TW201340300A - 光感測器裝置及其製造方法 - Google Patents

光感測器裝置及其製造方法 Download PDF

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Publication number
TW201340300A
TW201340300A TW101141001A TW101141001A TW201340300A TW 201340300 A TW201340300 A TW 201340300A TW 101141001 A TW101141001 A TW 101141001A TW 101141001 A TW101141001 A TW 101141001A TW 201340300 A TW201340300 A TW 201340300A
Authority
TW
Taiwan
Prior art keywords
glass substrate
substrate
cavity
glass
electrode
Prior art date
Application number
TW101141001A
Other languages
English (en)
Chinese (zh)
Inventor
釜森均
奧定夫
藤田宏之
塚越功二
林惠一郎
Original Assignee
精工電子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 精工電子有限公司 filed Critical 精工電子有限公司
Publication of TW201340300A publication Critical patent/TW201340300A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW101141001A 2011-11-10 2012-11-05 光感測器裝置及其製造方法 TW201340300A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011246671A JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW201340300A true TW201340300A (zh) 2013-10-01

Family

ID=48465943

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101141001A TW201340300A (zh) 2011-11-10 2012-11-05 光感測器裝置及其製造方法

Country Status (3)

Country Link
US (1) US8933386B2 (https=)
JP (1) JP2013105784A (https=)
TW (1) TW201340300A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105117074A (zh) * 2015-08-19 2015-12-02 业成光电（深圳）有限公司 光感测结构及其制造方法

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US9374923B2 (en) * 2013-11-27 2016-06-21 Honeywell Federal Manufacturing & Technologies, Llc Monolithic LTCC seal frame and lid
KR102004797B1 (ko) * 2014-10-31 2019-10-01 삼성전기주식회사 센서 패키지 및 그 제조 방법
US9755105B2 (en) * 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device
KR102733549B1 (ko) * 2016-11-28 2024-11-26 엘지이노텍 주식회사 광 신호 측정 모듈 및 이를 포함하는 광 신호 감지 장치
KR20200042541A (ko) * 2017-09-13 2020-04-23 코닝 인코포레이티드 차량용 감지 시스템 및 유리 재료
US10919473B2 (en) 2017-09-13 2021-02-16 Corning Incorporated Sensing system and glass material for vehicles
US10712197B2 (en) 2018-01-11 2020-07-14 Analog Devices Global Unlimited Company Optical sensor package
DE102018207955B4 (de) * 2018-05-22 2023-05-17 Schweizer Electronic Ag Leiterplattenmodul mit integriertem leistungselektronischen Metall-Keramik-Modul sowie Verfahren zu dessen Herstellung
KR102276278B1 (ko) * 2019-11-05 2021-07-12 주식회사 이큐셀 반도체 공정 진단을 위한 플라즈마 센서 장치 및 이의 제조 방법

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPS61214565A (ja) 1985-03-20 1986-09-24 Toshiba Corp 半導体光センサ装置
JPS62109357A (ja) * 1985-11-08 1987-05-20 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサとその組立方法
JPH01163352U (https=) * 1988-04-30 1989-11-14
JPH0258356U (https=) * 1988-10-21 1990-04-26
JP3311914B2 (ja) * 1995-12-27 2002-08-05 株式会社シチズン電子 チップ型発光ダイオード
JP2002124845A (ja) * 2000-08-07 2002-04-26 Nippon Sheet Glass Co Ltd 水晶振動子パッケージ及びその製造方法
JP2007036264A (ja) 2003-01-20 2007-02-08 Sharp Corp 光センサ用透光性樹脂組成物
JP2006013264A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
JP2007299929A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 光学デバイス装置とそれを用いた光学デバイスモジュール
JP4219943B2 (ja) * 2006-07-03 2009-02-04 パナソニック株式会社 固体撮像装置
JP2009064839A (ja) * 2007-09-04 2009-03-26 Panasonic Corp 光学デバイス及びその製造方法
JP4799542B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ
JP5189378B2 (ja) * 2008-02-18 2013-04-24 セイコーインスツル株式会社 圧電振動子の製造方法
JP4794615B2 (ja) * 2008-11-27 2011-10-19 パナソニック株式会社 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105117074A (zh) * 2015-08-19 2015-12-02 业成光电（深圳）有限公司 光感测结构及其制造方法
TWI550259B (zh) * 2015-08-19 2016-09-21 業成光電（深圳）有限公司 光感測結構及其製造方法
CN105117074B (zh) * 2015-08-19 2018-06-29 业成光电（深圳）有限公司 光感测结构及其制造方法

Also Published As

Publication number Publication date
JP2013105784A (ja) 2013-05-30
US8933386B2 (en) 2015-01-13
US20130134300A1 (en) 2013-05-30

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