CN113993367B

CN113993367B - PCB transferring method

Info

Publication number: CN113993367B
Application number: CN202111118808.6A
Authority: CN
Inventors: 林云峰; 孙畅; 刘龙生
Original assignee: New Career Guangzhou Electronics Co ltd
Current assignee: New Career Guangzhou Electronics Co ltd
Priority date: 2021-09-24
Filing date: 2021-09-24
Publication date: 2023-06-16
Anticipated expiration: 2041-09-24
Also published as: CN113993367A

Abstract

The invention relates to a PCB transferring method, which comprises the following steps: s1, acquiring PCB position coordinate information; s2, carrying out vacuum adsorption on the PCB according to the PCB position coordinate information, enabling the detection assembly to extend into the positioning hole of the PCB, enabling the detection assembly to be in a free state or blocking the lower end of the detection assembly, and enabling the detection assembly to be in a first triggering state; s3, when the detection assembly is in a free state, lifting the PCB and transferring the PCB to a target position; when the probe assembly is in the first trigger state, vacuum suction of the PCB is released and steps S1 to S3 are re-performed. The PCB transferring method provided by the invention realizes the accuracy of judging the PCB adsorption position and the accuracy of the placement position by matching with the PCB transferring device. The problem that the PCB is difficult to position and transfer and generates high rejection rate is solved, and particularly the problem of positioning and rejection rate of very thin and flexible circuit boards such as FPC is solved.

Description

PCB transferring method

Technical Field

The invention belongs to a PCB material taking technology, and particularly relates to a PCB transferring method.

Background

PCB (Printed Circuit Board) the Chinese name printed circuit board, also called printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting electronic components. It is called a "printed" circuit board because it is made using electronic printing. A flexible printed circuit board (Flexible Printed Circuit abbreviated as FPC) is a type of PCB, which is made of polyimide or polyester film as a base material and has high reliability, and is excellent in flexibility. The wiring density is high, the weight is light, the thickness is thin, the flexibility is good. In the processing process of the PCB, the PCB needs to be taken and discharged, namely, the PCB on the assembly line is placed into the storage module. The PCB on the assembly line is placed into the storage module by manual operation, so that the labor intensity of staff is high, the cost is high, the material taking and placing efficiency is low, and the PCB is easily scratched or damaged due to the influence of the manual operation.

CN202021190033.4 discloses a PCB suction means, can absorb the PCB that is located on the assembly line through absorbing the subassembly, can push-and-pull the tray of waiting to place through push-and-pull assembly, can place the PCB on the assembly line on waiting to place the tray through the combination of the motion of absorbing the subassembly and the motion of push-and-pull assembly. CN201821256891.7 discloses a PCB material taking mechanism, which comprises a frame, wherein the frame comprises a top plate, a bottom plate and supporting tubes, the four supporting tubes penetrate through guide holes arranged on a substrate, a first cylinder mounting frame and a first cylinder are fixed above the substrate, a second cylinder is fixed below the substrate, the second cylinder is connected with a third cylinder, the lower end of the third cylinder is connected with a rotary cylinder, the rotary cylinder is connected with a rotary component, the rotary component is connected with a sucking disc, and suction nozzles are arranged below the sucking disc; the bottom plate is annular structure, the sucking disc passes the bottom plate, and the four corners position of bottom plate still is equipped with the suction nozzle, first cylinder is all connected to the suction nozzle. In the above scheme, the problems that the accuracy of the adsorption position is low in the PCB adsorption process and the accuracy is low when the PCB is transferred to the target position after adsorption are not solved, and a high rejection rate is generated in the whole process.

Furthermore, if the PCB extracting mechanism directly adopts the positioning camera to directly position the PCB adsorbing position and the target position for transferring the PCB, the following problems are unavoidable: 1. the accuracy of the positioning camera for acquiring the PCB adsorption position and the PCB transfer target position depends on the visual positioning system of the positioning camera, so that the positioning camera has certain error in positioning the PCB adsorption position and the PCB transfer target position; 2. errors can exist in each mechanical action executed by the PCB material taking mechanism in the whole sucking and transferring process, and when the PCB is sucked, errors exist in the action executed by the PCB material taking mechanism close to the PCB and the action executed by the PCB sucking disc of the PCB material taking mechanism; when the adsorption is completed and the PCB is transferred and placed, errors exist in the action of the PCB taking mechanism, which is executed when the PCB taking mechanism is far away from the adsorption position, the PCB taking mechanism is close to the target position and the action executed when the PCB is placed. The above problems may affect the sucking and transferring processes singly or in combination, and eventually reduce the sucking and transferring accuracy of the PCB. Compared with a common PCB, the FPC is softer and thinner, so that the positioning, sucking and transferring difficulties are greater; when the positioning camera is directly used for positioning, the FPC is more significantly affected by the positioning error and the mechanical action error.

Disclosure of Invention

The PCB adsorption device aims at solving the problems that in the prior art, the accuracy of an adsorption position is low and the accuracy of the PCB is low when the PCB is transferred to a target position after adsorption; and when the positioning camera is directly used for positioning, positioning errors and errors for executing mechanical actions are unavoidable.

The embodiment of the invention provides a PCB transferring method, which comprises the following steps:

s1, acquiring PCB position coordinate information;

s2, carrying out vacuum adsorption on the PCB according to the PCB position coordinate information, enabling the detection assembly to extend into the positioning hole of the PCB, enabling the detection assembly to be in a free state or blocking the lower end of the detection assembly, and enabling the detection assembly to be in a first triggering state;

s3, when the detection assembly is in a free state, lifting the PCB and transferring the PCB to a target position; when the probe assembly is in the first trigger state, vacuum suction of the PCB is released and steps S1 to S3 are re-performed.

Preferably, in the step S1, the positioning camera is used to obtain the PCB position coordinate information.

Preferably, in the step S3, the step of lifting the PCB and transferring the PCB to the target position is specifically:

s11, acquiring target position coordinate information;

s12, matching and placing the PCB and the target position according to the coordinate information of the target position, judging whether the detection assembly is in a second trigger state, and when the lower end of the detection assembly is jacked up, enabling the detection assembly to be in the second trigger state;

s13, when the detection assembly is in a second trigger state, releasing vacuum adsorption to enable the PCB to be put down; when the detecting assembly is not in the second trigger state, the PCB is moved away from the target position, and steps S11 to S13 are re-performed.

Preferably, when the lower end of the detection assembly is jacked up, the detection assembly is in the second triggering state specifically includes: when the lower end of the detection assembly is jacked up, the second Hall sensor is triggered, and the detection assembly is in a second triggering state.

Preferably, when the number of times of performing steps S11 to S13 is greater than 3, the performing of the action is stopped and the malfunction alarm is performed.

Preferably, when the lower end of the detecting component is blocked, the detecting component is in the first triggering state, specifically: when the lower end of the detection component is blocked, the detection component retracts to trigger the first Hall sensor, and the detection component is in a first trigger state.

Preferably, when the number of times of performing steps S1 to S3 is greater than 3, the performing of the action is stopped and the malfunction alarm is performed.

Preferably, the PCB transferring method uses a PCB transferring apparatus including a vacuum adsorption assembly, a positioning body, the first hall sensor, a second hall sensor, and a detection assembly; the first Hall sensor and the second Hall sensor are arranged at the upper end of the positioning main body at an upper-lower interval; the upper end of the detection component is embedded in the positioning main body, the lower end of the detection component extends downwards towards the lower end of the positioning main body, the detection component can move upwards when the lower end of the detection component is blocked or jacked up,

the vacuum adsorption component performs vacuum adsorption on the PCB;

when the detection component stretches into the positioning hole of the PCB, the detection component is in a free state; when the lower end of the detection component is blocked, the detection component moves upwards to trigger the first Hall sensor, and the detection component is in a first triggering state; when the lower end of the detection assembly is jacked up, the detection assembly moves upwards to trigger the second Hall sensor, and the detection assembly is in a second trigger state.

Preferably, the target position of transferring is the position of tool, be provided with the bellied locating part that makes progress on the tool, PCB transfer device can with the location main part remove with the locating part matches, the location main part with when the locating part matches, the locating part jack-up detect the subassembly lower extreme, make detect the subassembly upward movement and trigger the second hall sensor, detect the subassembly and be in the second trigger state.

Preferably, when the lower end of the detecting assembly is not blocked or not jacked, the height difference between the second hall sensor and the top of the detecting assembly is adapted to the height of the positioning member, and the height difference between the bottom of the positioning body and the transfer body is adapted to the height difference between the bottom of the vacuum suction assembly and the transfer body.

The PCB positioning device realizes accurate PCB adsorption and accurate PCB placement, and solves the error caused by direct positioning by adopting a positioning camera; and solve FPC and be difficult to position, when transferring produce very high rejection rate's problem, more be applicable to FPC's absorption and transfer.

Drawings

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intentionally drawn to scale on actual size or the like, with emphasis on illustrating the principles of the invention.

Fig. 1 is a flowchart of a PCB transferring method according to an embodiment;

FIG. 2 is a flowchart of a PCB transfer method with a set number of repeated executions of 3 according to an embodiment;

fig. 3 is a schematic structural view of a PCB transferring apparatus according to an embodiment;

FIG. 4 is a schematic structural view of a positioning body according to an embodiment;

FIG. 5 is a schematic diagram of a structure of a misalignment positioning hole of a detection assembly according to an embodiment;

FIG. 6 is a schematic diagram of a structure of an alignment positioning hole of a detection assembly according to an embodiment;

fig. 7 is a schematic structural view of an alignment positioning component of a detection assembly according to an embodiment.

In the figure: the PCB positioning device comprises a positioning main body 1, a vacuum adsorption assembly 2, a PCB transfer device 3, a PCB4, a positioning hole 5, a jig 6 and a positioning component 7; the device comprises a first Hall sensor 11, a second Hall sensor 12, a magnetic component 13, a spring 14, a pressing plate 15, a limiting table 16, a detection component 17, external threads 18 and a process groove 19.

In fig. 2: a=1, which means that the detection group triggers the first hall sensor, and the detection assembly is in a first triggering state;

a=0, meaning that the detection group does not trigger the first hall sensor;

b=1, which means that the detection group triggers the second hall sensor, and the detection assembly is in the second triggering state;

b=0, meaning that the detection group does not trigger the first hall sensor;

a=0 and b=0, which means that the detecting component extends into the positioning hole of the PCB, and the detecting component is in a free state;

n refers to the number of repeated executions.

Detailed Description

In order that the invention may be understood more fully, the invention will be described with reference to the accompanying drawings.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to and integrated with the other element or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In order not to cause ambiguity to the reader, "PCB" in PCB4 refers to a printed circuit board, and "4" in PCB4 refers to a PCB with the drawing symbol "4" in the specification drawing.

s1, acquiring PCB position coordinate information;

s2, carrying out vacuum adsorption on the PCB4 according to the PCB position coordinate information, so that the detection assembly extends into the positioning hole 5 of the PCB4, the detection assembly is in a free state, or the lower end of the detection assembly is blocked, and the detection assembly is in a first triggering state;

s3, when the detection assembly is in a free state, lifting the PCB4 and transferring the PCB to a target position; when the probe assembly is in the first trigger state, the vacuum suction of the PCB4 is released and steps S1 to S3 are re-performed.

Referring to fig. 1 to 7, a flowchart of a PCB transferring method is shown in fig. 1 and 2, the PCB transferring method requires the PCB transferring device 3 to cooperate with each other, and a positioning hole 5 matching with a lower end of a probe assembly is provided on a PCB4 to be transferred.

The PCB4 is absorbed (S1 to S3), the PCB transferring device 3 is matched and moved to the PCB4, the vacuum absorbing component 2 vacuumizes and absorbs the PCB4, and if the detecting component cannot be accurately inserted into the positioning hole 5 on the PCB4, the first Hall sensor 11 is triggered, and the detecting component forms a first triggering state, namely A=1; the vacuum adsorption component 2 releases the adsorption to the PCB4, so that the PCB transfer device 3 is separated from the PCB4, the PCB4 is put back to the original position, the positioning camera reacquires the position coordinate information of the PCB after the PCB4 is put back to the original position, and the PCB transfer device 3 performs positioning and adsorption operation again, thus avoiding the problem that the PCB4 generates a very high rejection rate during transfer; if the lower end of the detection component is accurately inserted into the positioning hole 5 on the PCB4, the lower end of the detection component is not blocked, the first hall sensor 11 is not triggered, and a free state is formed, i.e., a=0 and b=0, so that the PCB4 can be accurately adsorbed and the transfer step can be performed.

And (S11 to S13) transferring the PCB4, wherein the target position is the position of the jig 6 in general, when the PCB transferring device transfers the PCB4 to the jig 6, the positioning component 7 corresponding to the transferring device is arranged on the jig 6, the positioning component 7 on the jig 6 can jack up the detecting component after being aligned and matched with the detecting component, the detecting component triggers the second Hall sensor 12, namely B=1, so that the PCB4 transferring position can be known to be accurate, the vacuum component releases the adsorption to the PCB4, and the PCB4 is correctly placed on the jig 6. If the position is inaccurate when the PCB is transferred to the jig 6, the detection component does not trigger the second Hall sensor 12, namely B=0, so that the PCB transfer device 3 is far away from the jig 6 for a certain distance, and the positioning camera re-acquires the position coordinate information of the jig 6 and repeats the transfer operation. The PCB4 is not adsorbed accurately and then repeatedly adsorbed for not more than 3 times, and the PCB is not adsorbed accurately and then repeatedly transferred for not more than 3 times when being transferred. The correct sucking and transferring of the PCB4 can be completed by the above arrangement. Wherein fig. 2 is a more specific embodiment as shown in fig. 1, and the upper limit value of the repeated execution is set to 3 times in fig. 2.

In a preferred embodiment, in step S1, PCB position coordinate information is acquired using a positioning camera. When the coordinate information of the position of the PCB is acquired, in order to obtain a better effect, the positioning camera is slightly far away from the PCB4 and shoots the PCB4 to acquire the coordinate information. The positioning camera is adopted for preliminary positioning, and the positioning camera is matched with detection components and the like on the PCB transfer device 3 for accurate positioning, so that the accurate positioning can be realized, and meanwhile, the suction efficiency and the transfer efficiency can be improved.

Referring to fig. 1 to 7, in a preferred embodiment, in step S3, the PCB4 is lifted and transferred to the target position specifically: s11, acquiring target position coordinate information; s12, carrying out matching placement on the PCB4 and the target position according to the target position coordinate information, judging whether the detection assembly is in a second trigger state, and when the lower end of the detection assembly is jacked up, enabling the detection assembly to be in the second trigger state; s13, when the detection assembly is in the second trigger state, releasing vacuum adsorption to enable the PCB4 to be put down; when the probe assembly is not in the second trigger state, the PCB4 is moved away from the target position and steps S11 to S13 are re-performed. Further, when the lower end of the detection assembly is jacked up, the detection assembly is in the second triggering state specifically: the second hall sensor 12 is triggered when the lower end of the detection assembly is lifted, and the detection assembly is in a second trigger state. Since the PCB transfer device 3 is typically connected to the lower end of the robot tool, the robot tool moves the PCB transfer device 3 when moving the PCB transfer device, and thus, after acquiring the target position coordinate information, the robot tool moves the robot tool to the target position coordinate to move the PCB4 to the target position coordinate. The target position is generally the position of tool 6, is provided with the reference column on the tool 6, and the reference column can survey the alignment of subassembly lower extreme and match, and the reference column can pass locating hole 5 on the PCB4 with survey the subassembly lower extreme jack-up and form the second and trigger the state.

Referring to fig. 1-2, in the preferred embodiment, when the number of times of executing steps S11 to S13 is greater than 3, the execution of the action is stopped and a fault alarm is performed. The above-mentioned number of times is greater than 3, and the number of times of execution steps may be set to any integer value of 3 or more, for example, 4, 5, 9, and 10, if necessary, and when the value is exceeded, execution of the action is stopped and a malfunction alarm is performed. The fault alarm is an audible and visual alarm.

Referring to fig. 4 and 6, in a preferred embodiment, when the lower end of the detection assembly is blocked, the detection assembly is in the first triggered state, specifically: when the lower end of the detection component is blocked, the detection component retracts to trigger the first Hall sensor 11, and the detection component is in a first trigger state.

In a preferred embodiment, when the number of times of performing steps S1 to S3 is greater than 3, the performing of the action is stopped and a malfunction alarm is performed. The number of times mentioned above is greater than 3 times, and the number of execution steps may be set to any integer value of 3 or more as needed.

Referring to fig. 1 to 7, in a preferred embodiment, the PCB transferring method uses a PCB transferring apparatus 3, the PCB transferring apparatus 3 including a vacuum suction assembly 2, a positioning body 1, a first hall sensor 11, a second hall sensor 12, and a detecting assembly; the first Hall sensor 11 and the second Hall sensor 12 are arranged at the upper end of the positioning main body 1 at intervals up and down; the upper end of the detection component is embedded in the positioning main body 1, the lower end of the detection component extends downwards towards the lower end of the positioning main body 1, the detection component can move upwards when the lower end of the detection component is blocked or jacked up,

the vacuum adsorption component 2 performs vacuum adsorption on the PCB 4;

when the detection component stretches into the positioning hole 5 of the PCB4, the detection component is in a free state; when the lower end of the detection component is blocked, the detection component moves upwards to trigger the first Hall sensor 11, and the detection component is in a first triggering state; when the lower end of the detection assembly is jacked up, the detection assembly moves upwards to trigger the second hall sensor 12, and the detection assembly is in a second triggering state. The reference to the vertical, height, transverse and longitudinal directions in this application refers to the positioning body 1, where the lower end of the detection assembly faces downward in use, unless otherwise specified. The lower end of the detecting member protrudes downward toward the lower end of the positioning body 1, and it is understood that the lower end of the detecting member protrudes toward the lower end of the positioning body 1 when not blocked.

Further, the positioning main body 1 and the vacuum adsorption component 2 are both fixed on the PCB transfer device 3, the detection component and the vacuum adsorption component 2 are both extended downwards from the PCB transfer device 3, and the downward extending height of the detection component relative to the PCB transfer device 3 is larger than the downward extending height of the vacuum adsorption component 2 relative to the PCB transfer device 3; the detection assembly moves upwards until the bottom of the detection assembly is level with the bottom of the adsorption assembly, and the first hall sensor 11 is triggered. Generally, the detecting component and the vacuum adsorbing component 2 are both disposed on the bottom surface of the PCB transferring device 3, and the above-mentioned detecting component protrudes downward from the PCB transferring device 3 to a greater extent than the vacuum adsorbing component 2 protrudes downward from the PCB transferring device 3, wherein the height refers to the distance between the bottom of the detecting component and the bottom surface of the PCB transferring device 3. The use mode of the PCB transferring device 3 has been described in the previous embodiment and will not be repeated, and the PCB4 can be precisely adsorbed by arranging the hall sensor and the detecting assembly on the PCB transferring device 3, the PCB transferring device 3 and the vacuum adsorbing assembly 2, so as to avoid errors generated when the camera is separately positioned.

Further, a plurality of all setting up in PCB transfer device 3 bottom surfaces of location main part 1 and vacuum adsorption subassembly 2, the detection subassembly bottom of location main part 1 all is on the coplanar, provides a plurality of setpoint through setting up a plurality of location main parts 1 for it is more accurate to fix a position, provides a plurality of adsorption points through setting up a plurality of vacuum adsorption subassemblies 2, makes absorption PCB4 more steady in order to be convenient for accurate PCB4 transfer. The vacuum suction assembly comprises a vacuum device and a sucker, the vacuum device can be connected to the PCB transferring device 3, the top end of the sucker is connected with the vacuum device and communicated with the vacuum device, the sucker extends downwards relative to the PCB transferring device 3, generally, the bottom of the sucker is on the same plane with the bottom of the positioning main body 1, and the vacuum device can pump out air in the sucker. The vacuum device and the sucker are arranged, and the sucker is kept vacuum by pumping through the vacuum device so as to be adsorbed on the PCB4, thereby being more beneficial to automatic operation. The arrangement of the vacuum device and the sucker is more beneficial to automatic operation.

Further, the detecting assembly comprises a magnetic component 13 and a detecting component 17 which are connected with each other, the magnetic component 13 is located at the upper end of the detecting assembly, when the detecting component 17 is not blocked, the lower end of the detecting component 17 extends downwards towards the lower end of the positioning main body 1, when the lower end of the detecting component 17 is blocked or jacked up, the detecting assembly moves upwards, and the magnetic component 13 can trigger the first hall sensor 11 and the second hall sensor 12 in sequence. Further, the magnetic component 13 is a magnet, the detecting component 17 is a sensing probe, and the magnet is embedded on the top of the sensing probe.

Further, the lower end of the positioning main body 1 is provided with a guide hole with a downward opening, the guide hole extends from the lower end of the positioning main body 1 towards the upper end of the positioning main body 1, the upper end of the detection component is embedded in the guide hole, when the detection component 17 is not blocked, the lower end of the detection component 17 extends out of the guide hole downwards, and the first hall sensor 11 and the second hall sensor 12 are arranged on one side of the guide hole. The first hall sensor 11 and the second hall sensor 12 are arranged on one side of the guide hole, and the first hall sensor 11 and the second hall sensor 12 can be completely embedded in the set position main body 1 and positioned on one side of the guide hole, or part of the first hall sensor 11 and part of the second hall sensor 12 are embedded in the set position main body 1 and are partially exposed in the guide hole. Through the guiding hole setting for the detection subassembly can be fine inlay and establish in positioning body 1, and along the direction up-and-down motion of guiding hole, more be favorable to detecting the subassembly and fix a position accurately.

Further, the middle part of detecting assembly is provided with along radial direction convex spacing platform 16, spacing platform 16 is located between detecting assembly upper end and the detecting assembly lower extreme, be equipped with spring 14 and clamp plate 15 in the guiding hole, spacing platform 16 is located clamp plate 15 below, the outside of detecting assembly upper end is located to the spring 14 cover, and spring 14 is spacing between clamp plate 15 and spacing platform 16, the clamp plate 15 outside is connected fixedly with the guiding hole, clamp plate 15 middle part is provided with the through-portion that runs through its upper surface and lower surface, the through-portion can overlap and locate detecting assembly upper end, detecting assembly can upwards slide in the through-portion when detecting assembly upward movement. Typically, the stop block 16 is part of a detection assembly, and the stop block 16 and the detection assembly are integrally formed; the lower end of the guide hole is a cylindrical guide hole, and the lower end of the guide hole is positioned below the limiting table 16 and has a diameter smaller than that of the limiting table 16. When the lower end of the detection assembly is blocked or jacked up, the spring 14 is compressed, and after the blocking of the lower end of the detection assembly disappears, the spring 14 is restored to the original state and the detection assembly is reset, so that the operation is more automatic through the arrangement.

Further, the inner wall of the guide hole is provided with an internal thread, and the heights of the upper end and the lower end of the internal thread are larger than those of the upper end and the lower end of the pressing plate 15; the outer periphery of the pressing plate 15 is formed with an external thread 19 that can be engaged with the internal thread, and the external thread 19 extends from the upper end of the pressing plate 15 to the lower end of the pressing plate 15. The fixed positions of the pressing plate 15 and the guide holes can be adjusted by rotating the pressing plate 15 up and down, and then the tightness of the springs 14 is adjusted, so that the PCB transferring device 3 is better applied to adsorbing and transferring different types of PCBs 4. Because the ordinary PCB4 has higher rigidity, the positioning, the adsorption and the transfer are facilitated when the force applied to the PCB4 by the detection assembly is higher, and the spring 14 is pressed more tightly; because of the high flexibility of the FPC (flexible circuit board, one of the PCBs 4), the force applied to the FPC by the probe assembly should be small to facilitate movement, adsorption and transfer, as compared to the conventional PCB4 where the springs 14 should be released somewhat. Further, a process groove 20 is formed below the internal thread of the guide hole, the process groove 20 protrudes in the radial direction relative to the guide hole, and the process groove 20 is convenient for processing the internal thread.

Referring to fig. 4 and 7, in the preferred embodiment, the target position for transferring is the position of the jig 6, the jig 6 is provided with an upward protruding positioning component 7, the pcb transferring device 3 can move the positioning main body 1 to match with the positioning component 7, when the positioning main body 1 matches with the positioning component 7, the positioning component 7 jacks up the lower end of the detecting component, so that the detecting component moves upward and triggers the second hall sensor 12, and the detecting component is in the second triggering state.

Further, the number of the positioning parts 7 is multiple, the tops of the positioning parts 7 are on the same plane, the positioning parts 7 can be matched with the positioning holes 5 and the detection assemblies on the PCB4, and when the PCB4 is placed, the positioning parts 7 penetrate through the positioning holes 5 to jack up the detection assemblies and enable the detection assemblies to be lifted up to trigger the second Hall sensor 12. The positioning part 7 is matched with the second Hall sensor 12 to provide positioning points for transferring the PCB4, so that the positioning is more accurate. Further, the positioning component 7 is a round platform positioning column, the diameter of the column of the positioning component 7 is smaller than that of the guide hole on the positioning main body 1, and the positioning component 7 can partially extend into the guide hole.

Referring to fig. 3 to 7, in the preferred embodiment, when the lower end of the probe assembly is not blocked or lifted, the height difference between the second hall sensor 12 and the top of the probe assembly is adapted to the height of the positioning member 7, and the height difference between the bottom of the positioning body 1 and the PCB transferring device 3 is adapted to the height difference between the bottom of the vacuum suction assembly 2 and the PCB transferring device 3. The "level difference adaptation" mentioned above may be that the level differences are equal or slightly error; the "height fit" may be height equality or slight error. Further, when the lower end of the detecting assembly is not blocked or is not lifted, the height difference between the second hall sensor 12 and the top of the detecting assembly is equal to the height of the positioning member 7, and the height difference between the bottom of the positioning body 1 and the PCB transferring device 3 is equal to the height difference between the bottom of the vacuum adsorbing assembly 2 and the PCB transferring device 3. The jig 6 is generally a cuboid, the positioning component 7 is a round table positioning column on the upper surface of the jig 6, and the height of the positioning component 7 is the distance from the top of the positioning component 7 to the upper surface of the jig 6.

The invention realizes accurate adsorption of the PCB4 and accurate placement of the PCB4, and solves the error caused by direct positioning by adopting a positioning camera; and solve FPC and be difficult to position, when transferring produce very high rejection rate's problem, more be applicable to FPC's absorption and transfer.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to the terms "preferred embodiment," "further embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims

1. A PCB transferring method is characterized by comprising the following steps:

s1, acquiring PCB position coordinate information;

s3, when the detection assembly is in a free state, lifting the PCB and transferring the PCB to a target position; when the detection assembly is in the first trigger state, the vacuum adsorption of the PCB is released, and the steps S1 to S3 are re-executed;

wherein: the lower end of the measuring component is not blocked, and the first Hall sensor is not triggered to form a free state; if the detection component cannot be accurately inserted into the positioning hole on the PCB, the first Hall sensor is triggered, and the detection component forms a first trigger state.

2. The PCB transferring method according to claim 1, wherein in the step S1, the positional coordinate information of the PCB is acquired using a positioning camera.

3. The PCB transferring method according to claim 1, wherein in the step S3, the PCB is lifted and transferred to a target position specifically includes:

s11, acquiring target position coordinate information;

s13, when the detection assembly is in a second trigger state, releasing vacuum adsorption to enable the PCB to be put down; when the detection assembly is not in the second trigger state, the PCB is moved away from the target position, and steps S11 to S13 are re-executed;

when the PCB transferring device transfers the PCB to the jig, the positioning component corresponding to the transferring device is arranged on the jig, the positioning component on the jig can jack up the detecting component after being aligned and matched with the detecting component, the detecting component triggers the second Hall sensor, the PCB transferring position can be known to be accurate, the vacuum component releases the adsorption to the PCB, and the PCB is correctly placed on the jig.

4. The PCB transferring method of claim 3, wherein when the number of times of performing the steps S11 to S13 is greater than 3, the performing of the operation is stopped and a malfunction alarm is performed.

5. The PCB transferring method of claim 1, wherein when the lower end of the detecting assembly is blocked, the detecting assembly is in the first triggering state: when the lower end of the detection component is blocked, the detection component retracts to trigger the first Hall sensor, and the detection component is in a first trigger state.

6. The PCB transferring method of claim 1, wherein when the number of times of performing the steps S1 to S3 is greater than 3, the performing of the operation is stopped and a malfunction alarm is performed.

7. The PCB transfer method of claim 1, wherein the PCB transfer method is transferred using a PCB transfer device comprising a vacuum suction assembly, a positioning body, the first hall sensor, a second hall sensor, and a detection assembly; the first Hall sensor and the second Hall sensor are arranged at the upper end of the positioning main body at an upper-lower interval; the upper end of the detection component is embedded in the positioning main body, the lower end of the detection component extends downwards towards the lower end of the positioning main body, the detection component can move upwards when the lower end of the detection component is blocked or jacked up,

the vacuum adsorption component performs vacuum adsorption on the PCB;

8. The PCB transferring method of claim 7, wherein the transferred target position is a position of a jig, a positioning component protruding upwards is provided on the jig, the PCB transferring device can move the positioning main body to match with the positioning component, and when the positioning main body matches with the positioning component, the positioning component jacks up the lower end of the detecting component, so that the detecting component moves upwards and triggers the second hall sensor, and the detecting component is in the second triggering state.

9. The PCB transferring method of claim 8, wherein a height difference between the second hall sensor and the top of the probe assembly is adapted to a height of the positioning member when the lower end of the probe assembly is not blocked or lifted, and a height difference between the bottom of the positioning body and the transfer body is adapted to a height difference between the bottom of the vacuum suction assembly and the transfer body.