JP5657845B2 - ボンディングツール冷却装置およびボンディングツールの冷却方法 - Google Patents
ボンディングツール冷却装置およびボンディングツールの冷却方法 Download PDFInfo
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- 238000001816 cooling Methods 0.000 title claims description 102
- 230000005855 radiation Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 18
- 229920001187 thermosetting polymer Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Description
Claims (6)
- ボンディングツール冷却装置であって、
基体部と、
ボンディングツールの先端面が接地する接地面を有する接地板と前記接地板に取り付けられた放熱フィンとを含む冷却部材と、
前記放熱フィンを冷却するファンと、を備え、
前記冷却部材は、前記ボンディングツールの先端面の方向に倣うように前記接地面の方向を可変とする支持機構によって前記基体部に支持されているボンディングツール冷却装置。 - 請求項1に記載のボンディングツール冷却装置であって、
前記放熱フィンは、前記接地板の前記接地面と反対側の面に取り付けられているボンディングツール冷却装置。 - 請求項1に記載のボンディングツール冷却装置であって、
前記支持機構は、前記接地面に沿った第一の軸と、前記接地面に沿い、前記第一の軸と直交する第二の軸との2つの軸の回りに回転自在となるように前記接地板を前記基体部に支持するボンディングツール冷却装置。 - 請求項1または3に記載のボンディングツール冷却装置であって、
前記基体部に設けられ、前記ボンディングツールの前記先端面が前記接地面に接地している前記ボンディングツールに冷却空気を吹き付ける冷却ノズルを備えているボンディングツール冷却装置。 - 請求項1から3のいずれか1項に記載のボンディングツール冷却装置であって、
前記接地板の前記接地面は、前記ボンディングツールの前記先端面が接地した際に、前記ボンディングツールから前記接地板に向って熱伝導が生じるボンディングツール冷却装置。 - ボンディングツールの冷却方法であって、
基体部と、電子部品を吸着するボンディングツールの先端面が接地する接地面を有する接地板と前記接地板に取り付けられた放熱フィンとを含む冷却部材と、前記放熱フィンを冷却するファンと、を備え、前記冷却部材が前記ボンディングツールの先端面の方向に倣うように前記接地面の方向を可変とする支持機構によって前記基体部に支持されているボンディングツール冷却装置を準備し、
前記ボンディングツールを加熱して前記電子部品のボンディングを行っている間に前記冷却ファンによって前記冷却部材を冷却し、
前記ボンディングの後、加熱により高温となった前記ボンディングツールの前記先端面を温度の低下した前記冷却部材の前記接地面に密着させて前記ボンディングツールの冷却を行うボンディングツールの冷却方法。
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JP2014545029A JP5657845B2 (ja) | 2012-12-05 | 2013-10-11 | ボンディングツール冷却装置およびボンディングツールの冷却方法 |
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JP2012266179 | 2012-12-05 | ||
JP2012266179 | 2012-12-05 | ||
PCT/JP2013/077759 WO2014087740A1 (ja) | 2012-12-05 | 2013-10-11 | ボンディングツール冷却装置およびボンディングツールの冷却方法 |
JP2014545029A JP5657845B2 (ja) | 2012-12-05 | 2013-10-11 | ボンディングツール冷却装置およびボンディングツールの冷却方法 |
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JP5657845B2 true JP5657845B2 (ja) | 2015-01-21 |
JPWO2014087740A1 JPWO2014087740A1 (ja) | 2017-01-05 |
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US (1) | US9576927B2 (ja) |
JP (1) | JP5657845B2 (ja) |
KR (1) | KR101599006B1 (ja) |
CN (1) | CN104813456B (ja) |
SG (1) | SG11201504435WA (ja) |
TW (1) | TWI576196B (ja) |
WO (1) | WO2014087740A1 (ja) |
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CN104303277B (zh) * | 2012-12-21 | 2017-05-10 | 株式会社新川 | 覆晶黏晶机以及黏晶平台的平坦度与变形量补正方法 |
US9093549B2 (en) * | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
CN105650397A (zh) * | 2014-12-04 | 2016-06-08 | 南京化工职业技术学院 | 一种热交换器 |
KR102452411B1 (ko) | 2015-03-20 | 2022-10-06 | 토레이 엔지니어링 컴퍼니, 리미티드 | 본딩 툴 냉각 장치 및 이것을 구비한 본딩 장치 및 본딩 툴 냉각 방법 |
KR102148555B1 (ko) * | 2016-12-19 | 2020-08-28 | 주식회사 에이치앤이루자 | 히터 어셈블리 |
CN108695404A (zh) * | 2017-04-04 | 2018-10-23 | 天合光能股份有限公司 | 一种太阳能电池片串的定位移动系统及其定位移动方法 |
JP7182036B2 (ja) * | 2018-06-28 | 2022-12-02 | パナソニックIpマネジメント株式会社 | 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法 |
CN108749257A (zh) * | 2018-07-13 | 2018-11-06 | 浙江柏益科技有限公司 | 一种塑胶地板的水冷却循环装置 |
JP7202115B2 (ja) * | 2018-09-20 | 2023-01-11 | 芝浦メカトロニクス株式会社 | 実装装置および実装方法 |
CN113787687A (zh) * | 2021-08-16 | 2021-12-14 | 王建春 | 一种具有防腐耐高温易调节的塑料加工用热熔机支撑装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH053223A (ja) * | 1991-06-24 | 1993-01-08 | Toshiba Corp | 平行出し機構と平行出し方法及びこの平行出し機構或いは平行出し方法を用いたインナリ−ドボンデイング装置とインナリ−ドボンデイング方法 |
JPH10335392A (ja) * | 1997-06-05 | 1998-12-18 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング装置 |
JPH11251361A (ja) * | 1998-03-02 | 1999-09-17 | Nec Corp | 電子部品実装装置及び電子部品の実装方法 |
JP2004193539A (ja) * | 2002-10-18 | 2004-07-08 | Juki Corp | 半導体素子の接合方法および装置 |
JP2012178414A (ja) * | 2011-02-25 | 2012-09-13 | Toshiba Tec Corp | ヒートツールおよび熱圧着装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5203401A (en) * | 1990-06-29 | 1993-04-20 | Digital Equipment Corporation | Wet micro-channel wafer chuck and cooling method |
US6199259B1 (en) * | 1993-11-24 | 2001-03-13 | Applied Komatsu Technology, Inc. | Autoclave bonding of sputtering target assembly |
US5985697A (en) * | 1996-05-06 | 1999-11-16 | Sun Microsystems, Inc. | Method and apparatus for mounting an integrated circuit to a printed circuit board |
US5923086A (en) * | 1997-05-14 | 1999-07-13 | Intel Corporation | Apparatus for cooling a semiconductor die |
TW559963B (en) * | 2001-06-08 | 2003-11-01 | Shibaura Mechatronics Corp | Pressuring apparatus of electronic device and its method |
US6477053B1 (en) * | 2001-07-17 | 2002-11-05 | Tyco Telecommunications (Us) Inc. | Heat sink and electronic assembly including same |
JP3909755B2 (ja) * | 2002-04-22 | 2007-04-25 | Obara株式会社 | 抵抗溶接装置の冷却方法 |
JP2004047670A (ja) | 2002-07-11 | 2004-02-12 | Sony Corp | フリップチップ実装方法及びフリップチップ実装装置 |
US7511372B2 (en) * | 2005-06-28 | 2009-03-31 | Intel Corporation | Microelectronic die cooling device including bonding posts and method of forming same |
US8029638B2 (en) * | 2007-12-04 | 2011-10-04 | Panasonic Corporation | Component mounting apparatus and method |
US7717984B1 (en) * | 2008-02-11 | 2010-05-18 | Mark Michael Schreiber | Electrostatic precipitator unit |
JP4755222B2 (ja) * | 2008-05-16 | 2011-08-24 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
JP5602439B2 (ja) * | 2010-01-22 | 2014-10-08 | デクセリアルズ株式会社 | 加熱装置および実装体の製造方法 |
JP4808283B1 (ja) * | 2010-06-30 | 2011-11-02 | 株式会社新川 | 電子部品実装装置及び電子部品実装方法 |
JP5608545B2 (ja) * | 2010-12-24 | 2014-10-15 | デクセリアルズ株式会社 | 熱圧着ヘッド、実装装置及び実装方法 |
JP5737424B2 (ja) * | 2011-11-16 | 2015-06-17 | トヨタ自動車株式会社 | 電気機器の冷却装置 |
TWI490956B (zh) * | 2013-03-12 | 2015-07-01 | Shinkawa Kk | 覆晶接合器以及覆晶接合方法 |
US9093549B2 (en) * | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
KR101543864B1 (ko) * | 2013-11-13 | 2015-08-11 | 세메스 주식회사 | 본딩 헤드 및 이를 포함하는 다이 본딩 장치 |
US9282650B2 (en) * | 2013-12-18 | 2016-03-08 | Intel Corporation | Thermal compression bonding process cooling manifold |
US9426898B2 (en) * | 2014-06-30 | 2016-08-23 | Kulicke And Soffa Industries, Inc. | Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly |
JP2016129205A (ja) * | 2015-01-09 | 2016-07-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
2013
- 2013-08-06 TW TW102128066A patent/TWI576196B/zh active
- 2013-10-11 KR KR1020147029803A patent/KR101599006B1/ko active IP Right Grant
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- 2013-10-11 JP JP2014545029A patent/JP5657845B2/ja active Active
-
2015
- 2015-06-05 US US14/731,431 patent/US9576927B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH053223A (ja) * | 1991-06-24 | 1993-01-08 | Toshiba Corp | 平行出し機構と平行出し方法及びこの平行出し機構或いは平行出し方法を用いたインナリ−ドボンデイング装置とインナリ−ドボンデイング方法 |
JPH10335392A (ja) * | 1997-06-05 | 1998-12-18 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング装置 |
JPH11251361A (ja) * | 1998-03-02 | 1999-09-17 | Nec Corp | 電子部品実装装置及び電子部品の実装方法 |
JP2004193539A (ja) * | 2002-10-18 | 2004-07-08 | Juki Corp | 半導体素子の接合方法および装置 |
JP2012178414A (ja) * | 2011-02-25 | 2012-09-13 | Toshiba Tec Corp | ヒートツールおよび熱圧着装置 |
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CN104813456A (zh) | 2015-07-29 |
CN104813456B (zh) | 2018-01-23 |
TWI576196B (zh) | 2017-04-01 |
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SG11201504435WA (en) | 2015-07-30 |
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