JP2013105784A - 光センサ装置およびその製造方法 - Google Patents

光センサ装置およびその製造方法 Download PDF

Info

Publication number
JP2013105784A
JP2013105784A JP2011246671A JP2011246671A JP2013105784A JP 2013105784 A JP2013105784 A JP 2013105784A JP 2011246671 A JP2011246671 A JP 2011246671A JP 2011246671 A JP2011246671 A JP 2011246671A JP 2013105784 A JP2013105784 A JP 2013105784A
Authority
JP
Japan
Prior art keywords
substrate
glass
optical sensor
cavity
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011246671A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013105784A5 (https=
Inventor
Hitoshi Kamamori
均 釜森
Sadao Oku
定夫 奥
Hiroyuki Fujita
宏之 藤田
Koji Tsukagoshi
功二 塚越
Keiichiro Hayashi
恵一郎 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP2011246671A priority Critical patent/JP2013105784A/ja
Priority to TW101141001A priority patent/TW201340300A/zh
Priority to US13/669,858 priority patent/US8933386B2/en
Publication of JP2013105784A publication Critical patent/JP2013105784A/ja
Publication of JP2013105784A5 publication Critical patent/JP2013105784A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2011246671A 2011-11-10 2011-11-10 光センサ装置およびその製造方法 Pending JP2013105784A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011246671A JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法
TW101141001A TW201340300A (zh) 2011-11-10 2012-11-05 光感測器裝置及其製造方法
US13/669,858 US8933386B2 (en) 2011-11-10 2012-11-06 Optical sensor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011246671A JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2013105784A true JP2013105784A (ja) 2013-05-30
JP2013105784A5 JP2013105784A5 (https=) 2014-10-30

Family

ID=48465943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011246671A Pending JP2013105784A (ja) 2011-11-10 2011-11-10 光センサ装置およびその製造方法

Country Status (3)

Country Link
US (1) US8933386B2 (https=)
JP (1) JP2013105784A (https=)
TW (1) TW201340300A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160051145A (ko) * 2014-10-31 2016-05-11 삼성전기주식회사 센서 패키지 및 그 제조 방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9374923B2 (en) * 2013-11-27 2016-06-21 Honeywell Federal Manufacturing & Technologies, Llc Monolithic LTCC seal frame and lid
US9755105B2 (en) * 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device
CN105117074B (zh) * 2015-08-19 2018-06-29 业成光电（深圳）有限公司 光感测结构及其制造方法
KR102733549B1 (ko) * 2016-11-28 2024-11-26 엘지이노텍 주식회사 광 신호 측정 모듈 및 이를 포함하는 광 신호 감지 장치
KR20200042541A (ko) * 2017-09-13 2020-04-23 코닝 인코포레이티드 차량용 감지 시스템 및 유리 재료
US10919473B2 (en) 2017-09-13 2021-02-16 Corning Incorporated Sensing system and glass material for vehicles
US10712197B2 (en) 2018-01-11 2020-07-14 Analog Devices Global Unlimited Company Optical sensor package
DE102018207955B4 (de) * 2018-05-22 2023-05-17 Schweizer Electronic Ag Leiterplattenmodul mit integriertem leistungselektronischen Metall-Keramik-Modul sowie Verfahren zu dessen Herstellung
KR102276278B1 (ko) * 2019-11-05 2021-07-12 주식회사 이큐셀 반도체 공정 진단을 위한 플라즈마 센서 장치 및 이의 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109357A (ja) * 1985-11-08 1987-05-20 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサとその組立方法
JPH01163352U (https=) * 1988-04-30 1989-11-14
JPH0258356U (https=) * 1988-10-21 1990-04-26
JPH09181359A (ja) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk チップ型発光ダイオード
JP2002124845A (ja) * 2000-08-07 2002-04-26 Nippon Sheet Glass Co Ltd 水晶振動子パッケージ及びその製造方法
JP2006013264A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
JP2006332685A (ja) * 2006-07-03 2006-12-07 Matsushita Electric Ind Co Ltd 固体撮像装置
JP2007299929A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 光学デバイス装置とそれを用いた光学デバイスモジュール

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214565A (ja) 1985-03-20 1986-09-24 Toshiba Corp 半導体光センサ装置
JP2007036264A (ja) 2003-01-20 2007-02-08 Sharp Corp 光センサ用透光性樹脂組成物
JP2009064839A (ja) * 2007-09-04 2009-03-26 Panasonic Corp 光学デバイス及びその製造方法
JP4799542B2 (ja) * 2007-12-27 2011-10-26 株式会社東芝 半導体パッケージ
JP5189378B2 (ja) * 2008-02-18 2013-04-24 セイコーインスツル株式会社 圧電振動子の製造方法
JP4794615B2 (ja) * 2008-11-27 2011-10-19 パナソニック株式会社 半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109357A (ja) * 1985-11-08 1987-05-20 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサとその組立方法
JPH01163352U (https=) * 1988-04-30 1989-11-14
JPH0258356U (https=) * 1988-10-21 1990-04-26
JPH09181359A (ja) * 1995-12-27 1997-07-11 Shichizun Denshi:Kk チップ型発光ダイオード
JP2002124845A (ja) * 2000-08-07 2002-04-26 Nippon Sheet Glass Co Ltd 水晶振動子パッケージ及びその製造方法
JP2006013264A (ja) * 2004-06-28 2006-01-12 Kyocera Corp 光半導体素子収納用パッケージおよび光半導体装置
JP2007299929A (ja) * 2006-04-28 2007-11-15 Matsushita Electric Ind Co Ltd 光学デバイス装置とそれを用いた光学デバイスモジュール
JP2006332685A (ja) * 2006-07-03 2006-12-07 Matsushita Electric Ind Co Ltd 固体撮像装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160051145A (ko) * 2014-10-31 2016-05-11 삼성전기주식회사 센서 패키지 및 그 제조 방법
KR102004797B1 (ko) * 2014-10-31 2019-10-01 삼성전기주식회사 센서 패키지 및 그 제조 방법

Also Published As

Publication number Publication date
TW201340300A (zh) 2013-10-01
US8933386B2 (en) 2015-01-13
US20130134300A1 (en) 2013-05-30

Similar Documents

Publication Publication Date Title
JP2013105784A (ja) 光センサ装置およびその製造方法
JP5855917B2 (ja) 光センサ装置
JP6987795B2 (ja) モジュール及び複数のモジュールを製造するための方法
US8946664B2 (en) Optical sensor device having wiring pattern within cavity housing optical sensor element
JP2013042135A5 (https=)
JP6214337B2 (ja) 電子部品、電子機器および電子部品の製造方法。
JP2011146752A (ja) 側面型発光ダイオード及び側面型発光ダイオードの製造方法
TW200905907A (en) Package structure of compound semiconductor device and fabrication method thereof
CN103325803B (zh) 图像传感器封装方法及结构、图像传感器模组及形成方法
CN100378933C (zh) 具有层合晶穴的半导体封装构造的制造方法
JP2008010814A (ja) 超薄型ｌｅｄパッケージに適用する基板及びそのパッケージ方法
TWI429043B (zh) 電路板結構、封裝結構與製作電路板的方法
CN103460376A (zh) 电子部件以及电子部件的制造方法
US20170053856A1 (en) Semiconductor die attachment with embedded stud bumps in attachment material
WO2017174007A1 (zh) 一种芯片封装结构、终端设备及方法
JP2015084378A (ja) 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
CN204675827U (zh) 一种芯片的封装结构
CN102270585B (zh) 电路板结构、封装结构与制作电路板的方法
CN105405777B (zh) 一种大面积平行堆栈式封装结构和封装方法
JP2009176955A (ja) 半導体装置およびその製造方法
CN102270584A (zh) 电路板结构、封装结构与制作电路板的方法
JP2015038902A (ja) Ｌｅｄモジュール装置及びその製造方法
CN100442466C (zh) 晶片级光电半导体组装构造的制造方法
CN2922128Y (zh) 感光组件封装结构
JP2011091332A (ja) 光半導体装置およびその製造方法、並びに光半導体装置に嵌合する光コネクタ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140911

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140911

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150707

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151013

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20160112

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160223