TW201231509A - Photosensitive resin composition and method for producing same - Google Patents

Photosensitive resin composition and method for producing same Download PDF

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Publication number
TW201231509A
TW201231509A TW100137423A TW100137423A TW201231509A TW 201231509 A TW201231509 A TW 201231509A TW 100137423 A TW100137423 A TW 100137423A TW 100137423 A TW100137423 A TW 100137423A TW 201231509 A TW201231509 A TW 201231509A
Authority
TW
Taiwan
Prior art keywords
group
resin composition
photosensitive resin
polyorganosiloxane
compound
Prior art date
Application number
TW100137423A
Other languages
English (en)
Chinese (zh)
Inventor
Toru Katsumata
Yamato Saito
Hiroko Iwakura
Osamu Yamazaki
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201231509A publication Critical patent/TW201231509A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Silicon Polymers (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
TW100137423A 2010-10-14 2011-10-14 Photosensitive resin composition and method for producing same TW201231509A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010231848 2010-10-14
JP2011116156 2011-05-24

Publications (1)

Publication Number Publication Date
TW201231509A true TW201231509A (en) 2012-08-01

Family

ID=45938421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100137423A TW201231509A (en) 2010-10-14 2011-10-14 Photosensitive resin composition and method for producing same

Country Status (6)

Country Link
JP (1) JPWO2012050201A1 (ko)
KR (1) KR20130066684A (ko)
CN (1) CN103154053A (ko)
SG (1) SG189383A1 (ko)
TW (1) TW201231509A (ko)
WO (1) WO2012050201A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698636B (zh) * 2018-12-18 2020-07-11 英業達股份有限公司 印刷機刮刀自動檢測設備
TWI801443B (zh) * 2017-10-27 2023-05-11 美商陶氏有機矽公司 可固化聚有機矽氧烷組成物、藉由固化該等組成物獲得之固化體、及包含其之電子裝置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031985A1 (ja) * 2011-08-31 2013-03-07 旭化成イーマテリアルズ株式会社 感光性アルカリ可溶シリコーン樹脂組成物
JP5975814B2 (ja) * 2012-09-14 2016-08-23 株式会社トクヤマ 光硬化性ナノインプリント用組成物およびパターンの形成方法
JP2019104836A (ja) * 2017-12-13 2019-06-27 信越化学工業株式会社 オルガノポリシロキサン化合物およびそれを含む活性エネルギー線硬化性組成物
KR102315376B1 (ko) * 2021-03-16 2021-10-20 모멘티브퍼포먼스머티리얼스코리아 주식회사 실리콘계 조성물 및 이의 경화물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10148894A1 (de) * 2001-10-04 2003-04-30 Fraunhofer Ges Forschung Photochemisch und/oder thermisch strukturierbare Harze auf Silanbasis, einstufiges Verfahren zu deren Herstellung, dabei einzetzbare Ausgangsverbindungen und Herstellungsverfahren für diese
US6818721B2 (en) * 2002-12-02 2004-11-16 Rpo Pty Ltd. Process for producing polysiloxanes and use of the same
US7393469B2 (en) * 2003-07-31 2008-07-01 Ramazan Benrashid High performance sol-gel spin-on glass materials
JP2008239634A (ja) * 2005-07-12 2008-10-09 Toagosei Co Ltd アルコール性水酸基を有する有機ケイ素樹脂及びその製造方法
JP4863787B2 (ja) * 2006-06-29 2012-01-25 旭化成イーマテリアルズ株式会社 有機無機感光性樹脂組成物
JP2008088195A (ja) * 2006-09-29 2008-04-17 Asahi Kasei Electronics Co Ltd 有機無機感光性樹脂組成物
US20090088547A1 (en) * 2006-10-17 2009-04-02 Rpo Pty Limited Process for producing polysiloxanes and use of the same
US8043899B2 (en) * 2007-04-04 2011-10-25 Asahi Kasei E-Materials Corporation Photosensitive resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801443B (zh) * 2017-10-27 2023-05-11 美商陶氏有機矽公司 可固化聚有機矽氧烷組成物、藉由固化該等組成物獲得之固化體、及包含其之電子裝置
TWI698636B (zh) * 2018-12-18 2020-07-11 英業達股份有限公司 印刷機刮刀自動檢測設備

Also Published As

Publication number Publication date
JPWO2012050201A1 (ja) 2014-02-24
KR20130066684A (ko) 2013-06-20
CN103154053A (zh) 2013-06-12
WO2012050201A1 (ja) 2012-04-19
SG189383A1 (en) 2013-05-31

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