TW201344773A - Vacuum suction sheet for singulation device, and method for producing fixing tool - Google Patents

Abstract

The purpose of the present invention is to provide a vacuum suction sheet for a singulation device, whereby it is possible for singulated items to be reliably released from vacuum suction when the vacuum suction is released, and the singulated items reliably transported to the next process. This vacuum suction sheet (2), which comprises an elastic body having suction holes (24) for vacuum suction of singulated items (40), is furnished with protrusions (25) surrounding the suction holes (24). When the singulated items (40) are rested on the vacuum suction sheet (2) and vacuum suction is applied, the singulated items (40) are pressed against the protrusions (25), causing the protrusions (25) to elastically deform, increasing the contact area of the two. On the other hand, when the vacuum suction is released, the protrusions (25) return to original shape due to elastic resilience, pushing the singulated items (40) upward. At this time, due to the small contact area of the singulated items (40) and the protrusions (25), the singulated items (40) can be easily removed from the vacuum suction sheet (2).

Description

Vacuum adsorption plate for cutting device and manufacturing method of fixing jig

The present invention relates to a vacuum adsorption plate used in a fixing jig for adsorbing and fixing a cutting object in a cutting device, and a manufacturing method of the fixing jig.

The substrate is divided into a plurality of regions in a lattice shape, and after the wafer-shaped electronic components are mounted on the respective regions, the entire substrate is resin-sealed. The resin sealing body is cut by a rotary knife or the like, and cut into individual area units to become an electronic component.

A device for cutting a resin sealing body in which a plurality of electronic components are integrally sealed, and manufacturing an electronic component including each electronic component, a step of cutting the resin sealing body, and a cleaning step of the electronic component obtained by the cutting step The plurality of manufacturing units corresponding to the steps of the drying step, the inspection step, and the like are connected in the order of steps. In order to transfer the cut electronic parts between the plurality of manufacturing units, fixing fixtures for adsorbing and fixing the cut electronic parts are respectively provided. The fixed jig is composed of a vacuum suction plate formed of an elastic body such as a base that can be freely moved and rotated, and a rubber fixed to the base. The vacuum suction plate is formed with an adsorption hole for vacuum-adsorbing the electronic components. Each of the adsorption holes communicates with the exhaust pump via an intake passage that is provided inside the base and an exhaust passage that is provided outside the base. An exhaust valve is provided in the middle of the exhaust passage, and an open valve for opening the inside of the exhaust passage to the outside is provided in the exhaust passage at a position closer to the suction hole than the exhaust valve. By switching the exhaust valves and the open valves, the electronic components can be adsorbed and fixed to the vacuum adsorption plate of the fixed fixture, or can be vacuumed. The adsorption plate is removed (Patent Documents 1 and 2).

In order to adsorb and fix the electronic component to the vacuum adsorption plate of the above fixed fixture, first, the cut electronic component is placed on the vacuum adsorption plate so as to cover each adsorption hole. Next, the exhaust valve is opened while the above-mentioned open valve is closed, so that the adsorption hole communicates with the exhaust pump. In this manner, the exhaust pump vacuum-extracts the exhaust passage that communicates with the adsorption hole, and the inside of the adsorption hole is in a reduced pressure state. Therefore, the electronic component is adsorbed and fixed to the vacuum adsorption plate by vacuum suction. On the other hand, in order to release the adsorption of the electronic component, the internal atmosphere of the adsorption hole is opened by opening the open valve while closing the exhaust valve. Thereby, the electronic parts can be removed from the vacuum adsorption plate.

When the resin sealing body is cut in each unit of area to produce an electronic component, the vacuum adsorption plate can be used for adsorption.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-203830

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-201275

In the conventional vacuum adsorption plate as described above, when the vacuum adsorption plate is wetted by a cleaning liquid for cleaning an electronic component or the like, the electronic component and the vacuum are adsorbed when the electronic component is adsorbed and fixed to the vacuum adsorption plate. The contact surface of the plate forms a liquid film which generates an adsorption force due to surface tension. On the other hand, if the vacuum adsorption plate is dried, the vacuum adsorption plate is electrostatically charged during the subsequent adsorption and fixation of the electronic component and the adsorption release. In this case, the electricity is generated. The contact surface between the sub-part and the vacuum adsorption plate generates an adsorption force caused by static electricity. In any case, such an undesired adsorption force is generated, and therefore, although the vacuum adsorption is released, the electronic component is adsorbed to the vacuum adsorption plate, and there is a problem that the electronic component cannot be transferred to the next step.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a vacuum for a cutting device which can reliably remove the suction of the cut material when the vacuum suction is released, and can reliably transfer the cut material to the next step. Adsorption plate. Further, a method of manufacturing a fixed jig using the plate is also provided.

In order to solve the above problems, the first aspect of the vacuum suction plate for a cutting device of the present invention is formed of an elastic body having an adsorption hole for vacuum-adsorbing a cutting object, and is characterized in that it is integrally formed with the plate and completely a protrusion surrounding the above adsorption hole.

The above-mentioned "cut material" includes, for example, a variety of substrates, an electronic component or the like mounted on the substrate, and a resin obtained by sealing the resin.

If the cutting object is placed on the first aspect of the vacuum suction plate (hereinafter referred to as "vacuum adsorption plate") of the cutting device of the present invention, and the air is discharged from the adsorption hole, the protruding portion completely surrounds the adsorption hole, The space above the adsorption hole is closed by the cutting object and the protrusion to perform vacuum suction. When the vacuum suction continues, the cutting object is pressed against the protruding portion, and the protruding portion is elastically deformed, so that the contact area between the two is enlarged. Thereby, the adhesion between the adsorption hole and the cut material becomes more sufficient, and vacuum suction of the cut material is surely performed.

When the vacuum is released by introducing air into the adsorption hole, the protruding portion is restored to its original shape due to its elasticity, and the cutting object is pushed up. Further, since the contact area between the cut object and the protruding portion is small, even if, for example, a liquid film exists between the two or an electrostatic force acts therebetween, The force is small, making it easy to remove the cutting material from the vacuum adsorption plate.

Further, the second aspect of the vacuum adsorption plate for a cutting device of the present invention is formed of an elastic body having an adsorption hole for vacuum-adsorbing a cutting object, characterized by having a projection, the projection being attached to the plate It is integrally provided on the surface of the plate around the adsorption hole, and is buried in the surface of the surrounding plate when air is sucked from the adsorption hole, and is elastically deformed until the cutting object comes into contact with the surface of the surrounding plate.

The protrusion of the vacuum adsorption plate disposed in this aspect is different from the above-described aspect, and it is not necessary to completely surround the adsorption hole. It may be in the form of dots or in the form of a line or a width having a certain degree of width. The number can be one or multiple. Further, if it has the characteristics as described above, it is also possible to completely surround the adsorption holes.

In the vacuum adsorption plate of the present aspect, if the cutting object is placed on the upper portion of the adsorption hole and the air is discharged from the adsorption hole to perform vacuum suction, the protrusion is deformed by pressing the cutting object, thereby being buried in the adsorption hole. The surface of the board around it. Thereby, the cut material comes into contact with the surface of the plate around the adsorption hole, thereby sufficiently performing vacuum adsorption.

When the vacuum is released by introducing air into the adsorption hole, the protruding portion is restored to its original shape by its elasticity, and the cutting object is pushed up. Further, when the protruding portion does not completely surround the adsorption hole, a gap can be formed between the cutting object and the surface of the plate around the adsorption hole, and the vacuum adsorption can be more reliably released. When the protruding portion completely surrounds the adsorption hole, by the same action as the first aspect described above, when the vacuum suction has been released, the cutting object is separated from the surrounding plate surface by the elastic restoring force of the protruding portion. The cut can be easily removed.

In the vacuum adsorption plate of the present aspect, when the air is initially discharged from the adsorption hole, the cutting object is in contact with the surface of the plate adjacent to the adsorption hole in advance, and is adsorbed, so that it is preferable to make the protrusion The air escapement portion is slightly disposed as low as possible or from a state completely surrounding the adsorption hole.

The fixing jig comprising the vacuum adsorption plate of each of the above aspects and for adsorbing and fixing the cutting material is manufactured by the method of the following steps: a) a molding step of supplying the above-mentioned cavity of the mold having the cavity to the room temperature a curable liquid resin, wherein the cavity is provided with a concave portion having a shape in which the protruding portion is reversed on the bottom surface, and corresponds to the vacuum suction plate; b) abutting step, positioning and abutting the substrate having the air intake through-passage a surface of the mold to which the mold of the room temperature curable liquid resin is supplied in the cavity; c) a hardening step to cure the room temperature curable liquid resin; d) a parting step by demolding The plate is formed on the substrate; and e) an adsorption hole forming step of forming the adsorption hole in the plate by perforating the plate through the intake passage.

In the vacuum adsorption plate for a cutting device of the present invention, in any of the first and second aspects, when the vacuum adsorption of the cutting object is released, the protruding portion pushes the cutting object by its elastic restoring force. The contact area between the cutting object and the protruding portion becomes small, or the contact between the cutting object and the surface of the plate around the protruding portion is released, so that even if, for example, a liquid film exists between the two, or an electrostatic force acts therebetween The force is also small, so that the cutting object is easily removed from the vacuum adsorption plate. That is, there is no case where the cut material is adsorbed to the sheet despite the vacuum suction, and the cut material can be surely transferred to the next step.

Moreover, in the manufacturing method of the fixing jig of the present invention, the bottom surface is provided with a corresponding The liquid resin is cured in a cavity of the concave portion of the protruding portion of the vacuum suction plate to form the plate, whereby the fixing jig including the vacuum suction plate of each of the above aspects can be easily manufactured.

1, 1A‧‧‧fixed fixture

2, 2A‧‧‧ vacuum adsorption board

3‧‧‧Base

10‧‧‧Mold

11‧‧‧ convex

12‧‧‧ recess

13‧‧‧Mold surface

14‧‧‧ cavity

15‧‧‧Boundary slot

20‧‧‧Resin

23, 23A, 23C‧‧‧ Housing Department

24, 24A, 24B, 24C‧‧‧ adsorption holes

25, 25A, 28, 28B, 28C‧‧‧ protruding parts

26‧‧‧ border

29‧‧‧Air escape department

30‧‧‧ Space

31‧‧‧Outstanding face

32‧‧‧Inspiratory thoroughs

40‧‧‧Electronic parts

41‧‧‧ lower surface

50‧‧‧Exhaust pump

51‧‧‧Exhaust pipe

52‧‧‧Exhaust valve

53‧‧‧Open valve

54‧‧‧ bubbles

61‧‧‧vacuum dryer

62‧‧‧ oven

70‧‧‧Contact section

Fig. 1 is a perspective overall view of a fixing jig provided with a vacuum suction plate of Example 1 of the present invention.

Figure 2 is a cross-sectional view taken along line A-A' of Figure 1.

Fig. 3 (a) is an enlarged longitudinal sectional view showing a state in which an electronic component has been placed in the vacuum suctioning plate of the first embodiment, and (b) is an enlarged longitudinal sectional view showing a state in which the electronic component has been vacuum-adsorbed.

Fig. 4 (a) is a plan enlarged view showing a state in which the electronic component has been placed on the vacuum suction plate of the first embodiment, and (b) is a plan enlarged view showing a state in which the electronic component has been vacuum-adsorbed.

Fig. 5 is a plan enlarged view showing a state in which an electronic component has been placed on a vacuum suction plate of a modification of the first embodiment.

Fig. 6 is a perspective enlarged view of a fixing jig provided with a vacuum suction plate of Example 2 of the present invention.

Figure 7 is a cross-sectional view taken along line BB' of Figure 6, (a) showing an enlarged view of the longitudinal section of the electronic component that has been placed on the vacuum adsorption plate, and (b) showing the state of the vacuum-adsorbed electronic component. An enlarged view of the longitudinal section.

Fig. 8 is a plan enlarged view showing a modification of the vacuum suction plate of the second embodiment.

Fig. 9 is a plan enlarged view showing another modification of the vacuum suction plate of the second embodiment.

Figure 10 is a perspective overall view of a mold for manufacturing the vacuum adsorption plate of Example 1.

Figure 11 is a cross-sectional view taken along line C-C' of Figure 10.

Figure 12 is a schematic view showing the steps of manufacturing a fixing jig having the vacuum adsorption plate of Example 1.

Hereinafter, each embodiment of the vacuum adsorption plate of the present invention will be described based on the drawings.

[Example 1]

The configuration of the vacuum suction plate 2 of the first embodiment (Example 1) of the present invention will be described with reference to Figs. 1 and 2 . The vacuum suctioning plate 2 of the present embodiment is used for mounting a fixing member on a metal base 3 in a fixed jig 1 in which a plurality of cut electronic components are collectively cleaned and inspected. The vacuum suction plate 2 is provided in such a manner as to cover the protruding surface 31 protruding from the upper surface of the substrate 3.

The vacuum suction plate 2 is formed by molding a polyfluorene-based resin or a fluorine-based resin into a plate shape, and a accommodating portion 23 is formed in a lattice shape on the surface of the plate, and the accommodating portion 23 corresponds to the shape of the electronic component as an object. space. In the present embodiment, each of the accommodating portions 23 is provided separately from each other by the lattice-like boundary 26, but the vacuum suction plate used for cutting the electronic components before cutting the resin sealing body before cutting is not provided. The boundary 26. Further, it is known that the arrangement and number of the accommodating portions 23 are not limited to those shown in FIG. 1. Adsorption holes 24 are provided in the bottom surface of each of the accommodating portions 23, and the vacuum suction plates 2 are subsequently fixed to the protruding faces 31 of the base 3 so that the respective adsorption holes 24 are aligned with the air intake passages 32 to be described later on the base 3. . In the vacuum suction plate 2 of the present embodiment, a projecting portion 25 having a trapezoidal shape and a semicircular cross section is formed on the bottom surface of each of the accommodating portions 23 so as to surround the adsorption holes 24.

As shown in FIG. 2, each of the intake passages 32 of the base 3 is connected to the exhaust pump 50 via respective exhaust pipes provided separately and an exhaust pipe 51 that collects them. An exhaust valve 52 is provided in the exhaust pipe 51, and an open valve 53 is provided on the upstream (adsorption hole 24) side of the exhaust valve 52.

The use form of the vacuum suction plate 2 will be described with reference to Fig. 3 . When the electronic component 40 having the flat lower surface 41 is accommodated in each of the accommodating portions 23 of the vacuum suction plate 2, the electronic component 40 is placed on the upper portion of the adsorption hole 24. At this time, since the protruding portion 25 completely surrounds the adsorption hole 24, the space 30 above the adsorption hole 24 is closed by the lower surface 41 of the electronic component 40 and the protruding portion 25 of the well shape (Fig. 3(a)). When the exhaust valve 52 is closed and the exhaust pump 50 is actuated while the exhaust valve 52 is opened in this state, air is exhausted from the space above the adsorption hole 24, and vacuum suction of the electronic component 40 is performed. When the air discharge (vacuum suction) is continued, the lower surface 41 of the electronic component 40 is pressed against the protruding portion 25, and the protruding portion 25 is elastically deformed, and the contact area between the two is enlarged (Fig. 3(b)). Thereby, the adhesion between the adsorption holes 24 and the electronic component 40 is further sufficient, and the vacuum suction of the electronic component 40 can be surely performed.

When the vacuum suction of the electronic component 40 is released, the open valve 53 is opened while the exhaust valve 52 is closed. Thereby, air is introduced into the space above the adsorption hole 24, and vacuum adsorption of the electronic component 40 is released. As a result, the protruding portion 25 returns to its original shape by the elastic restoring force (that is, returns from the state of FIG. 3(b) to the state of FIG. 3(a)), and the electronic component 40 is pushed up. Therefore, the contact area between the lower surface 41 of the electronic component 40 and the protruding portion 25 becomes small, so that even if there is a liquid film between the two, or an electrostatic force acts therebetween, the force is small, and the electronic component is made small. 40 can be easily removed from the vacuum adsorption plate 2. That is, when the electronic components 40 are adsorbed by using other fixed jigs, one electronic component 40 can be adsorbed without missing.

4(a) is an enlarged plan view showing a state in which the electronic component 40 is housed in the accommodating portion 23 of the vacuum suction plate 2. The dashed line in the figure shows the outline of the electronic component 40. As described above, the cross section of the protruding portion 25 of the vacuum suction plate 2 is semicircular. Therefore, in a state where the electronic component 40 is housed in the accommodating portion 23, the lower surface 41 of the electronic component 40 is in contact with the top of the protruding portion 25, The contact portion 70 of the person is linear. On the other hand, when the electronic component 40 is vacuum-adsorbed, the lower surface 41 of the electronic component 40 is pressed against the protruding portion 25, whereby the contact portion 70 which is linear is formed into a planar shape (Fig. 4(b)).

Further, the shape of the protruding portion 25 is not limited to the shape of a well, and may be, for example, an annular shape (projecting portion 25A) as shown in Fig. 5 . Further, the cross sections of the protruding portions 25 and 25A may be triangular or trapezoidal or the like in addition to the semicircle.

[Embodiment 2]

Fig. 6 is a perspective enlarged view showing the fixing jig 1A of the vacuum suction plate 2A of the second embodiment (Example 2) of the present invention. In the vacuum suction plate 2A of the present embodiment, a hemispherical projection 28 is formed on the bottom surface of the accommodating portion 23A. In consideration of the elasticity of the vacuum suction plate 2A and the strength of the vacuum suction, after the vacuum suction is started from the adsorption hole 24A, the protrusion 28 is set to be pressed against the surface of the plate and buried therein in a short time. Try to be as low as possible. Further, the protruding portion 28 may be a polygonal hammer shape, a polygonal column shape, a cylindrical shape or the like.

The use form of the vacuum suction plate 2A will be described with reference to Fig. 6 . When the electronic component 40 is housed in the accommodating portion 23A of the vacuum suctioning plate 2A, the lower surface 41 is in contact with the top of the protruding portion 28, so that the electronic component 40 is downloaded and placed on the upper portion of the adsorption hole 24A in an inclined state (Fig. 7 (a )). Further, since the protruding portion 28 is set lower as described above, the gap formed between the lower surface 41 of the electronic component 40 and the surface of the plate of the vacuum suctioning plate 2A is small. Therefore, when air is evacuated from the adsorption holes 24A and vacuum suction is performed in the same manner as in the first embodiment, the lower surface 41 of the electronic component 40 is adsorbed to the surface of the plate of the vacuum suction plate 2A in advance. Further, the protruding portion 28 is deformed by the pressing of the electronic component 40, and is buried in the surface of the plate around the adsorption hole 24A (Fig. 7(b)). Thereby, the lower surface 41 of the electronic component 40 is in contact with the surface of the plate around the adsorption hole 24A, and is charged. Vacuum adsorption was performed on a separate basis.

When the vacuum suction is released by introducing air into the space above the adsorption hole 24A, the protruding portion 28 is restored to its original shape by its elastic restoring force (that is, from the state of FIG. 7(b) to FIG. 7 (a) state) and pushes the electronic component 40 up. Thereby, vacuum suction can be released more reliably, and the electronic component 40 can be easily removed.

Fig. 8 is a view showing another aspect of the vacuum adsorption plate of Example 2. In this aspect, the C-shaped projecting portion 28B is provided to surround the adsorption hole 24B. That is, the protruding portion 28B has a shape in which the air escaping portion 29 is provided by cutting out a shape obtained by a part of the ring surrounding the adsorption hole 24B. Further, similarly to the protruding portion 28 of the vacuum suction plate 2A, the protruding portion 28B is set as low as possible. Thereby, even in the vacuum suction plate 2B, when the air is initially discharged from the adsorption holes 24C, the lower surface 41 of the electronic component 40 comes into contact with the surface of the plate around the adsorption hole 24B in advance, and is adsorbed.

Figure 9 is a further view showing another aspect of the vacuum adsorption plate of Example 2. In this aspect, the projections 28C are set to be very small, and a plurality of them are formed on the entire surface of the plate. That is, such a protruding portion 28C can be realized by performing a satin finish on the bottom surface of the accommodating portion 23C.

Furthermore, in the above embodiments 1 and 2, the lower surface 41 of the electronic component 40 is flat, but the lower surface of the electronic component 40 is not necessarily flat. If the electronic component 40 can be adsorbed on the surface of the plate of the vacuum adsorption plate 2 and elastically pushed up by the protruding portion provided on the surface of the plate, the lower surface of the electronic component 40 is, for example, curved or may have a small surface. The protrusion.

Next, a method of manufacturing the fixing jig provided with the vacuum suction plate 2 of the first embodiment will be described below with reference to Figs. 10 and 11 . Figure 10 is used to make a vacuum adsorption plate 2 FIG. 11 is a perspective view showing a C-C' line of the mold 10, and FIG. 12 is a view showing a manufacturing step of the fixture 1 having the vacuum suction plate 2. Further, the method of manufacturing the fixing jig having the vacuum adsorption plate of Example 2 is basically the same as the manufacturing method described below.

The mold 10 has a cavity 14 corresponding to one piece of vacuum suction plate 2. A convex portion 11 having a shape corresponding to the accommodating portion 23 is provided on the bottom surface of the cavity 14, and a concave portion 12 having a cross-sectional semicircular shape corresponding to the well-shaped groove of the protruding portion 25 is formed on the surface of the convex portion 11. The boundary groove 15 between the convex portion 11 and the convex portion 11 corresponds to the lattice-like boundary 26 in the vacuum suction plate 2. The opening of the cavity 14 is substantially the same rectangular shape as the protruding surface 31 of the substrate 3.

First, a polyfluorene-based or fluorine-based room temperature curable liquid resin 20 (hereinafter simply referred to as "resin 20") is injected into the cavity 14 of the mold 10 (step S1 of FIG. 12). At this time, the liquid level of the resin 20 is made to exceed the mold surface 13 of the mold 10. Next, the mold 10 is placed in a vacuum desiccator 61, and allowed to stand at normal temperature and about 100 kPa for 20 minutes, thereby removing the air bubbles 54 inside the resin 20 (step S2). Further, a primer is applied to the protruding surface 31 of the base 3 in advance, and the base 3 is brought into contact with the mold surface 13 of the mold 10 while the protruding surface 31 is inserted into the opening of the cavity 14 (step S3). The position of the substrate 3 relative to the mold surface 13 is determined by inserting the protruding surface 31 into the cavity 14.

When the base 3 is brought into contact with the mold surface 13 of the mold 10, the protruding surface 31 applies pressure to the resin 20 inside the cavity 14, whereby the resin 20 is injected into the suction passage 32 of the base 3, and overflows to Up to the inside of the substrate 3. In this state, the mold 10 and the substrate 3 were allowed to stand at room temperature for 24 hours to cure the resin 20 (step S4 in Fig. 12). When the resin 20 is completely cured, the mold 10 and the substrate 3 are placed in an oven 62 and heated at 100 ° C for 1 hour (step S5). Thereby, the primer applied to the protruding surface 31 of the substrate 3 is hardened, and the resin 20 is firmly adhered to Protruding face 31. Further, if the resin 20 is adhered to the substrate 3 as long as sufficient adhesive strength is obtained, it may be naturally followed by curing of the resin 20. In this case, the application of the primer and the subsequent step are not required.

Thereafter, the resin 20 reaching the inner side of the substrate 3 is removed, and the mold 10 is removed (step S6 of Fig. 12). Thereby, the vacuum adsorption plate 2 appears on the protruding surface 31 of the substrate 3. Finally, the inhalation through-hole 32 is pierced by a drill, the hardened resin 20 is removed inside the intake passage 32, and the adsorption hole 24 is formed in the vacuum adsorption plate 2 (step A7). . In this way, the fixing jig 1 including the vacuum suction plate 2 of the first embodiment can be obtained.

That is, in the case where it is convenient to manufacture the fixing jig having the vacuum suction plate of the second embodiment, the mold 10 may be provided on the bottom surface of the cavity 14 having a concave portion corresponding to the shape of each protruding portion, and manufactured in the same manner as described above. . As in the vacuum suction plate shown in Fig. 9, when a plurality of low and small projections 28C are to be provided, the surface of the convex portion 11 of the cavity 14 of the mold 10 is satin-finished.

Before the resin 20 is supplied to the mold 10, the obtained vacuum adsorption plate may be made electrically conductive by adding carbon powder to the resin 20. In such a vacuum adsorption plate, static elimination is generated by repeatedly performing adsorption and fixation of electronic components and release of adsorption, thereby preventing electrostatic damage to electronic components inside the electronic component 40. Further, instead of providing the boundary groove 15 on the bottom surface of the cavity 14, the cutting groove may be formed by machining at the position of the vacuum suction plate corresponding to the groove 15, whereby the resin sealing body may be cut by a rotary blade or the like. A vacuum adsorption plate used in the manufacture of electronic components.

2‧‧‧Vacuum adsorption board

3‧‧‧Base

24‧‧‧Adsorption holes

25‧‧‧Protruding

30‧‧‧ Space

40‧‧‧Electronic parts

41‧‧‧ lower surface

Claims (13)

A vacuum suction plate for a cutting device is formed of an elastic body having an adsorption hole for vacuum-adsorbing a cutting object, and has a protruding portion integrally formed with the plate and completely surrounding the adsorption hole. A vacuum suction plate for a cutting device according to the first aspect of the invention, wherein the cutting material has a flat lower surface. The vacuum suction plate for a cutting device according to the first or second aspect of the invention, wherein the protruding portion has a semicircular cross section in a direction perpendicular to the plate. A vacuum suction plate for a cutting device is formed of an elastic body having an adsorption hole for vacuum-adsorbing a cutting object, and has a protruding portion integrally provided with the plate around the adsorption hole. On the surface of the plate, when air is sucked from the adsorption holes, it is buried in the surface of the surrounding plate and elastically deformed until the cutting object comes into contact with the surface of the surrounding plate. A vacuum adsorption plate for a cutting device according to the fourth aspect of the invention, wherein the cutting material has a flat lower surface. The invention relates to a method for manufacturing a fixed fixture, which is a fixed fixture for a cutting device for adsorbing and fixing a cutting object, wherein the fixing device comprises a vacuum adsorption plate, which has adsorption for vacuum adsorption cutting materials. Forming an elastic body of the hole and having a protrusion integrally formed with the plate and completely surrounding the adsorption hole; and having: a) a molding step of supplying the mold cavity of the mold having the cavity to the room temperature hardening property a liquid resin, wherein the cavity is provided with a concave portion having a shape in which the protruding portion is reversed on the bottom surface, and corresponds to the vacuum suction plate; b) abutting step of positioning the substrate having the inhalation through-path and abutting against the surface of the mold to which the mold of the room temperature curable liquid resin is supplied in the cavity; c) a hardening step to make the room temperature hardenability The liquid resin is cured; d) a demolding step of forming the plate on the substrate by demolding; and e) an adsorption hole forming step of piercing the plate by the through-passing passage for the suction The above adsorption holes were produced. The method of manufacturing a fixed jig according to claim 6, wherein the cut material has a flat lower surface. The method of manufacturing a fixed jig according to claim 6, wherein the protruding portion has a semicircular cross section in a direction perpendicular to the plate. The method of manufacturing a fixed jig according to claim 7, wherein the protruding portion has a semicircular cross section in a direction perpendicular to the plate. The invention relates to a method for manufacturing a fixed fixture, which is a fixed fixture for a cutting device for adsorbing and fixing a cutting object, wherein the fixing device comprises a vacuum adsorption plate, which has adsorption for vacuum adsorption cutting materials. The elastic body of the hole is formed and has a protruding portion which is integrally provided with the plate on the surface of the plate around the adsorption hole, and is buried on the surface of the surrounding plate when the air is sucked from the adsorption hole and is generated. Elastically deforming until the cutting object is in contact with the surface of the surrounding plate; and characterized in that: a) a molding step of supplying a room temperature hardening liquid resin to the cavity of the mold having the cavity, the cavity being disposed on the bottom surface a concave portion having a shape in which the protruding portion is reversed and corresponding to the vacuum suction plate; b) abutting step of positioning a base having a through passage for suction and abutting in the cavity a mold surface of the mold having the above-mentioned room temperature curable liquid resin; c) a hardening step for hardening the room temperature curable liquid resin; d) a demolding step of forming the plate on the substrate by demolding; And e) an adsorption hole producing step of piercing the plate by the air intake through-passage to form the adsorption hole in the plate. The method of manufacturing a fixed jig according to claim 10, wherein the cut material has a flat lower surface. The method of manufacturing a fixed jig according to any one of claims 6 to 11, wherein the recessed portion is formed by providing a groove having a square shape on the bottom surface of the cavity. The method of manufacturing a fixed jig according to any one of claims 6 to 11, wherein the bottom surface of the cavity is subjected to satin processing.