TW201422357A - 接合工具冷卻裝置及接合工具之冷卻方法 - Google Patents

接合工具冷卻裝置及接合工具之冷卻方法 Download PDF

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TW201422357A
TW201422357A TW102128066A TW102128066A TW201422357A TW 201422357 A TW201422357 A TW 201422357A TW 102128066 A TW102128066 A TW 102128066A TW 102128066 A TW102128066 A TW 102128066A TW 201422357 A TW201422357 A TW 201422357A
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bonding tool
cooling
ground
bonding
cooling device
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TWI576196B (zh
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Osamu Kakutani
Takatoshi Kawamura
Kohei Seyama
Akira Sato
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Shinkawa Kk
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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Abstract

縮短接合工具之冷卻時間。設在接合載台附近之接合工具冷卻裝置10，具備：框架12；以及冷卻構件16，包含具有接合工具61之前端面接地之接地面14a之接地板14、及安裝在接地板14之與接地面14a相反側之面之散熱片15；冷卻構件16係藉由支承機構20以繞沿著接地面14a之X軸、與沿著接地面14a之Y軸之二個軸旋轉自如之方式支承於框架12。

Description

接合工具冷卻裝置及接合工具之冷卻方法
本發明係關於一種使用熱硬化性樹脂將半導體晶片等電子零件構裝在基板上之接合工具冷卻裝置之構造及接合工具之冷卻方法。
藉由接合工具將半導體晶片等電子零件構裝在基板上之動作係經常地進行。近年來，使用下述接合方法，即在基板上預先塗布熱硬化性樹脂，此外按壓吸附於接合工具之半導體晶片，藉由接合工具內部之加熱器加熱吸附於前端之半導體晶片等電子零件，使熱硬化性樹脂硬化以接合半導體晶片與基板(例如，參照專利文獻1)。
專利文獻1：日本特開2004-47670號公報
然而，專利文獻1記載之熱硬化性樹脂在常溫下為黏度高之液體，但具有加熱後硬化之性質。因此，使高溫度狀態之半導體晶片接觸塗布在基板上之熱硬化性樹脂上後，與半導體晶片接觸之熱硬化性樹脂之上表面硬化，在充分地將內部之熱硬化性樹脂加熱硬化前，成為僅熱硬化性樹脂之外表面硬化之狀態，會有半導體晶片與基板無法良好地接合之情形。
因此，藉由熱硬化性樹脂將半導體晶片接合於基板時，即使在因先前接合而溫度上升後狀態之接合工具之前端吸附半導體晶片，其溫 度亦冷卻至成為使熱硬化性樹脂不硬化之溫度，之後，使半導體晶片吸附於接合工具之前端，將低溫度之半導體晶片按壓在熱硬化樹脂之表面後，藉由接合工具內部之加熱器及吸附固定基板之接合載台內部之加熱器加熱半導體晶片與基板與熱硬化性樹脂，使熱硬化性樹脂整體地硬化。
然而，使為了使熱硬化性樹脂硬化而上升至150~200℃程度之接合工具之溫度例如下降至常溫附近程度之溫度非常耗時，因此接合工具之冷卻時間對使用熱硬化性樹脂之接合步驟整體之時間造成大影響。
因此，本發明之目的在於縮短接合工具之冷卻時間。
本發明之接合工具冷卻裝置，具備：基體部；以及冷卻構件，包含具有接合工具之前端面接地之接地面之接地板、及安裝在接地板之散熱構件；冷卻構件係藉由以追隨接合工具前端面之方向之方式使接地面之方向可變之支承機構支承於基體部。
本發明之接合工具冷卻裝置中，較佳為，冷卻構件之熱容量較接合工具之熱容量大，較佳為，散熱構件係安裝於接地板之與接地面相反側之面，較佳為，散熱構件為散熱片；具備使散熱片冷卻之冷卻風扇，較佳為，支承機構以繞沿著接地面之第一軸、與沿著接地面且與第一軸正交之第二軸之二個軸旋轉自如之方式將接地板支承於基體部。
本發明之接合工具冷卻裝置中，較佳為，具備設於基體部且對前端面與接地面接觸之接合工具吹送冷卻空氣之冷卻嘴，較佳為，接地板之接地面，在接合工具之前端面接地時，從接合工具朝向接地板產生熱傳遞。
本發明之接合工具之冷卻方法，係使用接合工具冷卻裝置， 該接合工具冷卻裝置具備基體部、包含具有吸附電子零件之接合工具之前端面接地之接地面之接地板及安裝在接地板之散熱構件之冷卻構件，冷卻構件係藉由以追隨接合工具前端面之方向之方式使接地面之方向可變之支承機構支承於基體部；冷卻構件之熱容量較接合工具之熱容量大；具備使散熱構件冷卻之冷卻風扇；其特徵在於：在加熱接合工具以進行電子零件之接合之期間，藉由冷卻風扇將冷卻構件冷卻；在接合之後，使因加熱成為高溫之接合工具之前端面密合於溫度降低後之冷卻構件之接地面以進行接合工具之冷卻。
本發明達成可縮短接合工具之冷卻時間之效果。
10‧‧‧接合工具冷卻裝置
11‧‧‧安裝托架
12‧‧‧框架
13‧‧‧中間框架
14‧‧‧接地板
14a‧‧‧接地面
15‧‧‧散熱片
16‧‧‧冷卻構件
17,18‧‧‧冷卻空氣供應管
19‧‧‧冷卻嘴
20‧‧‧吹出孔
21‧‧‧托架
22‧‧‧冷卻風扇
23,24‧‧‧銷
25‧‧‧中心
26‧‧‧X軸
27‧‧‧Y軸
30‧‧‧XY台
40‧‧‧接合載台
50‧‧‧基板
60‧‧‧接合頭
61‧‧‧接合工具
62‧‧‧曲柄
63‧‧‧Z方向驅動部
70‧‧‧半導體晶片
100‧‧‧接合裝置
200‧‧‧支承機構
210‧‧‧樞軸支承機構
211‧‧‧凹陷
212‧‧‧支承銷
220‧‧‧彈簧支承機構
221‧‧‧彈簧
圖1係顯示設有本發明實施形態之接合工具冷卻裝置之接合裝置之說明圖。
圖2係顯示本發明實施形態之接合工具冷卻裝置之立體圖。
圖3係顯示本發明實施形態之接合工具冷卻裝置之剖面圖。
圖4係顯示本發明實施形態之接合工具冷卻裝置之接地板之安裝狀態之俯視圖。
圖5(a)、(b)係顯示本發明實施形態之接合工具冷卻裝置之動作之說明圖。
圖6係顯示本發明另一實施形態之接合工具冷卻裝置之剖面圖。
圖7係顯示本發明另一實施形態之接合工具冷卻裝置之俯視圖。
以下，在參照圖式說明本發明之接合工具冷卻裝置前，說明設有本發明實施形態之接合工具冷卻裝置之接合裝置100。
如圖1所示，接合裝置100具備上部與XY方向水平移動之XY台30、安裝在XY台30上之接合載台40、包含使接合工具61相對於接合載台40往接近分離方向(Z方向)移動之Z方向驅動部63與安裝在Z方向驅動部63且固定有接合工具61之曲柄62之接合頭60、及與接合載台40相鄰配置之接合工具冷卻裝置10。
接合裝置100之接合載台40在內部具備未圖示之加熱器，連接有未圖示之真空裝置，在其表面吸附固定基板50且能進行加熱。接合工具61亦連接於未圖示之真空裝置，在前端可吸附半導體晶片70。又，接合工具61亦在內部安裝有加熱器，可加熱吸附在前端之電子零件即半導體晶片70。
如圖2、圖3所示，本發明實施形態之接合工具冷卻裝置10具備基體部即框架12、及包含具有接合工具61之前端接地之接地面14a之接地板14與安裝在接地板14之與接地面14a相反側之面之散熱構件即散熱片15之冷卻構件16，接地板14係藉由支承機構200以接地面14a之方向可變之方式安裝在框架12。又，在框架12之側面安裝有透過托架21安裝且沿著接地面14a之表面附近從吹出孔20噴出冷卻空氣之冷卻嘴19、及對冷卻嘴19供應冷卻空氣之冷卻空氣供應管17,18。此外，框架12係藉由安裝托架11固定在圖1所示之XY台30之上。又，在冷卻構件16之散熱片15之下側配置有對散熱片15吹送冷卻空氣之冷卻風扇22。
如圖3、圖4所示，支承機構200係藉由四角環狀之中間框 架13與銷24構成，該中間框架13係以繞通過接地板14之中心25且與沿著接地面14a之X軸26正交之第二軸即Y軸27旋轉自如之方式藉由銷23安裝在框架12之四角開口之內側，該銷24係安裝在中間框架13之內側，繞通過接地板14之中心25且沿著接地面14a之第一軸即X軸26將接地板14支承成旋轉自如。是以，接地板14係以相對於框架12繞通過中心25之X軸26及Y軸27旋轉自如且接地面14a相對於框架12之方向或接地面14a之傾斜可變之方式被支承。又，如圖3所示，散熱片15固定在接地板14之下側之面(與接地面14a相反側之面)，與接地板14一體移動，因此包含接地板14與散熱片15之冷卻構件16，整體繞通過接地板14之中心25之X軸26及Y軸27旋轉自如。
接地板14之表面即接地面14a為接合工具61之前端面可密合之平面，包含接地板14與散熱片15之冷卻構件16之熱容量較接合工具61之熱容量大。
參照圖5說明以上述方式構成之接合工具冷卻裝置10之動作。
如圖5(a)所示，接合結束之接合工具61之溫度為例如150℃程度之高溫狀態。驅動圖1所示之XY台30使接合工具61之中心成為接合工具冷卻裝置10之中心。此時，接合工具冷卻裝置10之冷卻風扇22旋轉，對散熱片15如圖中箭頭C所示送出冷卻空氣，因此接地板14、散熱片15為大致常溫狀態。
如圖5(b)所示，驅動圖1所示之接合頭60之Z方向驅動部63使接合工具61如圖5(b)所示之箭頭A般往下方向(Z方向負側)移動，使 接合工具61之前端面與接地板14表面之接地面14a接觸。如參照圖3、圖4所說明，接地板14係藉由支承機構200以相對於框架12繞通過接地板14之中心25之X軸26、Y軸27旋轉自如之方式安裝於框架12，因此其接地面14a之傾斜(接地面14a之方向)追隨接合工具61之前端面之傾斜(前端面之方向)繞X軸26、Y軸27旋轉。藉此，接合工具61之前端面密合於接地面14a。接地板14與散熱片15一體地固定，因此接合工具61之前端面密合於接地面14a後，接合工具61之熱如圖5(b)之箭頭D所示，朝向保持常溫之接地板14、散熱片15流去。包含接地板14及散熱片15之冷卻構件16之熱容量較接合工具61之熱容量大，因此接合工具61之溫度急速下降。又，接合工具61之前端面密合於接地板14之接地面14a時，從安裝在框架12之橫之冷卻嘴19之吹出孔20往沿著接地面14a之方向(箭頭B方向)噴出冷卻空氣並碰觸接合工具61之前端，從接合工具61之外面亦進行冷卻。
使接合工具61密合於接地板14之接地面14a既定時間後，接合工具61之溫度降低至即使在前端吸附半導體晶片70，半導體晶片70之溫度亦不成為熱硬化性樹脂之硬化開始溫度之溫度，因此使半導體晶片70吸附於接合工具61之前端面，按壓於圖1所示之接合載台40之表面所吸附固定之基板50上之熱硬化性樹脂之上，藉由未圖示之設在接合工具61內部之加熱器加熱半導體晶片70，使熱硬化性樹脂硬化，將半導體晶片70固定於基板50。
另一方面，接合工具冷卻裝置10之冷卻風扇22，如圖5(a)所示，在接合工具61之前端面從接地板14之接地面14a離開後亦持續將冷卻空氣送至散熱片15，因此接地板14與散熱片15所構成之冷卻構件16， 在藉由接合工具61進行半導體晶片70之接合之期間，冷卻至常溫附近。
接著，使接合結束溫度為例如150℃程度之高溫之接合工具61之前端面再次密合於常溫附近之接地板14之接地面14a，藉此能在短時間進行接合工具61之冷卻。
如以上說明，本實施形態之接合工具冷卻裝置10，使高溫之接合工具61之前端面密合於常溫且熱容量大之冷卻構件16之接地面14a，藉此使接合工具61之熱往冷卻構件16移動，使接合工具61急速冷卻。又，藉由接合工具61進行接合之期間使冷卻構件16之溫度預先冷卻至常溫附近，藉此可謀求接合步驟之工時之縮短，可達到有效率地進行接合之效果。此外，接合工具61之前端面與冷卻構件16之接地面14a即使未完全密合，只要接觸成使接合工具61之熱往冷卻構件16移動，能使接合工具61急速冷卻之程度即可。
以上說明之實施形態中，雖說明接合裝置100係藉由XY台30使接合載台40往XY方向移動，但本發明之接合工具冷卻裝置10當然可適用於其他構成之接合裝置。例如，藉由以導軌搬送基板50之搬送機構使基板50往X方向移動，在導軌之間配置不移動之接合載台，使接合頭60能往Z方向與Y方向移動，在搬送基板之導軌外側於接合載台附近配置接合工具冷卻裝置10亦可，在導軌內側與接合載台相鄰設置亦可。又，在接合頭安裝其前端能往XYZ方向移動之接合臂，在接合臂之前端安裝接合工具之接合裝置之情形，只要為能藉由接合臂使接合工具移動之範圍內，則在接合載台附近之何處配置接合工具冷卻裝置10亦可。
又，本實施形態中，如圖3、圖4所示，雖說明藉由組合二 個銷23,24與中間框架13之支承機構200安裝於框架12，接地板14相對於XY之各軸旋轉自如，但只要接地板14相對於XY之各軸旋轉自如，則不限於本實施形態之構成，為以下所示之構成亦可。
以下，參照圖6、圖7說明本發明之另一實施形態。圖6、圖7中，對與參照圖1至圖5說明之實施形態相同之部分賦予相同符號以省略其說明。圖6所示之實施形態，係使參照圖1至圖5說明之實施形態之支承機構200為以設在框架12之支承銷212將設在接地板14下面之凹陷211加以樞軸支承之樞軸支承機構210。又，圖7所示之實施形態，係以彈簧221支承接地板14之四角之彈簧支承機構220。又，替代圖6所示之實施形態之樞軸支承機構210，以設在框架12之球面狀台座支承設在接地板14下面之球面狀凹陷亦可。圖6、圖7所示之實施形態，除了相對於XY各軸旋轉自如外，相對於Z軸亦旋轉自如。又，散熱片15只要以能使接地板14之熱散熱之方式與接地板14一體即可，如圖6所示，配置在接地板14之橫亦可。再者，冷卻構件16並非藉由散熱片15，而是例如藉由冷卻水在內部流動等空氣以外之冷媒冷卻亦可。
10‧‧‧接合工具冷卻裝置
11‧‧‧安裝托架
12‧‧‧框架
13‧‧‧中間框架
14‧‧‧接地板
14a‧‧‧接地面
15‧‧‧散熱片
16‧‧‧冷卻構件
17,18‧‧‧冷卻空氣供應管
19‧‧‧冷卻嘴
20‧‧‧吹出孔
21‧‧‧托架
22‧‧‧冷卻風扇
61‧‧‧接合工具
200‧‧‧支承機構

Claims (8)

  1. 一種接合工具冷卻裝置，具備：基體部；以及冷卻構件，包含具有接合工具之前端面接地之接地面之接地板、及安裝在該接地板之散熱構件；該冷卻構件係藉由支承機構支承於該基體部，該支承機構使該接地面之方向可變以追隨該接合工具前端面之方向。
  2. 如申請專利範圍第1項之接合工具冷卻裝置，其中，該冷卻構件之熱容量較該接合工具之熱容量大。
  3. 如申請專利範圍第1或2項之接合工具冷卻裝置，其中，該散熱構件係安裝於該接地板之與接地面相反側之面。
  4. 如申請專利範圍第1或2項之接合工具冷卻裝置，其中，該散熱構件為散熱片；具備使該散熱片冷卻之冷卻風扇。
  5. 如申請專利範圍第1或2項之接合工具冷卻裝置，其中，該支承機構將該接地板支承於該基體部成為繞沿著該接地面之第一軸、與沿著該接地面且與該第一軸正交之第二軸之二個軸旋轉自如。
  6. 如申請專利範圍第1或2項之接合工具冷卻裝置，其具備設於基體部且對該前端面與該接地面接觸之該接合工具吹送冷卻空氣之冷卻嘴。
  7. 如申請專利範圍第1或2項之接合工具冷卻裝置，其中，該接地板之該接地面，在該接合工具之該前端面接地時，從該接合工具朝向該接地板產生熱傳遞。
  8. 一種接合工具之冷卻方法，係使用接合工具冷卻裝置，該接合工具冷卻裝置具備基體部、包含具有吸附電子零件之接合工具之前端面接地之接地面之接地板及安裝在該接地板之散熱構件之冷卻構件，該冷卻構件係藉由以追隨該接合工具前端面之方向之方式使該接地面之方向可變之支承機構支承於該基體部；該冷卻構件之熱容量較該接合工具之熱容量大；具備使該散熱構件冷卻之冷卻風扇；其特徵在於：在加熱接合工具以進行電子零件之接合之期間，藉由該冷卻風扇將該冷卻構件冷卻；在該接合之後，使因加熱成為高溫之該接合工具之該前端面密合於溫度降低後之該冷卻構件之該接地面以進行該接合工具之冷卻。
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WO2014087740A1 (ja) 2014-06-12
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