TW201302907A - 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置 - Google Patents
液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置 Download PDFInfo
- Publication number
- TW201302907A TW201302907A TW101118042A TW101118042A TW201302907A TW 201302907 A TW201302907 A TW 201302907A TW 101118042 A TW101118042 A TW 101118042A TW 101118042 A TW101118042 A TW 101118042A TW 201302907 A TW201302907 A TW 201302907A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- liquid resin
- group
- epoxy resin
- inorganic filler
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011123213 | 2011-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201302907A true TW201302907A (zh) | 2013-01-16 |
Family
ID=47259098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101118042A TW201302907A (zh) | 2011-06-01 | 2012-05-21 | 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2013010940A (ja) |
TW (1) | TW201302907A (ja) |
WO (1) | WO2012165239A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629296B (zh) * | 2013-09-30 | 2018-07-11 | 長瀨化成股份有限公司 | 半導體密封用環氧樹脂組成物、半導體安裝結構體、及其製造方法 |
CN109328204A (zh) * | 2016-06-23 | 2019-02-12 | 三星Sdi株式会社 | 用于密封固态半导体器件的环氧树脂组合物、包含其的封装材料及半导体封装件 |
CN112955487A (zh) * | 2018-12-03 | 2021-06-11 | 松下知识产权经营株式会社 | 补强用树脂组合物、电子元件、制造电子元件的方法、安装结构体以及制造安装结构体的方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105899569B (zh) | 2014-01-08 | 2018-04-10 | 信越化学工业株式会社 | 半导体密封用液体环氧树脂组合物和树脂密封半导体装置 |
JP6822651B2 (ja) * | 2016-09-16 | 2021-01-27 | ナミックス株式会社 | シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物 |
JP6915256B2 (ja) * | 2016-10-18 | 2021-08-04 | 昭和電工マテリアルズ株式会社 | 封止用樹脂組成物、並びに、それを用いた再配置ウエハ、半導体パッケージ及び半導体パッケージの製造方法 |
JP2021055108A (ja) * | 2020-12-24 | 2021-04-08 | ナミックス株式会社 | シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物 |
JP2022110920A (ja) * | 2021-01-19 | 2022-07-29 | 味の素株式会社 | 樹脂組成物及び樹脂組成物充填済みシリンジ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0755979B2 (ja) * | 1988-08-18 | 1995-06-14 | 有限会社鈴木研究所 | エポキシ樹脂組成物 |
JP4279521B2 (ja) * | 2002-07-30 | 2009-06-17 | トヨタ自動車株式会社 | 半導体封止用エポキシ樹脂組成物用金属酸化物粉体、その製造方法及び半導体封止用エポキシ樹脂組成物 |
JP5220981B2 (ja) * | 2003-12-15 | 2013-06-26 | トヨタ自動車株式会社 | 微塩基性シリカ粉体、その製造方法及び樹脂組成物 |
JP5130698B2 (ja) * | 2006-11-21 | 2013-01-30 | 住友ベークライト株式会社 | 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置 |
JP4934085B2 (ja) * | 2008-03-06 | 2012-05-16 | 電気化学工業株式会社 | エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体 |
JP5195454B2 (ja) * | 2009-01-22 | 2013-05-08 | 味の素株式会社 | 樹脂組成物 |
JP2011052160A (ja) * | 2009-09-04 | 2011-03-17 | Sumitomo Bakelite Co Ltd | 液状封止用樹脂組成物、半導体パッケージ、および半導体パッケージの製造方法 |
-
2012
- 2012-05-21 TW TW101118042A patent/TW201302907A/zh unknown
- 2012-05-23 WO PCT/JP2012/063123 patent/WO2012165239A1/ja active Application Filing
- 2012-05-24 JP JP2012118238A patent/JP2013010940A/ja not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629296B (zh) * | 2013-09-30 | 2018-07-11 | 長瀨化成股份有限公司 | 半導體密封用環氧樹脂組成物、半導體安裝結構體、及其製造方法 |
CN109328204A (zh) * | 2016-06-23 | 2019-02-12 | 三星Sdi株式会社 | 用于密封固态半导体器件的环氧树脂组合物、包含其的封装材料及半导体封装件 |
CN109328204B (zh) * | 2016-06-23 | 2023-12-29 | 三星Sdi株式会社 | 用于密封固态半导体器件的环氧树脂组合物、包含其的封装材料及半导体封装件 |
CN112955487A (zh) * | 2018-12-03 | 2021-06-11 | 松下知识产权经营株式会社 | 补强用树脂组合物、电子元件、制造电子元件的方法、安装结构体以及制造安装结构体的方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2012165239A1 (ja) | 2012-12-06 |
JP2013010940A (ja) | 2013-01-17 |
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