TW200806444A - Conveyance apparatus, conveyance method, and device production method - Google Patents

Abstract

A conveyance apparatus capable of conveying a body while reliably holding it, and a conveyance method. The conveyance apparatus for conveying an object (W) while holding it has a conveyance body (30). The conveyance body (30) has holding members (32, 33) coming into contact with the object (W). The angle of the holding members (32, 33) is changeable relative to the object (W).

Description

200806444 IX. Description of the Invention: • Technical Field to Which the Invention Is Along The present invention relates to a conveying apparatus, a conveying method, and a component manufacturing method. This case advocates the application of the special request 2006-108524 ^ Tiger's priority in April 2006, and its content is used for this. [Prior Art] Conventionally, a mask or a reticle formed with a pattern or a substrate such as a semiconductor wafer 11 is transported by a substrate transfer device. The substrate transfer device includes, for example, a transfer arm that transports the substrate from the wafer substrate receiving portion of the substrate to the substrate processing position. For example, as shown in FIG. 2A, the transfer arm 100 supports the substrate w from below by a pair of substrate supporting portions 110 and 111, and the substrate W is sucked through the adsorption holes 120 provided in the substrate supporting portions 110 and 111, respectively. The transfer arm 1 (10) transports the substrate W while the substrate W is adsorbed and held by the two substrate supporting portions 11 and U1. However, the substrate W may be warped, bent, or the like due to various factors such as heat. Therefore, a part (the held surface) of the substrate W sucked by the adsorption holes 120 is also deformed. When the substrate w on which the surface to be held is deformed is conveyed by the transfer arm 1 ,, as shown in the drawing, the gap s between the lower surface Wd of the substrate W and the upper surfaces 110a and 11 la of the substrate supporting portions 110 and 111 cannot be sufficiently adsorbed. It is impossible to surely hold the substrate W. [Patent Document] Japanese Patent Publication No. 2004-537867 5 200806444 SUMMARY OF THE INVENTION The holding ability can be further improved. In recent years, the conveying device is required to be lifted to the held body. The present invention is to provide a conveying device. The present invention which can improve the holding ability of the held body adopts the configuration corresponding to Figs. 1 to 9 as shown in the embodiment.

In addition, the symbols enclosed in parentheses after each element are only examples of the element and are not used to limit the element. According to a first aspect of the present invention, a conveying apparatus capable of holding an object (W) and conveying the object (w) is provided, comprising: a holding member (32, 33) that abuts against the object W, and the foregoing The angle of the holding member (32, 33) can be changed to the movable body (3〇) with respect to the object (w). According to a second aspect of the present invention, a conveying apparatus capable of holding an object (W) and transporting the object (w) is provided, comprising: a plurality of holding members (32, 33) that abut against the object (W) The body (31) of the plurality of holding members (32, 33) is supported, and at least the height positions of the plurality of holding members 〇2, 33) are changeable with respect to the body (31). According to a third aspect of the present invention, there is provided a transport method comprising: an operation of holding an object (W) and transporting the object (w), and a holding member abutting the object (w) (32, 33) The action of changing the angle with respect to the object (w). According to a fourth aspect of the present invention, there is provided a transport method comprising: an operation of holding an object (W) and transporting the object (w), and 6 200806444 a plurality of holding members abutting on the object (W) (32, 33) The operation of changing the height of the body (31) of the plurality of holding members (32, 33) before the support. According to the above configuration, the present invention can transport the object to be held in a more secure state. [Embodiment] Hereinafter, an embodiment of the present invention will be specifically described using the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a general view of a processing system to which a transfer apparatus according to the present invention is applied. The processing system has an injured wafer storage unit, a stage, and a transfer arm 30.曰: Round storage single 兀! 〇 A wafer containing a plurality of substrates to be held. The stage is provided corresponding to the processing device 21 such as an exposure device. The wafer is mounted on the stage to carry out a predetermined process such as exposure of the wafer w mounted on the stage 2 to the wafer.

As shown in Figs. 2 to 4, the arm (the arm 30) is provided with the arm body 31 and the plurality of wafer support portions 32, 33. The base end of the arm body 31, as shown in Fig. 1, is supported by the arm support portion 37. Such as. The I branch C is configured to be movable back and forth in the up and down direction. In other words, the position near the arm 2 and the position near the stage 2 are accommodated in the two parts and 3 parts of the wafer storage unit f, and the guide is formed between the stages 20 in a slidable state. Within the slot 9. The carriage 2 is moved between white, and the delivery arm 30 can be in the wafer storage unit. Further, the transfer arm 30 can be transported from the wafer storage sheet 7 200806444, or the wafer w received from the wafer storage unit carrier 10 as shown in Fig. 2, and delivered to the station 20 for acceptance. The processed wafer W is transported and delivered to the end of 10 〇 31, and the transport arm 30 is described in detail below. As shown in the arm bodies 4, a hanging portion 34 extending orthogonally to the arm body 31 is formed. People, Yu He, ah, forming a right &

Extending extensions 35, 30. At the front end of the two extension portions 35°, the rust w ❹〇-shaped ring or the like has the intermediate portion 4G of the (four) nature, and the base ends 32a, 33a of the ridge portions 32, 33 are respectively mounted. 32, 33 are respectively attached to the base end portions of the two projecting portions h, ... extending inwardly. Therefore, the two wafer supporting portions 32 3 3 are in a state of being opposed to each other. Each of the portions 32, 33 (2) has a wafer adsorption hole 41. The wafer adsorption hole 41 is connected to a vacuum suction device (not shown). The vacuum suction device attracts crystal from the wafer adsorption & 41 In the circle w, the wafer W can be vacuum-adsorbed onto the wafer support portions 32, 33. Further, in the present embodiment, the vacuum suction device is used to attract the wafer w to be adsorbed to the wafer master. The round forks 32, 33 are provided, but the present invention is not limited thereto, and the wafer w may be adsorbed on the wafer support portion 3 2 3 3 by, for example, electrostatic adsorption or an electrostatic adsorption mechanism. The transfer arm 30 is provided with wafer support portions 32, 33, and the wafer support portion 3 2 h ^ + ' ° has a wafer adsorption hole 41. Therefore, as shown in FIG. The wafer W is mounted on the wafer support portion 32, and the wafer w is sucked and held on the wafer support portion 32 by the wafer 8'. Further, as described above, the intermediate portion 4A having a predetermined elasticity is provided between the extending portions 35, 36 and the two wafer supporting portions 32, 33. Therefore, as shown in Fig. 3, The circular support portions 32, 33 may have their base ends 32 &, 33 & as the axis, and can be rotated (tilted) at a specific width (angle). For example, as shown in Fig. 5A and Fig. 5B, when the wafer w is in the front view When the deformation of the convex φ shape or the concave shape is performed, the wafer support portions 32, 33 are rotated (tilted) by the deformation of each wafer w to maintain the held surface of the wafer w and the wafer support portion μ. The faces 32b, 33b can be in surface contact, that is, a gap can be prevented between the held surface of the wafer w and the holding faces 32b, 33b of the wafer supporting portions 32, 33. As a result, the wafer is sufficiently adsorbed. The wafer crucible is indeed maintained. In the present embodiment, the 'wafer support portions 32, 33 are arranged to be separated from each other. The base point of the wafer support portion 32 is rotated (tilted) The fulcrum is provided at the base portion 32a. The base portion 32a of the wafer stub 32 is located farther from the wafer support portion 33 extending along the wafer support portion 32. Further, it abuts against the floor portion 32 of the wafer W. Keeping the face hunger is located near the wafer support portion 33. When the wafer cut portion 33 is also =/day 1 round/hold, each holding *worker is placed on the wafer and placed in the vicinity of the 曰n W field. The base point (the fulcrum and the center) of the rotation is arranged. Outside the edge of the HW day. The holding surface 32b is located on the outer edge of the outer edge of the sun, and the octagonal eye contacts the crystal 81 W, the wafer support portion 32 33 and the other is located at the outer edge of the crystal mesh W, and 3-he avoids it and the wafer. W pick up 9 200806444 Touch. In addition, the wafer support portions 32, 33 and/or the hanging portion may be "arranged to be freely stretchable" or the wafer support portions 32, 33 may be disposed to extend from the projecting portion 基 to the base end portions 32a, 33a. The direction (the vertical direction in Fig. 3) is the free rotation of the axis. In this case, the distance between the opposing wafer-receiving portions η" can be changed. Further, the present invention is not limited to An intermediate portion 4q having a predetermined elasticity is provided between the protruding portion 35, % and the two wafer supports = 2, 33 to make the wafer teeth. "2, 33 is free to move. For example, it can also be set in the transfer arm 30. A piezoelectric element, a v (four) voice coil motor, or a cylinder or the like that drives the wafer support portions 32, 33, and the driving mechanism of the frame structure, and the rotation of the sunday® support portions 32, 33 (tilt) In addition, it is also possible to combine the medium and the armor, and the driving mechanism to rotate (tilt) the wafer supporting portions 3 2, 3 3 . The ground can also be used to measure the adsorption force of the wafer adsorption holes 41 . The action of the wafer support portions 32, 33 is sensed. At this time, for example, as measured by a known device, the suction measured after the wafer support portions 32, 33 are rotated When it exceeds a predetermined value, it is determined that the upper surface of the wafer supporting portions 32, 33 (holding surfaces 32b, 33b) and the wafer w are in contact with each other. When determining the wafer, the upper surface and the wafer arm In the case of the surface contact state, it is judged that there is sufficient adsorption force to maintain the roundness, and it is determined that the inclination angle of the wafer supporting portions 32, 33 has reached a certain degree, and the driving mechanism is stopped: ::The dip angle of the second 7 points is reversed. The support points 32, 33 are movable. 'The adsorption force measured in the above-mentioned wafer adsorption hole is larger than the established estimation" and the attached force measurement is When there is no 疋 value, it is determined that the wafer W does not have a shape of 200806444, and the wafer support portions 32, 33 are not rotated. Also, the wafer adsorption hole 41 may be disposed not in the wafer support #32, 33, By the above-described driving mechanism, 祯曰mw sees the deformed state of the winding back W, and changes the inclination angle of the wafer supporting portions 32, 33 of the holding wafer W to support the wafer W. The V can also be sighed in advance. For example, the deformation state of the wafer W (the degree of warpage, the front view is convex, the shape of the love π々 & the deformation of the shape or the concave shape, etc.) The sensor controls the inclination angle of the support portions 32, 33 of the remaining k days according to the output of the #海仪. The transfer arm 3 of the present embodiment is configured as above. Next, the transfer arm 3〇 will be described. A method of supporting the crystals. (1) The wafer W is taken from the wafer storage unit 10 onto the wafer supporting portions 32, 33.

W (7) starts to attract the wafer through the wafer adsorption hole 41 by the vacuum suction device. At this time, for example, as shown in Fig. 5, the rounded w gentleman a, ^ Tian Ri H W has a convex shape in front view.

At the time of deformation, the wafer support portions 3 2, 33 are the forces of the wafer W on the upper side of the wafer absorbing holes 41, and the wafer fulcrum portions 32, 33 are at the base end portion 32a. ,... The front end of the wafer support portions 32, 33 rises as the axis starts to rotate. In other words, the wafer supporting portions 32, 33 are subjected to the attraction of the center 0, and are determined to be swung (tilted) toward the wafer W in the direction of attraction from the crystal 0 adsorption hole 41. As a result, the upper surfaces (holding surfaces 32b, 33b) of the wafer supporting portions 32, 33 can be brought into contact with the lower surface of the wafer w. Therefore, the wafer w which is deformed into a convex shape in front view can be surely received by the wafer support portion 32, 33 and supported. On the other hand, for example, FIG. 5R & -μ does not have the right wafer W When the deformation is concave, the wafer branch portions 32, 33 are inclined by the base end portions 32a, 33a due to the weight of the wafer w, and the front end portions are respectively inclined downward. During the downward tilting of the Japanese yen branch portions 32, 33, the suction of the wafer w by the vacuum suction device k曰曰 circular adsorption hole 41 continues. The surface of the wafer W that is deformed into a concave shape by the front view is wound by the bottom of the wafer, and the surface of the wafer holding surface 32b, 33b, 33, 33, and the surface contact between the wafer holding surfaces 3 2b, 3 3b, crystal, day WW It is indeed adsorbed, and the wafer supports 32, 33 stop tilting. As a result, the wafer w is a concave wafer w by the wafer holding portions 32, 33. A memory portion for storing information on the eight tilt angles of the wafer support portion 32 of the wafer W may be provided at the two places. The stored information about the oblique angle of the wafer support 32 33 can be used for a variety of different purposes. For example, when used as a quantity, the outer edge of the wafer W is “Beibei. This is because the wafer w is deformed, and the outer edge position of the wafer W is different when it is not deformed. Second, the position and (3) Next, by the movement of the transfer arm 30, W moves back to the Δ △, and will hold the wafer 魬 & to the stage 20, the Asian wafer W is delivered to the plant 2. (4) Next, on the stage 2, the wafer % ΰ 等 既 。 。 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ In the same manner as in the above (2), the wafer 32 is sucked by the vacuum suction holes 41, and the wafer over-wafer UW is surely adsorbed and held on the wafer support portions 32, 33 of 200804064. (6) The wafer which is surely adsorbed and held is slid, transferred to the wafer storage unit 10 by the movement of the transfer arm 3, and the wafer w is delivered to the wafer storage unit 10. Further, the transfer arm of the present invention is It is not limited to a transport system for processing devices such as exposure devices, and can be widely applied to, for example, devices for performing various measurements or inspections on wafers, or for performing photomasks. The transport system of the device for trapping various inspections can be further used as a transport system for coating the developer. Furthermore, the object to be transported by the transport arm of the present invention is not limited to a wafer, and can be used, for example, for a liquid crystal exposure apparatus. A glass substrate for liquid crystal, etc. Further, as shown in Fig. 9, the micro device such as a semiconductor element is subjected to the step S302 of the reticle according to the design step described above, and the S3G1 for designing the micro device and the performance of the micro device. Step S303 of manufacturing the wafer w includes the step S304 of the substrate processing process in which the reticle pattern is polished on the wafer W, the exposed substrate is developed, the substrate is post-developed, and the substrate processing process is performed, such as the exposure apparatus of the embodiment. Component assembly step (including (4): ^ Manufacturing process such as packaging), and step briber inspection, etc. - The following describes the transfer arm 3 of the second embodiment using FIG. Real: Transfer arm 3. The basic configuration is different from that of the embodiment as shown in Fig. 6. The difference is that the two extensions of the hanging portion 34 form the elevation guides 70, 71. The lower side is formed on the other side of the lifting guide 70, 71; (1, the front side of the figure), and is formed with 13 200806444 81. The base groove portions 80, 81 of the wafer retaining portions 32, 33 are slidable up and down in the sliding groove 80 which is extended in the vertical direction. The sliding grooves 80, 81 are provided with wafer defining portions 32, 33, 33, and the "wafer" wafer supporting portion 32 is moved in the vertical direction. As a result, the height of 31 can be changed freely. The driving mechanism (not shown) is used to move the support portion 32 33 such as m η , the opposite arm body

Therefore, the wafer support portions 32, 33 are relatively loud with respect to the arm body 31, and the port is changed to, for example, the wafer w can be deformed to be small, and the wafer w can be surely held. The height of the wafer support portion 32 33 relative to the arm body 31 may be different from each other (any height is different from each other). 'borrow

Therefore, the height of each of the wafer support portions 32, 33 can be adapted to the wafer = elastic. < / T I. In Fig. 6, the portions corresponding to the portions shown in the corresponding embodiments are given the same reference numerals', and the description thereof is omitted in the second embodiment. Hereinafter, the transfer arm 3A of the third embodiment will be specifically described using Fig. 7 . The basic configuration of the transfer arm 30 of the third embodiment is the same as that of the first and second embodiments, but it differs in the following points. In the transfer arm 30 of the third embodiment, the elevating portions 75 and 76 that move in the vertical direction are attached to both end portions of the hanging portion 34. Sliding grooves 85, 86 in the vertical direction are formed on the inner side surface (the side surface on the side of the hanging portion 34) of the lifting portions 75, 76. Both ends of the hanging portion 34 are disposed inside the sliding grooves 85, 86. The lifting portions 75, 76 are movable up and down along the sliding grooves 85, 86 with respect to the hanging portion 34. 200806444 The lower end of the lifting and lowering portions 75, 76 is through the intermediate portion 32, and the wafer support is mounted at 33 ° 40. Thus, the wafer supporting portions 32, 33 are opposite to the arm body.

31 can be moved up and down through the interposer 40, and the relative crystal enables the wafer support portions 32, 33

Wafer support portion 32. The wafer support portion 32 is attached to the arm body 31 so as to be rotatable about a predetermined angle around the axis of the arm body 31 (the axis extending from the base end of the arm body 31 toward the distal end). X, a wafer adsorption hole 41 is provided on the upper surface of the wafer support portion 32 (the holding surface 32b). Further, in Fig. 8, the portions corresponding to those in the first embodiment are given the same, and the description thereof is omitted in the fourth embodiment. Although the preferred embodiments of the present invention have been described, the present invention is not limited to the embodiments. Additions, omissions, substitutions, and other changes can be made in the structure without departing from the scope of the invention. The present invention is not limited to the description of the invention, which is limited only by the scope of the patent application described below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic illustration of a processing system for a transfer arm to which the present invention is applied 15 200806444

Figure 2 is a plan view of the transfer arm of the present invention. Figure 3 is a front elevational view of the transfer arm of the present invention. Fig. 4 is a perspective explanatory view of a transfer arm of the present invention. Fig. 5A is a front view of the transfer arm when the wafer is deformed into a convex type. Fig. 5B is a front view of the transfer arm when the wafer is deformed into a concave type. Fig. 6 is a perspective explanatory view showing a second embodiment of the transfer arm.

Fig. 7 is a perspective explanatory view showing a third embodiment of the transfer arm. Fig. 8 is a perspective explanatory view showing a fourth embodiment of the transfer arm. The figure shows a flow chart of a process example of a semiconductor device. Fig. 1 is a plan view showing an example of a conventional transfer arm. Figure U is a front view showing an example of a conventional transfer arm. [Main component symbol description] > Guide slot

10 20 Wafer storage unit stage 21 30 31 31a 32, 33 32a, 33a 32b, 33b Exposure apparatus transport arm body main body center wafer support part base end holding surface 16 200806444 34 Lifting parts 35, 36 Portion 37 Arm support portion 40 Intermediary portion 41 Wafer adsorption hole 70, 71 Lifting guide portion 75, 76 Lifting portion 80, 81 Sliding groove 85, 86 Slot groove 100 Transfer arm 110, 111 Substrate support portion 110a, 111a Substrate support portion Above 120 adsorption holes s gap W wafers Wd wafers below 17

Claims (1)

200806444 Patent Application No.: The present invention relates to a transport device that holds an object and transports the object. The feature is provided with a transport body having a contact with the object and the angle of the retaining member relative to the object is changeable. 2. The transfer device of claim </RTI> wherein the 誃 member has an adsorption portion for adsorbing the object. ',, 3. If you apply for the patent scope 丨 or 2, move several holding components. The sigh is sturdy. The transport device according to any one of the claims of the present invention is the angle of the member with the adsorption of the object through the adsorption portion. The holding device according to any one of claims 1 to 3, wherein the object acts on the angle of the object to the holding member member. The holding device according to any one of the first to fifth aspects of the invention, wherein the holding member abuts near the outer edge of the object. 7. The transfer device of claim 6, wherein the angle at which the holder is inclined to the object is changed centering on an outer side of the outer edge of the object. 8. If the transfer is carried out according to any one of the claims 1 to 7, the memory unit for storing the angle information of the holding member to hold the object is provided in one step; A post-processing bias information. 18 200806444 9 A conveying device for holding an object and transporting the object, characterized in that: a plurality of holding members abutting the object and a body supporting the plurality of holding members; at least a plurality of holding members The height position can be changed freely with respect to the body. 10. The transfer device of claim 9, wherein the at least one of the plurality of retaining members is freely changeable relative to the object. 11. A method of transporting, comprising: an act of holding an object and transporting the object; and an operation of owing an angle of the holding member that is more abutting to the object relative to the object. • I2. The method of transporting the object of claim 11, further comprising the act of adsorbing the object relative to the holding member. 13. The method of conveying a product, comprising: an operation of holding an object and transporting the object; and an operation of changing a height position of the plurality of holding members that abut against the object with respect to the body of the plurality of holding members. 14. The method of transporting the scope of claim 13 further entails the action of at least one of the plurality of retaining members relative to the angle of the object. A component manufacturing method according to any one of claims 1 to 10, wherein the holding member abuts on the object and holds the object. 19