CN113993367A

CN113993367A - PCB transferring method

Info

Publication number: CN113993367A
Application number: CN202111118808.6A
Authority: CN
Inventors: 林云峰; 孙畅; 刘龙生
Original assignee: New Career Guangzhou Electronics Co ltd
Current assignee: New Career Guangzhou Electronics Co ltd
Priority date: 2021-09-24
Filing date: 2021-09-24
Publication date: 2022-01-28
Anticipated expiration: 2041-09-24
Also published as: CN113993367B

Abstract

The invention relates to a PCB transferring method, which comprises the following steps: s1, acquiring PCB position coordinate information; s2, performing vacuum adsorption on the PCB according to the PCB position coordinate information, so that the detection assembly extends into the positioning hole of the PCB and is in a free state, or the lower end of the detection assembly is blocked and the detection assembly is in a first trigger state; s3, when the detection component is in a free state, the PCB is lifted and moved to a target position; when the probe assembly is in the first trigger state, the vacuum adsorption of the PCB is released, and steps S1 to S3 are re-executed. According to the PCB transferring method provided by the invention, the PCB adsorption position and the placing position are accurately judged by matching with the PCB transferring device. The problem of very high rejection rate when solving PCB and being difficult to fix a position, transporting, especially FPC class very thin and soft circuit board fix a position and the rejection rate problem.

Description

PCB transferring method

Technical Field

The invention belongs to a PCB material taking technology, and particularly relates to a PCB transferring method.

Background

Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. A Flexible Printed Circuit (FPC) is a kind of PCB, and is a Flexible Printed Circuit board with high reliability and excellent performance, which is manufactured by using polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. In the processing process of the PCB, the PCB needs to be taken and placed, namely the PCB on the assembly line is placed into the storage module. Adopt manual operation to put into the storage module with PCB on the assembly line in, not only staff's intensity of labour is high, the cost of labor is high, get and put the material inefficiency, and PCB receives manual operation's influence easily moreover and appears the fish tail or damage.

CN202021190033.4 discloses a PCB suction means, can absorb the PCB that is located on the assembly line through absorbing the subassembly, can treat through push-and-pull subassembly and place the tray and carry out the push-and-pull, can place the PCB on the assembly line on treating the tray through the combination of the motion of absorbing the subassembly and the motion of push-and-pull subassembly. CN201821256891.7 discloses a PCB material taking mechanism, which comprises a frame, wherein the frame comprises a top plate, a bottom plate and supporting tubes, the four supporting tubes penetrate through guide holes arranged on a substrate, a first cylinder mounting frame and a first cylinder are fixed above the substrate, a second cylinder is fixed below the substrate and connected with a third cylinder, the lower end of the third cylinder is connected with a rotary cylinder, the rotary cylinder is connected with a rotary assembly, the rotary assembly is connected with a sucker, and suction nozzles are arranged below the sucker; the bottom plate is of an annular structure, the suckers penetrate through the bottom plate, and suction nozzles are further arranged at the four corners of the bottom plate and are connected with the first air cylinders. In the scheme, the problems that the accuracy of the adsorption position is low in the PCB adsorption process and the accuracy is low when the PCB is transferred to the target position after adsorption are not solved, and the high rejection rate is generated in the whole process.

Furthermore, if the PCB material taking mechanism directly adopts the positioning camera to directly position the PCB adsorption position and the target position for PCB transfer, the following problems are inevitable: 1. the accuracy of the positioning camera for acquiring the PCB adsorption position and the target position transferred by the PCB depends on a visual positioning system of the positioning camera, so that the positioning camera has a certain error in positioning the PCB adsorption position and the target position; 2. errors can exist in each mechanical action executed by the PCB material taking mechanism in the whole sucking and transferring process, and when the PCB is adsorbed, the errors exist in the action executed by the PCB material taking mechanism close to the PCB and the action executed by the PCB adsorbed by a sucker of the PCB material taking mechanism; when the PCB picking mechanism is adsorbed and transferred, the PCB picking mechanism is far away from the action executed by the adsorption position, and the PCB picking mechanism is close to the target position and has errors in the action executed when the PCB is placed. The problems can be independently or superposedly influenced on the suction and transfer processes, and the suction and transfer accuracy of the PCB is finally reduced. Compared with a common PCB, the FPC is softer and thinner, so that the positioning, sucking and transferring difficulties are higher; when the positioning camera is directly used for positioning, the FPC is influenced by the positioning error and the executing mechanical action error.

Disclosure of Invention

Aiming at the problems of lower accuracy of the adsorption position and lower accuracy when the PCB is transferred to the target position after adsorption in the prior art; and when the positioning camera is directly adopted for positioning, the positioning error and the error of executing mechanical action are inevitable.

The embodiment provided by the invention discloses a PCB transferring method, which comprises the following steps:

s1, acquiring PCB position coordinate information;

s2, performing vacuum adsorption on the PCB according to the PCB position coordinate information, so that the detection assembly extends into the positioning hole of the PCB and is in a free state, or the lower end of the detection assembly is blocked and the detection assembly is in a first trigger state;

s3, when the detection component is in a free state, the PCB is lifted and moved to a target position; when the probe assembly is in the first trigger state, the vacuum adsorption of the PCB is released, and steps S1 to S3 are re-executed.

Preferably, in step S1, the PCB position coordinate information is acquired by using a positioning camera.

Preferably, in step S3, the lifting and transferring the PCB to the target position specifically includes:

s11, acquiring coordinate information of the target position;

s12, the PCB is placed in a matching way with the target position according to the coordinate information of the target position, whether the detection assembly is in the second trigger state or not is judged, and when the lower end of the detection assembly is jacked up, the detection assembly is in the second trigger state;

s13, when the detection assembly is in the second trigger state, releasing vacuum adsorption and enabling the PCB to be put down; when the probing assembly is not in the second triggered state, the PCB is moved away from the target position, and steps S11 to S13 are performed again.

Preferably, when the lower end of the detection assembly is jacked up, the detection assembly being in the second trigger state specifically includes: when the lower end of the detection assembly is jacked up, the second Hall sensor is triggered, and the detection assembly is in a second trigger state.

Preferably, when the number of times of performing steps S11 to S13 is more than 3 times, the performing of the action is stopped, and a malfunction alarm is performed.

Preferably, when the lower end of the detection assembly is blocked, the detection assembly being in the first trigger state specifically comprises: when the lower end of the detection assembly is blocked, the detection assembly retracts to trigger the first Hall sensor, and the detection assembly is in a first trigger state.

Preferably, when the number of times of performing steps S1 to S3 is more than 3 times, the performing of the action is stopped, and a malfunction alarm is performed.

Preferably, the PCB transfer method transfers the PCB using a PCB transfer device, the PCB transfer device including a vacuum adsorption assembly, a positioning body, the first hall sensor, the second hall sensor, and a detection assembly; the first Hall sensor and the second Hall sensor are arranged at the upper end of the positioning main body at intervals up and down; the upper end of the detection component is embedded in the positioning main body, the lower end of the detection component extends downwards towards the lower end of the positioning main body, and the detection component can move upwards when the lower end of the detection component is blocked or jacked up,

the vacuum adsorption component carries out vacuum adsorption on the PCB;

when the detection assembly extends into the positioning hole of the PCB, the detection assembly is in a free state; when the lower end of the detection assembly is blocked, the detection assembly moves upwards to trigger the first Hall sensor, and the detection assembly is in a first trigger state; when the lower end of the detection assembly is jacked up, the detection assembly moves upwards to trigger the second Hall sensor, and the detection assembly is in a second trigger state.

Preferably, the target position of the transfer is a position where the jig is located, an upward protruding positioning component is arranged on the jig, the PCB transfer device can move the positioning main body to be matched with the positioning component, when the positioning main body is matched with the positioning component, the positioning component jacks up the lower end of the detection assembly, the detection assembly moves upwards and triggers the second Hall sensor, and the detection assembly is in a second trigger state.

Preferably, when the lower end of the detection assembly is not blocked or jacked, the height difference between the second hall sensor and the top of the detection assembly is adapted to the height of the positioning component, and the height difference between the bottom of the positioning body and the transfer body is adapted to the height difference between the bottom of the vacuum adsorption assembly and the transfer body.

The PCB is accurately adsorbed and placed, and errors caused by directly adopting a positioning camera for positioning are solved; and the problem that the FPC is difficult to position and has high rejection rate during transfer is solved, and the device is more suitable for sucking and transferring the FPC.

Drawings

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 is a flowchart of a PCB transfer method according to an embodiment;

fig. 2 is a flowchart of a PCB transfer method with a repeat execution number of 3 according to an embodiment;

fig. 3 is a schematic structural diagram of a PCB transfer device according to an embodiment;

FIG. 4 is a schematic structural diagram of a positioning body according to an embodiment;

FIG. 5 is a schematic structural view illustrating a misalignment positioning hole of the detecting assembly according to an embodiment;

FIG. 6 is a schematic structural view illustrating the alignment of the probe assembly with the positioning hole according to the embodiment;

FIG. 7 is a schematic structural diagram of an alignment positioning component of the probe assembly according to an embodiment.

In the figure: the PCB transferring device comprises a positioning main body 1, a vacuum adsorption component 2, a PCB transferring device 3, a PCB4, a positioning hole 5, a jig 6 and a positioning component 7; the device comprises a first Hall sensor 11, a second Hall sensor 12, a magnetic component 13, a spring 14, a pressure plate 15, a limit table 16, a detection component 17, external threads 18 and a process groove 19.

In fig. 2: a is 1, the detection group triggers the first Hall sensor, and the detection component is in a first triggering state;

a is 0, the first Hall sensor is not triggered by the detection group;

b is 1, the detection group triggers the second Hall sensor, and the detection component is in a second trigger state;

b is 0, which means that the first hall sensor is not triggered by the detection group;

a is 0 and B is 0, the detection assembly extends into a positioning hole of the PCB and is in a free state;

n, refers to the number of repeated executions.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In order not to be ambiguous to the reader, hereinafter "PCB" in PCB4 refers to a printed circuit board and "4" in PCB4 refers to a PCB identified by the reference numeral "4" in the drawings accompanying this specification.

s1, acquiring PCB position coordinate information;

s2, performing vacuum adsorption on the PCB4 according to the PCB position coordinate information, so that the detection assembly extends into the positioning hole 5 of the PCB4 and is in a free state, or the lower end of the detection assembly is blocked and the detection assembly is in a first trigger state;

s3, when the detecting component is in free state, the PCB4 is lifted and moved to the target position; when the probe assembly is in the first trigger state, the vacuum adsorption of the PCB4 is released, and steps S1 to S3 are re-executed.

Referring to fig. 1 to 7, a flow chart of a PCB transfer method is shown in fig. 1 and 2, the PCB transfer method requires a PCB transfer device 3 to be used in cooperation, and a positioning hole 5 matched with the lower end of the probe assembly is formed in a PCB4 to be transferred.

The PCB4 adsorption step (S1 to S3), the PCB transfer device 3 moves to the PCB4, the vacuum adsorption component 2 vacuumizes and adsorbs the PCB4, if the detection component is not inserted into the positioning hole 5 on the PCB4, the first hall sensor 11 is triggered, and the detection component forms a first trigger state, that is, a is 1; the vacuum adsorption component 2 releases the adsorption of the PCB4, so that the PCB transfer device 3 is separated from the PCB4, the PCB4 is put back to the original position, the PCB4 is put back to the original position, the positioning camera acquires the position coordinate information of the PCB again, and the PCB transfer device 3 carries out positioning and adsorption operation again, thus avoiding the problem of high rejection rate of the PCB4 during transfer; if the lower end of the detection assembly is accurately inserted into the positioning hole 5 in the PCB4, the lower end of the detection assembly is not blocked, the first hall sensor 11 is not triggered, a free state is formed, namely, a is 0 and B is 0, so that the PCB4 can be accurately adsorbed and can be transferred.

In the step of transferring the PCB4 (S11 to S13), the target position is generally the position of the fixture 6, when the PCB4 is transferred to the fixture 6 by the PCB transfer device, the positioning component 7 corresponding to the transfer device is disposed on the fixture 6, the positioning component 7 on the fixture 6 can jack up the detection component after aligning and matching with the detection component, and the detection component triggers the second hall sensor 12, that is, B is 1, it can be known that the transfer position of the PCB4 is accurate, the vacuum component releases the adsorption of the PCB4, and the PCB4 is correctly placed on the fixture 6. If when transferring to the fixture 6, the position is inaccurate, the detection component does not trigger the second hall sensor 12, that is, B is 0, so that the PCB transferring device 3 is away from the fixture 6 by a distance, and the positioning camera acquires the position coordinate information of the fixture 6 again and repeats the transferring operation. The adsorption operation is repeated no more than 3 times after the PCB4 is inaccurately adsorbed, and the transfer operation is repeated no more than 3 times after the PCB4 is accurately transferred. The PCB4 can be correctly sucked and transferred through the arrangement. Fig. 2 shows a more specific embodiment as fig. 1, and fig. 2 shows that the upper limit value set for repeated execution is 3 times.

In a preferred embodiment, in step S1, PCB position coordinate information is acquired using a positioning camera. When acquiring the PCB position coordinate information, in order to obtain better effect, the camera is positioned a distance slightly away from the PCB4 and shoots the PCB4 to acquire the coordinate information. Adopt the location camera to carry out preliminary location, cooperation such as detection subassembly on the cooperation PCB transfer device 3 carries out accurate location, can realize accurate location and improve simultaneously and absorb efficiency and transfer efficiency.

Referring to fig. 1-7, in the preferred embodiment, in step S3, the lifting and moving the PCB4 to the target position specifically includes: s11, acquiring coordinate information of the target position; s12, the PCB4 is placed in a matched mode with the target position according to the coordinate information of the target position, whether the detection assembly is in the second trigger state or not is judged, and when the lower end of the detection assembly is jacked up, the detection assembly is in the second trigger state; s13, when the detection assembly is in the second trigger state, the vacuum adsorption is released, and the PCB4 is put down; when the probe assembly is not in the second triggered state, the PCB4 is moved away from the target position, and steps S11 to S13 are performed again. Further, when the lower end of the detection assembly is jacked up, the detection assembly in the second trigger state specifically comprises: when the lower end of the detection component is jacked up, the second Hall sensor 12 is triggered, and the detection component is in a second trigger state. Generally, the PCB transferring device 3 is connected to a lower side of the robot tool end, and is moved by the robot tool end when the PCB transferring device 3 is moved, so that the PCB4 is moved to the target position coordinates by moving the robot tool end to the target position coordinates after the target position coordinate information is acquired. The target position is the position of the general jig 6, and the jig 6 is provided with a positioning column, the positioning column can detect the alignment and matching of the lower end of the component, and the positioning column can pass through the positioning hole 5 on the PCB4 to jack up the lower end of the detection component to form a second trigger state.

Referring to fig. 1-2, in the preferred embodiment, when the number of times steps S11-S13 are performed is greater than 3, the execution of actions is stopped and a malfunction alarm is performed. The above-mentioned number is more than 3 times, and the number of times of performing the step may be set to any integer number of 3 or more, for example, 4, 5, 9 and 10, if necessary, and when the number is exceeded, the execution of the action is stopped and a malfunction alarm is performed. The fault alarm is an audible and visual alarm.

Referring to fig. 4 and 6, in the preferred embodiment, when the lower end of the detecting component is blocked, the detecting component is in the first triggering state specifically: when the lower end of the detection assembly is blocked, the detection assembly retracts to trigger the first Hall sensor 11, and the detection assembly is in a first trigger state.

In a preferred embodiment, when the number of times of performing steps S1 to S3 is more than 3 times, the execution of the action is stopped, and a malfunction alarm is performed. The above mentioned times are more than 3 times, and the number of times of executing the steps can be set to any integer value above 3 according to the requirement.

Referring to fig. 1 to 7, in a preferred embodiment, the PCB transfer method uses a PCB transfer device 3 for transfer, and the PCB transfer device 3 includes a vacuum adsorption assembly 2, a positioning body 1, a first hall sensor 11, a second hall sensor 12, and a detection assembly; the first Hall sensor 11 and the second Hall sensor 12 are arranged at the upper end of the positioning main body 1 at intervals up and down; the upper end of the detection component is embedded in the positioning main body 1, the lower end extends downwards towards the lower end of the positioning main body 1, the detection component can move upwards when the lower end of the detection component is blocked or jacked,

the vacuum adsorption component 2 carries out vacuum adsorption on the PCB 4;

when the detection assembly extends into the positioning hole 5 of the PCB4, the detection assembly is in a free state; when the lower end of the detection assembly is blocked, the detection assembly moves upwards to trigger the first Hall sensor 11, and the detection assembly is in a first trigger state; when the lower end of the detection component is jacked up, the detection component moves upwards to trigger the second Hall sensor 12, and the detection component is in a second trigger state. The upper and lower, height, lateral and longitudinal directions mentioned in this application are all referred to with the lower end of the probe assembly facing downwards when the positioning body 1 is in use, unless otherwise specified. The lower end of the detection component extends downwards towards the lower end of the positioning main body 1, so that the lower end of the detection component can be understandably detected to extend towards the lower end of the positioning main body 1 when not blocked.

Further, the positioning main body 1 and the vacuum adsorption component 2 are both fixed on the PCB transfer device 3, the detection component and the vacuum adsorption component 2 both extend downwards relative to the PCB transfer device 3, and the height of the downward extension of the detection component relative to the PCB transfer device 3 is greater than the height of the downward extension of the vacuum adsorption component 2 relative to the PCB transfer device 3; when the detection assembly moves upwards to the position that the bottom of the detection assembly is level with the bottom of the adsorption assembly, the first Hall sensor 11 is triggered. Generally, the detection assembly and the vacuum adsorption assembly 2 are both disposed on the bottom surface of the PCB transferring device 3, and the above-mentioned height of the detection assembly protruding downward relative to the PCB transferring device 3 is greater than the height of the vacuum adsorption assembly 2 protruding downward relative to the PCB transferring device 3, wherein the height refers to the distance between the bottom of the detection assembly and the bottom surface of the PCB transferring device 3. The use mode of the PCB transfer device 3 has been described in the previous embodiment and is not described again, and the hall sensor and the detection component are arranged on the PCB transfer device 3, the PCB transfer device 3 and the vacuum adsorption component 2 can accurately adsorb the PCB4, so that errors generated when a separate positioning camera is adopted are avoided.

Further, location main part 1 and vacuum adsorption subassembly 2 are a plurality of all setting and transfer 3 bottom surfaces of device at the PCB, and the detection subassembly bottom of location main part 1 all is on the coplanar, provides a plurality of setpoint through setting up a plurality of location main parts 1 for the location is more accurate, provides a plurality of adsorption points through setting up a plurality of vacuum adsorption subassemblies 2, makes to adsorb PCB4 more steady so that accurate PCB4 transfers. The vacuum adsorption component comprises a vacuum device and a sucker, the vacuum device can be connected to the PCB transfer device 3, the top end of the sucker is connected with the vacuum device and communicated with the vacuum device, the sucker extends downwards relative to the PCB transfer device 3, generally, the bottom of the sucker and the bottom of the positioning main body 1 are on the same plane, and the vacuum device can extract air in the sucker. The arrangement of the vacuum device and the sucker ensures that the sucker keeps vacuum through the air suction of the vacuum device and is sucked on the PCB4, thereby being more beneficial to automatic operation. The arrangement of the vacuum device and the suction cup is more beneficial to the automation operation.

Further, the detection assembly comprises a magnetic component 13 and a detection component 17 which are connected with each other, the magnetic component 13 is located at the upper end of the detection assembly, when the detection component 17 is not blocked, the lower end of the detection component 17 extends downwards towards the lower end of the positioning main body 1, when the lower end of the detection component 17 is blocked or jacked up, the detection assembly moves upwards, and the magnetic component 13 can sequentially trigger the first hall sensor 11 and the second hall sensor 12. Further, the magnetic component 13 is a magnet, the detecting component 17 is a sensing probe, and the magnet is embedded in the top of the sensing probe.

Further, the lower end of the positioning main body 1 is provided with a guide hole with a downward opening, the guide hole extends from the lower end of the positioning main body 1 to the upper end of the positioning main body 1, the upper end of the detection component is embedded in the guide hole, when the detection component 17 is not blocked, the lower end of the detection component 17 extends downwards out of the guide hole, and the first hall sensor 11 and the second hall sensor 12 are arranged on one side of the guide hole. The first hall sensor 11 and the second hall sensor 12 are arranged on one side of the guide hole, and the first hall sensor 11 and the second hall sensor 12 can be completely embedded in the main body 1 and located on one side of the guide hole, or the first hall sensor 11 and the second hall sensor 12 are partially embedded in the main body 1 and partially exposed in the guide hole. Through the guiding hole setting for survey the subassembly and can inlay well and establish in location main part 1, and follow the direction up-and-down motion of guiding hole, more be favorable to surveying the subassembly and fix a position accurately.

Furthermore, a limiting table 16 protruding in the radial direction is arranged in the middle of the detection assembly, the limiting table 16 is located between the upper end of the detection assembly and the lower end of the detection assembly, a spring 14 and a pressing plate 15 are arranged in the guide hole, the limiting table 16 is located below the pressing plate 15, the spring 14 is sleeved on the outer side of the upper end of the detection assembly, the spring 14 is limited between the pressing plate 15 and the limiting table 16, the outer side of the pressing plate 15 is fixedly connected with the guide hole, a through portion penetrating through the upper surface and the lower surface of the pressing plate 15 is arranged in the middle of the pressing plate 15, the through portion can be sleeved on the upper end of the detection assembly, and when the detection assembly moves upwards, the detection assembly can slide upwards in the through portion. Generally, the limit table 16 is a part of the detection assembly, and the limit table 16 and the detection assembly are integrally formed; the lower end of the guide hole is a cylindrical guide hole, and the lower end of the guide hole is positioned below the limiting table 16 and has a diameter smaller than that of the limiting table 16. When detecting the subassembly lower extreme and receiving to block or by jack-up, spring 14 is compressed, detects the subassembly lower extreme and receives to block to disappear the back, and spring 14 reconversion makes and detects the subassembly and resets, through the aforesaid setting for the operation is more automatic.

Furthermore, the inner wall of the guide hole is provided with internal threads, and the heights of the upper end and the lower end of each internal thread are greater than the heights of the upper end and the lower end of the pressure plate 15; the outer periphery of the pressure plate 15 is formed with an external thread 19 which can be matched with the internal thread, and the external thread 19 extends from the upper end of the pressure plate 15 to the lower end of the pressure plate 15. The fixing position of the pressing plate 15 and the guide hole can be adjusted by rotating the pressing plate 15 up and down, and the tightness of the spring 14 can be adjusted, so that the PCB transferring device 3 can be better applied to adsorbing and transferring different types of PCBs 4. Because the common PCB4 has higher rigidity, the force applied by the detection assembly to the PCB4 is more favorable for positioning, adsorption and transportation, and the spring 14 is pressed more tightly; because the FPC (flexible circuit board, a kind of PCB 4) is flexible, the force applied by the detection assembly to the FPC should be small to facilitate moving, positioning, absorbing and transferring, and the spring 14 should be loosened compared with the ordinary PCB 4. Further, a process groove 20 is formed below the internal thread of the guide hole, the process groove 20 protrudes in the radial direction relative to the guide hole, and the process groove 20 is arranged to facilitate machining of the internal thread.

Referring to fig. 4 and 7, in a preferred embodiment, the target position of the transfer is the position of the jig 6, the jig 6 is provided with a positioning component 7 protruding upward, the PCB transfer device 3 can move the positioning body 1 to match with the positioning component 7, when the positioning body 1 matches with the positioning component 7, the positioning component 7 jacks up the lower end of the detection component, so that the detection component moves upward and triggers the second hall sensor 12, and the detection component is in the second trigger state.

Further, the number of the positioning components 7 is multiple, the tops of the positioning components 7 are on the same plane, the positioning components 7 can be matched with the positioning holes 5 and the detection assemblies on the PCB4, and when the PCB4 is placed, the positioning components 7 penetrate through the positioning holes 5 to jack up the detection assemblies and lift the detection assemblies to trigger the second hall sensors 12. The positioning component 7 is arranged to be matched with the second Hall sensor 12 to provide positioning points for the moving PCB4, so that the positioning is more accurate. Furthermore, the positioning component 7 is a circular truncated cone positioning column, the column diameter of the positioning component 7 is smaller than the diameter of the guide hole on the positioning main body 1, and the positioning component 7 can partially extend into the guide hole.

Referring to fig. 3 to 7, in the preferred embodiment, when the lower end of the probe assembly is not blocked or lifted, the height difference between the second hall sensor 12 and the top of the probe assembly is adapted to the height of the positioning member 7, and the height difference between the bottom of the positioning body 1 and the PCB transfer device 3 is adapted to the height difference between the bottom of the vacuum chuck assembly 2 and the PCB transfer device 3. The above-mentioned "height difference adaptation" may be that the height difference is equal or slightly wrong; "height-adaptive" may be equal in height or slightly erroneous. Further, when the lower end of the detection assembly is not blocked or not jacked, the height difference between the second hall sensor 12 and the top of the detection assembly is equal to the height of the positioning member 7, and the height difference between the bottom of the positioning body 1 and the PCB transfer device 3 is equal to the height difference between the bottom of the vacuum absorption assembly 2 and the PCB transfer device 3. The jig 6 is generally a cuboid, the positioning component 7 is a circular truncated cone positioning column on the upper surface of the jig 6, and the height of the positioning component 7 is the distance from the top of the positioning component 7 to the upper surface of the jig 6.

The PCB4 is accurately adsorbed and the PCB4 is accurately placed, and errors caused by directly adopting a positioning camera for positioning are avoided; and the problem that the FPC is difficult to position and has high rejection rate during transfer is solved, and the device is more suitable for sucking and transferring the FPC.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, reference to the description of the terms "preferred embodiment," "yet another embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. A PCB transfer method is characterized by comprising the following steps:

s1, acquiring PCB position coordinate information;

2. The PCB transfer method of claim 1, wherein in the step S1, PCB position coordinate information is acquired using a positioning camera.

3. The PCB transferring method of claim 1, wherein the lifting and transferring the PCB to the target position in the step S3 comprises:

s11, acquiring coordinate information of the target position;

4. The PCB transfer method of claim 3, wherein when the lower end of the probe assembly is jacked up, the probe assembly being in the second triggered state is specifically: when the lower end of the detection assembly is jacked up, the second Hall sensor is triggered, and the detection assembly is in a second trigger state.

5. The PCB transfer method of claim 3, wherein when the number of times of performing the steps S11 to S13 is more than 3, the performing action is stopped and a malfunction alarm is performed.

6. The PCB transfer method of claim 1, wherein when the lower end of the probe assembly is blocked, the probe assembly being in the first triggered state comprises: when the lower end of the detection assembly is blocked, the detection assembly retracts to trigger the first Hall sensor, and the detection assembly is in a first trigger state.

7. The PCB transfer method of claim 1, wherein when the number of times of performing the steps S1 to S3 is more than 3, the performing of the action is stopped and a malfunction alarm is performed.

8. The PCB transfer method of claim 1, wherein the PCB transfer method is transferred using a PCB transfer device including a vacuum adsorption assembly, a positioning body, the first hall sensor, a second hall sensor, and a detection assembly; the first Hall sensor and the second Hall sensor are arranged at the upper end of the positioning main body at intervals up and down; the upper end of the detection component is embedded in the positioning main body, the lower end of the detection component extends downwards towards the lower end of the positioning main body, and the detection component can move upwards when the lower end of the detection component is blocked or jacked up,

the vacuum adsorption component carries out vacuum adsorption on the PCB;

9. The PCB transferring method of claim 8, wherein the target position of the transfer is a position of a jig, the jig is provided with a positioning component protruding upward, the PCB transferring device can move the positioning body to match with the positioning component, when the positioning body matches with the positioning component, the positioning component jacks up the lower end of the detection component, so that the detection component moves upward and triggers the second hall sensor, and the detection component is in a second triggering state.

10. The PCB transfer method of claim 9, wherein a height difference between the second hall sensor and the top of the probe assembly corresponds to a height of the positioning member when the lower end of the probe assembly is not blocked or lifted, and a height difference between the bottom of the positioning body and the transfer body corresponds to a height difference between the bottom of the vacuum adsorption assembly and the transfer body.