CN204675827U - 一种芯片的封装结构 - Google Patents
一种芯片的封装结构 Download PDFInfo
- Publication number
- CN204675827U CN204675827U CN201520342601.0U CN201520342601U CN204675827U CN 204675827 U CN204675827 U CN 204675827U CN 201520342601 U CN201520342601 U CN 201520342601U CN 204675827 U CN204675827 U CN 204675827U
- Authority
- CN
- China
- Prior art keywords
- chip
- pcb board
- anisotropic conductive
- conductive adhesive
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000006071 cream Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 238000005538 encapsulation Methods 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010924 continuous production Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Landscapes
- Micromachines (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520342601.0U CN204675827U (zh) | 2015-05-25 | 2015-05-25 | 一种芯片的封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520342601.0U CN204675827U (zh) | 2015-05-25 | 2015-05-25 | 一种芯片的封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204675827U true CN204675827U (zh) | 2015-09-30 |
Family
ID=54175534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520342601.0U Active CN204675827U (zh) | 2015-05-25 | 2015-05-25 | 一种芯片的封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204675827U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105914268A (zh) * | 2016-05-30 | 2016-08-31 | 深圳市德润达光电股份有限公司 | 一种led倒装工艺及倒装结构 |
CN110291361A (zh) * | 2018-01-05 | 2019-09-27 | 深圳市大疆创新科技有限公司 | 电路板及采用该电路板的无人飞行器 |
CN110574395A (zh) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | 一种mems麦克风 |
US11289444B2 (en) | 2019-12-13 | 2022-03-29 | General Electric Company | Sensor systems and methods for providing sensor systems |
-
2015
- 2015-05-25 CN CN201520342601.0U patent/CN204675827U/zh active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105914268A (zh) * | 2016-05-30 | 2016-08-31 | 深圳市德润达光电股份有限公司 | 一种led倒装工艺及倒装结构 |
CN110574395A (zh) * | 2017-05-05 | 2019-12-13 | 歌尔股份有限公司 | 一种mems麦克风 |
CN110574395B (zh) * | 2017-05-05 | 2020-11-13 | 潍坊歌尔微电子有限公司 | 一种mems麦克风 |
US11109162B2 (en) | 2017-05-05 | 2021-08-31 | Goertek Inc. | MEMS microphone |
CN110291361A (zh) * | 2018-01-05 | 2019-09-27 | 深圳市大疆创新科技有限公司 | 电路板及采用该电路板的无人飞行器 |
EP3736534A4 (en) * | 2018-01-05 | 2021-08-18 | SZ DJI Technology Co., Ltd. | PRINTED CIRCUIT BOARD AND UNPILOT AIR VEHICLE USING A PRINTED CIRCUIT BOARD |
US11304292B2 (en) | 2018-01-05 | 2022-04-12 | SZ DJI Technology Co., Ltd. | Circuit board and unmanned aerial vehicle including the same |
US11289444B2 (en) | 2019-12-13 | 2022-03-29 | General Electric Company | Sensor systems and methods for providing sensor systems |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204675827U (zh) | 一种芯片的封装结构 | |
CN103793689B (zh) | 指纹识别传感器封装结构、电子设备及指纹识别传感器的制备方法 | |
CN103257007B (zh) | 压力传感器介质隔离封装结构及其封装方法 | |
CN104779221A (zh) | 指纹识别模组封装结构、制备指纹识别模组封装结构的方法以及电子设备 | |
CN207706274U (zh) | 摄像头模组 | |
SG146570A1 (en) | Image sensor module having build-in package cavity and the method of the same | |
US10718497B2 (en) | Electronic product with light emitting function and method for manufacturing the same | |
TW200828377A (en) | A packaging structure of pressure sensor and a method therefor | |
KR20200094127A (ko) | 저 프로파일 트랜스듀서 모듈 | |
WO2022188524A1 (zh) | 封装模组、封装工艺及电子设备 | |
CN105676953B (zh) | 一种具有指纹传感器封装结构的移动终端及其制备方法 | |
CN110164824B (zh) | 柔性封装结构、制作方法及具有该结构的可穿戴设备 | |
WO2017174007A1 (zh) | 一种芯片封装结构、终端设备及方法 | |
CN204442686U (zh) | 一种压电扬声器装置 | |
CN103762200B (zh) | 芯片封装件及其封装方法 | |
WO2016042937A1 (ja) | 圧力センサモジュール | |
CN204558444U (zh) | 指纹识别模组封装结构以及电子设备 | |
CN107113485B (zh) | 在mems换能器封装件的制造中使用的基于引线框架的芯片载体 | |
CN109788167A (zh) | 降低摄像头模组高度的装配方法及摄像头模组 | |
US10867942B2 (en) | Chip packages and methods for forming the same | |
CN204731795U (zh) | 一种指纹识别模组、指纹感测装置及电子设备 | |
CN204180271U (zh) | 一种高灵敏度高信噪比的mems硅麦克风 | |
CN207560068U (zh) | 模组结构和终端设备 | |
CN204836576U (zh) | Mems麦克风 | |
CN214373078U (zh) | 气压传感器及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
TR01 | Transfer of patent right |