CN110291361A - 电路板及采用该电路板的无人飞行器 - Google Patents

电路板及采用该电路板的无人飞行器 Download PDF

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Publication number
CN110291361A
CN110291361A CN201880011491.6A CN201880011491A CN110291361A CN 110291361 A CN110291361 A CN 110291361A CN 201880011491 A CN201880011491 A CN 201880011491A CN 110291361 A CN110291361 A CN 110291361A
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China
Prior art keywords
main part
circuit board
micro
slot
control unit
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CN201880011491.6A
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朱誉品
李进吉
赵有成
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SZ DJI Technology Co Ltd
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SZ DJI Technology Co Ltd
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Publication of CN110291361A publication Critical patent/CN110291361A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/80—Arrangement of on-board electronics, e.g. avionics systems or wiring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
    • G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
    • G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Mechanical Engineering (AREA)
  • Gyroscopes (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种电路板(100)，包括：板体(10)，设有走线；微控制单元(20)，设置于板体(10)；以及惯性测量单元(30)，设置于板体(10)，所述惯性测量单元(30)通过所述板体(10)的走线与所述微控制单元(20)通信连接，用于将其感测的惯性测量数据传送给所述微控制单元(20)；其中，所述板体(10)包括主体部(11)及位于所述主体部边缘的隔离部(13)，所述微控制单元(20)安装于所述主体部(11)，所述惯性测量单元(30)安装于所述隔离部(13)。如此，降低了惯性测量单元受到热应力的影响，保证其感测的惯性测量数据的准确性。

Description

PCT国内申请，说明书已公开。

Claims (46)

  1. PCT国内申请，权利要求书已公开。
CN201880011491.6A 2018-01-05 2018-01-05 电路板及采用该电路板的无人飞行器 Pending CN110291361A (zh)

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Application Number Priority Date Filing Date Title
PCT/CN2018/071605 WO2019134129A1 (zh) 2018-01-05 2018-01-05 电路板及采用该电路板的无人飞行器

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CN110291361A true CN110291361A (zh) 2019-09-27

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US (1) US11304292B2 (zh)
EP (1) EP3736534A4 (zh)
CN (1) CN110291361A (zh)
WO (1) WO2019134129A1 (zh)

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US11605593B2 (en) 2019-10-12 2023-03-14 Yangtze Memory Technologies Co., Ltd. Semiconductor devices having interposer structure with adhesive polymer and methods for forming the same

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CN213779051U (zh) * 2020-11-05 2021-07-23 深圳市大疆创新科技有限公司 惯性测量模组和无人飞行器
US11947348B2 (en) * 2021-04-07 2024-04-02 Skydio, Inc. Unmanned aerial vehicle (UAV) controller
CN218411208U (zh) * 2022-09-22 2023-01-31 广州导远电子科技有限公司 惯性测量装置和设备

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US20050160814A1 (en) * 2004-01-24 2005-07-28 Vladimir Vaganov System and method for a three-axis MEMS accelerometer
US20050242991A1 (en) * 2004-04-30 2005-11-03 Montgomery Paul Y Method and apparatus for improved position, velocity, orientation or angular rate sensor
WO2009153094A1 (de) * 2008-06-20 2009-12-23 Robert Bosch Gmbh Anordnung zur stressentkopplung bei einem substrat mit einem chip
CN101934807A (zh) * 2010-08-24 2011-01-05 北京交通大学 基于列车控制系统的移动授权计算方法
US20140100037A1 (en) * 2012-10-05 2014-04-10 Qfo Labs, Inc. Wireless communication system for game play with multiple remote-control flying craft
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11605593B2 (en) 2019-10-12 2023-03-14 Yangtze Memory Technologies Co., Ltd. Semiconductor devices having interposer structure with adhesive polymer and methods for forming the same

Also Published As

Publication number Publication date
EP3736534A4 (en) 2021-08-18
WO2019134129A1 (zh) 2019-07-11
US20200337151A1 (en) 2020-10-22
US11304292B2 (en) 2022-04-12
EP3736534A1 (en) 2020-11-11

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