200 mass % or less, preferably 0.100 mass % or less, based on 100 mass % of the total amount of the aforementioned working liquid , more preferably 0.080% by mass or less, more preferably 0.075% by mass or less. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, their combinations are not particularly limited. For example, with regard to one aspect of the aforementioned processing fluid, the content of component (A) is preferably not less than 0.010% by mass and 0.200% by mass based on 100% by mass of the total amount of the aforementioned processing fluid. Mass % or less, preferably 0.015 mass % or more and 0.200 mass % or less, more preferably 0.020 mass % or more and 0.200 mass % or less, still more preferably 0.025 mass % or more and 0.100 mass % or less, still more preferably 0.030 mass % % or more and 0.080 mass % or less, more preferably 0.035 mass % or more and 0.075 mass % or less.

＜Ingredient (B)＞ Component (B) is a compound whose cloud point is greater than 50°C and lower than 80°C in a 1% by mass aqueous solution, contains copolymerization sites of ethylene oxide and oxyalkylene other than ethylene oxide, and does not have an ethynyl group, and is preferably a 1% by mass aqueous solution Compounds whose cloud point is greater than 50°C and less than 80°C contain copolymerization sites of ethylene oxide and propylene oxide and do not have ethynyl groups. A 1% by mass aqueous solution of component (B) whose cloud point is not more than 50°C and not less than 20°C is equivalent to the aforementioned component (A), but if the working fluid does not contain component (B), the cleaning performance of the working fluid is reduced. Therefore, from the viewpoint of obtaining a processing fluid with excellent cleaning properties, the cloud point of a 1% by mass aqueous solution of component (B) is preferably 55°C or higher, preferably 58°C or higher, more preferably 60°C or higher. On the other hand, if the cloud point of the 1% by mass aqueous solution of component (B) exceeds 80° C., the cleanability of the processing fluid will decrease. Therefore, from the viewpoint of obtaining a machining fluid with excellent cleaning properties, the cloud point of a 1% by mass aqueous solution of component (B) is preferably 75°C or lower, preferably 70°C or lower, more preferably 65°C or lower. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, there are no special restrictions on their combinations. For example, regarding one aspect of component (B), the cloud point of a 1% by mass aqueous solution of component (B) should preferably be above 55°C and below 75°C, preferably 58°C Above 70°C, more preferably above 60°C and below 65°C. In addition, the cloud point value of the 1 mass % aqueous solution of a component (B) is the value measured using the method described in the Example mentioned later.

The compound containing ethylene oxide and an oxyalkylene oxide other than ethylene oxide in the component (B) and having no ethynyl group may be a copolymer selected from EO and AO other than EO, or polyoxyethylene One or more of the group consisting of alkylene alkyl ethers. Among them, a copolymer of EO and AO other than EO is preferable.

In the copolymer of EO and AO other than EO in the aforementioned component (B), the addition state of the EO and AO other than EO may be any of random addition and block addition, and may also be present in admixture. Regular addition and block addition, but block addition copolymers are preferred. Regarding AO other than EO in the aforementioned component (B), examples include alkylene oxides having 3 or 4 carbon atoms, such as propylene oxide (PO), oxetane, 1,2-butylene oxide, 2,3-oxide Butene, 1,3-Butene Oxide, Tetrahydrofuran. Regarding the copolymer of EO and AO other than EO in the aforementioned component (B), it is preferably a copolymer of EO and PO, more preferably a block copolymer of EO and PO, and even more preferably a triblock of EO and PO The copolymer is more preferably a Pluronic type copolymer (EO-PO-EO type tri-block copolymer) in which ethylene oxide is added to polypropylene glycol.

In addition, in the copolymer of EO of the aforementioned component (B) and AO other than EO, the content of the structural unit derived from EO is preferably 25 mol% or more in the total amount of 100 mol% of the structural units constituting the aforementioned copolymer. , preferably more than 30 mol%, more preferably more than 35 mol%, more preferably more than 40 mol%, and preferably less than 75 mol%, preferably less than 70 mol%, more preferably 65 mole % or less, more preferably 60 mole % or less.

The polyoxyethylene alkylene alkyl ether of the component (B) is the same as that described for the polyoxyethylene alkylene alkyl ether of the component (A) except that the cloud point is different, and its preferred embodiment Also the same.

Also, from the viewpoint of improving lubricity, the mass average molecular weight (Mw) of component (B) is preferably 500 or more, preferably 1,000 or more, more preferably 1,500 or more, and still more preferably 2,000 or more. On the other hand, the mass average molecular weight (Mw) of component (B) is preferably 10,000 or less, preferably 9,000 or less, more preferably 8,000 or less, and still more preferably Below 6,000. In addition, the value of this mass average molecular weight (Mw) is the value measured using the method described in the Example mentioned later.

Component (B) may be used individually by 1 type, and may use it in combination of 2 or more types.

The content of component (B) is 0.005% by mass or more based on 100% by mass of the total amount of the aforementioned machining fluid. If the content is less than 0.005% by mass, the cleaning property of the working fluid is poor. Therefore, from the viewpoint of improving the cleanliness of the machining fluid, based on 100% by mass of the total amount of the aforementioned machining fluid, the content of component (B) should be at least 0.010% by mass, preferably at least 0.012% by mass, and more preferably at least 0.012% by mass. 0.015% by mass or more. On the other hand, the content of component (B) is preferably 0.090% by mass or less based on 100% by mass of the total amount of the aforementioned machining fluid. If the content exceeds 0.090% by mass, the lubricity of the machining fluid is poor. Therefore, from the viewpoint of improving the lubricity of the machining fluid, based on 100% by mass of the total amount of the aforementioned machining fluid, the content of component (B) is preferably 0.080% by mass or less, preferably 0.050% by mass or less, more preferably 0.030% by mass or less. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, their combinations are not particularly limited. For example, with regard to one aspect of the aforementioned machining fluid, based on the total amount of the aforementioned machining fluid of 100% by mass, the content of component (B) is preferably not less than 0.010% by mass and 0.080% by mass. % by mass or less, preferably not less than 0.012 mass % and not more than 0.050 mass %, more preferably not less than 0.015 mass % and not more than 0.030 mass %.

Also, from the viewpoint of improving the lubricity of the machining fluid, the ratio [(A)/(B)] of the content of the aforementioned component (A) in the aforementioned machining fluid to the content of the aforementioned component (B) is preferably expressed as a mass ratio 1.00 or more, preferably 1.50 or more, more preferably 2.00 or more. On the other hand, from the viewpoint of improving the cleanliness and machining accuracy of the machining fluid, the ratio [(A)/(B)] of the content of the aforementioned component (A) in the aforementioned machining fluid to the content of the aforementioned component (B) is, In terms of mass ratio, it is preferably 20.00 or less, preferably 15.00 or less, more preferably 10.00 or less.

＜Ingredient (C)＞ Component (C) is at least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 . When the aforementioned working fluid does not contain component (C), the defoaming property and cleanability of the working fluid deteriorate. Here, as mentioned above, when the component (B) is not included, the cleanability of the working fluid deteriorates, but a working fluid with good cleanability cannot be obtained when only one of the components is included. That is, by including both the component (B) and the component (C), a working fluid having good cleaning properties can be obtained. Therefore, by including all of the component (A), component (B) and component (C) in a predetermined amount, a machining fluid excellent in lubricity, defoaming property and cleanability can be obtained.

Also, if the HLB value of the component (C) is less than 4, the solubility of the component (C) to water is poor. Therefore, from the viewpoint of improving the solubility of the component (C) in water, the HLB value of the component (C) is preferably 5 or more, preferably 6 or more, more preferably 7 or more. On the other hand, when the HLB value of the component (C) exceeds 12, the defoaming property and cleanability of the processing fluid deteriorate. Therefore, the HLB value of component (C) is preferably 11 or less, preferably 10 or less, more preferably 9 or less, from the viewpoint of improving the defoaming and cleaning properties of the working fluid. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, there is no particular limitation on their combinations. For example, regarding an aspect of component (C), the HLB value of component (C) is preferably 5 or more and 11 or less, preferably 6 or more and 10 or less, more preferably 7 or more and 9 or less. Moreover, the HLB value of a component (C) is the value computed by the Griffin's method as mentioned above.

The compound represented by the following general formula (1) is mentioned about said acetylene diol.

[chemical formula 1]

In the general formula (1), R ¹ to R ⁴ each independently represent an alkyl group having 1 to 5 carbon atoms. Regarding the alkyl group having 1 to 5 carbon atoms that can be adopted for R ¹ to R ⁴ , specific examples include: methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, secondary Butyl, tertiary butyl, n-pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutyl, 1,1-dimethylpropyl, 1,2-dimethyl Propyl, 2,2-Dimethylpropyl. Among them, R ¹ and R ³ are preferably isobutyl or 3-methylbutyl. Also, R ² and R ⁴ are preferably methyl groups. Also, with regard to the compound represented by the general formula (1), it is preferably a compound having the same structure of R ¹ and R ³ or a structure of R ² and R ⁴ being the same as each other, more preferably having the same structure of R ¹ and R ³ , and R ² and R ⁴ are compounds having the same structure as each other.

Also, as for the alkylene oxide adducts of the above-mentioned acetylene diol, preferably, the alkylene oxide adducts of the compounds represented by the general formula (1) having AO added to each hydroxyl group of the compound represented by the general formula (1) can be exemplified. More preferably, it is an alkylene oxide adduct of a compound represented by the general formula (1) to which EO and/or PO is added, and even more preferably an alkylene oxide adduct of a compound represented by the general formula (1) to which EO is added . In addition, the preferable aspect of the acetylene diol which forms the alkylene oxide adduct of this acetylene diol is the same as the preferable aspect of the compound represented by general formula (1) mentioned above. Also, when including a structure to which a structure derived from EO (such as an ethylenyloxy group or a poly(oxyethylene) structure) and a structure derived from PO (such as a propyleneoxy group or a poly(oxypropylene) structure) are bonded, each The structures may be bonded to each other in a random type or in a block type, preferably a block type.

Component (C) includes: 2,5,8,11-tetramethyl-6-dodedecyne-5,8-diol, 5,8-dimethyl-6-dodedecyn-5, 8-diol, 2,4,7,9-tetramethyl-5-dodedecyn-4,7-diol, 8-hexadeyn-7,10-diol, 7-tetradecyn-6 ,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-Dimethyl-3-hexyne-2,5-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol, and 3,6-diol Acetylene glycol represented by the general formula (1) such as methyl-4-octyne-3,6-diol; and an alkylene oxide adduct of the acetylene glycol represented by the general formula (1), etc. EO and/or PO etc. are mentioned about this alkylene oxide. Among them, it is preferably selected from 2,5,8,11-tetramethyl-6-dodedecyn-5,8-diol, 5,8-dimethyl-6-dodedecyn- 5,8-diol, 2,4,7,9-tetramethyl-5-dodecyn-4,7-diol, 8-hexadecane-7,10-diol, 7-tetradecyne -6,9-diol, 2,3,6,7-tetramethyl-4-octyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol alcohol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol and 3,6- One or more alkylene oxide adducts in the group consisting of dimethyl-4-octyne-3,6-diol, preferably selected from 2,5,8,11-tetramethyl- 6-Dodedecyn-5,8-diol, 5,8-Dimethyl-6-dodeyn-5,8-diol, 2,4,7,9-tetramethyl-5-dodeca Alkyne-4,7-diol, 8-hexadecane-7,10-diol, 7-tetradecyn-6,9-diol, 2,3,6,7-tetramethyl-4-octane Alkyne-3,6-diol, 3,6-diethyl-4-octyne-3,6-diol, 2,5-dimethyl-3-hexyne-2,5-diol, 2 , one of the group consisting of 4,7,9-tetramethyl-5-decyne-4,7-diol and 3,6-dimethyl-4-octyne-3,6-diol The above ethylene oxide adducts are more preferably selected from 2,5,8,11-tetramethyl-6-dodecyn-5,8-diol ethylene oxide adducts and 2,4, One or more of the group consisting of ethylene oxide adducts of 7,9-tetramethyl-5-decyne-4,7-diol, more preferably 2,5,8,11-tetramethyl - Ethylene oxide adduct of 6-dodecyne-5,8-diol. In addition, a component (C) may be used individually by 1 type, and may use it in combination of 2 or more types.

The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the aforementioned machining fluid. If the content is less than 0.006% by mass, the cleanability of the working fluid deteriorates. From the viewpoint of obtaining excellent cleanability of the machining fluid, the content of component (C) is preferably 0.007 mass % or more, preferably 0.008 mass % or more, more preferably 0.009 mass % based on 100 mass % of the total amount of the aforementioned machining liquid Mass% or more. On the other hand, from the viewpoint of improving the solubility of component (C) in water, the content of component (C) is preferably 0.100% by mass or less, preferably 0.070% by mass, based on 100% by mass of the total amount of the aforementioned processing fluid Mass % or less, more preferably 0.050 mass % or less, still more preferably 0.030 mass % or less. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, their combinations are not particularly limited. For example, with regard to one aspect of the aforementioned machining fluid, based on the total amount of the aforementioned machining fluid of 100% by mass, the content of component (C) is preferably not less than 0.006% by mass and 0.100% by mass. Mass % or less, preferably 0.007 mass % or more and 0.070 mass % or less, more preferably 0.008 mass % or more and 0.050 mass % or less, still more preferably 0.009 mass % or more and 0.030 mass % or less.

In addition, in the aforementioned processing liquid, the ratio [(A)+(B)/(C)] of the total content of the aforementioned component (A) and component (B) to the content of the component (C) is preferably 1.00 in terms of mass ratio Above, preferably above 1.20, more preferably above 1.30, preferably below 20.00, preferably below 15.00, more preferably below 12.00.

＜Ingredient (D)＞ The water used as component (D) is not particularly limited, and purified water such as distilled water, ion-exchanged water (deionized water) can be used; tap water; industrial water, etc., preferably purified water, more preferably ion-exchanged water (deionized water) ).

For example, from the viewpoint of improving the flame retardancy of the aforementioned machining fluid to improve safety, and from the perspective of lowering the viscosity of the machining fluid to improve workability, based on 100% by mass of the total amount of the aforementioned machining fluid, the components ( The content of D) is preferably at least 95.000 mass %, preferably at least 97.500 mass %, more preferably at least 99.500 mass %, even more preferably at least 99.600 mass %. Then, from the viewpoint of ensuring the amount of component (A), component (B) and component (C) in the aforementioned machining fluid, it is 99.979% by mass or less, preferably 99.965% by mass or less, preferably 99.950% by mass or less, More preferably, it is 99.945 mass % or less, More preferably, it is 99.930 mass % or less. Here, in this specification, the "additive mixture in the working fluid" refers to the total components after removing water as the component (D) from the aforementioned working fluid.

＜Other ingredients＞ In addition to the aforementioned components (A) to (D), the aforementioned machining fluid may further contain other components within the range that does not interfere with the purpose of the present invention. Other components include surfactants, pH adjusters, water retention enhancers, defoamers, metal deactivators, bactericides and preservatives, antirust agents other than compounds corresponding to components (A) to (C). additives, antioxidants, etc. These additives can be used individually or in combination of 2 or more types, respectively. In addition, among these additives, preferably one or more selected from the group consisting of surfactants other than components (A) to (C), pH adjusters, and water retention enhancers, or more Preferably, it is one or more types selected from the group consisting of a water retention enhancer and a pH adjuster, and more preferably a pH adjuster. In addition, these additives may be used individually by 1 type, and may use it in combination of 2 or more types.

Surfactants other than compounds corresponding to components (A) to (C) include: anionic surfactants, cationic surfactants, nonionic surfactants other than compounds corresponding to components (A) to (C) agents, and amphoteric surfactants, etc. As for the anionic surfactant, alkylbenzene sulfonate, α olefin sulfonate, etc. are mentioned. As for the cationic surfactant, quaternary ammonium salts such as alkyltrimethylammonium salts, dialkyldimethylammonium salts, and alkyldimethylbenzylammonium salts, etc. are mentioned. Regarding nonionic surfactants other than the compounds corresponding to components (A) to (C), examples include: polyoxyethylene alkyl ethers; polyoxyalkylene alkyl ethers (among which, polyoxyalkylene alkyl ethers The site does not contain a structure derived from ethylene oxide); ethers such as polyoxyethylene alkylphenyl ether; compounds whose cloud point is less than 20°C and greater than 80°C in a 1% by mass aqueous solution, including ethylene oxide and other than ethylene oxide The copolymerization site of oxyalkylene without ethynyl group; acetylene glycol with HLB value less than 4 and greater than 12; oxyalkylene adduct of acetylene glycol with HLB value less than 4 and greater than 12; fatty acid alkanolamide Isoamide etc. The amphoteric surfactant may, for example, be betaine-based alkyl betaines or the like.

The pH adjuster is mainly used to adjust the pH of the processing fluid. As the pH adjuster, various acid components or alkali components can be exemplified, and by adjusting the content ratio of these components, the pH of the processing liquid can be adjusted appropriately. Furthermore, the acid component and the base component may react with each other to form a salt. Therefore, when an acid component and an alkali component are used as a pH adjuster, when the reactant of the acid component and the alkali component exists in the aforementioned processing fluid, as described above, the ratio of the reactant of the acid component and the alkali component can also be calculated. The calculated contents of the acid component and the base component contribute to the reaction. In addition, at this time, instead of the reactant, it can be regarded as containing the acid component and the base component before the reaction.

Regarding the acid component used as a pH adjuster, for example, various fatty acids such as lauric acid, stearic acid, oleic acid, linoleic acid, linolenic acid, neodecanoic acid, isononanoic acid, capric acid, and isostearic acid are listed; Carboxylic acids such as acetic acid, malic acid, and citric acid; Polymer acids such as polyacrylic acid and their salts; Inorganic acids such as phosphoric acid. Among these, fatty acids are preferred, fatty acids with carbon numbers below 12 such as neodecanoic acid, isononanoic acid, capric acid, and dodecanedioic acid are more preferred, and fatty acids selected from neodecanoic acid, isononanoic acid, etc. One or more species from the group consisting of nonanoic acid, capric acid and dodecanedioic acid.

As for the alkali component used as a pH adjuster, for example, monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, tri-n-propanolamine, tri-n-butyl Alcoholamine, triisobutanolamine, tri-tertiary butanolamine, N-methylethanolamine, N-ethylethanolamine, N-butylethanolamine, N-cyclohexylethanolamine, N-methyldiethanolamine, N- Ethyldiethanolamine, N-cyclohexyldiethanolamine, N,N-dimethylethanolamine, N,N-diethylethanolamine and other alkanolamines; methylamine, dimethylamine, ethylamine, diethylamine, propylamine, Alkylamines such as dipropylamine; ammonia. Among these, it is preferably a tertiary amine, more preferably at least 1 selected from the group consisting of triethanolamine, triisopropanolamine, N-methyldiethanolamine, and N-cyclohexyldiethanolamine. kind.

Regarding the water retention improving agent, for example, ethylene glycol, propylene glycol, 1,4-butanediol, hexamethylene glycol, neopentyl glycol, diethylene glycol, triethylene glycol, dipropylene glycol, triethylene glycol, Propylene glycol, glycerin, their ester derivatives, their ether derivatives; polyethylene glycol, polypropylene glycol, etc. Examples of the antifoaming agent include silicone oil, fluorosilicone oil, polyether polysiloxane, and fluoroalkyl ether. As for the metal deactivator, for example, imidazoline, pyrimidine derivatives, thiadiazole and benzotriazole are mentioned. Regarding the fungicides and preservatives, examples include parabens (paraben esters), benzoic acid, salicylic acid, sorbic acid, dehydroacetic acid, p-toluenesulfonic acid, and salts thereof class, and phenoxyethanol. As for the rust inhibitor, for example, alkylbenzenesulfonate, dinonylnaphthalenesulfonate, alkenylsuccinate, and polyol ester are mentioned. As for antioxidant, a phenolic antioxidant and an amine antioxidant are mentioned, for example.

When the aforementioned processing fluid contains other components, based on the total amount of the aforementioned processing fluid of 100% by mass, the total content of other components in the aforementioned processing fluid is preferably at least 0.0001% by mass, preferably at least 0.0002% by mass, more preferably at least 0.0002% by mass. 0.0003 mass % or more, more preferably 0.0004 mass % or more, and preferably 0.0800 mass % or less, preferably 0.0500 mass % or less, more preferably 0.0100 mass % or less, still more preferably 0.0050 mass % or less, even more preferably 0.0010% by mass or less.

Also, when the aforementioned processing liquid contains a pH adjuster as another component, the total content of the pH adjuster in the aforementioned processing liquid is preferably 0.0001% by mass or more, preferably 0.0002% by mass, based on 100% by mass of the total amount of the aforementioned processing liquid. Mass % or more, more preferably 0.0003 mass % or more, and preferably 0.0100 mass % or less, preferably 0.0050 mass % or less, more preferably 0.0010 mass % or less, more preferably 0.0008 mass % or less.

Also, from the viewpoint of improving lubricity, defoaming properties, and cleanability, based on 100% by mass of the total amount of the aforementioned machining fluid, the component (A), component (B), and component (C) in the aforementioned machining fluid and the total content of component (D) is preferably at least 99.9200 mass %, preferably at least 99.9500 mass %, more preferably at least 99.9900 mass %, still more preferably at least 99.9950 mass %, even more preferably at least 99.9990 mass %, and Preferably it is 100.0000 mass % or less, preferably 99.9999 mass % or less, more preferably 99.9998 mass % or less, still more preferably 99.9997 mass % or less, still more preferably 99.9996 mass % or less.

Also, when the aforementioned machining fluid is used for machining brittle materials, the pH of the aforementioned machining fluid is preferably 3.0 or higher, preferably 3.0 or higher, from the viewpoint of suppressing corrosion of wire rods and processing equipment, etc. 4.0 or more, more preferably 5.0 or more. On the other hand, the pH of the working liquid is preferably 9.0 or less, preferably 8.0 or less, more preferably 7.0 or less, from the viewpoint of suppressing the generation of a large amount of hydrogen from powder chips during processing of silicon or the like. In addition, the pH value of this working liquid is the value measured using the method described in the Example mentioned later.

Also, for example, as described later, when the aforementioned machining liquid is used for the purpose of machining a workpiece made of a brittle material using a wire rod, from the viewpoint of easily suppressing the breakage of the wire rod that occurs during the cutting of the brittle material, the aforementioned machining The surface tension of the liquid is preferably 35 mN/m or less, preferably 34 mN/m or less, more preferably 33 mN/m or less. On the other hand, the surface tension of the aforementioned working fluid is preferably not less than 1 mN/m, preferably not less than 5 mN/m, more preferably not less than 10 mN/m. In addition, the surface tension of the machining fluid is a value measured by the method described in Examples described later.

[Manufacturing method of machining fluid] The manufacturing method of the aforementioned working fluid is to prepare at least the following components: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The foregoing manufacturing method is prepared in the following manner to obtain the machining fluid: Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid.

There is no special limitation on the order of ingredients (A)~components (D). For example, ingredients (A), ingredients (B) and ingredients (C) can be prepared sequentially or simultaneously with water as ingredient (D), or they can be prepared in advance. After preparing the component (A), the component (B) and the component (C), the mixture is prepared in the water which is the component (D). In addition, in this production method, component (A) to component (D) can also be compounded, and further other components can be compounded if necessary, and the compounding order and compounding method of each component compounded at this time are not particularly limited. Furthermore, component (A), component (B), component (C), component (D) and other components are the same as those described above in the column of processing fluid, and their preferred aspects are also the same, so they are omitted its detailed description. Also, regarding the preferred blending amounts of component (A), component (B), component (C), component (D) and other components and the preferred blending amount ratio between each component, due to the above-mentioned processing fluid respectively The respective contents and respective content ratios in the aforementioned working fluids described in the column of are the same, so detailed description thereof will be omitted.

[Use of machining fluid] The aforementioned machining fluid is suitable for use when using the aforementioned wire saw, preferably a fixed abrasive wire saw, to wire saw a material to be processed consisting of brittle materials such as silicon ingots. That is, the aforementioned machining fluid is suitable for use when machining a workpiece composed of a brittle material with a wire rod, and is more suitable for use when machining a workpiece composed of a brittle material with a fixed abrasive wire rod. Regarding the aforementioned brittle materials, for example, crystalline silicon, sapphire, gallium nitride, silicon carbide, neodymium magnets, crystals, and glass can be cited. From the viewpoint of effectively utilizing the excellent cleaning properties of the aforementioned machining fluid, the aforementioned machining fluid is more suitable for use when processing crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnets, crystal or glass, and further can Suitable for processing crystalline silicon, sapphire or silicon carbide.

[Processing method of brittle materials] A method of processing a brittle material according to an embodiment of the present invention is a method of processing a workpiece composed of the aforementioned brittle material such as a silicon ingot using the aforementioned machining fluid. Here, the machining liquid is used by supplying it to the workpiece and bringing it into contact with the workpiece. The working fluid lubricates between the workpiece and a working tool such as the wire saw. Furthermore, it is also used to remove swarf (dust), rust prevention of processed materials, cooling tools and processed materials, etc. The processing of brittle materials using the above-mentioned processing fluid specifically includes various processing such as cutting processing, grinding processing, punching processing, polishing, drawing processing, drawing processing, rolling processing, etc. Among them, preferred Cutting processing, grinding processing, more preferably cutting processing. As a brittle material to be processed, the above-mentioned materials can be mentioned. Furthermore, as mentioned above, the aforementioned machining fluid is suitable for use when cutting silicon ingots.

Here, more specifically, the wire saw processing methods of the two methods of the free abrasive grain method and the fixed abrasive grain method mentioned above use multiple wires to cut out a plurality of silicon wafers from the aforementioned silicon ingot at one time. Saw device. In the multi-wire saw device, one wire is wound around each groove of two or more guide rollers engraved with a plurality of grooves at fixed intervals, and each wire is held in parallel at a constant tension. Then, during the cutting process, each guide roller is rotated, and while the machining fluid sprayed from the nozzle etc. is attached to the wire, the wire is moved in one direction or two directions, and the silicon ingot is pressed against the surface to which the machining fluid adhered. The wire is cut. Also, if necessary, the workpiece itself, such as a silicon ingot, may be processed while being poured with the processing liquid. The machining fluid used for machining is stored in a tank or the like, and is transported from there to the aforementioned machining chamber nozzles by piping or the like. In addition, the machining fluid used in the cutting is recovered by the used machining fluid receiving tank and the like at the lower part of the cutting device. In addition, depending on the situation, it may be recycled in the device.

Then, the machining fluid according to one embodiment of the present invention contributes to improvement of machining accuracy and productivity (yield improvement) due to its excellent balance of lubricity, defoaming properties, and cleaning properties. Therefore, the aforementioned processing fluid according to one embodiment of the present invention is more suitable as a processing fluid used in such a processing method for brittle materials, among which, it is more suitable for cutting out silicon wafers from silicon ingots by using a fixed abrasive wire saw. The processing fluid used in the processing method is especially suitable as a processing method for cutting out silicon wafers from silicon ingots using a multi-wire device using a fixed abrasive wire saw. In addition, the above-mentioned processing fluid according to one embodiment of the present invention can also exert the above-mentioned excellent effect when using a wire rod (preferably a fixed abrasive wire rod) with a thinner wire diameter (wire shape) to cut out a silicon wafer from a silicon ingot. . Therefore, for example, it is more suitable for the processing method of cutting silicon wafers for solar cells from silicon ingots.

Here, the wire diameter of the wire used for processing brittle materials can be appropriately selected according to the application, for example, it is preferably 55 μm or less, preferably 54 μm or less, more preferably 53 μm or less, and preferably 30 μm or more, preferably 35 μm or more , more preferably 38 μm or more.

[processing device] A processing device for brittle materials according to one embodiment of the present invention is a processing device using the above-mentioned processing fluid according to one embodiment of the present invention, preferably a multi-wire cutting processing device, more preferably a multi-wire with a fixed abrasive wire saw The cutting processing device is more preferably a multi-wire cutting processing device equipped with a fixed abrasive wire saw for cutting silicon ingots.

[Composition for machining fluid] In addition, the processing liquid in one embodiment of the present invention may be obtained by diluting a concentrated liquid or a composition having the same composition as the concentrated liquid with water, and the concentrated liquid is concentrated by reducing the amount of water in the processing liquid. 20 times or more and 2,000 times or less. That is, when performing the aforementioned processing, the concentrate of the aforementioned processing fluid or the aforementioned composition for processing fluid having the same composition as the concentrate (hereinafter also simply referred to as "the composition for processing fluid") may be diluted to 20 times or more with water and After 2,000 times or less, it is used as the aforementioned processing fluid. For example, the aforementioned machining fluid may be formed into a composition for machining fluid and used in a form suitable for storage, transportation, and the like. Here, the "composition for processing fluid" in this specification is not limited to the one prepared by reducing the amount of water in the processing fluid and concentrating it as described above, but also includes those prepared on the premise of diluting with water to obtain a processing fluid. Composition. Furthermore, the composition prepared on the premise of being diluted with water to become a processing fluid also includes the following composition: just being diluted with water does not become the aforementioned processing fluid, but before the aforementioned processing is performed to become the aforementioned processing fluid. In the form of the above-mentioned range of each component of the liquid, a part of the components described later is added to the composition, and the amount is adjusted for use.

Regarding one embodiment of the aforementioned composition for working fluid, the following composition for working fluid can be exemplified, which includes: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more.

Moreover, in addition to the above-mentioned components (A)-(D), the said composition for machining fluids may further contain other components within the range which does not interfere with the object of this invention. In addition, in the above-mentioned composition for processing fluid, component (A), component (B), component (C) and component (D) and other components that can be added arbitrarily are the same as those described in the column of the above-mentioned processing fluid. The same, and its preferred form is also the same, so its detailed description is omitted. In addition, in the above-mentioned composition for working fluid, there is no particular limitation on the suitable content ranges of component (A), component (B), component (C) and component (D), and other components, but the composition for working fluid When the substance is diluted with water by 20 times or more and 2,000 times or less, it is preferably contained so as to satisfy the appropriate content ranges of the above-mentioned components in the column of the above-mentioned processing fluid.

For example, with regard to the composition for machining fluid according to one embodiment of the present invention described above, the following embodiments can be exemplified. [2-1] A composition for working fluid, comprising: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more. [2-2] In the composition for working fluid as described in [2-1] above, based on 100% by mass of the total amount of the composition for working fluid, the content of component (A) is preferably 1.000% by mass or more, preferably 2.500% by mass % or more, more preferably 5.000 mass % or more, and preferably 91.780 mass % or less, preferably 90.900 mass % or less, more preferably 89.250 mass % or less, more preferably 86.500 mass % or less. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, there is no particular limitation on their combinations. For example, regarding one aspect of the composition for working fluid described in [2-1] above, based on the total amount of the composition for working fluid 100% by mass, the composition The content of (A) is preferably not less than 0.200% by mass and not more than 91.780% by mass, preferably not less than 1.000% by mass and not more than 90.900% by mass, more preferably not less than 2.500% by mass and not more than 89.250% by mass, still more preferably 5.000% by mass Above and below 86.500% by mass. [2-3] The composition for working fluid as described in [2-1] or [2-2] above, wherein the content of component (B) is preferably 0.500% by mass or more based on 100% by mass of the total amount of the composition for working fluid , preferably more than 1.250 mass%, more preferably more than 2.500 mass%, and preferably less than 91.680 mass%, preferably less than 90.400 mass%, more preferably less than 88.000 mass%, more preferably less than 84.000 mass%. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, there is no particular limitation on their combinations. For example, regarding one aspect of the composition for machining fluid described in [2-1] or [2-2] above, the total amount of the composition for machining fluid mentioned above is 100% by mass. Based on %, the content of component (B) is preferably from 0.100% by mass to 91.680% by mass, preferably from 0.500% by mass to 90.400% by mass, more preferably from 1.250% by mass to 88.000% by mass, and then More preferably, it is 2.500 mass % or more and 84.000 mass % or less. [2-4] The composition for working fluid as described in any one of [2-1]~[2-3] above, wherein based on the total amount of the composition for working fluid 100% by mass, the content of component (C) is preferably 0.600 mass % or more, preferably 1.500 mass % or more, more preferably 3.000 mass % or more, and preferably 91.700 mass % or less, preferably 90.500 mass % or less, more preferably 88.250 mass % or less, more preferably 84.500 mass % Mass% or less. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, there is no particular limitation on their combinations. For example, with regard to one aspect of the composition for working fluid described in any one of [2-1] to [2-3] above, the composition for working fluid mentioned above is Based on the total amount of 100% by mass, the content of component (C) is preferably not less than 0.120% by mass and not more than 91.700% by mass, preferably not less than 0.600% by mass and not more than 90.500% by mass, more preferably not less than 1.500% by mass and not more than 88.250% by mass % or less, more preferably 3.000 mass % or more and 84.500 mass % or less. [2-5] The composition for working fluid according to any one of [2-1] to [2-4] above, wherein component (A) is a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, and Contains copolymerization sites of ethylene oxide and propylene oxide, and does not have ethynyl groups. [2-6] The composition for a working fluid according to any one of [2-1] to [2-5] above, wherein component (B) is a compound having a cloud point of a 1% by mass aqueous solution of more than 50°C and not more than 80°C, and Contains copolymerization sites of ethylene oxide and propylene oxide, and does not have ethynyl groups. [2-7] The composition for working fluid according to any one of [2-1] to [2-6] above, wherein the ratio of the content of component (A) to the content of component (B) [(A)/(B)] The mass ratio is preferably 1.00 or more, preferably 1.50 or more, more preferably 2.00 or more, and preferably 20.00 or less, preferably 15.00 or less, more preferably 10.00 or less. [2-8] The composition for working fluid as described in any one of [2-1] to [2-7] above, wherein the ratio of the total content of component (A) and component (B) to the content of component (C) [(A )+(B)/(C)], the mass ratio is preferably 1.00 or more, preferably 1.20 or more, more preferably 1.30 or more, and preferably 20.00 or less, preferably 15.00 or less, more preferably 12.00 or less. [2-9] The composition for working fluid as described in any one of [2-1] to [2-8] above, wherein based on the total amount of the composition for working fluid 100% by mass, the content of component (D) is preferably 8.000 mass % or more, preferably 9.000 mass % or more, more preferably 10.000 mass % or more, more preferably 12.000 mass % or more, preferably 99.580 mass % or less, preferably 97.900 mass % or less, more preferably 94.750 mass % Mass % or less, more preferably 89.500 mass % or less. [2-10] The composition for working fluid as described in any one of [2-1] to [2-9] above, wherein when the composition for working fluid further includes other components, the total amount of the composition for working fluid is 100% by mass Based on this, the total content of other components in the aforementioned composition for processing fluid is preferably at least 0.002% by mass, preferably at least 0.004% by mass, more preferably at least 0.006% by mass, even more preferably at least 0.008% by mass, and preferably It is 40.000 mass % or less, preferably 35.000 mass % or less, more preferably 30.000 mass % or less, still more preferably 27.000 mass % or less, still more preferably 25.000 mass % or less.

[2-11] The composition for working fluid as described in any one of [2-1] to [2-10] above, wherein when the composition for working fluid further contains a pH adjuster as another component, the composition for working fluid Based on the total amount of 100% by mass, the total content of the pH adjusters in the aforementioned composition for working fluid is preferably at least 0.002% by mass, preferably at least 0.003% by mass, more preferably at least 0.004% by mass, and preferably at least 20.000% by mass. Mass % or less, preferably 10.000 mass % or less, more preferably 2.000 mass % or less, still more preferably 1.600 mass % or less. [2-12] The composition for working fluid as described in any one of [2-1] to [2-11] above, wherein based on 100% by mass of the total amount of the composition for working fluid, in the composition for working fluid The total content of component (A), component (B), component (C) and component (D) is preferably 60.000 mass % or more, preferably 65.000 mass % or more, more preferably 70.000 mass % or more, and more preferably 73.000 mass % or more, more preferably 75.000 mass % or more, and preferably 100.000 mass % or less, preferably 99.998 mass % or less, more preferably 99.996 mass % or less, still more preferably 99.994 mass % or less, even more preferably It is 99.992% by mass or less. [2-13] The composition for working fluid as described in any one of [2-1] to [2-12] above, wherein the pH is preferably 3.0 or higher, preferably 4.0 or higher, more preferably 5.0 or higher, and preferably 9.0 or lower, Preferably it is 8.5 or less, More preferably, it is 8.0 or less. [2-14] The composition for a working fluid as described in any one of [2-1] to [2-13] above, which is used when machining a workpiece made of a brittle material with a wire rod. [2-15] The composition for machining fluid as described in [2-14] above, wherein the wire rod is a fixed abrasive wire rod. [2-16] The composition for machining fluid as described in [2-14] or [2-15] above, wherein the brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass.

[Manufacturing method of composition for machining fluid] The aforementioned composition for working fluid can be produced, for example, by the following production method. That is, the method for producing the composition for machining fluid described in any one of the aforementioned [2-1] to [2-16] is to prepare at least the following components: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The aforementioned manufacturing method is formulated in the following manner to obtain the composition for machining fluid: Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more.

There is no special limitation on the order of ingredients (A)~components (D). For example, ingredients (A), ingredients (B) and ingredients (C) can be prepared sequentially or simultaneously with water as ingredient (D), or they can be prepared in advance. After preparing the component (A), the component (B) and the component (C), the mixture is prepared in the water which is the component (D). In addition, in this production method, component (A) to component (D) can also be compounded, and further other components can be compounded if necessary, and the compounding order and compounding method of each component compounded at this time are not particularly limited. Furthermore, component (A), component (B), component (C), component (D) and other components are the same as those described above in the column of processing fluid, and their preferred aspects are also the same, so they are omitted its detailed description. Also, regarding the preferred blending amounts of component (A), component (B), component (C), component (D) and other components and the preferred blending amount ratio between each component, because they are also the same as those mentioned above in [ 2-1] to [2-16], the respective contents and respective content ratios in the aforementioned compositions for working fluids are the same, and therefore detailed description thereof will be omitted.

[How to use the composition for machining fluid] The aforementioned composition for working fluid is mainly used for preparing the aforementioned working fluid by diluting it with water as described above. That is, the method of using the composition for machining fluid in one embodiment of the present invention can be exemplified as follows: Dilute the above-mentioned composition for processing fluid with water to prepare the above-mentioned processing fluid in the following manner, and use the processing fluid to use the application of the processing fluid and the processing method for brittle materials described in the column of the above-mentioned processing fluid; the processing fluid Include: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The aforementioned method of use is to prepare the aforementioned working fluid in the following manner: Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid.

Therefore, the composition for machining fluid according to the embodiments described in [2-1] to [2-16] above can be further diluted with water, and the content of components (A) to (C) can be adjusted as necessary, It is used as a working fluid in one embodiment of the present invention described above. Regarding one embodiment of the processing fluid, for example: dilute the composition for processing fluid of the embodiment described in the aforementioned [2-1] to [2-16] with water, and adjust components (A) to ( C) content obtained as the processing fluid described in the aforementioned [1] to [12] embodiment. The dilution factor when diluting the composition for processing fluid with water as the component (D) is not particularly limited as long as the composition for processing fluid can be prepared, but calculated in terms of the total amount (mass) of the composition for processing fluid Preferably more than 20 times, preferably more than 100 times, more preferably more than 250 times, more preferably more than 500 times, and preferably less than 2,000 times, preferably less than 1,800 times, more preferably less than 1,500 times, and then More preferably, it is 1,000 times or less.

On the other hand, as mentioned above, for example, the composition for processing fluids of the embodiments described in [2-1] to [2-16] above can also be obtained in the form of a concentrated solution, which is the aforementioned The processing fluid according to one embodiment of the present invention is obtained by reducing the amount of water as the component (D) and concentrating it. As an example of an embodiment of the composition for processing fluid, the processing fluid of the embodiment described in [1] to [12] above is concentrated to 20 times or more by reducing the amount of component (D) by distillation or the like. and 2,000 times or less, the composition for machining fluid of the embodiment described in [2-1] to [2-16] above. The concentration ratio when reducing the water as component (D) from the aforementioned working liquid to concentrate is not particularly limited, but it is preferably 20 times or more, preferably 100 times or more, in terms of the total amount (mass) of the aforementioned working liquid , more preferably at least 250 times, more preferably at least 500 times, and preferably at most 2,000 times, preferably at most 1,800 times, more preferably at most 1,500 times, and even more preferably at most 1,000 times.

Also, regarding the use of the machining fluid obtained using the machining fluid composition described in [2-1] to [2-16] above, the processing method of brittle materials using the machining fluid obtained using the machining fluid composition, and Since the processing devices are also the same as those described in the corresponding items in the above-mentioned processing fluid column of one embodiment of the present invention, detailed description thereof will be omitted.

[Fluid composition for brittle materials] In addition, the following brittle material processing fluid compositions can be exemplified as the brittle material processing fluid composition according to an embodiment of the present invention. A brittle material processing fluid composition, comprising: an additive mixture containing the following components (A)~(C), and component (D): water; Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ; In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture.

In addition, the above-mentioned brittle material processing fluid composition may further contain other components in addition to the above-mentioned components (A) to (D) within the range that does not hinder the purpose of the present invention. In addition, in this brittle material processing fluid composition, component (A), component (B), component (C) and component (D), and other components that may be added arbitrarily are respectively the same as in the column of the aforementioned processing fluid The descriptions are the same, and the preferred aspects are also the same, so detailed description thereof is omitted.

More specifically, examples of the brittle material processing fluid composition according to one embodiment of the present invention include the following embodiments. [3-1] A brittle material processing fluid composition, comprising: an additive mixture containing the following components (A)~(C), and component (D): water; Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ; In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture. [3-2] In the brittle material processing fluid composition as described in [3-1] above, the content of component (A) is preferably 24.00% by mass or more, preferably 27.00% by mass based on 100% by mass of the total amount of the aforementioned additive mixture. Above, more preferably at least 30.00% by mass, more preferably at least 40.00% by mass, and preferably at most 80.50% by mass, preferably at most 79.50% by mass, more preferably at most 78.50% by mass. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, their combinations are not particularly limited. For example, regarding one aspect of the brittle material processing fluid composition described in [3-1] above, based on the total amount of the additive mixture 100% by mass, the component (A ) content is preferably not less than 20.00% by mass and not more than 80.50% by mass, preferably not less than 24.00% by mass and not more than 80.50% by mass, more preferably not less than 27.00% by mass and not more than 80.50% by mass, more preferably not less than 30.00% by mass and not more than 80.50% by mass 80.50 mass % or less, more preferably 40.00 mass % or more and 79.50 mass % or less, still more preferably 40.00 mass % or more and 78.50 mass % or less. [3-3] In the brittle material processing fluid composition described in [3-1] or [3-2] above, based on 100% by mass of the total amount of the additive mixture, the content of component (B) is preferably at least 6.50% by mass, It is preferably at least 8.00% by mass, more preferably at least 10.00% by mass, and is preferably at most 50.00% by mass, preferably at most 47.50% by mass, more preferably at most 45.00% by mass. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, their combinations are not particularly limited. For example, with regard to the aspect of the brittle material processing fluid composition described in the aforementioned [3-1] or [3-2], the total amount of the aforementioned additive mixture is 100% by mass. Based on the basis, the content of component (B) is preferably 6.50 mass % to 50.00 mass %, preferably 8.00 mass % to 47.50 mass %, more preferably 10.00 mass % to 45.00 mass %. [3-4] The brittle material processing fluid composition as described in any one of the aforementioned [3-1]~[3-3], wherein the content of component (C) is preferably 6.00% based on the total amount of the aforementioned additive mixture of 100% by mass Mass % or more, preferably 6.50 mass % or more, more preferably 7.00 mass % or more, preferably 55.00 mass % or less, preferably 50.00 mass % or less, more preferably 47.00 mass % or less, more preferably 42.00 mass % %the following. In addition, as mentioned above, the upper limit and lower limit of these numerical ranges can be combined independently. Therefore, their combinations are not particularly limited. For example, regarding one aspect of the brittle material processing fluid composition described in any one of the aforementioned [3-1]~[3-3], the total amount of the aforementioned additive mixture Based on 100% by mass, the content of component (C) is preferably 5.00% by mass to 55.00% by mass, preferably 6.00% by mass to 50.00% by mass, more preferably 6.50% by mass to 47.00% by mass , More preferably, it is not less than 7.00% by mass and not more than 42.00% by mass. [3-5] The brittle material processing fluid composition described in any one of [3-1] to [3-4] above, wherein component (A) is a compound having a cloud point of 1% by mass aqueous solution of not less than 20°C and not more than 50°C, And contains the copolymerization site of ethylene oxide and propylene oxide, and does not have ethynyl group. [3-6] The brittle material processing fluid composition described in any one of [3-1] to [3-5] above, wherein component (B) is a compound having a cloud point of a 1% by mass aqueous solution of greater than 50°C and less than 80°C, And contains the copolymerization site of ethylene oxide and propylene oxide, and does not have ethynyl group. [3-7] The brittle material processing fluid composition described in any one of [3-1] to [3-6] above, wherein the ratio of the content of component (A) to the content of component (B) [(A)/(B) ] The mass ratio is preferably 1.00 or more, preferably 1.50 or more, more preferably 2.00 or more, and preferably 20.00 or less, preferably 15.00 or less, more preferably 10.00 or less. [3-8] The brittle material processing fluid composition described in any one of the aforementioned [3-1]~[3-7], wherein the ratio of the total content of component (A) and component (B) to the content of component (C) [( A)+(B)/(C)], in terms of mass ratio, it is preferably 1.00 or more, preferably 1.20 or more, more preferably 1.30 or more, and preferably 20.00 or less, preferably 15.00 or less, more preferably 12.00 or less . [3-9] The brittle material processing fluid composition as described in any one of the aforementioned [3-1] to [3-8], wherein the component (A) in the aforementioned additive mixture is based on 100% by mass of the total amount of the aforementioned additive mixture , the total content of component (B) and component (C) is preferably at least 80.00% by mass, preferably at least 85.00% by mass, more preferably at least 90.00% by mass, still more preferably at least 95.00% by mass, even more preferably at least 99.00% by mass Mass % or more, and 100.00 mass % or less, preferably 99.90 mass % or less, preferably 99.80 mass % or less, more preferably 99.75 mass % or less, still more preferably 99.70 mass % or less. [3-10] The brittle material processing fluid composition described in any one of the aforementioned [3-1] to [3-9], wherein when the aforementioned brittle material processing fluid composition further includes other components, the total amount of the aforementioned additive mixture is 100% by mass Based on the basis, the total content of other components in the aforementioned brittle material processing fluid composition is preferably at least 0.10% by mass, preferably at least 0.20% by mass, more preferably at least 0.25% by mass, even more preferably at least 0.30% by mass, And it is preferably not more than 20.00 mass %, preferably not more than 15.00 mass %, more preferably not more than 10.00 mass %, still more preferably not more than 5.00 mass %, still more preferably not more than 1.00 mass %.

[3-11] The brittle material processing fluid composition as described in any one of [3-1] to [3-10] above, wherein the component (D) is preferably at least 8 parts by mass, preferably at least 8 parts by mass, relative to 100 parts by mass of the aforementioned additive mixture 9 parts by mass or more, more preferably 10 parts by mass or more, more preferably 11 parts by mass or more, more preferably 12 parts by mass or more, and preferably 1,000,000 parts by mass or less, preferably 500,000 parts by mass or less, more preferably It is not more than 250,000 parts by mass, more preferably not more than 200,000 parts by mass. [3-12] The brittle material processing fluid composition described in any one of [3-1] to [3-11] above, wherein the component (D) is preferably contained at least 1,000 parts by mass, preferably at least 100 parts by mass of the aforementioned additive mixture 2,000 parts by mass or more, more preferably 5,000 parts by mass or more, more preferably 10,000 parts by mass or more, more preferably 20,000 parts by mass or more, more preferably 25,000 parts by mass or more, and preferably 1,000,000 parts by mass or less, more preferably Preferably, it is 500,000 mass parts or less, More preferably, it is 250,000 mass parts or less, More preferably, it is 200,000 mass parts or less. [3-13] The brittle material processing fluid composition described in any one of [3-1] to [3-11] above, wherein the content of component (D) is preferably at least 8 parts by mass, preferably at least 8 parts by mass relative to 100 parts by mass of the aforementioned additive mixture 9 parts by mass or more, more preferably 10 parts by mass or more, more preferably 11 parts by mass or more, more preferably 12 parts by mass or more, and preferably 100,000 parts by mass or less, preferably 50,000 parts by mass or less, more preferably It is not more than 25,000 parts by mass, more preferably not more than 10,000 parts by mass, still more preferably not more than 5,000 parts by mass, still more preferably not more than 2,000 parts by mass, still more preferably not more than 1,000 parts by mass. [3-14] The brittle material processing fluid composition as described in any one of the aforementioned [3-1]~[3-13], wherein the pH is preferably above 3.0, preferably above 4.0, more preferably above 5.0, and preferably below 9.0 , preferably less than 8.0, more preferably less than 7.0. [3-15] The brittle material processing fluid composition described in any one of the aforementioned [3-1] to [3-14] is used when processing a workpiece composed of a brittle material with a wire rod. [3-16] The brittle material processing fluid composition as described in [3-15] above, wherein the wire is a fixed abrasive wire. [3-17] The brittle material processing fluid composition as described in [3-15] or [3-16] above, wherein the brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass.

[Manufacturing method of brittle material processing fluid composition] The aforementioned brittle material processing fluid composition can be produced, for example, by the following production method. That is, the production method of the brittle material processing fluid composition described in any one of the aforementioned [3-1] to [3-17] is to prepare at least an additive mixture containing the following components (A) to (C), and components ( D): water: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as The aforementioned manufacturing method is formulated in the following manner to obtain the brittle material processing fluid composition: In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture.

There is no special limitation on the order of ingredients (A)~components (D). For example, ingredients (A), ingredients (B) and ingredients (C) can be prepared sequentially or simultaneously with water as ingredient (D), or they can be prepared in advance. After preparing the component (A), the component (B) and the component (C), the mixture is prepared in the water which is the component (D). In addition, in this production method, component (A) to component (D) can also be compounded, and further other components can be compounded if necessary, and the compounding order and compounding method of each component compounded at this time are not particularly limited. Furthermore, component (A), component (B), component (C), component (D) and other components are the same as those described in the column of the processing fluid above, and their preferred forms are also the same, so they are omitted its detailed description. Also, with regard to the preferred formulation amounts of component (A), component (B), component (C), component (D) and other components and the preferred formulation amount ratio between each component, due to the above-mentioned in [3 Each content and each content ratio described in the columns of -1] to [3-17] are the same, so detailed description thereof is omitted.

In addition, regarding the use of the brittle material processing fluid composition described in [3-1]~[3-17] above, the processing method of brittle material using the brittle processing fluid composition, and the processing device, because they are also the same as those in this paper The contents described in the corresponding items in the column of the aforementioned machining fluid in one embodiment of the invention are the same, so detailed description is omitted. Example

Hereinafter, one embodiment of the present invention will be more specifically described using examples, but the present invention is not limited to these examples. In addition, each component and each physical property related to a machining fluid were evaluated according to the method shown below.

[Cloud point of 1% by mass aqueous solution] The cloud point of the 1% by mass aqueous solution of components (A) and (B) is introduced into a 200mL beaker with 100mL of the 1% by mass aqueous solution of the component to be measured, while using a magnetic stirrer (the length of the stirring bar: 30mm) at a rotational speed Stir the aqueous solution under the condition of 400rpm, while heating at a heating rate of 5°C/min until the temperature of the aqueous solution reaches the cloud point from 15°C, and measure the liquid temperature when the appearance of the aqueous solution is cloudy. In addition, the "cloud point" of the compound shown in following Table 1 and Table 2 means "the cloud point of 1 mass % aqueous solution" of the said compound.

[HLB value] As the HLB value of the component (C), the value calculated by the Griffin method was used.

[Mass average molecular weight] The mass average molecular weight (Mw) was determined using gel permeation chromatography (GPC). GPC uses two "TSKgel (registered trademark) SuperMultiporeHZ-M" manufactured by Tosoh Co., Ltd. as the column, tetrahydrofuran as the eluent, the detector uses a refractive index detector for measurement, and polystyrene as the standard sample. Mass average molecular weight (Mw).

[Surface Tension] The surface tension of each machining fluid obtained in Examples and Comparative Examples was measured according to the platinum plate method described in JIS K 2241:2017.

[pH value] The pH of each of the processing fluids obtained in Examples and Comparative Examples was evaluated using a glass electrode type hydrogen ion concentration indicator (model: HM-25R) manufactured by DKK Toa Co., Ltd.

[Silicon (Si) Friction Coefficient] Using the machining fluids obtained in Examples and Comparative Examples, a reciprocating dynamic friction test was performed under the following test conditions to measure the coefficient of friction. Reciprocating dynamic friction tester: "F-2100" manufactured by Orientec Co., Ltd. Ball: 3/16 inch SUJ2 Test temperature: 50°C Test board: polysilicon (surface polished to a mirror surface) Test plate temperature: 50°C Sliding speed: 20mm/sec Sliding distance: 2cm Reciprocating times: 50 times Load: 200g

[Evaluation of defoaming properties] Each processing fluid obtained in the examples and comparative examples was evaluated by the following method. Introduce 90mL of processing fluid into a measuring cylinder with a capacity of 100mL, cover the measuring cylinder, shake vigorously up and down 10 times, and measure the liquid level after standing for 20 seconds. In addition, the height of the liquid level is compared with the unit "mL" (every 0.5mL scale) using the scale of the graduated cylinder. At this time, when foaming occurs, the liquid level becomes higher, that is, the value of "mL" becomes larger, so the smaller the value of the liquid level (mL), the better the defoaming property. For example, when the liquid level becomes 93.5 mL due to foaming, 3.5 mL, which is an increase from the height of 90.0 mL before shaking the measuring cylinder, is defined as the liquid level, as shown in Tables 1 and 2 below.

[Evaluation of cleanliness] Each processing fluid obtained in the examples and comparative examples was evaluated by the following method. (Evaluation of fouling on the cylinder wall) Introduce 90mL of processing fluid and 0.5g of micropowder ("graphite powder", manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., special grade) into a measuring cylinder with a capacity of 100mL, cover the measuring cylinder, shake vigorously up and down 10 times, and use the following criteria Evaluate the degree of dirt on the upper part of the inner wall of the measuring cylinder. ･A: The dirt on the cylinder wall surface caused by fine powder is slight, and the background near the liquid surface can be seen through. ･B: Severe dirt on the cylinder wall surface caused by fine powder, and the background near the liquid surface cannot be seen through.

[Examples 1 to 8, and Comparative Examples 1 to 8] Each component was prepared so that it might become the composition shown in following Table 1 and 2, and each processing liquid of Examples 1-8 and Comparative Examples 1-8 was prepared. According to the aforementioned evaluation method, the processing fluids of each example and comparative example were evaluated. The obtained results are shown in Tables 1 and 2 below.

In addition, each component shown in following Table 1 and 2 represents the following compound, respectively. ＜Ingredient (A)＞ ･Compound A1: Polyoxyalkylene alkyl ether (terminal methyl group (terminal alkyl part), mass Average molecular weight (Mw)=4,597, EO/PO ratio (molar ratio)=42/58, cloud point of 1% by mass aqueous solution=43°C) ･Compound A2: Poly(oxypropylene)-poly(ethylene oxide)-poly(oxypropylene) type block copolymer (mass average molecular weight (Mw)=4,261, EO/PO ratio (molar ratio)=30/70, Cloud point of 1% by mass aqueous solution = 38°C) ･Compound A3: Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) type block copolymer (cloud point of 1% by mass aqueous solution=23°C)

＜Ingredient (B)＞ ･Compound B1: Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) type block copolymer (mass average molecular weight (Mw)=5,654, EO/PO ratio (molar ratio)=48/52, Cloud point of 1% by mass aqueous solution = 63°C) ･Compound B2: Poly(ethylene oxide)-poly(propylene oxide)-poly(ethylene oxide) type block copolymer (mass average molecular weight (Mw)=5,498, EO/PO ratio (molar ratio)=52/48, Cloud point of 1% by mass aqueous solution = 61°C)

＜Ingredient (C)＞ ･Compound C1: EO adduct of 2,5,8,11-tetramethyl-6-dodeyn-5,8-diol (EO adduct of acetylene diol, HLB=8) ＜Ingredient (D)＞ ･Ion exchanged water

＜Other ingredients＞ ･Compound S1: EO adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol (EO adduct of acetylene diol, HLB=13) ･pH adjuster 1: Isononanoic acid ･pH adjuster 2: Triisopropanolamine

[Table 1]

[Table 2]

As shown in Table 1, since the machining fluids of Examples 1 to 8 contain components (A) to (D), and contain components (A) to (C) in predetermined amounts, the lubricity, Excellent in both defoaming and cleaning properties, and confirmed to be a machining fluid with an excellent balance of lubricity, defoaming and cleaning properties. On the other hand, as shown in Table 2, since the machining fluids of Comparative Examples 1 to 8 did not contain any of Component (A), Component (B) and Component (C) (Comparative Examples 1, 3, 6 and 7) , or did not meet the requirement to contain components (A) to (C) at a specified content (comparative examples 2, 4, 5 and 8), so it was confirmed that any one of the characteristics of lubricity, defoaming and cleaning properties was poor. Using the machining fluid described in Example 1, using a multi-wire saw device with a fixed abrasive grain method, and using a fixed abrasive grain wire rod with a wire diameter of 52 μm, the silicon ingot was cut and processed, and the defoaming and cleaning properties of the machining fluid were confirmed during processing. excellent. In addition, it was also confirmed that the cutting precision of the silicon ingot was good, and the wire breakage rate was less than 5%. In addition, the above-mentioned "cutting accuracy" was evaluated by measuring the thickness variation of the cut out silicon wafer, that is, TTV (Total Thickness Variation). In Example 1, the average TTV of the silicon wafer obtained by cutting one silicon ingot was 15 μm, which was good. On the other hand, in Comparative Example 1, the average TTV value of the silicon wafer obtained by cutting one silicon ingot was greater than 15 μm. In addition, the aforementioned "wire breakage rate (unit: %)" is a value calculated from "the number of wire breakages/the number of silicon ingots cut x 100", for example, when cutting 100 silicon ingots , when wire breakage occurred during the processing of 5 silicon ingots, the estimated breakage rate was 5%. Industrial availability

The aforementioned working fluid according to one embodiment of the present invention has an excellent balance of lubricating properties, defoaming properties, and cleansing properties. Due to the excellent lubricity, it can be expected to improve the processing efficiency when cutting the workpiece composed of brittle materials such as silicon ingots, suppress the friction between the workpiece and the tool for processing the workpiece, and reduce the friction caused by processing. Frictional heat, prolonging the tool life effect. Furthermore, excellent processing accuracy can also be obtained when processing with a thinner wire rod. Also, for example, during the above-mentioned processing when the workpiece is cut and processed, the foaming of the processing liquid can be suppressed, and the processing liquid can be prevented from overflowing from the groove that receives the processing liquid due to foaming (generating overflow). ) problems, or adverse effects such as reduced processing accuracy due to foaming. In addition, since the cleanliness is excellent, for example, during the processing of cutting the workpiece as described above, it is possible to prevent contamination of processing machines such as cutting machines or the workpiece used for the processing with fine powder such as dust. The processed material. As a result, the processing machine and the processed product can be easily cleaned. As mentioned above, the machining fluid according to one embodiment of the present invention is excellent in balance of lubricity, defoaming property, and cleanability, so it can contribute to improving the cutting process of workpieces made of brittle materials such as silicon ingots. The productivity of the obtained products. Then, as mentioned above, the machining fluid according to one embodiment of the present invention is suitably used as a machining fluid for cutting and machining brittle materials such as silicon ingots. Furthermore, the machining fluid according to one embodiment of the present invention is excellent in balance among lubricity, defoaming properties, and cleaning properties, and can also suppress wire breakage, etc., and contribute to the improvement of machining accuracy and productivity (yield improvement), so It is more suitable as a coolant for the process of cutting silicon wafers from silicon ingots using fixed abrasive wires.

(none)

Claims (17)

A processing fluid comprising: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid. The machining fluid according to Claim 1, wherein the content of component (A) is 0.200% by mass or less based on 100% by mass of the total amount of the machining fluid. The machining fluid according to claim 1 or 2, wherein the content of component (C) is 0.100% by mass or less based on 100% by mass of the total amount of the machining fluid. The processing fluid according to any one of claims 1 to 3, wherein component (A) is a compound having a cloud point of 20°C or higher and 50°C or lower in a 1% by mass aqueous solution, and contains copolymerization sites of ethylene oxide and propylene oxide, and Does not have an ethynyl group. The processing fluid according to any one of claims 1 to 4, wherein component (B) is a compound having a cloud point of greater than 50°C and less than 80°C in a 1% by mass aqueous solution, and contains copolymerization sites of ethylene oxide and propylene oxide, and Does not have an ethynyl group. The machining fluid according to any one of claims 1 to 5, wherein the ratio [(A)/(B)] of the content of component (A) to the content of component (B) is 1.00 or more in mass ratio. The processing fluid according to any one of claims 1 to 6, wherein the ratio of the total content of component (A) and component (B) to the content of component (C) [(A)+(B)/(C)] is equal to or greater than The mass ratio is 1.00 or more. The machining fluid according to any one of claims 1 to 7, wherein the content of component (D) is not less than 95.000% by mass and not more than 99.979% by mass based on 100% by mass of the total amount of the machining fluid. The working fluid according to any one of claims 1 to 8, which has a pH of not less than 3.0 and not more than 9.0. The processing fluid according to any one of claims 1 to 9, which is used when processing a workpiece made of a brittle material with a wire rod. The machining fluid according to claim 10, wherein the wire is a fixed abrasive wire. The machining fluid according to claim 10 or 11, wherein the brittle material is crystalline silicon, sapphire, silicon carbide, gallium nitride, neodymium magnet, crystal or glass. A method of manufacturing a machining fluid according to any one of Claims 1 to 12, comprising at least preparing the following components: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The foregoing manufacturing method is prepared in the following manner to obtain the machining fluid: Based on 100% by mass of the total amount of processing fluid, the content of component (A) is 0.010% by mass or more; The content of component (B) is not less than 0.005% by mass and not more than 0.090% by mass based on 100% by mass of the total amount of the machining fluid; and, The content of the component (C) is 0.006% by mass or more based on 100% by mass of the total amount of the machining fluid. A composition for working fluid, comprising: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more. A method of manufacturing a composition for machining fluid according to claim 14, comprising at least preparing the following components: Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ;as well as Ingredient (D): water; The aforementioned manufacturing method is formulated in the following manner to obtain the composition for machining fluid: Based on 100% by mass of the total amount of the composition for machining fluids, the content of component (A) is 0.200% by mass or more; The content of component (B) is 0.100 mass % or more and 92.000 mass % or less based on 100 mass % of the total amount of the composition for machining fluid; and, Based on 100% by mass of the total amount of the composition for machining fluid, the content of component (C) is 0.120% by mass or more. A brittle material processing fluid composition, comprising: an additive mixture containing the following components (A)~(C), and component (D): water; Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a cloud point of greater than 50°C and less than 80°C in a 1% by mass aqueous solution, which contains a copolymerization site of ethylene oxide and an alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ; In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture. A method of manufacturing a brittle material processing fluid composition according to claim 16, comprising at least preparing an additive mixture containing the following components (A)~(C), and component (D): water; Component (A): a compound having a cloud point of 20°C to 50°C in a 1% by mass aqueous solution, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Ingredient (B): a compound having a 1% by mass aqueous solution whose cloud point is higher than 50°C and lower than 80°C, which contains copolymerization sites of ethylene oxide and alkylene oxide other than ethylene oxide, and does not have an ethynyl group; Component (C): At least one selected from the group consisting of acetylene glycol with an HLB value of 4 to 12 and an alkylene oxide adduct of acetylene glycol with an HLB value of 4 to 12 ; The aforementioned manufacturing method is formulated in the following manner to obtain the brittle material processing fluid composition: In the aforementioned additive mixture, Based on 100% by mass of the total amount of the aforementioned additive mixture, the content of component (A) is 20.00% by mass or more; The content of component (B) is not less than 5.00% by mass and not more than 53.50% by mass based on 100% by mass of the total amount of the aforementioned additive mixture; and, The content of the component (C) is 5.00% by mass or more based on 100% by mass of the total amount of the aforementioned additive mixture.