WO2014087740A1 - ボンディングツール冷却装置およびボンディングツールの冷却方法 - Google Patents
ボンディングツール冷却装置およびボンディングツールの冷却方法 Download PDFInfo
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- WO2014087740A1 WO2014087740A1 PCT/JP2013/077759 JP2013077759W WO2014087740A1 WO 2014087740 A1 WO2014087740 A1 WO 2014087740A1 JP 2013077759 W JP2013077759 W JP 2013077759W WO 2014087740 A1 WO2014087740 A1 WO 2014087740A1
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- bonding tool
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/44—Joining a heated non plastics element to a plastics element
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
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- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
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Definitions
- the present invention relates to a structure of a bonding tool cooling apparatus for mounting an electronic component such as a semiconductor chip on a substrate using a thermosetting resin, and a bonding tool cooling method.
- thermosetting resin is applied on a substrate in advance, and a semiconductor chip adsorbed on a bonding tool is pressed on the substrate, and an electronic component such as a semiconductor chip adsorbed on the tip by a heater inside the bonding tool. Is used to bond the semiconductor chip and the substrate by curing the thermosetting resin (see, for example, Patent Document 1).
- thermosetting resin as described in Patent Document 1 is a liquid having a high viscosity at room temperature, but has a property of curing when heated. For this reason, when a high-temperature semiconductor chip is brought into contact with the thermosetting resin applied on the substrate, the upper surface of the thermosetting resin in contact with the semiconductor chip is cured, and the internal thermosetting is performed. Before the thermosetting resin is sufficiently heated and cured, only the outer surface of the thermosetting resin is cured, and the semiconductor chip and the substrate may not be bonded satisfactorily.
- thermosetting resin when a semiconductor chip is bonded to a substrate with a thermosetting resin, even if the semiconductor chip is adsorbed to the tip of a bonding tool whose temperature has been raised by the previous bonding, the temperature cures the thermosetting resin. After cooling to a temperature that does not allow the semiconductor chip to be adsorbed to the tip of the bonding tool, the low-temperature semiconductor chip is pressed against the surface of the thermosetting resin, and then the heater and substrate inside the bonding tool are adsorbed and fixed The semiconductor chip, the substrate, and the thermosetting resin are heated by a heater inside the bonding stage so that the thermosetting resin is entirely cured.
- thermosetting resin since it takes a considerable amount of time to reduce the temperature of the bonding tool raised to about 150-200 ° C. to cure the thermosetting resin to a temperature close to room temperature, for example, cooling the bonding tool Time has had a great influence on the time of the entire bonding process using a thermosetting resin.
- an object of the present invention is to shorten the cooling time of the bonding tool.
- a bonding tool cooling device is a bonding tool cooling device, and includes a base portion, a ground plate having a ground surface on which a tip surface of the bonding tool is grounded, and a heat radiating member attached to the ground plate.
- the cooling member is supported by the base portion by a support mechanism that can change the direction of the grounding surface so as to follow the direction of the front end surface of the bonding tool.
- the heat capacity of the cooling member is preferably larger than the heat capacity of the bonding tool, and the heat radiating member is attached to the surface opposite to the ground surface of the ground plate.
- the heat dissipating member is a heat dissipating fin and includes a cooling fan for cooling the heat dissipating fin
- the support mechanism is a first member along the ground plane.
- the ground plate is supported on the base body so as to be rotatable about two axes, which are the shaft and the second shaft orthogonal to the first shaft along the ground contact surface.
- the bonding tool cooling device includes a cooling nozzle that blows cooling air to the bonding tool that is provided on the base portion and whose tip surface is grounded to the grounding surface.
- the ground plane is also suitable for heat conduction from the bonding tool toward the ground plate when the tip surface of the bonding tool is grounded.
- the bonding tool cooling method of the present invention includes a base member, a ground plate having a ground surface on which a tip surface of the bonding tool that adsorbs an electronic component is grounded, and a heat radiating member attached to the ground plate, and a cooling member,
- the cooling member is supported by the base portion by a support mechanism that can change the direction of the grounding surface so as to follow the direction of the tip surface of the bonding tool, and the heat capacity of the cooling member is larger than the heat capacity of the bonding tool,
- the bonding tool tip is brought into close contact with the grounding surface of the cooling member whose temperature has been lowered. Performing the cooling, characterized by.
- the present invention has an effect that the cooling time of the bonding tool can be shortened.
- the bonding apparatus 100 includes an XY table 30 whose upper part moves horizontally in the XY direction, a bonding stage 40 mounted on the XY table 30, and a contact / separation direction (Z direction) with respect to the bonding stage 40. ), A bonding head 60 including a Z-direction drive unit 63 for moving the bonding tool 61, a shank 62 attached to the Z-direction drive unit 63 and to which the bonding tool 61 is fixed, and the bonding stage 40. And a bonding tool cooling device 10.
- the bonding stage 40 of the bonding apparatus 100 includes a heater (not shown) inside, and a vacuum apparatus (not shown) is connected to the substrate 50 so that the substrate 50 can be adsorbed and fixed to the surface and heated.
- the bonding tool 61 is also connected to a vacuum device (not shown) so that the semiconductor chip 70 can be adsorbed to the tip.
- the bonding tool 61 is also provided with a heater inside, and can heat the semiconductor chip 70 which is an electronic component adsorbed on the tip.
- the bonding tool cooling apparatus 10 of the present embodiment includes a frame 12 as a base portion, a ground plate 14 having a ground surface 14 a to which the tip of the bonding tool 61 is grounded, and a ground plate 14. And a cooling member 16 including a heat dissipating fin 15 that is a heat dissipating member attached to a surface opposite to the grounding surface 14a.
- the grounding plate 14 can change the direction of the grounding surface 14a by the support mechanism 200. As shown in FIG.
- a cooling nozzle 19 that is attached to the side surface of the frame 12 via a bracket 21 and blows cooling air from the blowout hole 20 along the vicinity of the surface of the ground contact surface 14a, and cooling that supplies the cooling air to the cooling nozzle 19 Air supply pipes 17 and 18 are attached.
- the frame 12 is fixed on the XY table 30 shown in FIG.
- a cooling fan 22 that blows cooling air to the heat radiation fins 15 is disposed below the heat radiation fins 15 of the cooling member 16.
- the support mechanism 200 is rotatable around a Y axis 27 that is a second axis that passes through the center 25 of the ground plate 14 and is orthogonal to the X axis 26 along the ground surface 14 a.
- a square annular intermediate frame 13 attached to the inside of the square opening of the frame 12 by a pin 23, and attached to the inside of the intermediate frame 13, passing through the center 25 of the ground plate 14 and along the ground plane 14 a. It is comprised by the pin 24 which supports the grounding board 14 rotatably around the X-axis 26 which is a 1st axis
- the grounding plate 14 is rotatable around the X axis 26 and the Y axis 27 passing through the center 25 with respect to the frame 12, and the direction of the grounding surface 14a with respect to the frame 12 or the inclination of the grounding surface 14a is variable. So that it is supported.
- the radiation fin 15 is fixed to the lower surface of the ground plate 14 (the surface opposite to the ground surface 14 a) and moves integrally with the ground plate 14.
- the cooling member 16 including the radiating fins 14 and the radiating fins 15 is rotatable around the X axis 26 and the Y axis 27 passing through the center 25 of the ground plate 14.
- the grounding surface 14a which is the surface of the grounding plate 14, is a flat surface that allows the tip end surface of the bonding tool 61 to be in close contact with each other.
- the heat capacity of the cooling member 16 including the grounding plate 14 and the heat radiation fin 15 is It is configured to be larger than 61 heat capacity.
- the bonding tool 61 that has finished bonding is in a high temperature state, for example, about 150 ° C.
- the XY table 30 shown in FIG. 1 is driven so that the center of the bonding tool 61 becomes the center of the bonding tool cooling apparatus 10.
- the cooling fan 22 of the bonding tool cooling apparatus 10 is rotating and sending cooling air to the radiating fin 15 as indicated by an arrow C in the figure. It is in a state.
- the Z-direction drive unit 63 of the bonding head 60 shown in FIG. 1 is driven to move the bonding tool 61 downward (in the Z-direction minus side) as indicated by an arrow A in FIG. And the tip end surface of the bonding tool 61 is grounded to the grounding surface 14a on the surface of the grounding plate 14.
- the ground plate 14 is rotatable about the X axis 26 and the Y axis 27 passing through the center 25 of the ground plate 14 with respect to the frame 12 by the support mechanism 200.
- the inclination of the grounding surface 14a follows the inclination of the tip surface of the bonding tool 61 (the direction of the tip surface) around the X axis 26, Rotate around axis 27.
- the tip surface of the bonding tool 61 is in close contact with the ground contact surface 14a. Since the ground plate 14 is fixed integrally with the radiating fins 15, when the tip surface of the bonding tool 61 is in close contact with the ground surface 14 a, the heat of the bonding tool 61 is indicated by an arrow D in FIG. It flows toward the ground plate 14 and the heat radiating fins 15 held at room temperature.
- the temperature of the bonding tool 61 decreases rapidly. Further, when the tip surface of the bonding tool 61 is in close contact with the grounding surface 14a of the grounding plate 14, the direction along the grounding surface 14a from the blowing hole 20 of the cooling nozzle 19 attached to the side of the frame 12 (indicated by the arrow B). The cooling air is jetted in the direction) and applied to the tip of the bonding tool 61, and cooling is also performed from the outer surface of the bonding tool 61.
- the temperature of the bonding tool 61 is equal to the temperature of the semiconductor chip 70 even if the semiconductor chip 70 is adsorbed to the tip. Since the temperature drops to a temperature that does not reach the starting temperature, the semiconductor chip 70 is adsorbed on the tip surface of the bonding tool 61, and the thermosetting property on the substrate 50 that is adsorbed and fixed to the surface of the bonding stage 40 shown in FIG.
- the semiconductor chip 70 is pressed onto the resin, and the semiconductor chip 70 is heated by a heater provided inside the bonding tool 61 (not shown) to cure the thermosetting resin, thereby fixing the semiconductor chip 70 to the substrate 50.
- the cooling fan 22 of the bonding tool cooling apparatus 10 sends cooling air to the radiation fins 15 even after the front end surface of the bonding tool 61 is separated from the ground surface 14a of the ground plate 14. Since it continues, the cooling member 16 comprised by the ground plate 14 and the radiation fin 15 is cooled to near normal temperature while bonding the semiconductor chip 70 by the bonding tool 61.
- the tip surface of the bonding tool 61 whose temperature is high, for example, about 150 ° C. is again brought into close contact with the grounding surface 14a of the grounding plate 14 near normal temperature.
- the bonding tool 61 can be cooled.
- the bonding tool cooling apparatus 10 of the present embodiment cools the heat of the bonding tool 61 by bringing the tip surface of the high-temperature bonding tool 61 into close contact with the grounding surface 14a of the cooling member 16 having a large heat capacity at room temperature. It moves to the member 16 and cools the bonding tool 61 rapidly. Further, by cooling the temperature of the cooling member 16 to near room temperature while bonding is performed by the bonding tool 61, the tact time of the bonding process can be shortened, and the bonding can be performed efficiently. There is an effect that can be done.
- the bonding apparatus 100 has been described as moving the bonding stage 40 in the XY direction by the XY table 30, but the bonding tool cooling apparatus 10 of the present invention can be applied to bonding apparatuses having other configurations.
- the substrate 50 is moved in the X direction by a conveyance mechanism that conveys the substrate 50 by the guide rail, a bonding stage that does not move is arranged between the guide rails, and the bonding head 60 is moved in the Z direction and the Y direction.
- the bonding tool cooling device 10 may be arranged in the vicinity of the bonding stage outside the guide rail for transporting the substrate, or may be provided adjacent to the bonding stage inside the guide rail.
- the bonding tool cooling device 10 may be disposed anywhere near the bonding stage.
- the frame 12 is attached to the frame 12 by the support mechanism 200 in which the two pins 23 and 24 and the intermediate frame 13 are combined.
- the configuration is not limited to the configuration of the present embodiment, and may be configured as follows. .
- FIGS. 6 and 7 the same reference numerals are given to the same portions as those in the embodiment described with reference to FIGS. 1 to 5, and the description thereof is omitted.
- the support mechanism 200 of the embodiment described with reference to FIGS. 1 to 5 is pivotally supported by the support pin 212 provided in the frame 12 with the recess 211 provided in the lower surface of the ground plate 14.
- the pivot support mechanism 210 is used.
- a spring support mechanism 220 that supports the four corners of the ground plate 14 with springs 221 is used.
- a spherical recess provided on the lower surface of the ground plate 14 may be supported by a spherical pedestal provided on the frame 12.
- the embodiment shown in FIGS. 6 and 7 is rotatable with respect to the XY axes and is also rotatable with respect to the Z axis.
- the radiation fin 15 should just be united with the ground plate 14 so that the heat of the ground plate 14 can be radiated, and may be arrange
- the cooling member 16 may be cooled not by the heat radiating fins 15 but by a coolant other than air, for example, by flowing cooling water therein.
- Bonding tool cooling device 11 mounting bracket, 12 frame, 13 intermediate frame, 14 ground plate, 14a ground plane, 15 heat radiation fin, 16 cooling member, 17, 18 cooling air supply pipe, 19 cooling nozzle, 20 blowing hole, 21 Bracket, 22 cooling fan, 23, 24 pins, 25 center, 26 X axis, 27 Y axis, 30 XY table, 40 bonding stage, 50 substrate, 60 bonding head, 61 bonding tool, 62 shank, 63 Z direction drive, 70 semiconductor chip, 100 bonding apparatus, 200 support mechanism, 210 pivot support mechanism, 211 depression, 212 support pin, 220 spring support mechanism, 221 spring.
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Abstract
Description
Claims (8)
- ボンディングツール冷却装置であって、
基体部と、
ボンディングツールの先端面が接地する接地面を有する接地板と、前記接地板に取り付けられた放熱部材と、を含む冷却部材と、を備え、
前記冷却部材は、前記ボンディングツール先端面の方向に倣うように前記接地面の方向を可変とする支持機構によって前記基体部に支持されているボンディングツール冷却装置。 - 請求項1に記載のボンディングツール冷却装置であって、
前記冷却部材の熱容量は、前記ボンディングツールの熱容量よりも大きいボンディングツール冷却装置。 - 請求項1に記載のボンディングツール冷却装置であって、
前記放熱部材は、前記接地板の接地面と反対側の面に取り付けられているボンディングツール冷却装置。 - 請求項1から3のいずれか1項に記載のボンディングツール冷却装置であって、
前記放熱部材は、放熱フィンであり、
前記放熱フィンを冷却する冷却ファンを備えているボンディングツール冷却装置。 - 請求項1から3のいずれか1項に記載のボンディングツール冷却装置であって、
前記支持機構は、前記接地面に沿った第一の軸と、前記接地面に沿い、前記第一の軸と直交する第二の軸との2つの軸の回りに回転自在となるように前記接地板を前記基体部に支持するボンディングツール冷却装置。 - 請求項1から3のいずれか1項に記載のボンディングツール冷却装置であって、
基体部に設けられ、前記先端面が前記接地面に接地している前記ボンディングツールに冷却空気を吹き付ける冷却ノズルを備えているボンディングツール冷却装置。 - 請求項1から3のいずれか1項に記載のボンディングツール冷却装置であって、
前記接地板の前記接地面は、前記ボンディングツールの前記先端面が接地した際に、前記ボンディングツールから前記接地板に向って熱伝導が生じるボンディングツール冷却装置。 - ボンディングツールの冷却方法であって、
基体部と、電子部品を吸着するボンディングツールの先端面が接地する接地面を有する接地板と、前記接地板に取り付けられた放熱部材と、を含む冷却部材と、を備え、前記冷却部材は、前記ボンディングツール先端面の方向に倣うように前記接地面の方向を可変とする支持機構によって前記基体部に支持されており、
前記冷却部材の熱容量が、前記ボンディングツールの熱容量よりも大きく、
前記放熱部材を冷却する冷却ファンを備えるボンディングツール冷却装置を準備し、
ボンディングツールを加熱して電子部品のボンディングを行っている間に前記冷却ファンによって前記冷却部材を冷却し、
前記ボンディングの後、加熱により高温となった前記ボンディングツールの前記先端面を温度の低下した前記冷却部材の前記接地面に密着させて前記ボンディングツールの冷却を行うボンディングツールの冷却方法。
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KR1020147029803A KR101599006B1 (ko) | 2012-12-05 | 2013-10-11 | 본딩 툴 냉각 장치 및 본딩 툴의 냉각 방법 |
SG11201504435WA SG11201504435WA (en) | 2012-12-05 | 2013-10-11 | Bonding tool cooling apparatus and method for cooling bonding tool |
CN201380028377.1A CN104813456B (zh) | 2012-12-05 | 2013-10-11 | 接合工具冷却装置及接合工具的冷却方法 |
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KR101599006B1 (ko) | 2016-03-02 |
TW201422357A (zh) | 2014-06-16 |
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JPWO2014087740A1 (ja) | 2017-01-05 |
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