CN112614788A - Electronic component detection system - Google Patents
Electronic component detection system Download PDFInfo
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- CN112614788A CN112614788A CN202010866949.5A CN202010866949A CN112614788A CN 112614788 A CN112614788 A CN 112614788A CN 202010866949 A CN202010866949 A CN 202010866949A CN 112614788 A CN112614788 A CN 112614788A
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- 238000001514 detection method Methods 0.000 title claims abstract description 89
- 230000007246 mechanism Effects 0.000 claims description 37
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- 238000012360 testing method Methods 0.000 description 22
- 238000007689 inspection Methods 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
- G01N35/025—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations having a carousel or turntable for reaction cells or cuvettes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8841—Illumination and detection on two sides of object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
- G01N35/04—Details of the conveyor system
- G01N2035/0439—Rotary sample carriers, i.e. carousels
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Abstract
An electronic component detection system comprises a first surface-to-be-detected detection device and a second surface-to-be-detected detection device. The first detection device for detecting the first surface to be detected defines a first detection area for detecting the image of the first surface to be detected when the first surface to be detected of the electronic component moves to the first detection area for detecting the first surface to be detected. The second surface-to-be-detected detection device comprises a rotary detection platform, a fixed jig and at least one detection module, and when the rotary detection platform drives the fixed jig to move, the detection module is used for carrying out image detection on the second surface-to-be-detected of the electronic component.
Description
Technical Field
The present invention relates to an electronic component detecting system, and more particularly, to an electronic component detecting system for detecting a plurality of surfaces of an electronic component to be detected.
Background
In order to improve the quality of human life, the recent trend of technology development is mainly based on small-sized and powerful technology products, and therefore the sizes of the electronic components constituting the technology products must be smaller and smaller, but when the sizes of the electronic components are precise to a certain degree, the electronic components are easily damaged due to slight collision in the production and manufacturing process, and particularly when the manufacturing process of the electronic components includes a plurality of workstations, the electronic components are easily damaged after being picked and placed by the plurality of workstations, and therefore after the electronic components are manufactured, a series of electrical tests and appearance tests are required to ensure that the electronic components can provide preset functions; among them, in electronic components mainly including optical elements, since defects such as scratches and stains on the surface affect the functions of the optical elements, image detection for appearance is often more severe.
As mentioned above, since the electronic components mainly including the optical elements have high requirements on appearance, when performing appearance inspection, it is usually necessary to control the quality of the finished product through multiple image inspection steps, however, the more inspection steps also represent that the number of times of picking and placing or moving the electronic components is relatively increased, thereby increasing the risk of damaging the electronic components.
Disclosure of Invention
In view of the fact that after the electronic component mainly comprising the optical element is manufactured, multiple image detection steps are generally required, and the risk of damage to the electronic component during the detection process is also increased; accordingly, the present invention is directed to an electronic device inspection system, which can effectively reduce the number of picking, placing and moving of electronic devices during image inspection, thereby reducing the risk of damage to the electronic devices due to picking and placing of the electronic devices.
In order to achieve the above object, the present invention provides an electronic device inspection system for image inspection of an electronic device having a first surface to be inspected and at least a second surface to be inspected, the electronic device inspection system including a first surface to be inspected inspection apparatus and a second surface to be inspected inspection apparatus.
The first detection device for detecting the first surface to be detected defines a first detection area for detecting the image of the first surface to be detected when the first surface to be detected of the electronic component moves to the first detection area for detecting the image.
The second device for detecting a surface to be detected is adjacent to the first device for detecting a surface to be detected and comprises a rotary detection platform, a fixed fixture and at least one detection module. The rotary detection platform is provided with a bearing surface and is driven to rotate along a rotation direction; the fixed jig is arranged on the bearing surface and used for fixing the electronic component, a second surface to be detected of the electronic component is exposed out of the fixed jig, and the fixed jig moves along a detection path along with the rotation of the rotary detection platform; at least one detection module is arranged adjacent to the rotary detection platform and used for carrying out image detection on a second surface to be detected of the electronic assembly when the fixed jig moves to a detection area of the detection module along the detection path.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the electronic component detecting system further includes an object-to-be-detected conveying component, a first moving component and a second moving component. The object conveying assembly is arranged between the first surface detection device to be detected and the second surface detection device to be detected and is used for conveying the electronic assembly passing through the first surface detection device to be detected to a position adjacent to the second surface detection device to be detected.
The first moving component is used for moving the electronic component, so that the electronic component is placed on the object to be detected conveying component after passing through the first object to be detected surface detection device. The second moving component moves the electronic component placed on the object conveying component to be tested to the fixed fixture.
In an auxiliary technical means derived from the above-mentioned essential technical means, the electronic component detecting system further includes an input tray stacking mechanism for stacking a plurality of trays, and the electronic components are disposed on the trays. Preferably, the first moving assembly includes a first rail extending from a position adjacent to the input tray stacking mechanism along a first direction to a position adjacent to the object conveying assembly, and a first fetching device movably connected to the first rail along the first direction. In addition, the first object fetching device comprises an object fetching device body, a first suction nozzle and at least one second suction nozzle, wherein the object fetching device body is movably connected to the first track along the first direction and is provided with a first air suction channel and a second air suction channel, the first suction nozzle is communicated with the first air suction channel, the second suction nozzle is communicated with the second air suction channel, and the first suction nozzle and the second suction nozzle are correspondingly used for adsorbing the electronic component.
In an ancillary technical means derived from the above-mentioned essential technical means, the second moving assembly includes a second rail and a second fetching device, the second rail extends from a position adjacent to the object-to-be-tested conveying assembly to a position adjacent to the second surface-to-be-tested detecting device, and the second fetching device is movably connected to the second rail; preferably, the second object-taking device comprises an object-taking device body, a first suction nozzle and at least one second suction nozzle, the object-taking device body is movably connected to the second rail and is provided with a first air-extracting channel and a second air-extracting channel, the first suction nozzle is communicated with the first air-extracting channel, the second suction nozzle is communicated with the second air-extracting channel, and the first suction nozzle and the second suction nozzle are correspondingly used for adsorbing the electronic component.
In an ancillary technical means derived from the above-mentioned essential technical means, the object conveying assembly extends from the first device to be detected to a position adjacent to the second device to be detected. Preferably, the object conveying assembly includes a conveying track and a carrier, the conveying track extends from a position adjacent to the first device to be detected to a position adjacent to the second device to be detected, and the carrier is reciprocally disposed on the conveying track for moving the electronic assembly from the position adjacent to the first device to be detected to the position adjacent to the second device to be detected. In addition, the carrier is provided with a first through hole, at least one second through hole and a negative pressure air suction hole, the first through hole corresponds to a first part of the electronic component, the at least one second through hole corresponds to a second part of the electronic component, the first through hole and the at least one second through hole are respectively communicated with the negative pressure air suction hole, and the negative pressure air suction hole is communicated with a negative pressure source, so that the first through hole and the at least one second through hole fix the first part and the second part of the electronic component through the negative pressure generated by the negative pressure source in an adsorption manner.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the at least one detection module includes a detection angle adjusting mechanism, an image capturing element and an image reflecting assembly, the detection angle adjusting mechanism is disposed adjacent to the second device for detecting the surface to be detected, the image capturing element is movably connected to the detection angle adjusting mechanism, and the image reflecting assembly is disposed between the image capturing element and the second device for detecting the surface to be detected, so as to reflect the image of the at least one second surface to be detected to the image capturing element when the second surface to be detected moves to be adjacent to the at least one detection module.
As mentioned above, the electronic component detecting system of the present invention mainly uses the first surface-to-be-detected detecting device to detect the first surface-to-be-detected of the electronic component, and uses the second surface-to-be-detected detecting device to detect the second surface-to-be-detected of the electronic component, so that the electronic component detecting system of the present invention can effectively perform multi-directional image detection on the electronic component without moving the electronic component many times, thereby effectively preventing the electronic component from being damaged by multiple pick-and-place or movement, and effectively improving the efficiency of image detection.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is a schematic top plan view of an electronic component inspection system according to a preferred embodiment of the invention;
FIG. 2 is a perspective view of an electronic device being inspected by the electronic device inspection system in the electronic device inspection system according to the preferred embodiment of the present invention;
fig. 3 is a schematic plan view illustrating a first testing surface of an electronic component detecting system according to a preferred embodiment of the invention, which utilizes a first testing surface detecting device to detect the first testing surface of the electronic component;
FIG. 4 is a schematic side view of an electronic device mounted on a fixture and being inspected by a inspecting module when a rotary inspecting platform drives the fixture to move to a corresponding inspecting module according to a preferred embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view illustrating the electronic component not being sucked by the fetching device of the electronic component detecting system according to the preferred embodiment of the invention;
FIG. 6 is a schematic cross-sectional view of an electronic component being sucked by the fetching device of the electronic component detecting system according to the preferred embodiment of the present invention; and
fig. 7 is a schematic cross-sectional view illustrating the electronic component detecting system according to the preferred embodiment of the invention moving the electronic component placed on the object-to-be-tested conveying assembly to the fixing jig by using the second moving assembly.
Wherein, the reference numbers:
Detailed Description
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
referring to fig. 1, fig. 1 is a schematic top plan view of an electronic component inspection system according to a preferred embodiment of the invention. As shown in the figure, an electronic component detecting system 100 includes an input tray stacking mechanism 1, a tray stacking mechanism module 2, an object to be detected aligning structure 3, a first object to be detected detecting device 4, a second object to be detected detecting device 5, an object to be detected conveying component 6, a first moving component 7, a second moving component 8 and a third moving component 9.
The input tray stacking mechanism 1 is used to provide a plurality of trays 200 (only one is labeled), and the trays 200 carry a plurality of electronic components 300 (only one is labeled).
Referring to fig. 2, fig. 2 is a schematic perspective view illustrating an electronic device detected by the electronic device detecting system in the electronic device detecting system according to the preferred embodiment of the invention.
As shown in fig. 2, the electronic component 300 includes a first component part 301, a connecting part 302 and a second component part 303. The first part 301 is a lens assembly in this embodiment. The connecting portion 302 is electrically connected to the first component portion 301, and the connecting portion 302 is a flexible circuit board in this embodiment. The second component 303 is electrically connected to the connecting portion 302, and the second component 303 is a connection port in this embodiment. In addition, the electronic component 300 further has a first surface 300a to be measured, a second surface 300b to be measured, and four second surfaces 300c to be measured (only one is labeled in the figure), the first surface 300a to be measured and the second surface 300b to be measured are oppositely disposed, and the four second surfaces 300c to be measured are located between the first surface 300a to be measured and the second surface 300b to be measured.
In the present embodiment, the first surface 300a to be measured is a bottom surface, and the view of fig. 2 is viewed from the obliquely upper side of the electronic component 300 toward the electronic component 300, so that the first surface 300a to be measured is referred to as the surface of the whole electronic component 300 viewed from the lower side of the electronic component 300; the second surface 300b is a top surface, and thus refers to the entire surface of the electronic component 300 viewed from above the electronic component 300; the second surface 300c is a surface of the electronic component 300 as viewed from the periphery of the electronic component 300 toward the electronic component 300; in addition, in the present embodiment, since the first component 301 and the second component 303 both protrude the connection portion 302, when looking from the outside of the second component 303 toward the first component 301, an inner side surface (not shown) of the first component 301 is blocked by the second component 303.
The carrier stacking mechanism module 2 includes two carrier stacking mechanisms 21 and 22 that have not yet been detected, two output carrier stacking mechanisms 23 and 24 that have passed detection, and an empty carrier stacking mechanism 25.
The non-passing-detected tray stacking mechanisms 21 and 22 are for receiving the non-passing-detected electronic components 300, the passing-detected output tray stacking mechanisms 23 and 24 are for receiving the passing-detected electronic components 300, and the empty tray stacking mechanism 25 is for supplying the empty tray 200 to the non-passing-detected tray stacking mechanism 21, the non-passing-detected tray stacking mechanism 22, the passing-detected output tray stacking mechanism 23, or the passing-detected output tray stacking mechanism 24.
The dut alignment structure 3 is disposed adjacent to the input tray stacking mechanism 1 for performing alignment of the electronic assembly 300. In practical applications, the alignment structure 3 of the object to be measured is mainly provided with a tapered guide slot to align the angular position of the electronic component 300, wherein the tapered guide slot is actually formed by a bottom groove and a tapered structure, and the tapered structure is tapered from top to bottom to have a bottom groove similar to the plane profile of the electronic component 300, so that when the electronic component 300 is placed in the tapered guide slot, the electronic component can slide down along the tapered structure toward the bottom groove and slide under the guidance of the tapered structure, and the angular position is adjusted to be accurately sunk in the bottom groove. This is a common mechanical design and is believed to be understood by those of ordinary skill in the art and will not be further described herein.
Referring to fig. 3, fig. 3 is a schematic plan view illustrating the first testing surface of the electronic component detecting system according to the preferred embodiment of the invention detecting the first testing surface of the electronic component by using the first testing surface detecting device. As shown in fig. 1 and fig. 3, in the present embodiment, the first device for detecting a surface to be detected 4 is disposed adjacent to the input tray stacking mechanism 1, and the alignment structure 3 for objects to be detected is located between the first device for detecting a surface to be detected 4 and the input tray stacking mechanism 1; the first testing device 4 includes a track 41 and a detecting lens 42, the detecting lens 42 is movably disposed on the track 41, and the detecting lens 42 defines a first testing area 421 and has a capturing optical axis 422 passing through the first testing area 421, so as to capture an image of the first testing surface 300a along the capturing optical axis 422 when the first testing surface 300a of each electronic component 300 moves to the first testing area 421 to generate a first testing image data.
The second device 5 is adjacent to the first device 4 and includes a rotary testing platform 51, a fixing fixture 52, and six testing modules 53a, 53b, 53c, 53d, 53e, and 53 f.
The rotary testing platform 51 includes a driving shaft 511 and a turntable 512. The rotary disc 512 is fixedly disposed through the driving shaft 511 and has a bearing surface 5121, and the rotary disc 512 is driven by the driving shaft 511 to rotate along a rotation direction R1, so that the bearing surface 5121 can rotate along a rotation direction R1.
The fixing fixture 52 is fixed on the carrying surface 5121 for fixing the electronic device 300, so that the second surface 300b and the second surface 300c of the electronic device 300 are exposed out of the carrying surface 5121. The fixed fixture 52 moves along a detection path P1 along with the rotation of the rotary detection platform 51.
After the electronic component 300 is fixed on the fixing fixture 52, the second device for inspecting a surface to be inspected 5 can rotate along the rotation direction R1 by the rotation of the rotary inspecting platform 51, so that the electronic component 300 sequentially passes through the six inspecting modules 53a, 53b, 53c, 53d, 53e and 53f along the inspecting path P1 along the fixing fixture 52 for inspection.
The detecting modules 53a, 53b, 53c, 53d, 53e, and 53f are disposed adjacent to the rotary detecting platform 51, and are used for detecting the second surface-to-be-detected 300b or the second surface-to-be-detected 300c of each electronic component 300 to generate a front image data when the fixing fixture 52 moves to the detecting modules 53a, 53b, 53c, 53d, 53e, and 53f along the detecting path P1.
In the present embodiment, the detecting modules 53a, 53b, 53c, 53d, 53e and 53f respectively perform DOE detection, RX detection, three-side detection, top surface detection, inner side surface detection and flexible printed circuit board detection on the electronic component 300. The main components of the detection modules 53a, 53b, 53c, 53d, 53e and 53f are mainly photosensitive-coupled devices (CCDs) for optical image detection, and the DOE detection, the RX detection, the three-side detection, the top-side detection and the fpc detection belong to the top-side detection, and the three-side detection and the inner-side detection belong to the peripheral detection. Although the present embodiment includes six detecting modules 53a, 53b, 53c, 53d, 53e and 53f, in practice, the detecting types of the detecting modules 53a, 53b, 53c, 53d, 53e and 53f may be increased or decreased according to actual requirements.
Referring to fig. 4, fig. 4 is a schematic side view illustrating a plane view of an electronic component mounted on a fixed fixture and detected by a detecting module when a rotary detecting platform drives the fixed fixture to move to a corresponding detecting module according to a preferred embodiment of the present invention. As shown, in the present embodiment, the detecting module 53e includes a detecting angle adjusting mechanism 531e, an image capturing element 532e and an image reflecting element 533 e. The detecting angle adjusting mechanism 531e is disposed adjacent to the rotary detecting platform 51, the image capturing element 532e is movably connected to the detecting angle adjusting mechanism 531e, and the image reflecting element 533e is disposed outside the lens of the image capturing element 532e and aligned with the second surface 300c of the electronic component 300, wherein the second surface is adjacent to an inner side surface (not shown, being a part of the second surface 300 c) of the second component 303, so that the image capturing element 532e can obtain an image of the inner side surface of the second component 303 through the image reflecting element 533 e.
As shown in fig. 1, the object conveying assembly 6 is disposed between the first device for detecting a surface to be detected 4 and the second device for detecting a surface to be detected 5, and is used to convey the electronic assembly 300 passing through the first device for detecting a surface to be detected 4 to the periphery of the second device for detecting a surface to be detected 5.
Referring to fig. 1, fig. 5 and fig. 6 together, fig. 5 is a schematic cross-sectional view illustrating an electronic component not yet being sucked by a fetching device of the electronic component detecting system according to a preferred embodiment of the present invention; fig. 6 is a schematic cross-sectional view illustrating the electronic component being sucked by the fetching device of the electronic component detecting system according to the preferred embodiment of the invention.
As shown in fig. 1 and 5, the first moving assembly 7 is disposed adjacent to the input tray stacking mechanism 1 for moving the electronic assembly 300, so that the electronic assembly 300 passes through the first device for detecting surface to be detected 4 and then is placed on the device for conveying objects 6. The first moving assembly 7 includes a first rail 71 and a first fetching device 72. The first track 71 extends from a position adjacent to the input tray stacking mechanism 1 to a position adjacent to the object conveying assembly 6 along a first direction D1, and the first picking apparatus 72 is disposed on the first track 71 in a reciprocating manner along the first direction D1, so as to move the electronic component 300 of the tray 200 placed on the input tray stacking mechanism 1 to the object alignment structure 3 for alignment, then move the aligned electronic component 300 to the first object detection area 421 of the first object detection device 4 for first object detection, and finally place the electronic component 300 detected by the first object detection area on the object conveying assembly 6.
As mentioned above, the first picking-up device 72 further includes a picking-up device body 721, a first suction nozzle 722 and two second suction nozzles 723 (only one is labeled in the figure). Wherein, the fetching device body 721 is provided with a first air suction channel 7211 and a second air suction channel 7212, the first suction nozzle 722 is arranged on the fetching device body 721 and is communicated with the first air suction channel 7211; similarly, the second suction nozzles 723 are disposed on the fetching device body 721 and respectively connected to the second suction channels 7212. In practical applications, the first picking device 72 moves to above the carrier tray 200 and corresponds to the electronic component 300, then moves down along a vertical direction D3 to make the first suction nozzle 722 and the second suction nozzle 723 cover and adhere to the first part 301, the connection portion 302 and the second part 303 respectively, and then sucks air through the negative pressure source communicated with the first suction channel 7211 and the second suction channel 7212 to further suck and fix the electronic component 300, and then the picking device body 721 vertically ascends along a direction opposite to the vertical direction D3 to suck and separate the electronic component 300 from the carrier tray 200.
After the electronic component 300 passes through the detection of the first device for detecting a surface to be detected 4, the first moving component 7 moves the electronic component 300 to the transporting component 6 for transporting the object to be detected for placement.
As shown in fig. 1, 5 and 6, the second moving assembly 8 is disposed adjacent to the second device for testing surface 5, the object transportation assembly 6 and the output tray stacking mechanisms 23 and 24 passing the testing, and is used to move the electronic assembly 300 placed on the object transportation assembly 6 to the fixing fixture 52, and move the electronic assembly 300 passing the testing of the second device for testing surface 5 to a tray (not shown, corresponding to the tray 200) on the output tray stacking mechanism 23 or 24.
Referring to fig. 7, fig. 7 is a schematic cross-sectional view illustrating that the electronic component detecting system according to the preferred embodiment of the invention utilizes the second moving component to move the electronic component placed on the object-to-be-detected conveying component to the fixing jig. As shown in fig. 1 and 7, the dut conveying assembly 6 further includes a conveying rail 61 and a carrier 62. The conveying track 61 extends along a second direction D2 perpendicular to the first direction D1, the carrier 62 is disposed on the conveying track 61 in a reciprocating manner along the second direction D2, and the carrier 62 is provided with a first through hole 621, two second through holes 622 and 623, and a negative pressure suction hole 624. The first through hole 621 and the second through holes 622 and 623 correspond to the first part 301, the connecting portion 302 and the second part 303 of the electronic component 300, respectively, and the negative pressure pumping hole 624 is connected to the first through hole 621 and the second through holes 622 and 623, respectively, so that the electronic component 300 can be sucked and fixed by a vacuum pumping method when the negative pressure pumping hole 624 is connected to a negative pressure source.
As shown in fig. 1, the second moving assembly 8 further includes a second rail 81 and two second fetching devices 82 and 83. The second track 81 extends along a second direction D2, the second object-taking devices 82 and 83 are disposed on the second track 81 along a second direction D2 in a reciprocating manner, and the structures of the second object-taking devices 82 and 83 are the same as the structure of the first object-taking device 72, taking the second object-taking device 82 as an example, the second object-taking device 82 includes a device body 821, a first suction nozzle 822 and a second suction nozzle 823 (only one is labeled in the figure), the device body 821 is also provided with a first air-extracting channel 8211 and a second air-extracting channel 8212, and the first suction nozzle 822 and the second suction nozzle 823 are respectively communicated with the first air-extracting channel 8211 and the second air-extracting channel 8212; therefore, the second picking device 82 is used for moving the electronic component 300 on the second carrier 62 to the fixing fixture 52, and the picking device 83 is used for moving the electronic component 300 detected by the second device for detecting surfaces to be detected 5 to the tray 200 of the passing output tray stacking mechanism 23 or 24.
As shown in fig. 1, after the electronic component 300 is placed on the object-to-be-tested conveying assembly 6 by the first moving assembly 7 through the detection of the first surface-to-be-tested detecting device 4, the object-to-be-tested conveying assembly 6 fixes the electronic component 300 by suction, and when the second moving assembly 8 sucks the electronic component 300 from the object-to-be-tested conveying assembly 6, the second fetching device 82 of the second moving assembly 8 is moved to the object-to-be-tested conveying assembly 6 and attached to the electronic component 300, then the object-to-be-tested conveying assembly 6 stops the suction, and is switched to the second fetching device 82 of the second moving assembly 8 to suck the electronic component 300 and fix, and then the second fetching device 82 of the second moving assembly 8 fetches the electronic component 300 from the object-to-be-tested conveying assembly 6.
As mentioned above, after the second fetching device 82 of the second moving component 8 takes the electronic component 300 out of the object conveying component 6 to be tested, the second fetching device 82 of the second moving component 8 further moves the electronic component 300 to the fixing fixture 52, and when the second fetching device 82 of the second moving component 8 places the electronic component 300 in the fixing fixture 52, the electronic component 300 is attached to the positioning slot of the fixing fixture 52, and then the second fetching device 82 of the second moving component 8 switches the vacuum-pumping action to the fixing fixture 52, so that the electronic component 300 is fixed on the fixing fixture 52. In the present embodiment, the fixing fixture 52 is similar to the structure of the object conveying assembly 6, and is also provided with a pipeline structure similar to the first through hole 621, the second through holes 622 and 623, and the negative pressure pumping hole 624 for adsorbing and fixing the electronic assembly 300.
As shown in fig. 1, the third moving assembly 9 is disposed adjacent to the second device for detecting a surface to be detected 5 and the tray stacking mechanisms 21 and 22 that have not detected, and the third moving assembly 9 includes a third rail 91, a third rail 92 and a third fetching device 93. The third rail 91 extends along the second direction D2, and the third rail 92 extends along the first direction D1 and is reciprocally disposed on the third rail 91 along the second direction D2. The third fetching device 93 is arranged on the third track 92 in a reciprocating manner along the first direction D1; therefore, the third moving assembly 9 is used to move the electronic component 300 that has passed through the second device for inspecting surface to be inspected 5 but has not passed through to the tray (not shown, corresponding to the tray 200) of the tray stacking mechanism 21 or 22 that has not passed through inspection.
In summary, compared with the prior art that when the electronic component is detected, the electronic component is easily damaged due to multiple taking and placing of the electronic component among multiple workstations, the electronic component detection system of the invention mainly uses the first surface-to-be-detected detection device to detect the first surface-to-be-detected of the electronic component, and uses the second surface-to-be-detected detection device to detect the second surface-to-be-detected (top surface or peripheral surface) of the electronic component, so that the electronic component can be effectively detected in multiple directions without moving the electronic component for multiple times, and the electronic component is prevented from being damaged due to multiple taking and placing.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. An electronic component detecting system for detecting an image of an electronic component, the electronic component having a first surface to be detected and at least a second surface to be detected different from the first surface to be detected, the electronic component detecting system comprising:
a first surface-to-be-detected detection device defining a first surface-to-be-detected detection area for performing image detection on the first surface-to-be-detected when the first surface of the electronic component moves to the first surface-to-be-detected detection area; and
a second device for inspecting a surface to be inspected, which is adjacent to the first device for inspecting a surface to be inspected, and comprises:
a rotary detection platform, which has a bearing surface and is driven to rotate along a rotation direction;
the fixing jig is arranged on the bearing surface and used for fixing the electronic component, the at least one second surface to be detected of the electronic component is exposed out of the fixing jig, and the fixing jig moves along a detection path along with the rotation of the rotary detection platform; and
and the at least one detection module is arranged adjacent to the rotary detection platform and used for carrying out image detection on the at least one second surface to be detected of the electronic assembly when the fixed jig moves to the detection area of the at least one detection module along the detection path.
2. The electronic component detection system of claim 1, further comprising:
the object conveying assembly is arranged between the first surface detection device to be detected and the second surface detection device to be detected;
the first moving component is used for moving the electronic component so that the electronic component is placed on the object conveying component to be detected after passing through the first detection area to be detected; and
a second moving component, which moves the electronic component placed on the object conveying component to the fixed fixture.
3. The system according to claim 2, further comprising an input tray stacking mechanism for stacking a plurality of trays for placing the electronic devices thereon.
4. The system as claimed in claim 3, wherein the first moving assembly includes a first rail extending from a position adjacent to the input tray stacking mechanism along a first direction to a position adjacent to the object transporting assembly, and a first fetching device movably coupled to the first rail along the first direction.
5. The system as claimed in claim 4, wherein the first pick-up device includes a pick-up device body, a first nozzle and at least a second nozzle, the pick-up device body is movably connected to the first rail along the first direction and defines a first pumping channel and a second pumping channel, the first nozzle is connected to the first pumping channel, the second nozzle is connected to the second pumping channel, and the first nozzle and the second nozzle are correspondingly used for sucking the electronic component.
6. The system as claimed in claim 2, wherein the second moving assembly includes a second rail extending from adjacent to the object-transporting assembly to adjacent to the second device for inspecting surfaces, and a second picking apparatus movably coupled to the second rail.
7. The system as claimed in claim 6, wherein the second pick-up device includes a pick-up device body, a first nozzle and at least a second nozzle, the pick-up device body is movably connected to the second rail and defines a first pumping channel and a second pumping channel, the first nozzle is connected to the first pumping channel, the second nozzle is connected to the second pumping channel, and the first nozzle and the second nozzle are correspondingly used for sucking the electronic component.
8. The system as claimed in claim 2, wherein the object transporting assembly includes a transporting rail extending from adjacent to the first device to be inspected to adjacent to the second device to be inspected, and a carrier reciprocally disposed on the transporting rail for moving the electronic component from adjacent to the first device to adjacent to the second device to be inspected.
9. The system according to claim 8, wherein the carrier defines a first through hole, at least one second through hole and a negative pressure suction hole, the first through hole corresponds to a first component portion of the electronic component, the at least one second through hole corresponds to a second component portion of the electronic component, the first through hole and the at least one second through hole are respectively connected to the negative pressure suction hole, the negative pressure suction hole is connected to a negative pressure source, so that the first through hole and the at least one second through hole fix the first component portion and the second component portion of the electronic component by suction through the negative pressure generated by the negative pressure source.
10. The electronic device detecting system according to claim 2, wherein the at least one detecting module includes a detecting angle adjusting mechanism disposed adjacent to the second surface-to-be-detected detecting device, an image capturing element movably connected to the detecting angle adjusting mechanism, and an image reflecting element disposed between the image capturing element and the second surface-to-be-detected detecting device for reflecting an image of the at least one second surface-to-be-detected to the image capturing element when the second surface-to-be-detected moves to be adjacent to the at least one detecting module.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108136095 | 2019-10-04 | ||
| TW108136095A TWI729520B (en) | 2019-10-04 | 2019-10-04 | Electronic assembly detecting system |
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| Publication Number | Publication Date |
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| CN112614788A true CN112614788A (en) | 2021-04-06 |
| CN112614788B CN112614788B (en) | 2024-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010866949.5A Active CN112614788B (en) | 2019-10-04 | 2020-08-26 | Electronic component detection system |
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| Country | Link |
|---|---|
| KR (1) | KR20210041477A (en) |
| CN (1) | CN112614788B (en) |
| TW (1) | TWI729520B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20210041477A (en) | 2021-04-15 |
| TW202115402A (en) | 2021-04-16 |
| TWI729520B (en) | 2021-06-01 |
| CN112614788B (en) | 2024-05-24 |
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