TW201402669A - 液狀顯像型之順丁烯二醯亞胺組成物、印刷配線板 - Google Patents

液狀顯像型之順丁烯二醯亞胺組成物、印刷配線板 Download PDF

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Publication number
TW201402669A
TW201402669A TW102117518A TW102117518A TW201402669A TW 201402669 A TW201402669 A TW 201402669A TW 102117518 A TW102117518 A TW 102117518A TW 102117518 A TW102117518 A TW 102117518A TW 201402669 A TW201402669 A TW 201402669A
Authority
TW
Taiwan
Prior art keywords
resin
maleimide
compound
group
pigment
Prior art date
Application number
TW102117518A
Other languages
English (en)
Chinese (zh)
Inventor
Arata Endo
Shoji Minegishi
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201402669A publication Critical patent/TW201402669A/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
TW102117518A 2012-05-17 2013-05-17 液狀顯像型之順丁烯二醯亞胺組成物、印刷配線板 TW201402669A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012113860 2012-05-17

Publications (1)

Publication Number Publication Date
TW201402669A true TW201402669A (zh) 2014-01-16

Family

ID=49583835

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102117518A TW201402669A (zh) 2012-05-17 2013-05-17 液狀顯像型之順丁烯二醯亞胺組成物、印刷配線板

Country Status (4)

Country Link
JP (1) JP6317253B2 (ko)
KR (1) KR102050619B1 (ko)
TW (1) TW201402669A (ko)
WO (1) WO2013172434A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770369B (zh) * 2018-03-30 2022-07-11 日商太陽油墨製造股份有限公司 鹼顯像型感光性樹脂組成物、乾膜、硬化物，及印刷配線板

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JP6078535B2 (ja) * 2012-05-17 2017-02-08 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
SG11201606071WA (en) * 2014-01-24 2016-09-29 Toray Industries Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor
WO2015151341A1 (ja) * 2014-04-01 2015-10-08 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用硬化性樹脂組成物、ドライフィルムおよびプリント配線板
JP5798218B1 (ja) * 2014-06-25 2015-10-21 太陽インキ製造株式会社 硬化性樹脂組成物、永久被膜形成用組成物、ドライフィルムおよびプリント配線板
JP6550872B2 (ja) * 2015-04-03 2019-07-31 住友ベークライト株式会社 プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP6750363B2 (ja) * 2016-07-20 2020-09-02 日立化成株式会社 積層体、金属張積層体及びプリント配線板
JP7009838B2 (ja) * 2017-08-28 2022-01-26 味の素株式会社 樹脂組成物
WO2020105692A1 (ja) * 2018-11-21 2020-05-28 三菱瓦斯化学株式会社 リソグラフィー用膜形成材料、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜及びパターン形成方法
JP2020166214A (ja) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品
EP3916025B1 (en) 2019-06-28 2023-08-09 Mitsubishi Gas Chemical Company, Inc. Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
CN113795522B (zh) * 2019-06-28 2022-08-12 三菱瓦斯化学株式会社 树脂组合物、树脂片、多层印刷电路板和半导体装置

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DE69324942T2 (de) * 1992-02-14 1999-10-07 Shipley Co Strahlungsempfindliche Zusammensetzungen und Verfahren
JP2006235371A (ja) * 2005-02-25 2006-09-07 Nitto Denko Corp 感光性樹脂組成物およびそれを用いて得られるソルダーレジストを有する配線回路基板
JP5301915B2 (ja) * 2008-08-07 2013-09-25 太陽ホールディングス株式会社 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
TWI532756B (zh) * 2009-03-31 2016-05-11 Taiyo Holdings Co Ltd Hardened resin composition and printed circuit board
JP5368153B2 (ja) * 2009-04-15 2013-12-18 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びそれを用いた回路基板
JP5216682B2 (ja) * 2009-04-27 2013-06-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5559999B2 (ja) 2009-07-21 2014-07-23 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP2011043565A (ja) * 2009-08-19 2011-03-03 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP5537864B2 (ja) * 2009-08-19 2014-07-02 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP2012071557A (ja) * 2010-09-29 2012-04-12 Fujifilm Corp 平版印刷版原版、平版印刷方法、及び、有機粘土複合体
JP2013041227A (ja) * 2011-08-19 2013-02-28 Fujifilm Corp 感光性樹脂組成物、並びにこれを用いた感光性フイルム、感光性積層体、永久パターン形成方法およびプリント基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770369B (zh) * 2018-03-30 2022-07-11 日商太陽油墨製造股份有限公司 鹼顯像型感光性樹脂組成物、乾膜、硬化物，及印刷配線板

Also Published As

Publication number Publication date
KR20150009590A (ko) 2015-01-26
KR102050619B1 (ko) 2019-11-29
JP6317253B2 (ja) 2018-04-25
JPWO2013172434A1 (ja) 2016-01-12
WO2013172434A1 (ja) 2013-11-21

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