TW201326013A - 搬送機構 - Google Patents

搬送機構 Download PDF

Info

Publication number
TW201326013A
TW201326013A TW101130745A TW101130745A TW201326013A TW 201326013 A TW201326013 A TW 201326013A TW 101130745 A TW101130745 A TW 101130745A TW 101130745 A TW101130745 A TW 101130745A TW 201326013 A TW201326013 A TW 201326013A
Authority
TW
Taiwan
Prior art keywords
processed
pick
rocking roller
conveying mechanism
rocking
Prior art date
Application number
TW101130745A
Other languages
English (en)
Chinese (zh)
Inventor
Junichi Abe
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201326013A publication Critical patent/TW201326013A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
TW101130745A 2011-08-25 2012-08-24 搬送機構 TW201326013A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011183236A JP2013045912A (ja) 2011-08-25 2011-08-25 搬送機構

Publications (1)

Publication Number Publication Date
TW201326013A true TW201326013A (zh) 2013-07-01

Family

ID=47746352

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130745A TW201326013A (zh) 2011-08-25 2012-08-24 搬送機構

Country Status (3)

Country Link
JP (1) JP2013045912A (ja)
TW (1) TW201326013A (ja)
WO (1) WO2013027605A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203794B2 (ja) * 1992-09-02 2001-08-27 ソニー株式会社 円盤状部品の搬送方法及びその装置
JP3138554B2 (ja) * 1992-12-11 2001-02-26 株式会社荏原製作所 ウエハ支持装置
JPH1074816A (ja) * 1996-08-29 1998-03-17 Hitachi Techno Eng Co Ltd ウェファ搬送装置
JP4873129B2 (ja) * 2006-02-16 2012-02-08 株式会社安川電機 基板把持装置
JP2008108991A (ja) * 2006-10-27 2008-05-08 Daihen Corp ワーク保持機構

Also Published As

Publication number Publication date
WO2013027605A1 (ja) 2013-02-28
JP2013045912A (ja) 2013-03-04

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