TW201302907A - 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置 - Google Patents

液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置 Download PDF

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Publication number
TW201302907A
TW201302907A TW101118042A TW101118042A TW201302907A TW 201302907 A TW201302907 A TW 201302907A TW 101118042 A TW101118042 A TW 101118042A TW 101118042 A TW101118042 A TW 101118042A TW 201302907 A TW201302907 A TW 201302907A
Authority
TW
Taiwan
Prior art keywords
resin composition
liquid resin
group
epoxy resin
inorganic filler
Prior art date
Application number
TW101118042A
Other languages
English (en)
Chinese (zh)
Inventor
Seiji Fukamachi
Takeshi Masuda
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW201302907A publication Critical patent/TW201302907A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
TW101118042A 2011-06-01 2012-05-21 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置 TW201302907A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011123213 2011-06-01

Publications (1)

Publication Number Publication Date
TW201302907A true TW201302907A (zh) 2013-01-16

Family

ID=47259098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101118042A TW201302907A (zh) 2011-06-01 2012-05-21 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置

Country Status (3)

Country Link
JP (1) JP2013010940A (ja)
TW (1) TW201302907A (ja)
WO (1) WO2012165239A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629296B (zh) * 2013-09-30 2018-07-11 長瀨化成股份有限公司 半導體密封用環氧樹脂組成物、半導體安裝結構體、及其製造方法
CN109328204A (zh) * 2016-06-23 2019-02-12 三星Sdi株式会社 用于密封固态半导体器件的环氧树脂组合物、包含其的封装材料及半导体封装件
CN112955487A (zh) * 2018-12-03 2021-06-11 松下知识产权经营株式会社 补强用树脂组合物、电子元件、制造电子元件的方法、安装结构体以及制造安装结构体的方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105899569B (zh) 2014-01-08 2018-04-10 信越化学工业株式会社 半导体密封用液体环氧树脂组合物和树脂密封半导体装置
JP6822651B2 (ja) * 2016-09-16 2021-01-27 ナミックス株式会社 シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物
JP6915256B2 (ja) * 2016-10-18 2021-08-04 昭和電工マテリアルズ株式会社 封止用樹脂組成物、並びに、それを用いた再配置ウエハ、半導体パッケージ及び半導体パッケージの製造方法
JP2021055108A (ja) * 2020-12-24 2021-04-08 ナミックス株式会社 シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物
JP2022110920A (ja) * 2021-01-19 2022-07-29 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0755979B2 (ja) * 1988-08-18 1995-06-14 有限会社鈴木研究所 エポキシ樹脂組成物
JP4279521B2 (ja) * 2002-07-30 2009-06-17 トヨタ自動車株式会社 半導体封止用エポキシ樹脂組成物用金属酸化物粉体、その製造方法及び半導体封止用エポキシ樹脂組成物
JP5220981B2 (ja) * 2003-12-15 2013-06-26 トヨタ自動車株式会社 微塩基性シリカ粉体、その製造方法及び樹脂組成物
JP5130698B2 (ja) * 2006-11-21 2013-01-30 住友ベークライト株式会社 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置
JP4934085B2 (ja) * 2008-03-06 2012-05-16 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
JP5195454B2 (ja) * 2009-01-22 2013-05-08 味の素株式会社 樹脂組成物
JP2011052160A (ja) * 2009-09-04 2011-03-17 Sumitomo Bakelite Co Ltd 液状封止用樹脂組成物、半導体パッケージ、および半導体パッケージの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI629296B (zh) * 2013-09-30 2018-07-11 長瀨化成股份有限公司 半導體密封用環氧樹脂組成物、半導體安裝結構體、及其製造方法
CN109328204A (zh) * 2016-06-23 2019-02-12 三星Sdi株式会社 用于密封固态半导体器件的环氧树脂组合物、包含其的封装材料及半导体封装件
CN109328204B (zh) * 2016-06-23 2023-12-29 三星Sdi株式会社 用于密封固态半导体器件的环氧树脂组合物、包含其的封装材料及半导体封装件
CN112955487A (zh) * 2018-12-03 2021-06-11 松下知识产权经营株式会社 补强用树脂组合物、电子元件、制造电子元件的方法、安装结构体以及制造安装结构体的方法

Also Published As

Publication number Publication date
WO2012165239A1 (ja) 2012-12-06
JP2013010940A (ja) 2013-01-17

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