TW201231509A - Photosensitive resin composition and method for producing same - Google Patents

Photosensitive resin composition and method for producing same Download PDF

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Publication number
TW201231509A
TW201231509A TW100137423A TW100137423A TW201231509A TW 201231509 A TW201231509 A TW 201231509A TW 100137423 A TW100137423 A TW 100137423A TW 100137423 A TW100137423 A TW 100137423A TW 201231509 A TW201231509 A TW 201231509A
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TW
Taiwan
Prior art keywords
group
resin composition
photosensitive resin
polyorganosiloxane
compound
Prior art date
Application number
TW100137423A
Other languages
Chinese (zh)
Inventor
Toru Katsumata
Yamato Saito
Hiroko Iwakura
Osamu Yamazaki
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Asahi Kasei E Materials Corp
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Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201231509A publication Critical patent/TW201231509A/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/08Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04Homopolymers or copolymers of monomers containing silicon
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Abstract

The present invention provides: a photosensitive transparent resin composition having excellent thermal shock resistance in the production of products with integrated electronic parts or of solid-state imaging elements that requires a reflow soldering process; and a microplastic lens or an optical-element molded product for liquid crystal polarizing plates that uses said photosensitive transparent resin composition. The photosensitive resin composition contains: 100 parts by mass of a polyorganosiloxane (a) having a polymerizable functional group and prepared according to a method of mixing an alkoxysilane compound represented by the following general formula (1), R1 aR2 bSi(OR3)4-a-b (wherein R1, R2, R3, a, and b are as defined in the Description), with a catalyst and polymerizing the alkoxysilane compound, wherein said polyorganosiloxane (a) includes a structure represented by the following general formula (2), =Si-O-X-Si= (wherein X is as defined in the Description), and the structure of said general formula (2) contains 5 to 60% of the Si atoms contained in said polyorganosiloxane (a); and 0.01 to 30 parts by mass of a photopolymerization initiator (b).

Description

201231509 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種用於主要以光學用途為目的之半導體 裝置、塑膝微透鏡(Microplastic Lens)、液晶偏光板、光波 導等電氣零件的感光性樹脂組合物,及半導體裝置、多層 配線基板等電氣、電子材料所使用之樹脂絕緣膜。更詳細 而言,本發明係關於如下者:行動電話、監控攝影機等相 機模組用之塑穋迷你透鏡(plastic mini lens)及相機模組周 邊材料’光通訊用塑膠微透鏡,CCD(Charge Coupled201231509 VI. Description of the Invention: [Technical Field] The present invention relates to a photosensitive device for a semiconductor device, a plastic microlens (Microplastic Lens), a liquid crystal polarizing plate, an optical waveguide, etc., which are mainly used for optical purposes. A resin insulating film used for electrical and electronic materials such as a semiconductor device or a multilayer wiring board. More specifically, the present invention relates to a plastic mini lens for a camera module such as a mobile phone or a surveillance camera, and a peripheral material for a camera module. A plastic microlens for optical communication, CCD (Charge Coupled)

Device ’ 電何搞合裝置)、CMOS(Complimentary MetalDevice ’ CMOS (Complimentary Metal)

Oxide Semiconductor,互補型金屬氧化物半導體)影像感 測器等固體攝像元件用之塑膠微透鏡,LED(Light_ Emitting Diode,發光二極體)之密封劑,用於LED高亮度 化之光子晶體,顯示器領域之薄膜電晶體陣列(FUm Transistor Array) ’用於形成抗反射膜之材料,液晶投影器 (liquid crystal projector)用之偏光板用光學元件之材料, 用於製作LSI(Large Scale Integration,大型積體電路)晶片 之緩衝塗膜或層間絕緣膜之材料。 【先前技術】 由於塑膠透鏡與玻璃相比成型較容易且廉價’故而廣泛 地用於各種光學製品中。作為其材料,可使用聚曱基丙稀 酸甲酯、聚苯乙烯等熱塑性塑膠、及聚二乙二醇雙(碳酸 烯丙酯)等熱硬化性塑膠等各種透明材料。但是,先前之 材料如專利文獻⑷所示,即便改良耐熱性,大部分月亦為 159229.doc 201231509 200°C以下者,而無法保證260°C之回流焊耐熱。 通常,具有3Si-0-Si=結構之矽氧烷聚合物之耐熱性較 高。專利文獻3中揭示有藉由使矽烷二醇與烷氡基矽烷於 兩階段之步驟中聚合而獲得之分子量為3,〇〇〇以上、1〇,〇〇〇 以下之聚矽氧烷。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開平〇9-3 1136號公報 [專利文獻2]曰本專利特開2004-245867號公報 [專利文獻3]國際公開第2008/123224號說明書 【發明内容】 [發明所欲解決之問題] 本發明之目的在於提供一種用於需要回流焊步驟之固體 攝像元件或電子零件一體型製品之製造用途的具有即便於 硬化後經過-4(TC〜125。(:之冷熱循環亦不會產生龜裂或剝 離之耐溫度衝擊性等優異之特性的感光性透明樹脂組合 物、可用於該組合物之樹脂、及使用該組合物之硬化物。 [解決問題之技術手段] 為了解決上述課題,本發明者等人對含有矽氧烷之感光 性樹脂進行研究,發現藉由僅使特定之絲基钱縮聚 =,或將特定之矽烷醇化合物與特定之烷氧基矽烷化合物 此合並使之縮聚合,繼而添加光聚合起始劑,可獲得耐溫 度衝擊性優異之感光性樹脂。又,本發明者等人發明出使 聚矽氧烷高分子量化之方法,從而完成本發明。即,本發 159229.doc 201231509 明如下所述。 π] —種感光性樹脂組合物,其含有. 聚有機矽氧烷(a) 100質量份、及 光聚合起始劑(b) 0.01〜30質量份, ,、上機破氧燒⑷係藉由將下述通式⑴所表示之至 二一種烧氧基石夕烧化合物、及觸•合並使之聚合之方法 ^的具有聚合性官能基者’該聚有切氧院⑷具有下述Oxide Semiconductor, complementary metal oxide semiconductor) plastic microlens for solid-state imaging devices such as image sensors, LED (Light_ Emitting Diode) encapsulant, photonic crystal for LED high-brightness, display A thin film transistor array (FUm Transistor Array) is used as a material for forming an antireflection film, and a material for an optical element for a polarizing plate for a liquid crystal projector is used for LSI (Large Scale Integration). Body circuit) A material of a buffer coating film or an interlayer insulating film of a wafer. [Prior Art] Since plastic lenses are easier and cheaper to form than glass, they are widely used in various optical articles. As the material, various transparent materials such as a thermoplastic resin such as polymethyl methacrylate or polystyrene, and a thermosetting plastic such as polydiethylene glycol bis(allyl carbonate) can be used. However, as shown in the patent document (4), the conventional material is improved in heat resistance, and most of the months are 159229.doc 201231509 200 °C or less, and reflow soldering at 260 °C cannot be guaranteed. Generally, a siloxane polymer having a 3Si-0-Si= structure has high heat resistance. Patent Document 3 discloses a polyoxyalkylene having a molecular weight of 3, 〇〇〇 or more, 1 Å or less, which is obtained by polymerizing a decanediol and an alkyl decyl decane in a two-step process. [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] An object of the present invention is to provide a solid-state image sensor or an electronic component-integrated article for use in a reflow soldering step, which has been subjected to curing even after hardening - 4 (TC to 125. (: a photosensitive transparent resin composition which does not cause cracking or peeling resistance to temperature shock resistance, etc., a resin which can be used for the composition, and the use of the composition [Technical means for solving the problem] In order to solve the above problems, the inventors of the present invention conducted research on a photosensitive resin containing a siloxane, and found that only specific molecular weight is condensed = or a specific decane is used. The alcohol compound and the specific alkoxydecane compound are combined and condensed, and then a photopolymerization initiator is added to obtain a photosensitive resin excellent in temperature impact resistance. The present invention has been invented, and the present invention has been completed by the method of polymerizing a polyoxane. That is, the present invention is described in the following paragraph: π]. A photosensitive resin composition containing polyorganosiloxane. 100 parts by mass of the alkane (a), and 0.01 to 30 parts by mass of the photopolymerization initiator (b), and the above-mentioned oxygen-breaking (4) are represented by the following formula (1) to two kinds of anthracenite A compound having a polymerizable functional group, which is a method of polymerizing a compound, and a method of polymerizing the compound, which has a polymerizable functional group,

=):表示之結構,且該聚有機,氧院⑷所具有之Si 原子數中之5〜祕包含於上述通式(2)所㈣之結構内, R'aR^SiCOR3)^ (1) (式中,R1為碳數2〜17之含有酷鍵之有機基,至少一 個具有丙烯酿基或甲基丙烯^,R2於存在複數個之情形 時分別獨立為可具有取代基之碳數㈣之脂肪族基,汉3於 存在複數個之情形時分別獨立為f基或乙基,…或& 整數,b為〇〜2之整數,並且a+b為3以下} —Si-0-X-Si= (2) {式中’X為碳數1〜15之有機基}。 [2]如[1]之感光性樹脂組合物,其中上述聚有機矽氧烷 ⑷係藉由將上述通式⑴所表示之至少—種院氧基石夕烧化 s物下述通式(3)戶斤表示之至少一種石夕烧醇化合物、及觸 媒混合並使之聚合之方法而獲得者, R4R5Si(〇H)2 (3) {式中’R及R5為可具有取代基之碳數3〜1〇之脂肪族基、 脂環式基或芳香族基)。 159229.doc 201231509 [3] 如Π ]或[2]之感光性樹脂組合物,其中上述聚有機石夕 氧烧(a)所具有之si原子數中之〜40%包含於上述通式(2) 所表示之結構内。 [4] 一種感光性樹脂組合物,其含有: 聚有機矽氧烷(a) 1〇〇質量份 '及 光聚合起始劑(b) 0.01〜30質量份, 上述聚有機矽氧烷(a)係藉由將下述通式(1)所表示之至 少一種烷氧基矽烷化合物、及觸媒混合並使之聚合之方法 而獲得者,且丨H-NMR譜中之s旨鍵之源自賴之波峰面積 與醋鍵之源自醇之波峰面積的比與添加時相比減少 5〜60%, ^ aK bSl(〇R )4ea b {式令,R,為碳數2〜17之含有酿鍵之有機基,R1之至少 個具有㈣醯基或甲基丙_基,r2於存在複數個之情 ::別獨立為可具有取代基之碳數…之脂肪族基,R3 存在複數個之情形時分別獨立為氫、f基或乙基,… 之整數,b為0〜2之整數,並且㈣為3以下}。 ” ’ 如[4]之感光性樹脂組合 (a)係藉由將上述通式至、:有機矽氧’ 合物、下述通式嶋示之至:、之至二,氧基彻 媒混合並使之聚合之方法獲彳種料醇化合物、及角 R4R5Si(〇H)2 (3) {式中,R及R為可具有取代基 脂環式基或芳香族基^ 厌數3〜10之脂肪族基、 I59229.doc 201231509 [6] 如[4]或[5]之感光性樹脂組合物,其中上述聚有機矽 氧烷(a)係1H-NMR譜中之酯鍵之源自羧酸之波峰面積與酯 鍵之源自醇之波峰面積的比與添加時相比減少ι〇〜/4'〇〇/〇 者。 [7] —種感光性樹脂組合物,其含有: '聚有機矽氧烷(a) 100質量份、及 光聚合起始劑(b)0.01〜30質量份, 上述聚有機矽氧烷(a)係藉由將下述通式(1)所表示之至 少一種烷氧基矽烷化合物、下述通式(3)所表示之至少一種 矽烷醇化合物、及觸媒混合並使之聚合之方法而獲得者, 且於凝膠滲透層析法(GPC)測定中標準聚苯乙烯換算之重 量平均分子量為1,050以上的面積為70%以上, RWbSKOR^.a.b (!) {式中,R為碳數2〜17之含有酯鍵之有機基,Ri之至少一 個具有丙烯醯基或甲基丙烯醯基,r2於存在複數個之情形 ❹ 時分別獨立為可具有取代基之碳數1〜1〇之脂肪族基,R3於 存在複數個之情形時分別獨立為甲基或乙基,a為1或2之 整數,b為0〜2之整數,並且a+b為3以下} R4R5Si(〇H)2 (3) {式中’ R4及R5為可具有取代基之碳數3〜1〇之脂肪族基、 脂環式基或芳香族基}。 [8] 如[1]至[7]中任一項之感光性樹脂組合物,其中上述 通式(1)所表示之烷氧基矽烷化合物為下述通式(4)所表示 之至少一種烷氧基矽烷化合物, 159229.doc 201231509 H2C=C(R6)-(C=0)-〇.(CH2)n-SiR7c(OR8)d (4) {式中,R6為氫或曱基,R7於存在複數個之情形時分別獨 立為可具有取代基之碳數卜10之脂肪族基,R8於存在複數 個之情形時分別獨立為甲基或乙基,C為〇〜2之整數,d為 1〜3之整數,c+d為3以下,並且η為1〜14}。 [9] 如[2]' [3]及[5]至[8]中任—項之感光性樹脂組合物, 其中上述通式(3)中之R4及R5之至少一者為可具有取代基之 碳數3〜10之脂環式基。 [10] 如[1]至[9]中任一項之感光性樹脂組合物其相對於 聚有機矽氧烷(a) 100質量份進而含有乙烯性不飽和加成聚 合性單體(c)0.1〜1〇〇〇質量份。 [11 ]如[10]之感光性樹脂組合物,#中上述乙烯性不飽 和加成聚合性單體為含有脂環式基之化合物。 [12] 如[1]至[π]申任一項之感光性樹脂組合物,其進而 含有選自由紫外線吸收劑 '光穩定劑、接著助劑、聚合抑 制劑、增感劑、抗氧化劑及平滑性賦予劑所組成之群中之 至少1種添加劑。 [13] 如[1 ]至[12]中任一項之感光性樹脂組合物其中上 述感光性樹脂組合物中之鹼金屬或鹼土金屬濃度為 0.1 〜500 ppm 〇 [14] 一種聚有機矽氧烷之製造方法,其包括: 1)將下述通式⑴所表示之至少―種㈣基⑪貌化合物、 相對於存在於反應體系中之院氧基石夕燒化合物所具有之 0R基1虽量為〇.〇1〜〇.5當量之水、及觸媒加以混合,於 159229.doc 201231509 130C下使之反應0.1〜20小時,且一面將藉由反應而 生成之醇除去至料外…面生成聚有㈣氧烧⑷之步 驟, RWbSKOR^.b ⑴ {式中,R1為碳數2〜17之含有酯鍵之有機基,y之至少— • 個具有丙烯醯基或曱基丙烯醯基,R2於存在複數個之情形 時分別獨立為可具有取代基之碳數丨〜⑺之脂肪族基,R3於 存在複數個之情形時分別獨立為甲基或乙基,a為i或2之 整數,b為0〜2之整數,並且a+b為3以下};及 i i)利用不會溶解聚有機矽氧烷之溶劑對該聚有機矽氧烷 0)進行清洗之步驟。 [15] —種聚有機矽氧烷之製造方法,其包括: 1)將下述通式(1)所表示之至少一種烷氧基矽烷化合物、 下述通式(3)所表示之至少一種矽烷醇化合物、及觸媒加以 混合,於20〜130°C下,使之反應01〜2〇小時,且一面將藉 〇 由反應而生成之醇除去至體系外,一面生成聚有機矽氧烷 (a)之步驟, R、R2bSi(〇RVa.b ⑴ {式中,R1為碳數2〜17之含有酯鍵之有機基,Ri之至少_ 個具有丙烯醯基或曱基丙烯醯基,R2於存在複數個之情形 時分別獨立為可具有取代基之碳數丨〜1〇之脂肪族基,尺3於 存在複數個之情形時分別獨立為曱基或乙基,a為1或2之 整數,b為0〜2之整數,並且a+b為3以下} R4R5Si(〇H)2 159229.doc (3) 201231509 {式中,R4及R5為可具有取代基之碳數3〜1〇之脂肪族基、 脂環式基或芳香族基及 11)利用不會溶解聚有機矽氧烷之溶劑對該聚有機矽氧烷 (a)進行清洗之步驟。 [16]如[14]或[15]之製造方法’其中上述觸媒為選自由驗 金屬氫氧化物及鹼土金屬氫氧化物所組成之群中之至少一 種化合物。 Π7]如Π4]至[16]中任一項之製造方法,其中上述觸媒為 Ba(OH)2及/或其水合物。 間如間至[17]巾任-項之製造方法,纟巾上述觸媒之 量相對於矽(Si)之總莫耳數為0.05〜30莫耳%。 [19] 如[14]至[18]中任-項之製造方法,纟中上述觸媒之 量相對於矽(Si)之總莫耳數為〇.〖〜;! 〇莫耳0/〇。 [20] 如[⑷至間中任-項之製造方法,纟中上述溶劑為 醇或乙腈。 [21] —種硬化物,其係使如[”至。”中任一項之感光性 樹脂組合物 '或含有藉由如[14]至[2〇]中任—項之製造方 法而獲得之聚有機矽氧烷(&)及光聚合起始劑沙)之感光性 樹脂組合物光硬化而獲得者。 [22] —種成型物之製造方法,其包括如下步驟: 將如[1]至[13] t任一項之感光性樹脂組合物、或含有藉 由如[14]至[20]中任—項之製造方法而獲得之聚有機石夕氧 烷(a)及光聚合起始劑(b)之感光性樹脂組合物填充至成型 用模具中之步驟, 159229.doc -10· 201231509 將該模具之開口部按壓至基板或另—模具上之步驟 自該模具及/或該基板側將該感光性樹脂組合物: 獲得光硬化物之步驟, 而 將該模具自該基板剝離或將位於兩 驟,以及 自之破模具剝離之步 該基板一併加 僅將該光硬化物加熱,或將該光硬化物與 熱之步驟。 、 ❹ 者 [23] —種硬化物,其係藉由如[22】 之製造方法而獲 得 [24] 一種聚有機石夕氧炫,其係藉由將下述通式⑴所表干 之至少-㈣氧基㈣化合物、下述通式(3)所表示之至少 :種石夕烧醇化合物、及觸媒混合並使之聚合之方法而獲得 ,該聚有機錢料有下料式⑺所表結構,且該 ^有㈣氧烧所具有之81原子數中之5〜峨包含於上述通 式(2)所表示之結構内, Ο 訂心㈣3)“·,⑴ (式中,Rl為碳數2〜17之含有㈣之有機基,R2於存在複 數個之情形時分別獨立為可具有取代基之碳數卜⑺之脂肪 族基’ R3於存在複數個之情料分卿立為甲基或乙基, a為1或2之整數’ b為〇〜2之整數,並以下} R4R5Si(OH)2 (3) ^式中,R4及R5為可具有取代基之碳數⑽之脂肪族基、 脂環式基或芳香族基} sSi-〇-x_si= (2) l59229.d〇c -11 - 201231509 {式中,X為碳數1〜15之有機基}。 述通式(I)中之Ri,為 [25]如[24]之聚有機矽氧烷,其中上 具有丙碲酸酯及/或曱基丙烯酸酯之基。 [發明之效果] 根據本發明,可提供一種用於需要回流焊步驟之固體攝 像元件或電子零件一體型製品之製造用途的具有即便經過 冷熱循環亦不會產生龜裂或剝離之耐溫度衝擊性等優異之 特性的樹脂、或感光性樹脂組合物。 【實施方式】 <感光性樹脂組合物> 本發明中之感光性樹脂組合物係藉由將特定之烧氧基石夕 烷化合物、及觸媒混合並使之聚合之方法而獲得,且含有 具有下述通式(2) = Si-0-X-Si= (2) {式中,X為碳數1〜15之有機基}之聚有機矽氧烷(a);及光 聚合起始劑(b)。 上述烷氧基矽烷化合物為下述通式所表示之至少一 種烧氧基碎烧化合物,=): indicates the structure, and the polyorganism, oxygen chamber (4) has a number of Si atoms 5 to secret contained in the structure of the above formula (2) (4), R'aR^SiCOR3)^ (1) (wherein R1 is an organic group having a carbon bond of 2 to 17 and having at least one of a ketone group or a methacrylic group; and R2 is independently a carbon number which may have a substituent in the case where a plurality of R2 are present (IV) The aliphatic group, Han 3 is independently a f group or an ethyl group when there are a plurality of cases, respectively, or an integer, b is an integer of 〇~2, and a+b is 3 or less} —Si-0- (2) The photosensitive resin composition of [1], wherein the polyorganosiloxane (4) is obtained by the above-mentioned At least one of the compounds represented by the formula (1), which is obtained by a method of mixing and polymerizing at least one of the sulphuric acid compounds represented by the following formula (3), and the catalyst, R4R5Si (〇H) 2 (3) wherein R and R5 are an aliphatic group, an alicyclic group or an aromatic group having 3 to 1 carbon atoms which may have a substituent. [1] The photosensitive resin composition of [2], wherein the polyorgano oxyazepine (a) has ~40% of the number of si atoms contained in the above formula (2). ) within the structure represented. [4] A photosensitive resin composition comprising: polyorganosiloxane (a) 1 part by mass ' and a photopolymerization initiator (b) 0.01 to 30 parts by mass, the above polyorganosiloxane (a) It is obtained by a method in which at least one alkoxydecane compound represented by the following formula (1) and a catalyst are mixed and polymerized, and the source of the bond in the 丨H-NMR spectrum The ratio of the peak area of the self-reliant peak to the peak area of the vinegar-derived alcohol is reduced by 5 to 60% compared with the addition, ^ aK bSl(〇R )4ea b {formation, R, is the carbon number 2~17 The organic group containing a stimulating bond, at least one of R1 has a (tetra) fluorenyl group or a methyl propyl group, and r2 is present in plural plural:: independently, an aliphatic group having a carbon number which may have a substituent, and R3 has a plural number In each case, it is independently an integer of hydrogen, f-group or ethyl, ..., b is an integer of 0 to 2, and (iv) is 3 or less}. The photosensitive resin composition (a) as in [4] is obtained by mixing the above formula to: an organic oxime compound, and the following formula: And the method of polymerizing the obtained alcohol compound, and the angle R4R5Si(〇H)2 (3) wherein R and R are a substituent alicyclic group or an aromatic group. [6] The photosensitive resin composition of [4] or [5], wherein the polyorganosiloxane (a) is derived from a carboxyl bond in a 1H-NMR spectrum. The ratio of the peak area of the acid to the peak area of the ester bond derived from the alcohol is reduced by ι 〇 / / 4 ' 〇〇 / 〇 compared with the case of the addition. [7] A photosensitive resin composition containing: 100 parts by mass of the organic siloxane (a) and 0.01 to 30 parts by mass of the photopolymerization initiator (b), and the polyorganosiloxane (a) is at least represented by the following formula (1) An alkoxydecane compound, at least one stanol compound represented by the following formula (3), and a method in which a catalyst is mixed and polymerized, and is obtained by gel permeation chromatography (GPC). The area of the polystyrene-equivalent weight average molecular weight of 1,050 or more is 70% or more, RWbSKOR^.ab (!) {wherein, R is an organic group containing an ester bond of 2 to 17 carbon atoms, and at least one of Ri Having a propylene fluorenyl group or a methacryl fluorenyl group, and r2 is independently an aliphatic group having a carbon number of 1 to 1 可 which may have a substituent when there are a plurality of ❹, and R 3 is independently Methyl or ethyl, a is an integer of 1 or 2, b is an integer of 0 to 2, and a+b is 3 or less} R4R5Si(〇H)2 (3) {wherein R4 and R5 are substitutable The photosensitive resin composition of any one of [1] to [7], wherein the above formula ( 1) The alkoxydecane compound represented by the following formula (4) is at least one alkoxydecane compound, 159229.doc 201231509 H2C=C(R6)-(C=0)-〇.(CH2 n-SiR7c(OR8)d (4) {wherein, R6 is hydrogen or a fluorenyl group, and R7 is independently an aliphatic group having a carbon number of a substituent in the presence of a plurality of cases, and R8 is present. Multiple cases Independently methyl or ethyl, C is an integer of 〇~2, d is an integer of 1 to 3, c+d is 3 or less, and η is 1 to 14}. [9] as [2]' [3] And a photosensitive resin composition of any one of the above-mentioned items (5), wherein at least one of R4 and R5 in the above formula (3) is an alicyclic ring having a carbon number of 3 to 10 which may have a substituent [10] The photosensitive resin composition according to any one of [1] to [9] further comprising an ethylenically unsaturated addition polymerizable monomer with respect to 100 parts by mass of the polyorganosiloxane (a) ( c) 0.1 to 1 part by mass. [11] The photosensitive resin composition according to [10], wherein the ethylenically unsaturated addition polymerizable monomer is a compound containing an alicyclic group. [12] The photosensitive resin composition according to any one of [1] to [π], which further comprises an ultraviolet absorber selected from the group consisting of a light stabilizer, a light stabilizer, a polymerization inhibitor, a sensitizer, an antioxidant, and At least one additive selected from the group consisting of smoothness imparting agents. [13] The photosensitive resin composition according to any one of [1] to [12] wherein the alkali metal or alkaline earth metal concentration in the photosensitive resin composition is 0.1 to 500 ppm 14 [14] a polyorganosiloxane The method for producing an alkane, which comprises: 1) a compound of at least a (tetra) group 11 represented by the following formula (1), and an amount of a ruthenium 1 having a compound of the oxy-stone compound present in the reaction system The mixture of 〇.〇1~〇.5 equivalent of water and a catalyst is mixed and reacted at 159229.doc 201231509 130C for 0.1 to 20 hours, and the alcohol formed by the reaction is removed to the outside of the surface. The step of forming a poly(4-)oxygen (4), RWbSKOR^.b (1) wherein R1 is an organic group containing an ester bond having 2 to 17 carbon atoms, and at least y has a propylene fluorenyl group or a fluorenyl fluorenyl group. R2 is independently an aliphatic group having a carbon number 丨~(7) which may have a substituent in the case of a plurality of plural, and R3 is independently a methyl group or an ethyl group in the case of a plurality of cases, and a is an i or 2 An integer, b is an integer from 0 to 2, and a+b is 3 or less}; and ii) does not dissolve polyorganosiloxane The solvent is used to clean the polyorganooxane 0). [15] A method for producing a polyorganosiloxane, comprising: 1) at least one alkoxydecane compound represented by the following formula (1), or at least one represented by the following formula (3) The stanol compound and the catalyst are mixed and reacted at 20 to 130 ° C for 01 to 2 hours, and the alcohol formed by the reaction is removed to the outside of the system to form a polyorganosiloxane. (a) a step, R, R2bSi (〇RVa.b (1) {wherein, R1 is an organic group having an ester bond having 2 to 17 carbon atoms, and at least one of Ri has an acryloyl group or a fluorenyl fluorenyl group. When R2 is present in a plurality of cases, it is independently an aliphatic group having a carbon number of 丨~1〇 which may have a substituent, and the ruler 3 is independently a fluorenyl group or an ethyl group in the case of a plurality of cases, and a is 1 or 2, respectively. An integer, b is an integer of 0 to 2, and a+b is 3 or less} R4R5Si(〇H)2 159229.doc (3) 201231509 {wherein, R4 and R5 are carbon atoms 3 to 1 which may have a substituent An aliphatic group, an alicyclic group or an aromatic group of hydrazine and 11) a step of washing the polyorganosiloxane (a) with a solvent which does not dissolve the polyorganosiloxane. [16] The method of producing [14] or [15] wherein the catalyst is at least one compound selected from the group consisting of metal hydroxides and alkaline earth metal hydroxides. The method of any one of the above-mentioned, wherein the catalyst is Ba(OH)2 and/or a hydrate thereof. For example, in the method of manufacturing the article [17], the amount of the above-mentioned catalyst is 0.05 to 30 mol% with respect to the total number of moles of cerium (Si). [19] As in the manufacturing method of any of [14] to [18], the total amount of the above-mentioned catalyst relative to 矽(Si) is 〇. 〖~;! 〇莫耳0/〇 . [20] For example, in the manufacturing method of [(4) to intermediate-term, the above solvent is alcohol or acetonitrile. [21] A cured product obtained by the photosensitive resin composition of any one of [" to 至." or by a production method according to any one of [14] to [2] The photosensitive resin composition of the polyorganosiloxane (&) and the photopolymerization initiator sand) was obtained by photocuring. [22] A method for producing a molded article, comprising the steps of: or a photosensitive resin composition according to any one of [1] to [13], or containing any of [14] to [20] - a step of filling the photosensitive resin composition of the polyorgano-oxyalkane (a) and the photopolymerization initiator (b) obtained in the production method into a molding die, 159229.doc -10·201231509 Step of pressing the opening of the mold onto the substrate or the other mold: the photosensitive resin composition is obtained from the mold and/or the substrate side: a step of obtaining a photocured material, and the mold is peeled off from the substrate or will be located at two And the step of removing the mold from the step of removing the mold from the step of removing the photo-cured material or the step of heating the photo-cured material. , [23] - a hardened material obtained by the method of [22] [24] A polyorganism, which is at least dried by the following formula (1) - (IV) an oxy (tetra) compound, a method represented by the following formula (3), at least: a seed smelting alcohol compound, and a catalyst mixed and polymerized, and the polyorganic material has a blanking formula (7) The structure of the table, and 5 to 峨 of the 81 atomic number of the (4) oxy-combustion is contained in the structure represented by the above formula (2), 订 ordering (4) 3) "·, (1) (wherein, R1 is The carbon number 2 to 17 contains the organic group of (4), and R2 is independently a carbon number which can have a substituent in the case of a plurality of carbon atoms (7), and the aliphatic group 'R3 is present in a plurality of cases. Or an ethyl group, a is an integer of 1 or 2 'b is an integer of 〇~2, and the following} R4R5Si(OH)2 (3) where R4 and R5 are a carbon having a substituent (10) Group, alicyclic or aromatic group} sSi-〇-x_si= (2) l59229.d〇c -11 - 201231509 {wherein, X is an organic group having 1 to 15 carbon atoms}. Ri in I), [25] [24] A polyorganosiloxane having a propyl acrylate and/or a methacrylate group thereon. [Effect of the Invention] According to the present invention, a solid-state image sensor for a reflow soldering step or A resin or a photosensitive resin composition which has excellent properties such as temperature crack resistance which does not cause cracking or peeling even after a heat-and-heat cycle, and a photosensitive resin composition. [Embodiment] <Photosensitive resin Compositions The photosensitive resin composition of the present invention is obtained by a method in which a specific alkoxyline compound and a catalyst are mixed and polymerized, and contains the following formula (2) = Si-0-X-Si= (2) {wherein, X is an organic group having a carbon number of 1 to 15} of a polyorganosiloxane (a); and a photopolymerization initiator (b). The decane compound is at least one alkoxylated calcined compound represented by the following formula,

RiaR2bSi(〇R3)4_a_b ⑴ {式中’ R為碳數2〜17之含有酯鍵之有機基,Ri之至少一 個具有丙烯醯基或曱基丙烯醯基,R2於存在複數個之情形 時分別獨立為於任一情形時均可具有取代基之碳數卜1〇之 月曰肪族基、脂環式基或芳香族基’ R3於存在複數個之情形 時刀別獨立為甲基或乙基,a為1或2之整數,b為0〜2之整 159229.doc • 12- 201231509 數,並且a+b為3以下}。 作為聚有機矽氧烷(a),就保存穩定性之觀點而言,較佳 $使用藉由將上述通式⑴所表示之至少_種院氧基石夕烧化 纟物m珍燒醇化合物、及觸媒混合並使之聚合之方 法而獲得者。 &此情形時,上述残醇化合物為下述通式(3)所表示 之至少一種矽烷醇化合物, R4R5Si(〇H)2 ⑶ {式中,R及R5為可具有取代基之碳數3〜1〇之脂肪族基、 脂環式基或芳香族基}。 作為上述通式(1)所表示之烷氧基矽烷,較佳為使用下 述通式(5)所表示之至少一種烷氧基矽烷化合物,更佳為具 有丙烯酸酯及/或曱基丙烯酸酯之化合物, R9-(C=0)-〇-X.SiRi〇c(OR8)d (5) {式中,R9為碳數丨〜15之脂肪族基、脂環式基或芳香族 〇 基,可具有取代基,至少一種具有丙烯酸酯及/或甲基丙 烯酸酯,X為碳數丨〜15之脂肪族基、脂環式基或芳香族 基,可具有取代基,RU於存在複數個之情形時分別獨立 為碳數1〜10之脂肪族基,可具有取代基,RS於存在複數個 之情形時分別獨立為甲基或乙基,(^為0〜2之整數,4為^〜3 之整數,c+d為3以下,並且„為丨〜14卜就^^感光性之觀 點而言,尤佳為使用下述通式(4)所表示之至少一種烷氧基 矽烷化合物, (4) H2C=C(R6)-(C=〇)-〇.(CH2)n-SiR7c(〇R8)d 159229.doc -13· 201231509 {式中’ R6為氫或曱基’ R7於存在複數個之情形時分別獨 立為可具有取代基之碳數之脂肪族基、脂環式基或芳 香族基,R8於存在複數個之情形時分別獨立為甲基或乙 基,c為〇〜2之整數’ d為^3之整數,e + d為3以下,並且n 為卜14}。作為通式(4)所表示之烷氧基矽烷化合物之例, 可列舉:3-甲基丙烯醯氧基丙基三甲氧基石夕烧、3甲基丙 稀醯氧基丙基二乙氧基石夕燒、3_甲基丙稀醢氧基丙基甲基 二曱氧基矽烷、3·丙烯醯氧基丙基三曱氧基矽烷、3-丙烯 酿氧基丙基三乙氧基矽烷、2_甲基丙烯醯氧基乙基三甲氧 夕烷2甲基丙烯醯氧基乙基三乙氧基矽烷、甲基丙 稀酿氧基乙基甲基二甲氧基石夕烧、2-丙婦酿氧基乙基三甲 =錢:2-丙烯酿氧基乙基三乙氧基石夕烧、甲基丙烯醯 土曱基二甲氧基㈣、甲基丙烯醯氧基甲基三乙氧基石夕 、元其— 甲基丙稀酿氧基甲基甲基二甲氧基石夕院、丙烯醯氧基 了#:甲氧基錢、丙烯醯氧基甲基三乙氧基⑦烧等。亦 可使用3-乙酿氧基丙其= A . ·"—甲氧基矽烷等不具有聚合性官能 基之含酯鍵之烷氧基矽烷。 進而,於獲得如下聚有切氧 式⑴所表示之至少一種尸备^ 月μ作為上迷通 栌翁苴 凡氧基矽烷化合物,除上述所示之 燒氧基發烧化合物以外,__ 基…… 可使用3_乙酿氧基丙基三甲氧 丞矽烷等不具有聚合性 Τ軋 b土之3酯鍵之烧氧基矽烷,該 聚有機石夕乳烧係藉由將下述 該 基矽烷化合物、下述 : 不之至少-種燒氧 物、及觸媒混合並使之所表不之至少-種錢醇化合 0之方法而獲得者,該聚有機矽 159229.doc *14· 201231509 罝=有通式⑺所表示之結構,且該聚有機碎氧烧所 =有U數中5〜6G%包含於上料式⑺所表示之 内, RI'aR2bSi(〇R3)4.ab ⑴RiaR2bSi(〇R3)4_a_b (1) where R is an organic group containing an ester bond of 2 to 17 carbon atoms, and at least one of Ri has an acryloyl group or a fluorenyl fluorenyl group, and R2 is present in a plurality of cases. Independently, in any case, the carbon number of the substituent may be a hydrazine group, an alicyclic group or an aromatic group 'R3. In the case where there are a plurality of cases, the cleavage is independently methyl or B. Base, a is an integer of 1 or 2, b is an integer of 159229.doc • 12-201231509, and a+b is 3 or less}. As the polyorganosiloxane (a), from the viewpoint of storage stability, it is preferred to use at least a compound of the above formula (1), which is a compound of the formula A method in which the catalyst is mixed and polymerized. & In this case, the residual alcohol compound is at least one stanol compound represented by the following formula (3), R4R5Si(〇H)2 (3) wherein R and R5 are a carbon number which may have a substituent ~1〇 of an aliphatic group, an alicyclic group or an aromatic group}. The alkoxydecane represented by the above formula (1) is preferably at least one alkoxydecane compound represented by the following formula (5), more preferably having an acrylate and/or a mercapto acrylate. Compound, R9-(C=0)-〇-X.SiRi〇c(OR8)d (5) wherein R9 is an aliphatic group, an alicyclic group or an aromatic fluorenyl group having a carbon number of 丨15. And may have a substituent, at least one having an acrylate and/or methacrylate, X being an aliphatic group, an alicyclic group or an aromatic group having a carbon number of -15 -15, which may have a substituent, and RU may be present in plural In the case of an aliphatic group having a carbon number of 1 to 10, respectively, may have a substituent, and RS may be independently a methyl group or an ethyl group in the case of a plurality of cases, (^ is an integer of 0 to 2, and 4 is ^ An integer of ~3, c+d is 3 or less, and „为丨14 is a photosensitive property, and at least one alkoxydecane compound represented by the following general formula (4) is preferably used. , (4) H2C=C(R6)-(C=〇)-〇.(CH2)n-SiR7c(〇R8)d 159229.doc -13· 201231509 {wherein R6 is hydrogen or sulfhydryl' R7 When there are multiple cases An aliphatic group, an alicyclic group or an aromatic group which is independently a carbon number which may have a substituent, and R8 is independently a methyl group or an ethyl group in the case of a plurality of cases, and c is an integer of 〇~2 'd is An integer of ^3, e + d is 3 or less, and n is a b). As an example of the alkoxydecane compound represented by the formula (4), 3-methylpropenyloxypropyltrimethyl is exemplified. Oxygen sulphur, 3-methyl propyl methoxy propyl diethoxy sulphur, 3-methyl propyl methoxy propyl methyl decyl oxy decane, 3 · propylene methoxy propyl three曱oxydecane, 3-propenyloxypropyltriethoxydecane, 2-methylpropenyloxyethyltrimethoxyoxane 2-methylpropenyloxyethyltriethoxydecane, methyl Propylene oxyethyl methyl dimethoxy zeshi, 2-propene oxyethyl trimethyate = money: 2-propene oxyethyl triethoxy zebra, methacryl 醯 曱Dimethoxy (tetra), methacryloxymethyl triethoxy sulphur, sylvestre, methyl propylene, oxymethylmethyldimethoxy, oxime, propylene oxime #: A Oxyl money, propylene Oxymethyltriethoxy 7 or the like. It is also possible to use an alkoxydecane having an ester bond which does not have a polymerizable functional group such as 3-ethyloxypropane = A. · "-methoxy decane Further, at least one type of corpse compound represented by the following oxygen-cutting formula (1) is obtained as a compound of the above-mentioned alkoxy decane compound, in addition to the above-described alkoxy compound, __ group... An alkoxy decane which does not have a 3 ester bond of a polymerizable ruthenium b-belt, such as 3, ethoxypropyltrimethoxy decane, may be used, which is obtained by the following decane compound And the following: If at least the oxygen-burning substance and the catalyst are mixed and the method of at least the alcohol-alcoholization is not obtained, the polyorgano 矽 159229.doc *14· 201231509 罝= There is a structure represented by the general formula (7), and the polyorganic oxy-combustion gas = 5 to 6 G% of the U number is contained in the above-mentioned formula (7), RI'aR2bSi(〇R3)4.ab (1)

{式中’ R A碳數2〜17之含有S|鍵之有機基,R2於存在複 數個之情形時分別獨立為可具有取代基之碳數WG之脂肪 族基,R3於存在複數個之情形時分別獨立為甲基或乙基, a為1或2之整數,b為〇〜2之整數,並且&+1)為3以下) R4R5Si(OH)2 ⑺ {式中,R4及R5為可具有取代基之碳數3〜1〇之脂肪族基、 脂環式基或芳香族基} — Si-O-X-Si^ (2) {式中,X為碳數1〜15之有機基}。 藉由使用上述聚有機矽氧烷,可獲得耐溫度衝擊性優異 之樹脂。 作為觸媒’可使用促進烷氧基矽烷化合物之烷氧基之水 解、及由此生成之矽烷醇彼此或烷氧基矽烷及矽烷醇之縮 合反應’且於聚合過程中進行酯水解反應或酯交換反應之 化合物。 作為烧氧基石夕烧化合物及石夕院醇化合物之反應所使用之 觸媒,可使用促進矽烷醇化合物之矽烷醇基與烷氧基碎烷 化合物之烷氧基之脫醇縮合反應且於聚合過程中進行酯水 解反應或醋交換反應之化合物。 觸媒可為酸性化合物亦可為驗性化合物,可列舉:金屬 159229.doc 15- 201231509 烧氧化物、無機酸、有機酸、無機驗、有機驗、填腈化合 物等。其中,較佳為鹼金屬氫氧化物或鹼土金屬氫氧化 物、銨化合物等,作為具體例,可列舉:Ba(OH)2、 Ca(OH)2、Mg(OH)2、KOH、LiOH、NH3、NH4OH、 NR4(OH) ' NR4C1 ' NR4Br、NR4I 等。於 NR4(OH)、 NR4C1、NR4Br及NR4I中,R為可具有取代基之碳數1〜10之 脂肪族基、脂環式基或芳香族基。可更佳地列舉鹼金屬氫 氧化物、鹼土金屬氫氧化物等。進而較佳為觸媒為鹼土金 屬氫氧化物,作為具體例,可列舉:Ba(〇H)2、Ca(〇H)2、 Mg(OH)2 等。又,亦可使用 Ba(〇H)2、Ca(〇H)2、 之水合物,就穩定性及可縮短反應時間,且可藉由縮短不 均勻狀態下之反應時間而再現性良好地進行反應之觀點而 言,更佳為使用Ba(〇H)2 · 8H2〇。 應 ...... ”丨ώ 4 4贫枣等之水解」 、或S旨交換反應適當進行之、.曾# ., ? ^ 备遇仃之濃度,例如相對於添加Si」 子莫耳數為0.05〜30装耳。η , 4相性及反應控制性之觀. 較佳為0.1〜20莫耳0/0,更較為(Μ〜Η)莫耳%,尤佳) 0H0莫耳%。所料純科數 乂 烧氧基石夕貌化合物與通式(3)所表示 ^^表不; 耳應體系中之其他可縮合之錢化合 j 莫耳數’所謂觸媒量之莫耳% tsu 數添加多少莫耳之觸媒。 表-相對於該Si原子莫, 作為通式(3)所表示之錢醇化 性之觀點而言,較佳為尺】及&2 D ,就化合物之穩定 為體積較大之取代基之 159229.doc -16« 201231509 芳香族基或脂環式基。就耐光性及耐熱性之觀點 ^ 佳為R4及Μ之至少一者為可具有取代基之碳數3:。:脂二 式基之化合物。又’就更優異之透明性之觀點而言二 較佳為二環己基石夕烧二醇、二環戊基石夕燒二醇。 通式(1)所表示之烷氧基矽烷化合物與通式所表示 矽烷醇化合物之混合比相對於通式(3)所表示之矽 : 物100莫耳,通式⑴所表示之燒氧基石夕燒化合物為1〇 莫耳,較佳為20〜180莫耳,更佳為30〜150莫耳,進而較佳 為40〜120莫耳,就分子量及所獲得之樹脂之1;乂感光性之 觀點而言,最佳為60〜1〇〇莫耳。 於將通式(1)所表示之烷氧基矽烷化合物與通式(3)所表 示之矽烷醇化合物混合,使之於觸媒之存在化下進行反應 之情形時,反應溫度為2(TC〜13CTC、較佳為3〇〜1〇(rc、更 佳為40〜8〇t之溫度,反應時間為小時、較佳為 0.2〜10小時、更佳為〇.3〜5小時。反應器内之環境可為氮氣 Q 環境或空氣環境。可向反應體系中積極地添加水亦可不積 極地添加。即便於不積極地添加水之情形時,所使用之觸 媒之水合化合物中之水或矽烷醇中之水分亦可存在於反應 體系中。於僅使用通式(1)所表示之烷氧基矽烷化合物之情 形時,可使用最小量之水,較佳為相對於鍵結於si原子之 院氧基1當量為0.001至0.5當量。 以降低硬化物之線膨脹常數,調整折射率等為目的,可 向反應體系中添加二氧化矽、氧化鍅、二氧化鈦等微粒 子0 159229.doc 17- 201231509 <燒氧基矽烷化合物、或烷氧基矽烷化合物與秒烧醇化合 物之反應> σ 將通式(1)所表示之烷氧基矽烷化合物與 、>、取將通式 (1)所表示之烧氧基梦烧化合物與通式(3)所表示之妙燒醇 化合物加以混合,使之於觸媒之存在化下進行反應。=隔 某時間(例如15分鐘、30分鐘、60分鐘)’對反應混合物進 行1H-NMR譜測定,一面確認通式(1)所表示之烷氧基矽烷 化合物所具有的酯鍵之源自羧酸之側之波峰面積的減= 率,一面使之反應。例如為A-C(=〇)-0_B之酯鍵之情形 時,A為酯鍵之源自羧酸之側,B為酯鍵之源自醇之側。 藉由酯之水解或溶劑分解(s〇lv〇lysis) , 1H_NMR中之源自A 之某質子之波峰面積會減少,所謂源自羧酸之側之波峰面 積之減少率,表示該源自A之某質子之波峰面積於以反應 中不發生變化之其他某質子為基準時減少多少。 減少率可藉由與原料之NMR相比較而求出。例如使用 Η20(:(Μ+(00)-〇_(ί:Η2)3_8Κ〇Μβ)3 作為原料之情形 時,於添加最初、即原料之^^肘尺譜中,於〇 6 ppm附近出 現Si CH2·之質子之波峰,並且於5 5叩爪及6.〇沖瓜附近 出現H2C=C<之質子之波峰,該等波峰面積為2: 2,其比 為1。相對於此’於酯鍵係藉由羧酸與醇之縮合而形成但 該酯鍵之羧酸部位消失之聚有機矽氧烷中,酯鍵之羧酸部 位即H2C=C<之波峰面積與酯鍵之 醇部位即=Si-CH2-之波峰 面積相比減少’該等波峰面積之比成為1以下,可計算出 酯鍵之羧酸部位消失之比例。作為具體例,於獲得如圖i 159229.doc -18· 201231509 所不之聚有機矽氧烷之情形時,兩個H2C = C<之波峰面積 之和為1.997,=Si-CH2-之波峰面積成為2.885,由此可知 波峰面積比為1.997 ·· 2.885、即0.69,與添加最初、即原 料之波峰面積比1相比,酯鍵之源自羧酸之波峰面積減少 31°/〇 ’即,酯鍵之羧酸部位消失31〇/。。其中,ιΗ·ΝΜΚ譜係 將CHCI3之波峰設為7.24ppm而作為基準者。 藉由改變觸媒量、時間、溫度、反應容器内之壓力等, 可控制通式(1)所表示之烷氧基矽烷化合物之酯鍵之源自羧 酸之波峰面積的減少。例如藉由增加觸媒量、延長時間、 提高溫度等條件變更’可提高減少速度。作為具體例,於 通式(1)所表示之烷氧基矽烷係使用具有甲基丙烯酸酯之烷 氧基矽烷,使用Ba(OH)2,H2〇作為觸媒,且採用通常使用 之觸媒濃度即相對於總Si量為O.i莫耳%之情形時,即便將 反應溫度設為5〇t,將反應時間設為2小時,酯鍵之源自 羧酸之波峰面積亦不會減少,但藉由將觸媒量增加至〇3 Q 莫耳/(>進行反應,可合成酯鍵之源自羧酸之波峰面積減少 約30/。左右之聚有機矽氧烷。如此,藉由改變觸媒量、溫 度、反應時間,可使酯鍵之源自羧酸之波峰面積僅減少所 需之量。 聚〇反應中,作為通式〇)所表示之烷氧基矽烷化合物 中之酯鍵消失之比例,相對於通式⑴所表示之院氧基石夕院 化合物之添加量為5〜60%,較佳為7〜50%,更佳為 10 40/。冑佳為15〜35%。該等消失比例如上述所說明, 相田於通式(1)所表不之烧氧基石夕垸化合物之醋鍵之源自叛 159229.doc -19· 201231509 酸的波峰面積減少之比例β 認為醋鍵之羧酸部位之波峰、 聚合反應中’因藉由通式⑴所表,、之減少的原因在於:於 烷氧基部位與通式(3)所表示 示之烷氧基矽烷化合物之 而生成之醇(甲醇或乙醇)之垸醇之矽烷醇部位之縮合 之存在等1進行下述反應式所微量之水分及驗性觸媒 酯交換反應等, 不之輯鍵之水解反應及 [化1] r12ohWherein R has an organic group containing a S| bond of carbon number 2 to 17, and R2 is independently an aliphatic group having a carbon number of WG which may have a substituent in the case where a plurality of R2 are present, and R3 is present in plural cases. The time is independently methyl or ethyl, a is an integer of 1 or 2, b is an integer of 〇~2, and &+1) is 3 or less) R4R5Si(OH)2 (7) {wherein, R4 and R5 are An aliphatic group, an alicyclic group or an aromatic group having a carbon number of 3 to 1 Å having a substituent} - Si-OX-Si^ (2) wherein X is an organic group having 1 to 15 carbon atoms . By using the above polyorganosiloxane, a resin excellent in temperature impact resistance can be obtained. As the catalyst, the hydrolysis of the alkoxy group which promotes the alkoxydecane compound, and the condensation reaction of the stanols or the alkoxydecane and the stanol which are formed by the mixture can be used, and the ester hydrolysis reaction or ester is carried out during the polymerization. Exchange the compound of the reaction. As the catalyst used for the reaction of the alkoxylate compound and the shixi compound, a dealcoholization condensation reaction for promoting the alkoxy group of the stanol group of the stanol compound and the alkoxyhalide compound can be used in the polymerization. A compound which undergoes an ester hydrolysis reaction or a vinegar exchange reaction in the process. The catalyst may be an acidic compound or an inspective compound, and examples thereof include a metal 159229.doc 15- 201231509 a burned oxide, an inorganic acid, an organic acid, an inorganic test, an organic test, a nitrile compound, and the like. Among them, an alkali metal hydroxide or an alkaline earth metal hydroxide or an ammonium compound is preferable, and specific examples thereof include Ba(OH)2, Ca(OH)2, Mg(OH)2, KOH, and LiOH. NH3, NH4OH, NR4(OH) 'NR4C1 'NR4Br, NR4I, etc. In NR4(OH), NR4C1, NR4Br and NR4I, R is an aliphatic group, an alicyclic group or an aromatic group having 1 to 10 carbon atoms which may have a substituent. More preferably, it is an alkali metal hydroxide, an alkaline earth metal hydroxide or the like. Further, the catalyst is preferably an alkaline earth metal hydroxide, and specific examples thereof include Ba (〇H) 2, Ca(〇H) 2, and Mg(OH) 2 . Further, it is also possible to use a hydrate of Ba(〇H) 2 and Ca(〇H) 2 to improve the stability and shorten the reaction time, and to improve the reproducibility by shortening the reaction time in the uneven state. From the viewpoint of the reaction, it is more preferred to use Ba(〇H)2 · 8H2〇. Should be... "丨ώ 4 4 hydrolysis of poor jujubes, etc.", or S is an appropriate exchange reaction, .#,, ^ ^ The concentration of sputum, for example, relative to the addition of Si" The number is 0.05 to 30 ears. η, 4-phase and reaction controllability. It is preferably 0.1~20 mol 0/0, more (Μ~Η) mol%, especially good) 0H0 mol%. The pure compound number 乂 氧基 氧基 夕 夕 夕 与 与 与 与 与 与 与 与 与 与 与 与 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; How many moles of catalyst are added. With respect to the Si atom, as a viewpoint of the alcoholicity represented by the general formula (3), it is preferably a ruthenium and a < 2 D , and a 159,229 which is a stable substituent of the compound. .doc -16« 201231509 Aromatic or alicyclic. From the viewpoint of light resistance and heat resistance, at least one of R4 and hydrazine is a carbon number 3 which may have a substituent. : a compound of the lipid group. Further, from the viewpoint of more excellent transparency, dicyclohexyl sulphuric acid diol and dicyclopentyl sulphuric acid diol are preferred. The mixing ratio of the alkoxydecane compound represented by the formula (1) to the stanol compound represented by the formula is based on the oxime of the formula (3): 100 moles, the alkoxylate represented by the formula (1) The compound of the smoldering compound is 1 Torr, preferably 20 to 180 moles, more preferably 30 to 150 moles, still more preferably 40 to 120 moles, and the molecular weight and the obtained resin are 1; From the point of view, the best is 60~1〇〇. When the alkoxydecane compound represented by the formula (1) is mixed with the stanol compound represented by the formula (3) to carry out a reaction in the presence of a catalyst, the reaction temperature is 2 (TC). 〜13CTC, preferably 3〇~1〇 (rc, more preferably 40~8〇t, the reaction time is hour, preferably 0.2~10 hours, more preferably 〇.3~5 hours. Reactor The internal environment may be a nitrogen Q environment or an air environment. The water may be actively added to the reaction system or may not be actively added. Even in the case where water is not actively added, the water in the hydrated compound of the catalyst used or The water in the stanol may also be present in the reaction system. When only the alkoxydecane compound represented by the formula (1) is used, a minimum amount of water may be used, preferably with respect to the bond to the Si atom. The amount of the oxy group is from 0.001 to 0.5 equivalents. In order to reduce the linear expansion constant of the cured product and adjust the refractive index, fine particles such as cerium oxide, cerium oxide, and titanium oxide may be added to the reaction system. 201231509 <Alkoxydecane compound, or Reaction of a oxydecane compound with a squirrel alcohol compound > σ The alkoxy decane compound represented by the formula (1) and >, the alkoxylated compound represented by the formula (1) The oxy-alcohol compound represented by the formula (3) is mixed and allowed to react in the presence of a catalyst. = 1H-NMR of the reaction mixture at a certain time (for example, 15 minutes, 30 minutes, 60 minutes) In the spectrum measurement, the reduction ratio of the peak area derived from the side of the carboxylic acid of the ester bond of the alkoxydecane compound represented by the formula (1) is confirmed, and the reaction is carried out, for example, AC (=〇). In the case of the ester bond of -0_B, A is the side of the ester bond derived from the carboxylic acid, and B is the side derived from the alcohol of the ester bond. By hydrolysis or solvolysis of the ester, 1H_NMR The peak area of a proton derived from A is reduced, and the reduction rate of the peak area derived from the side of the carboxylic acid indicates that the peak area of the proton derived from A is a proton that does not change during the reaction. How much is reduced in the benchmark. The reduction rate can be determined by comparison with the NMR of the raw material. For example, use When 20(:(Μ+(00)-〇_(ί:Η2)3_8Κ〇Μβ)3 is used as a raw material, Si CH2 appears in the vicinity of 〇6 ppm in the initial, ie, the elbow spectrum of the raw material. · The peak of the proton, and the peak of the proton of H2C=C<, near the 5 5 claws and 6. The peaks of the peaks are 2: 2, and the ratio is 1. Relative to the 'ester linkage' In a polyorganosiloxane which is formed by condensation of a carboxylic acid and an alcohol but the carboxylic acid moiety of the ester bond disappears, the carboxylic acid moiety of the ester bond, that is, the peak area of H2C=C< and the alcohol moiety of the ester bond is = The ratio of the peak area of Si-CH2- is reduced by 'the ratio of the peak areas is 1 or less, and the ratio of the disappearance of the carboxylic acid moiety of the ester bond can be calculated. As a specific example, when the polyorganosiloxane is not shown in Figure 159229.doc -18·201231509, the sum of the peak areas of the two H2C=C< is 1.997, and the peak area of the Si-CH2- When it is 2.885, it can be seen that the peak area ratio is 1.997 ·· 2.885, that is, 0.69, and the peak area of the ester bond derived from the carboxylic acid is reduced by 31°/〇 as compared with the initial ratio of the peak area ratio of the raw material. The carboxylic acid moiety of the ester bond disappeared 31 〇 /. . Among them, the ιΗ·ΝΜΚ spectrum system set the peak of CHCI3 to 7.24 ppm as a reference. By reducing the amount of catalyst, time, temperature, pressure in the reaction vessel, etc., it is possible to control the reduction of the peak area derived from the carboxylic acid of the ester bond of the alkoxydecane compound represented by the formula (1). For example, by increasing the amount of catalyst, extending the time, and increasing the temperature, the rate of decrease can be increased. As a specific example, the alkoxy decane represented by the formula (1) is an alkoxy decane having a methacrylate, and Ba(OH) 2 and H 2 fluorene are used as a catalyst, and a commonly used catalyst is used. When the concentration is a molar ratio of Oi to the total amount of Si, even if the reaction temperature is 5 Torr and the reaction time is 2 hours, the peak area of the ester bond derived from the carboxylic acid does not decrease, but By increasing the amount of catalyst to 〇3 Q mol / (> reacting, the peak area of the carboxylic acid-derived ester bond can be reduced by about 30/. Polyorganosiloxane. Thus, by changing The amount of catalyst, temperature, and reaction time can reduce the peak area of the ester bond derived from the carboxylic acid only by the amount required. In the polyfluorene reaction, the ester bond in the alkoxydecane compound represented by the formula 〇) The amount of disappearance is from 5 to 60%, preferably from 7 to 50%, more preferably 10 40/, based on the amount of the compound of the compound of the compound of the formula (1).胄佳 is 15~35%. The disappearance ratio is, for example, as described above, and the vinegar bond of the alkoxylate compound represented by the formula (1) is derived from the ratio of the peak area of the acid 159229.doc -19·201231509. The peak of the carboxylic acid moiety of the bond and the decrease in the polymerization reaction by the formula (1) are due to the alkoxy group and the alkoxydecane compound represented by the formula (3). The presence of the condensation of the decyl alcohol moiety of the decyl alcohol of the produced alcohol (methanol or ethanol), etc. 1 The trace amount of water and the catalyzed transesterification reaction of the following reaction formula are carried out, and the hydrolysis reaction of the bond is not carried out. 1] r12oh

-Si— 〇 χΎ1 + r12〇yr11 0 (6) ,RM為碳數〇〜15之有機 並且R12為甲基、乙基或 (式中’ X為碳數1〜15之有機基 基’ X與R11之碳數之和為1〜16, 氫)。 藉由自曰鍵之水解反應及酯交換 父換反應’源自羧酸之部位消 夭’源自醇之部位殘留。進而 ㈣4所生成之醇藉由與通 式⑴所表*之烧氧基我化合物之烧氧基及通式⑺所表 不之石夕燒醇化合物之核醇基之醇交換反應等而發生下述 式(7)所表示之交聯反應, [化2]-Si—〇χΎ1 + r12〇yr11 0 (6) , RM is an organic having a carbon number of 〇15 and R12 is a methyl group, an ethyl group or (wherein X is an organic group having a carbon number of 1 to 15' X and The sum of the carbon numbers of R11 is 1 to 16, hydrogen). The hydrolysis reaction by the hydrazone bond and the transesterification of the parent-reversed reaction 'depletion of the carboxylic acid-derived portion' are derived from the residue of the alcohol. Further, the alcohol produced by (4) 4 is produced by an alcohol exchange reaction with an alkoxy group of the alkoxy compound of the formula (1) and a nucleophilic group of the cerium alcohol compound represented by the formula (7). The cross-linking reaction represented by the formula (7), [Chemical 2]

X -0H I —έ卜 IX -0H I - έ卜 I

OR12 I —Si— IOR12 I —Si— I

I OSi— l / r —Si-X I I HOR12 (7) (式中’ X為碳數1〜15之有機基,較佳為碳數2〜1〇之有機 基’更佳為碳數3〜5之有機基’就耐熱性及耐龜裂性之觀 159229.doc -20- 201231509 點而言,最佳為碳數為3 ,並且Rl2為曱基、乙基或氣卜 即,3忍為藉由酯部位消失而生成之烷二醇或伸笨基醇 一部分或其全部與通式(1)所表示之烷氧基矽烷化合物、通 式(3)所表示之錢醇化合物或該等之至少—種縮合聚合物 進行交聯,而獲得聚有機矽氧烷(a)。 ° 藉由該交聯反應,可進行高分子量化。因此,可獲得具 有上述通式(2)所表示之結構之聚有機矽氧烷“)。藉由具 有上述通式(2)之結構,可發揮出耐溫度衝擊性優異之效 I於上述通式(2)中,X可於主鏈中具有芳香族基,進而 較佳為可經取代之院基、或料族基。具體而言,作為 -X-0- ’可列舉下述通式所表示之結構, [化3]I OSi - l / r - Si-X II HOR12 (7) (wherein X is an organic group having a carbon number of 1 to 15, preferably an organic group having a carbon number of 2 to 1 Å) more preferably a carbon number of 3~ 5 organic base 'in terms of heat resistance and crack resistance 159229.doc -20- 201231509 point, the best carbon number is 3, and Rl2 is sulfhydryl, ethyl or gas, ie, forbearance a part or all of the alkanediol or the stearyl alcohol which is formed by the disappearance of the ester moiety, and the alkoxydecane compound represented by the formula (1), the phenolic compound represented by the formula (3) or the like At least one type of condensation polymer is crosslinked to obtain a polyorganosiloxane (a). By the crosslinking reaction, high molecular weight can be obtained. Therefore, a structure represented by the above formula (2) can be obtained. By the structure of the above formula (2), it is excellent in temperature impact resistance. In the above formula (2), X can have an aromatic group in the main chain. The base is further preferably a substituted base or a base group. Specifically, as -X-0- ', a structure represented by the following formula can be cited, [Chemical 3]

• 一 (C Η2)「Ο• One (C Η 2) "Ο

—(CHs)—(CHs)

(CH2)n-〇— (8) (式中,1為1〜15 ’ 〜9 ’ 〇為〇〜9,並且n+m<9)。又就 耐光性之觀點而言較佳為烧基’就耐熱性之觀點而言,χ 之碳數較佳為2〜1〇,更佳為3〜5,最佳為3。 又’聚有機妙氧垸具有上述通式⑺所表示之結構可藉 由例如^-NMR及i3c_NMR譜測定而確認。 ^體而 σ 於使用 H2c=c(CH3)-(C=〇)-〇_(CH2)3-Si(OCH3)3 通式⑴所表示之烧氧基⑦烧化合物之情形時,上述通 弋()所示之、,Ό構成為EHCH2_CH2 CH2_Sb,於〗H 譜中’醋鍵未消失之H2C=C(CH3)_(C哪0 CH2-CH2_CH2_ 仏結構之下劃線部分的質子之波峰出現於3.9〜4.2 PPm, I59229.doc 201231509 相對於此,=Si-0-CH2-CH2-CH2-Si=結構之下劃線部分之 質子之波峰出現於3.4〜3.9 ppm附近。進而,於13C-NMR譜 中,H2C=C(CH3)-(C=0)-0-CH2-CH2-CH2-Sis結構之下劃線 部分之碳之波峰出現於66.5 ppm附近,相對於此,藉由上 述反應式(6)生成之HO-CH2-CH2-CH2-S^結構之下劃線部 分之碳之波峰出現於62.0 ppm附近,藉由上述反應式(7)生 成之ESi-0-CH2-CH2-CH2-SiE結構之下劃線部分之碳之波 峰出現於64.5卩卩111附近(其中,111"^^^11譜係將(:11(:13之波 峰對準7.24卩?111者,13(:"^]\«1譜係將€0(:13之中央之波峰 對準77.0 ppm者,13C-NMR譜測定係於NNE模式下之測 定;參照圖1及圖3)。 該等波峰可藉由二維下之NMR譜測定而鑑定。圖7為HH COSY(HH correlation spectroscopy,HH相關譜)譜,圖 8為 CH C0SY(CH correlation spectroscopy,CH相關譜)譜。通 常,於HH COSY中,處於鄰接關係之2個碳原子各自所鍵 結之氫原子之波峰表現出相關性,於CH COSY中,所鍵結 之碳原子與氫原子之波峰表現出相關性。 於圖7所示之HH COSY光譜中,得知3.4〜3.9 ppm之波峰 與1.0 ppm附近之波峰有關,進而1.0 ppm附近之波峰與〇·〇 ppm附近之波峰有關。又,根據圖8所示之CH COSY光 譜,得知13C_NMR中之64.5 ppm之波峰與1Η-NMR中之 3.4〜3·9 ppm之波峰有關。對該等進行綜合判斷,結果可鑑 定各波峰(於COSY中,1H NMR譜中之波峰之基準係將最 高磁場側之波峰修正為0 ppm,與實際之1H NMR譜相比, 159229.doc -22- 201231509 整體向南磁場側偏移〇·6 ppm左右)。 藉由上述鑑定,可算出上述通式(2)之結構之存在比 率。具體而言,於使用H2C = C(CH3Mc = 〇)〇(cH2^ SKOCH3)3作為通式⑴所表示之烷氧基矽烷化合物之情形 時獲得圖3所示之13C NMR譜時,H2C = c(CH3) (c=〇)_〇 CHrCHrCHrSb結構之下劃線部分碳之波峰面積為 0.853,HO-CH2-CH2-CH2-Sb結構之下劃線部分碳之波峰 面積為0.099,qi-O-CHrCHrCHrSb結構之下劃線部分 之碳之波峰面積為0.415,若以50 : 5〇添加上述通式(ι) = 表示之烷氧基矽烷化合物與上述通式(3)所表示之矽烷醇化 合物,則對於Ki-O-CiVCHrCHrSb結構,算出該聚合 物所具有之Si原子數中之30%形成上述通式(2)所表示之結 構之鍵。 又,即便不知道烷氧基矽烷化合物或矽烷醇化合物之添 加比之情形時,亦可藉由添加有内標之29Si NMR譜算出si 原子含量’藉由添加有内標之1H NMR譜算出醋結構之含 量,藉由 C NMR 譜(NNE Mode)、HH COS Y、及 CH COSY光谱鑑疋結構,及算asSi-〇-x_si5之含有率。 NMR譜係使用JNM-GSX400進行測定。1η NMR譜係於 400 MHz下測定,^cnmR譜係於1〇〇 MHz下測定。 就对龜裂性、操作之容易度、及光硬化性之觀點而言, 聚有機矽氧烷所具有之Si原子數中形成上述通式(2)所表示 之結構之鍵之比例較佳為5〜60%,更佳為7〜50%,進而較 佳為10〜40%,最佳為15〜35〇/〇。 159229.doc -23· 201231509 八作為維持聚有㈣找之交聯性官能基之#量並且提高 分子量之方法’亦可使用添加硼化合物之方法、或添加磷 化合物與過氧化物之方法。 又,藉㈣料會溶解”有_钱之溶劑對反應步 驟中所獲得之聚有機⑦氧垸進行清洗,可除去低分子體 (例如一聚物、三聚物'四聚物等)。於清洗步驟中,作為 不會a解聚有機;^氧燒之溶劑’可列舉水、醇(例如甲醇 或乙醇)、乙腈等。 作為清洗步驟,係向反應步驟中所獲得之聚有機石夕氧烧 中=加不會溶解聚有機⑦氧燒之溶劑,或將反應步驟中所 獲侍之聚有機矽氧烷添加於不會溶解聚有機矽氧烷之溶劑 中後進仃攪拌。於整體不均勻之狀態下繼續攪拌,其後 靜置:待分離為聚有機矽氧烷層與溶劑層後,可採集聚有 機♦氧烧層’或除去溶劑層,藉此進行清洗。 藉由'月洗步驟可減少殘留觸媒。就聚合物及樹脂組合物 呆存穩疋ϋ之觀點而言’樹脂組合物中之殘留觸媒量較 佳為 0· l~50〇 ppm。 <聚有機矽氧烷之高分子量化> +本發明之感光性樹脂組合物所使用之聚有㈣氧燒⑷係 藉由將上述通式⑴所表示之烧氧基⑦燒化合物、上述通式 (3),表7F之;^燒醇化合物及觸媒混合並使之聚合之方法而 獲付’且於凝膠渗透層析法(GPC)敎中標準聚苯乙稀換 算之重量平均分子量為1〇5〇以上之面積為以上。 分子量評價方法(GPC測定)如下所示。 159229.doc 24· 201231509 使用Tosoh製造之HLC-8020,使用示差折射率計(RI, Refractive Index)作為檢測器,管枉係使用將Tosoh股份有 限公司製造之 G5000HHR、G4000HHR、G3000HHR、 G2500HHR串接而成者,於40°C之條件下,將聚苯乙烯 (Tosoh製造之 TSK standard,分子量 1,090,000、706,000、 355,000、190,000、96,400、37,900、18,100、9,100、 5,970、2,630、1,056、500)作為標準聚苯乙烯製作校準曲 線’以 1 mL/min之流量’使用 THF(Tetrahydrofuran,四氮 呋喃)作為溶劑進行測定。 上述矽烷醇化合物、上述烷氧基矽烷化合物及觸媒、以 及反應條件等與上述相同。 高分子量化可藉由形成上述通式(2)所表示之結構而實 現。因此,為了控制分子量,而只要控制該上述通式(2)所 表不之結構、即上述反應式(6)及(7)所表示之反應即可。 該等反應可藉由改變反應溫度、反應時間、反應壓力、 觸媒量、觸媒之種類而控制。 <聚有機矽氧烷之製造方法> 聚有機石夕氧烧之(a)之製造方法依序包括如下步驟: i)將上述通式(1)所表示之至少一種烷氧基矽烷化合物、 及觸媒加以混合’於20C〜130C、較佳為3〇〜1〇〇〇c、更佳 為40〜8(TC之溫度下,於反應時間為〇.卜2〇小時、較佳為 0.2〜1〇小時、更佳為0_3〜5小時下使之反應,且一面將藉由 反應而生成之醇除去至體系外’一面生成聚有機矽氧烷(a) 之步驟’ η)利用不會溶解聚有機砂氣烷之溶劑對該聚有機 159229.doc -25- 201231509 矽氧烷(a)進行清洗之步驟。 亦可向反應體系令添加水, 中存在之貌氧基石夕燒化合 目對於反應體系 氧基1當量,較佳為。·〇】〜"當:之〜原子上所鍵結之炫 # , 44 , , ^ .畜量,更佳為0.05〜0.45當 量就藉由末端⑬氧基結構 而言,進而較佳為(M〜〇.4當量穩疋性及反應性之觀點 機錢炫⑷之製造方法依序包括如下步驟: 上=通式⑴所表示之至少"'種貌氧基錢化合物、 ,θ人_ 種夕烷醇化合物、及觸媒加以(CH2)n-〇—(8) (wherein 1 is 1 to 15 ′ to 9 ′ 〇 is 〇 ~9, and n+m<9). Further, from the viewpoint of light resistance, the base is preferably exemplified. From the viewpoint of heat resistance, the carbon number of ruthenium is preferably from 2 to 1 Torr, more preferably from 3 to 5, most preferably 3. Further, the structure represented by the above formula (7) can be confirmed by, for example, ^-NMR and i3c_NMR spectrum measurement. When the H2c=c(CH3)-(C=〇)-〇((CH2)3-Si(OCH3)3 is used in the case of the alkoxy 7-burning compound represented by the formula (1), the above-mentioned overnight (), Ό is formed as EHCH2_CH2 CH2_Sb, in the H spectrum, the vinegar bond does not disappear H2C=C(CH3)_(C where 0 CH2-CH2_CH2_ 仏 structure under the proton peak appears in 3.9 ~4.2 PPm, I59229.doc 201231509 In contrast, the peak of protons in the underlined portion of the structure ==0-0-CH2-CH2-CH2-Si= appears in the vicinity of 3.4 to 3.9 ppm. Further, in the 13C-NMR spectrum, The carbon peak of the underlined portion of the H2C=C(CH3)-(C=0)-0-CH2-CH2-CH2-Sis structure appears near 66.5 ppm, whereas the above reaction formula (6) is generated. The carbon peak of the underlined portion of the HO-CH2-CH2-CH2-S^ structure appears near 62.0 ppm, and the underlined portion of the ESi-0-CH2-CH2-CH2-SiE structure formed by the above reaction formula (7) The peak of carbon appears near 64.5卩卩111 (where the 111"^^^11 pedigree will be (:11 (the peak of 13 is aligned with 7.24卩?111, 13(:"^]\«1 pedigree will be € 0 (: 13 center of the peak is aligned with 77.0 ppm The 13C-NMR spectrum was determined in the NNE mode; see Fig. 1 and Fig. 3). The peaks can be identified by two-dimensional NMR spectrum measurement. Figure 7 is HH COSY (HH correlation spectroscopy, HH correlation spectrum). Spectra, Fig. 8 is a CH C0SY (CH correlation spectroscopy) spectrum. Generally, in HH COSY, the peaks of the hydrogen atoms bonded to each of the two carbon atoms in abutting relationship show correlation, in CH In COSY, the carbon atoms of the bonded carbon and the peak of the hydrogen atom show a correlation. In the HH COSY spectrum shown in Fig. 7, it is found that the peak of 3.4 to 3.9 ppm is related to the peak near 1.0 ppm, and further to around 1.0 ppm. The peak is related to the peak near 〇·〇ppm. Further, according to the CH COSY spectrum shown in Fig. 8, it is found that the peak of 64.5 ppm in 13C_NMR is related to the peak of 3.4~3·9 ppm in 1Η-NMR. These comprehensive judgments can be used to identify each peak (in COSY, the reference of the peak in the 1H NMR spectrum corrects the peak on the highest magnetic field side to 0 ppm, compared with the actual 1H NMR spectrum, 159229.doc -22 - 201231509 The overall southward magnetic field side is offset by 〇·6 ppm . By the above identification, the existence ratio of the structure of the above formula (2) can be calculated. Specifically, when H2C=C(CH3Mc=〇)〇(cH2^SKOCH3)3 is used as the alkoxydecane compound represented by the general formula (1), the 13C NMR spectrum shown in Fig. 3 is obtained, H2C = c (CH3) (c=〇)_〇CHrCHrCHrSb structure under the underlined part of the carbon peak area is 0.853, the HO-CH2-CH2-CH2-Sb structure under the underlined part of the carbon peak area is 0.099, under the qi-O-CHrCHrCHrSb structure underline The partial carbon peak area is 0.415. If the alkoxydecane compound represented by the above formula (I) = is substituted with the stanol compound represented by the above formula (3) at 50:5, for Ki-O- In the CiVCHrCHrSb structure, 30% of the Si atoms in the polymer are calculated to form a bond of the structure represented by the above formula (2). Further, even if the addition ratio of the alkoxydecane compound or the stanol compound is not known, the si atom content can be calculated by adding the internal standard 29Si NMR spectrum to calculate the vinegar by adding the internal standard 1H NMR spectrum. The content of the structure is determined by C NMR spectrum (NNE Mode), HH COS Y, and CH COSY spectrum, and the content of asSi-〇-x_si5 is calculated. The NMR spectrum was measured using JNM-GSX400. The 1 η NMR spectrum was measured at 400 MHz, and the ^cnmR line was measured at 1 〇〇 MHz. The ratio of the bond forming the structure represented by the above formula (2) in the number of Si atoms of the polyorganosiloxane is preferably from the viewpoints of the cracking property, the ease of handling, and the photocurability. 5 to 60%, more preferably 7 to 50%, further preferably 10 to 40%, most preferably 15 to 35 Å/〇. 159229.doc -23· 201231509 VIII As a method of maintaining the amount of the crosslinkable functional group (and finding the molecular weight) and increasing the molecular weight, a method of adding a boron compound or a method of adding a phosphorus compound and a peroxide may be used. Further, the (tetra) material is dissolved, and the polyorgano 7 oxonium obtained in the reaction step is washed by a solvent having a solvent to remove low molecular weight (for example, a polymer, a trimer 'tetramer, etc.). In the washing step, as the solvent which does not depolymerize the organic solvent, water is used, and alcohol (for example, methanol or ethanol), acetonitrile, etc., as a washing step, is a polyorganismite obtained in the reaction step. Burning = adding solvent that does not dissolve the polyorgano 7 oxygen, or adding the polyorganosiloxane obtained in the reaction step to the solvent which does not dissolve the polyorganosiloxane, and then stirring the mixture. Stirring is continued in the state, and then left to stand: after being separated into a polyorganosiloxane layer and a solvent layer, a polyorgano-oxygen-fired layer can be collected or the solvent layer can be removed, thereby performing cleaning. The residual catalyst can be reduced. The amount of residual catalyst in the resin composition is preferably from 0. l to 50 〇 ppm from the viewpoint of the stability of the polymer and the resin composition. <Polyorganooxane High molecular weight > + photosensitive resin composition of the present invention (4) Oxygen-fired (4) is obtained by mixing and agitating the alkoxy 7-burning compound represented by the above formula (1), the above-mentioned formula (3), and the catalyst of the above-mentioned formula (3), and the catalyst. In the gel permeation chromatography (GPC), the weight average molecular weight in terms of standard polystyrene is 1〇5〇 or more, and the area is more than or equal to the above. The molecular weight evaluation method (GPC measurement) is as follows. 159229.doc 24· 201231509 Using HLC-8020 manufactured by Tosoh, using a differential refractometer (RI, Refractive Index) as a detector, the tube system is connected by G5000HHR, G4000HHR, G3000HHR, G2500HHR manufactured by Tosoh Co., Ltd. In the case of 40 ° C, polystyrene (TSK standard manufactured by Tosoh, molecular weight 1,090,000, 706,000, 355,000, 190,000, 96,400, 37,900, 18,100, 9,100, 5,970, 2,630, 1 , 056, 500) As a standard polystyrene, a calibration curve 'measured at a flow rate of 1 mL/min' using THF (Tetrahydrofuran, tetranitrofuran) as a solvent. The above stanol compound, the above alkoxydecane compound The catalyst, the reaction conditions, and the like are the same as described above. The polymerization can be achieved by forming the structure represented by the above formula (2). Therefore, in order to control the molecular weight, it is only necessary to control the above formula (2). The structure represented by the above reaction formulas (6) and (7) may be omitted. The reactions may be controlled by changing the reaction temperature, the reaction time, the reaction pressure, the amount of the catalyst, and the type of the catalyst. <Production Method of Polyorganooxane> The method for producing (a) of the polyorgano oxysulfide comprises the following steps: i) at least one alkoxydecane compound represented by the above formula (1) And the catalyst is mixed 'in 20C~130C, preferably 3〇~1〇〇〇c, more preferably 40~8 (at the temperature of TC, the reaction time is 〇. 2 2 hours, preferably 0.2 to 1 hour, more preferably 0 to 3 to 5 hours, and the alcohol formed by the reaction is removed to the outside of the system. The step of producing a polyorganosiloxane (a) is performed. The step of washing the polyorganic 159229.doc -25- 201231509 oxane (a) by dissolving the solvent of the polyorganic sand olefin. It is also possible to add water to the reaction system, and it is preferred to have an oxygenate in the reaction system. ·〇]~"When: ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ M~〇.4 equivalent stability and reactivity. The manufacturing method of Qianxuan (4) includes the following steps in sequence: upper = at least "' morphological oxygen compound represented by general formula (1), θ human _ a compound of a stanol, and a catalyst

二二於心〜13°°c、較佳為心㈣、更佳為4。書C =下,於反應時間為小時、較佳為〇2〜1〇小 ^更佳為〇·3〜5小時下使之反應,且一面將藉由反應而 成之醇除去至體系外’一面生成聚有機石夕氧烧⑷之步 驟, )'i用不會a解聚有機♦氧燒之溶劑對該聚有機石夕氧烧 (a)進行清洗之步驟。 聚有機石夕氧烧⑷之製造方法較佳為於上述生成步驟i) 中藉由於30〜80C之溫度下進行減壓而除去醇。即聚 有機石夕氧炫⑷之製造方法之特徵在於:一面在反應溫度為 所生成之醇之彿點以上時於常壓下,在反應溫度為彿點以 下時於減壓下’將所生成之醇排出至體系外,一面使之反 應。藉此’結果反應器中之醇量減少,反應之控制性提高 (即’酯切斷變緩而變得容易控制)。 作為聚合過程中所使用之觸媒,可使用促進矽烷醇化合 159229.doc •26· 201231509 物之矽烷醇基與烷氧基矽烷化合物之烷氧基之脫醇縮合反 應且於聚合過程中進行酯水解反應或酯交換反應的化合 物。可為酸性化合物亦可為驗性化合物,可列舉:金屬院 氧化物、無機酸、有機酸、無機鹼、有機鹼、磷腈化合物 等。其中,較佳為鹼金屬氫氧化物或鹼土金屬氫氧化物、 銨化合物等’作為具體例,可列舉:Ba(OH)2、Ca(OH)2、22 is in the heart ~ 13 ° ° c, preferably in the heart (four), more preferably 4. Book C = lower, the reaction time is hour, preferably 〇 2~1 〇 small ^ more preferably 〇 · 3 ~ 5 hours to react, and one side of the alcohol formed by the reaction is removed to the outside of the system' The step of producing a polyorganismite (4) is carried out, and the step of washing the polyorganusite (a) with a solvent which does not depolymerize the organic ♦ oxygen is formed. In the production method of the polyorganismite (4), it is preferred to remove the alcohol by performing a pressure reduction at a temperature of 30 to 80 C in the above production step i). That is, the method for producing polyorganisms (4) is characterized in that, when the reaction temperature is above the point of the generated alcohol, it is generated under normal pressure at a normal temperature and under a reduced pressure when the reaction temperature is below the point of the Buddha. The alcohol is discharged to the outside of the system and allowed to react. As a result, the amount of alcohol in the reactor is reduced, and the controllability of the reaction is improved (i.e., the ester cut becomes slow and becomes easy to control). As a catalyst used in the polymerization process, a dealcoholization condensation reaction for alkoxy groups of a decyl alcohol group and an alkoxydecane compound which promotes decyl alcohol compound 159229.doc •26·201231509 can be used and esterification is carried out during the polymerization. A compound of a hydrolysis reaction or a transesterification reaction. The acidic compound or the test compound may be mentioned, and examples thereof include a metal oxide, an inorganic acid, an organic acid, an inorganic base, an organic base, and a phosphazene compound. Among them, an alkali metal hydroxide or an alkaline earth metal hydroxide, an ammonium compound or the like is preferable. As a specific example, Ba(OH) 2 and Ca(OH) 2 may be mentioned.

Mg(OH)2、KOH、LiOH、NH3、NH4OH、NR4(OH)、 NR4C1、NR4Br、NR4I 等。於 NR4(〇H)、NR4CM、NR4Br及 NRd中’ R為可具有取代基之碳數卜1〇之脂肪族基、脂環 式基或芳香族基。可更佳地列舉鹼金屬氫氧化物、鹼土金 屬氫氧化物等。進而較佳為觸媒為鹼土金屬氫氧化物,作 為具體例,可列舉:Ba(0H)2、Ca(〇H)2、Mg(〇H)2 等。 又,亦可使用Ba(OH)2、Ca(OH)2、Mg(OH)2之水合物,就 穩定性、及可縮短反應時間,且可藉由縮短不均勻狀態下 之反應時間而再現性良好地進行反應之觀點而言,更佳為 使用 Ba(0H)2.8H20。 觸媒之添加量較佳為觸媒#中所含之水合水等之水_ 應、或較換反應適當進行之濃度,例如相料添加砂 子莫耳數為G.05〜30莫耳%,就透明性及反應控制性之_ 而言’較佳為(M〜2〇莫耳%,更㈣Q1〜iq莫耳%佳 〇.2〜1〇莫耳%。所謂添加Si原子數,係指通式⑴所表^ 烧氧基㈣化合物與通式(3)所表^之料醇化合物 在於反應體系中之其他可縮合之錢化合物之 ^ 莫耳數’所謂觸媒量之莫耳%’表示相對於邮原子= 159229.doc -27· 201231509 數添加多少莫耳觸媒。 於反應過程t或乾燥過程㈣媒析出之情形時,較佳為 溶解所獲得之聚有機石夕氧貌且不會溶解觸媒之溶剤,例如 於=媒為Ba(0H)2等驗金屬氳氧化物、驗土金屬氨氧化物 之月形時’可藉由利用環己烷及口等僅溶解聚有機矽氧 烧⑷,繼而進行過據而將觸媒除去。於此情形時,所添加 之溶劑於減廢及加熱條件下緩慢地除去後,進行乾燥 燥p時之溫度為抓〜13Gt、較佳為贼〜13代,㈣為^ a以下、較佳為15 hPa以下,並且乾燥時間為1()分鐘以 上、較佳為30分鐘以上、更佳為!小時。 藉由利用不會溶解聚有機矽氧烷之溶劑對所獲 燒⑷進行清洗’可減少低分子量體。作為溶劑,如 上述亦說明般,根據所生成之聚有财氧院⑷之 可使用甲醇、乙醇、乙腈'二甲亞颯'水等。 ’ 由於根據所使用之溶劑,低分子量體之溶解性不同 洗之次數,可進行複數次直至除去所需 分子量體為止。 里心低 氧r(a);體Μ方法,如上述亦說明般’藉由於聚有機矽 行中添加溶劑,或於溶劑中添加聚有機錢燒⑷進 而使低分子量體溶解於溶劑中,進行必要 Si4靜置’藉此使聚合物層與溶劑層分離。其後:二Mg(OH)2, KOH, LiOH, NH3, NH4OH, NR4(OH), NR4C1, NR4Br, NR4I, and the like. In NR4 (〇H), NR4CM, NR4Br and NRd, 'R is an aliphatic group, an alicyclic group or an aromatic group which may have a carbon number of a substituent. More preferably, it is an alkali metal hydroxide, an alkaline earth metal hydroxide or the like. Further, the catalyst is preferably an alkaline earth metal hydroxide, and specific examples thereof include Ba(0H)2, Ca(〇H)2, and Mg(〇H)2. Further, it is also possible to use a hydrate of Ba(OH)2, Ca(OH)2, and Mg(OH)2 for stability and shortening of reaction time, and can be reproduced by shortening the reaction time in an uneven state. From the viewpoint of performing the reaction well, Ba(0H)2.8H20 is more preferably used. The amount of the catalyst added is preferably the concentration of water such as hydration water contained in the catalyst #, or the concentration of the replacement reaction, for example, the molar amount of the added sand of the phase material is G.05 to 30 mol%. In terms of transparency and reaction controllability, it is preferably (M~2〇% by mole, more (4) Q1~iq% by mole%. 2~1〇% by mole. The so-called addition of Si atom number means The compound of the formula (1) and the alcohol compound of the formula (3) are in the reaction system, and the other moles of the condensable money compound are the number of moles of the so-called catalyst amount. Indicates how much molar catalyst is added relative to the mail atom = 159229.doc -27· 201231509. In the case of the reaction process t or the drying process (4), it is preferred to dissolve the obtained polyorganisms and not It dissolves the solvent of the catalyst, for example, when the medium is a metal oxide such as Ba(0H)2 or the shape of the metal oxide of the earth metal, it can be dissolved only by using cyclohexane and a port. The oxygen is burned (4), and then the catalyst is removed. In this case, the added solvent is slowly reduced under reduced waste and heating conditions. After the drying, the temperature is about 13 Gt, preferably thief to 13 generations, (4) is less than ^ a, preferably 15 hPa or less, and the drying time is 1 () minutes or more, preferably 30. More than a minute, more preferably! hours. The low molecular weight body can be reduced by washing the obtained fire (4) with a solvent which does not dissolve the polyorganosiloxane. As a solvent, as described above, according to the generated aggregate For example, methanol, ethanol, acetonitrile, dimethyl hydrazine, water, etc. can be used. [Because the solubility of the low molecular weight body varies depending on the solvent used, it can be repeated several times until the desired molecular weight is removed. The body is low-oxygen r(a); the body enthalpy method, as described above, is also described by adding a solvent to the polyorgano hydrazine or adding a polyorganic acid to the solvent (4) to dissolve the low molecular weight body in the solvent. In the middle, the necessary Si4 is allowed to stand 'by separating the polymer layer from the solvent layer. Thereafter: two

Si子:回收聚有機樣⑷層,藉此可單獨分離;: 了低刀子量體之聚有機矽氧烷(a)。 於減壓及加熱條件下除去溶劑後,對單獨分離後之聚有 159229.doc -28 · 201231509 機石夕氧烧(a)進行乾燥,藉此可獲得減少了低分子量體之聚 有機矽氧烷(a)。 <感光性樹脂組合物中所含之光聚合起始劑> 作為本發明之感光性樹脂組合物所使用之光聚合起始劑 (b)中之較佳者,可列舉如下化合物。 (1) 二苯甲酮衍生物:例如二苯甲酮、鄰苯甲醯苯曱酸 甲醋、4-苯曱醯基-4,-甲基二苯基酮、二苄基酮、苐酮 (2) 苯乙酮衍生物:例如2,2,_二乙氧基苯乙酮、2_羥基_ 2-曱基苯丙酮、2,2-二甲氧基_ι,2·二苯基乙烷-1-酮(CibaSi sub: The polyorganic (4) layer is recovered, whereby it can be separated separately; the polyorganosiloxane (a) with a low knife weight. After the solvent is removed under reduced pressure and heating, the 159229.doc -28 · 201231509 machine gas (o) is separately dried after separation, thereby obtaining a polyorganosiloxane having a reduced molecular weight. Alkane (a). <Photopolymerization initiator contained in the photosensitive resin composition> The photopolymerization initiator (b) used in the photosensitive resin composition of the present invention is preferably the following compound. (1) Benzophenone derivatives: for example, benzophenone, phthalic acid methyl ketone, 4-phenylhydrazine-4,-methyldiphenyl ketone, dibenzyl ketone, anthrone (2) Acetophenone derivatives: for example, 2,2,-diethoxyacetophenone, 2-hydroxy-2-nonylpropiophenone, 2,2-dimethoxy-ι, 2·diphenyl Ethane-1-one (Ciba

Specialty Chemicals公司製造,IRGACURE 6M)、1-羥基 環己基苯基酮(Ciba Specialty Chemicals公司製造, IRGACURE 184)、2-曱基444-(甲硫基)苯基]-2-嗎啉基丙 烧-1-酮(Ciba Specialty Chemicals公司製造 ’ IRGACURE 907)、2-經基-l-{4-[4_(2-羥基-2-曱基丙醯基)节基]苯基}-2-曱基丙烧-1·酮(Ciba Specialty Chemicals 公司製造, IRGACURE 127)、苯基乙醛酸甲酯 (3) 。塞嘲酮衍生物:例如噻噸酮、2_曱基噻噸酮、2_異丙 基噻噸酮、二乙基噻噸嗣 (4) 苯偶酿衍生物:例如苯偶醯、苯偶醯二甲基縮酮、 本偶酿-β -甲氧基乙基縮駿 (5) 安息香衍生物:例如安息香、安息香甲醚、2_羥基_ 2 甲基 1本基丙烧_1__ (dba Specialty Chemicals公司製 造,DAROCURE1173) (6) 肟系化合物:例如κ笨基-丁二酮_2_(〇_甲氧基羰 159229.doc -29- 201231509 基)肟、1-苯基-1,2-丙二酮-2-(0-甲氧基羰基)肟、;ι_苯基_ 1,2-丙二酮-2-(0-乙氧基羰基)肟、1_苯基-丨,2-丙二酮_2-(〇-苯曱醯基)肟、二苯基丙三酮-2-(0-乙氧基羰基)肟、1-苯基-3-乙氧基丙三酮-2·(0-苯曱醯基)肟、1_[4-(苯硫基)-1,2-辛二酮 2-(0-苯甲酿基躬*)](Ciba Specialty Chemicals 公 司製造’ IRGACURE OXEOl)、l-[9-乙基-6-(2-甲基苯甲醯 基)-9H-咔唑-3-基]乙酮 l-(〇-乙醯肟)(ciba Specialty Chemicals公司製造,IRGACURE OXE02) (7) α-羥基酮系化合物:例如2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]·2·羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-{4-[4·(2-羥基-2-甲基丙醯基)苄基]苯基卜2- 曱基丙烷 (8) α-胺烷基苯酮系化合物:例如2-苄基_2_二甲基胺基-1-(4-嗎啉基苯基)-丁酮-l(Ciba Specialty Chemicals公司製 造,IRGACURE 3 69)、2-二甲基胺基-2-(4-曱基苄基)-1-(4-嗎啉-4-基笨基)丁烷-1-酮(Ciba Specialty Chemicals公司製 造,IRGACURE 379) (9) 氧化膦系化合物:例如雙(2,4,6-三曱基苯曱醯基)苯 基氧化膦(Ciba Specialty Chemicals公司製造,IRGACURE 819)、雙(2,6-二曱氧基苯甲醯基)_2,4,4_三曱基-戊基氧化 膦、2,4,6-三曱基苯曱醯基_二苯基_氧化膦(BASF公司製 造,Lucirin(註冊商標),TPO) (ίο)二茂鈦化合物:例如雙(115_2,4_環戊二烯-丨-基卜雙 (2,6 一 氣-3-( 1 比洛-1 _基)苯基)鈦(ciba Specialty Chemicals 159229.doc *30· 201231509 公司製造,IRGACURE 784) 又,於使用該等光聚合起始劑(b)時,可單獨使用,亦 可使用2種以上之混合物。 於上述光聚合起始劑(b)中,尤其就感光度、透明性方 面而言’更佳為(5)之安息香衍生物或(9)之氧化膦系化合 物。其添加量相對於聚有機矽氧烷(a) 1〇〇質量份為 0.01〜30質量份,較佳為〇1〜5質量份,更佳為質量 份,進而較佳為0.3〜1質量份。就獲得實用性之硬化圖案 之觀點而言,光聚合起始劑(b)之添加量為〇〇1質量份以 上,又,就透明性之觀點而言,為3〇質量份以下。 〈感光性樹脂組合物中所含之乙婦性不飽和加成聚合性 單體&gt; 進而,本發明之感光性樹脂組合物較佳為含有乙烯性不 飽和加成聚合性單體⑷(以下,亦稱為「單體」)。作為於 感光性樹脂組合物中所添加之單體,就提高耐龜裂性、耐 熱性及硬度之觀點而言,可使用含有丙烯醯基、或甲基 丙烯醯基之化合物。 以下揭示可使用之單體之具體例。 -作為提高4龜裂性之單體,可列舉:下述通式(9)所表 示之具有聚烷基醚鏈或低聚烷基醚鏈之單體, H2C C(R)-(c = 〇)_〇_(P〇)mi_(E〇n=〇)_c(R)=cH2 (9) (式中’ R為氫或甲基,PO為環氧丙烷基,E〇為環氧乙烷 基,W為未達30之數,n,為未達3〇之數於存在p〇及£〇之 兩者之itn可以無規方式存在亦可以嵌段方式存在, 159229.doc -31 - 201231509 m'+n'為未達6〇之數}。 例如作為單體,可列裹. 〇〇 』芈.聚乙二醇二丙烯酸酯[乙二酵 早元之數為2~20〗、聚;^ 一醇二甲基丙婦酸脂[乙二酵單元 之數為2〜20]、聚(1,2·丙二醇)二丙烯酸师,2_丙二醇單元 數為2〜2〇]、及聚(1,2_丙二醇)二甲基丙烯酸脂[1,2-丙二醇 單元數為2〜20]。 作為提高耐熱性之單體,較佳為具有脂環式基之化合 物例如下述通式(10)所表示之具有脂環式基之單體、及 如下述通式(12)所表示之含有多環式結構之單體, C(R) (C-O)-O-Y -X'-Y2-〇-(c=〇)-C(R)=CH2 (10) {式中’ R為氫或甲基,γ\γ2為含有環氧乙烷基及/或環 氧丙烷基之碳數卜卯之有機基,並且X,為下述通式(U)所 表不之具有環己基之取代基} [化4] χ,= 〇—οκ&gt; [化5] rManufactured by Specialty Chemicals, IRGACURE 6M), 1-hydroxycyclohexyl phenyl ketone (manufactured by Ciba Specialty Chemicals, IRGACURE 184), 2-mercapto 444-(methylthio)phenyl]-2-morpholinylpropane 1-one (manufactured by Ciba Specialty Chemicals, 'IGGACURE 907), 2-carbyl-l-{4-[4-(2-hydroxy-2-mercaptopropyl)phenyl]-2-} Acetylene-1 Ketone (manufactured by Ciba Specialty Chemicals, IRGACURE 127), methyl phenylglyoxylate (3). Sebutone derivatives: for example, thioxanthone, 2-mercaptothioxanthone, 2-isopropylthioxanthone, diethylthioxanthene (4) benzoin derivative: for example, benzoin, benzo醯 dimethyl ketal, benzo-β-methoxyethyl benzoin (5) benzoin derivatives: such as benzoin, benzoin methyl ether, 2_hydroxy _ 2 methyl 1 base propyl _1__ (dba Manufactured by Specialty Chemicals, DAROCURE 1173) (6) Lanthanide compounds: for example, κ phenyl-butanedione 2 _(〇_methoxycarbonyl 159229.doc -29- 201231509 肟), 1-phenyl-1,2 -propanedione-2-(0-methoxycarbonyl)indole, iota-phenyl-1,2-propanedione-2-(0-ethoxycarbonyl)anthracene, 1-phenyl-anthracene, 2-propanedione_2-(〇-phenylhydrazinyl)anthracene, diphenylpropanetrione-2-(0-ethoxycarbonyl)anthracene, 1-phenyl-3-ethoxypropanetrione -2·(0-phenylhydrazinyl)anthracene, 1_[4-(phenylthio)-1,2-octanedione 2-(0-benzylidene fluorene*)] (manufactured by Ciba Specialty Chemicals) IRGACURE OXEOl), l-[9-ethyl-6-(2-methylbenzhydryl)-9H-indazol-3-yl]ethanone l-(〇-acetamidine) (ciba Specialty Chemicals Manufacture, IRGACURE OXE02) (7 Α-hydroxyketone-based compound: for example, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]·2·hydroxy-2 -methyl-1-propan-1-one, 2-hydroxy-1-{4-[4.(2-hydroxy-2-methylpropenyl)benzyl]phenyl b-2-mercaptopropane (8 An α-aminoalkylphenone compound: for example, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butanone-1 (manufactured by Ciba Specialty Chemicals, IRGACURE 3) 69), 2-Dimethylamino-2-(4-mercaptobenzyl)-1-(4-morpholin-4-ylphenyl)butan-1-one (manufactured by Ciba Specialty Chemicals, IRGACURE) 379) (9) A phosphine oxide-based compound: for example, bis(2,4,6-trimercaptophenyl) phenylphosphine oxide (manufactured by Ciba Specialty Chemicals, Inc., IRGACURE 819), bis(2,6-dioxin) Oxybenzhydryl)_2,4,4-tridecyl-pentylphosphine oxide, 2,4,6-trimercaptophenylenyl-diphenyl-phosphine oxide (manufactured by BASF, Lucirin (registered) Trademark), TPO) (ίο) Titanocene compound: for example, bis(115_2,4_cyclopentadiene-indole- bis-bis(2,6-a-gas-3-(1)-l-l-yl)phenyl) Titanium (ciba Specialty Chemicals 159229.doc * 30. 201231509, manufactured by the company, IRGACURE 784) When these photopolymerization initiators (b) are used, they may be used singly or in combination of two or more. In the above photopolymerization initiator (b), the benzoin derivative of (5) or the phosphine oxide compound of (9) is more preferable in terms of sensitivity and transparency. The amount thereof is 0.01 to 30 parts by mass, preferably 1 to 5 parts by mass, more preferably parts by mass, more preferably 0.3 to 1 part by mass, per part by mass of the polyorganosiloxane (a). . The amount of the photopolymerization initiator (b) to be added is 〇〇1 part by mass or more, and from the viewpoint of transparency, it is 3 parts by mass or less from the viewpoint of obtaining a practical hardening pattern. <Equivalent-saturated addition polymerizable monomer contained in the photosensitive resin composition> Further, the photosensitive resin composition of the present invention preferably contains an ethylenically unsaturated addition polymerizable monomer (4) (hereinafter) , also known as "single". As the monomer to be added to the photosensitive resin composition, a compound containing an acrylonitrile group or a methyl methacrylate group can be used from the viewpoint of improving crack resistance, heat resistance and hardness. Specific examples of the monomers that can be used are disclosed below. - A monomer having a polyalkyl ether chain or an oligomeric alkyl ether chain represented by the following formula (9), which is a monomer which increases the cracking property of 4, H2C C(R)-(c = 〇)_〇_(P〇)mi_(E〇n=〇)_c(R)=cH2 (9) (wherein R is hydrogen or methyl, PO is propylene oxide, and E is epoxy B Alkyl group, W is less than 30, n is less than 3 于 in the presence of both p〇 and 〇, and it can exist in a random manner or in a block manner, 159229.doc -31 - 201231509 m'+n' is less than 6〇}. For example, as a monomer, it can be listed. 〇〇』芈. Polyethylene glycol diacrylate [Ethylene glycol is 2~20] Poly(1) dimethyl dimethyl acrylate (the number of ethylene glycol units is 2 to 20), poly (1,2 propylene glycol) di acrylate, 2 propylene glycol units 2 to 2 〇], and Poly(1,2-propylene glycol) dimethacrylate [1,2-propanediol unit number is 2 to 20]. As the monomer for improving heat resistance, a compound having an alicyclic group is preferable, for example, the following formula (10) The monomer having an alicyclic group and the polycyclic ring represented by the following formula (12) Monomer, C(R)(CO)-OY -X'-Y2-〇-(c=〇)-C(R)=CH2 (10) {wherein R is hydrogen or methyl, γ\ Γ2 is an organic group containing a carbon number of an oxiranyl group and/or an oxypropylene group, and X is a substituent having a cyclohexyl group represented by the following formula (U)} χ,= 〇—οκ&gt; [化5] r

(12) 《式中,γ及x&quot;為氫、或包含烷基、環氧乙烷基或環氧丙 烷基之有機基,且Y,及X,,之至少一個為丙烯醯氧基、甲基 丙烯醯氧基、丙烯醯氧基曱基或甲基丙烯醯氧基甲基}。 作為上述通式(10)及(12)所表示之單體,例如可列舉: 一丙烯酸1,4-環己二酯、二甲基丙烯酸14•環己二脂、乙 159229.doc -32- 201231509 氧基化(氫化雙酚A)二丙烯酸酯[乙二醇單元之數為2〜3〇]、 乙氧基化(氫化雙酚A)二甲基丙烯酸脂[乙二醇單元之數為 2〜30]、三環癸烷二甲醇二甲基丙烯酸脂、三環癸烷二甲 醇二丙烯酸酯、丙烯酸二環戊酯、丙烯酸二環戊稀氧基乙 酯、丙烯酸二環戊烯酯、曱基丙烯酸二環戊酯、及甲基丙 • 烯酸二環戊烯氧基乙酯等。 作為提高折射率之單體,可列舉下述通式(13)所示之具 有苯環之單體, f% H2c=c(R)-(c=〇).〇.YLX....Y2.〇.(c=〇)_C(R)=CH2 {式中,R為氫或甲基,Y〗&amp;Y2為含有環氧乙烷基及/或環 氧丙烷基之碳數1〜90之有機基,並且χ&quot;,表示下述通式(1句 所表示之具有芳香族基之取代基} [化6] X·&quot;(12) In the formula, γ and x&quot; are hydrogen, or an organic group containing an alkyl group, an oxiranyl group or an propylene oxide group, and at least one of Y, and X, is an acryloxy group, A Alkyl oxime oxy, propylene oxime oxime or methacryloxymethyl}. Examples of the monomer represented by the above formulas (10) and (12) include 1,4-cyclohexanedicarboxylate, 14-cyclohexanedicarboxylate, and 159229.doc-32- 201231509 Oxylated (hydrogenated bisphenol A) diacrylate [ethylene glycol unit number is 2~3〇], ethoxylated (hydrogenated bisphenol A) dimethacrylate [the number of ethylene glycol units is 2~30], tricyclodecane dimethanol dimethacrylate, tricyclodecane dimethanol diacrylate, dicyclopentanyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, Dicyclopentyl methacrylate, and dicyclopentenyloxyethyl methacrylate. Examples of the monomer for increasing the refractive index include a monomer having a benzene ring represented by the following formula (13), and f% H2c=c(R)-(c=〇).〇.YLX....Y2 〇.(c=〇)_C(R)=CH2 {wherein R is hydrogen or methyl, Y is &amp; Y2 is a carbon number 1 to 90 containing an oxiranyl group and/or an oxypropylene group The organic group, and χ&quot;, represents a general formula (a substituent having an aromatic group represented by one sentence) [Chemical 6] X·&quot;

(14)(14)

作為上述通式⑼所表示之單體,例如可列舉:雙紛A 二縮水甘油醚-丙烯酸加成物、雙酚A二縮水甘油醚-甲基 丙烯酸加成物、乙氧基化㈣丙歸酸㈣乙二醇單元二 數為2骨乙氧基化雙盼八二甲基丙稀酸脂[乙 元 之數為2〜30]。 作為提高硬度及感光性之單體,可料下料式(15)所 不之具有3個以上丙烯酿基或甲基丙_基之單體, (H2C=C(R)-(C=〇)-〇-Y)n_x …丨(15) 159229.doc -33- 201231509 {式中,R為氫或甲基,γ為含有環氧乙烷基及/或環氧丙烷 基之碳數1〜90之有機基,X&quot;&quot;為碳數1〜6之η價有機基,並 且η為3或4}。 作為上述通式(15)所表示之單體,例如可列舉:季戊四 醇三丙浠酸酯、季戊四醇四丙烯酸酯、三羥曱基丙烷三丙 烯酸醋、乙氧基化三㈣基丙烧三丙稀酸[乙二醇單元 數為2 20]—备甲基丙烧三甲基丙烯酸醋、三(2_經基 乙基)異氰尿酸三丙烯酸酯、三(2_羥基乙基)異氰尿酸三甲 基丙烯酸酯、二(三羥曱基丙烷)三丙烯酸酯、二(三羥甲基 丙院)四丙烯I自日、二季戊四醇五丙稀酸醋、二季戊四醇 六丙稀酸醋等。又,於使用上述所列舉之單體時,視需要 可單獨使用,亦可混合使用2種以上。 就耐龜裂性、耐熱性、折射率、黏度(操作性)之觀點 吕,更佳為使用具有脂環式基之單體4為具有脂環式』 之单體之具體例,可列舉:三環錢二甲醇二甲基丙烯8 脂、、三環錢二甲醇二丙稀❹旨、二環戊基㈣酸醋、: 環戊基甲基丙烯酸醋、氫化等齡揮条7 a 虱化又酚%虱乙烷改性丙烯酸西丨 (二氧”單元數為降及氫化雙朌環氧乙炫改性甲基, 稀(環氧乙烧單元數為10)等。 就更佳之财龜裂性之觀點而士,、隹工“ 式美n i 親』而δ,進而較佳為除具有脂環 土之早體以外’進而組合使用具有伸烧氧基之單體。作 為具有伸以基之單體之具體例,可料:通式(9) 之聚乙二醇#400丙烯酸酯(m=〇,η=9)、 不 酸醋㈣,,、聚乙二醇_ 、;:_丙烯 7基丙烯酸酯(m=〇, 159229.doc -34&gt; 201231509 n=9)、聚乙二醇#6〇〇曱基丙烯酸酯(m=〇,等。 上述乙烯性不飽和加成聚合性單體(c)(即,選自由丙烯 酸酿或甲基丙烤酸醋所組成之群中之一種以上化合物)之 添加量相對於聚有機矽氧烷(a) 100質量份為O.^WOO質量 份,較佳為1〜500質量份’進而較佳為2〜2〇〇質量份,就耐 熱性之觀點而言,最佳為5〜1 〇〇質量份。 &lt;其他添加劑&gt; 〇 為了提供具有硬化後成型物之耐光性優異之特性的感光 性樹脂組合物,本發明之感光性樹脂組合物中亦可進而添 加選自由紫外線吸收劑及含有受阻胺之光穩定劑所組成之 群中之至少一種化合物。於添加之情形時,添加劑總量相 對於聚有切氧院⑷⑽f量份較佳為設為請^胃 量份’就透明性、熱重量減少量之觀點而言,更佳為設為 0.01〜20質量份。 於含有紫外線吸收劑或含有受阻胺之光穩㈣之情形時 ο =加量_於聚有㈣氧貌⑷_質量份較佳為設為 晉50質讀,更佳為設為i,質量份。若添加量為質 二上’則可有效地提高硬化成型物之耐候性及耐光 =加量為5Gf量份以下’則可維持添加後之感光性 候^口物及硬化成型物之高透射性並且提高耐光性及耐 性二了:供與玻璃、金屬等無機材料基板保持較高之密著 性之感光性樹脂組合物亦 物中進m ⑬Μ於树明之感紐樹脂組合 進而添加矽烷偶合劑等接著助劑。 159229.doc -35- 201231509 尤其就價格或有害性之觀點而言,較佳為3-縮水甘油氧 基丙基三甲氧基矽烷(信越化學工業股份有限公司kbm_ 403)、3-甲基丙烯醯氧基丙基三甲氧基矽烷(信越化學工業 股份有限公司KBM-503)、3-胺基丙基三乙氧基石夕燒(信越 化學工業股份有限公司KBE-903)。 含有矽烷偶合劑之情形時之添加量相對於聚有機石夕氧燒 (a) 100質量份,較佳為設為卜丨〇〇質量份,更佳為設為 1 0〜50質量份。若添加量為i質量份以上,則可獲得對玻 璃、金屬等無機材料基板保持優異之密著性之硬化成型 物。 本發明之感光性樹脂組合物中可視需要添加用以提高感 光度之增感劑。作為此種增感劑,例如可列舉··米其勒 酮、4,4,-雙(二乙基胺基)二苯甲酮、2,5_雙(4,_二乙基胺基 亞苄基)環戊酮、2,6-雙(4,-二乙基胺基亞苄基)環己酮、 2,6-雙(4,-二甲基胺基亞苄基)·4·甲基環己酮、2,6-雙(4,_二 乙基胺基亞苄基)-4-甲基環己酮、4,4'-雙(二甲基胺基)查耳 酮4’4-雙(一乙基胺基)查耳酮、2-(4’-二甲基胺基亞桂皮 基)茚_、2-(4’-二甲基胺基亞苄基)茚酮、2_(對_4,_二曱基 胺基聯苯)苯并喧嗤、以—雙⑷二甲基胺基亞节基)丙嗣、 1,3_雙(4-二乙基胺基亞苄基)丙酮、3,3,羰基雙(7_二乙基 胺基香豆素)、3 -乙酿基_7_二甲基胺基香豆素' 乙氧基 羰基-7-二甲基胺基香豆素、3_苄氧基羰基_7_二甲基胺基 香丑素、3-甲氧基羰基_7_二乙基胺基香豆素、3_乙氧基羰 基 乙基胺基香豆素、N-笨基-N-乙基乙醇胺、N-苯基 I59229.doc -36 - 201231509 二乙-醇胺、苯基二乙醇胺、Ν•苯基乙醇胺、Ν,Ν-雙 (2-羥基乙基)苯胺、4·嗎啉基二苯甲酮、仁二τ基胺基苯 f酸異戊醋、4-二乙基胺基苯尹酸異戊醋、苯并三唾、2_ 毓基苯并咪唑、〗-苯基-5-鲸基·152,3,4_四 Ο Ο 疏基似4·时、〗-(第三丁基)〜基切,4·=基t 疏基本并㈣、2-(對二甲基胺基笨乙稀基)苯并十坐、2_ (對二甲基胺基苯乙稀基)苯并喧唾、2_(對二甲基胺基苯乙 稀基)萘幷(1,2·Ρ)嗟吐、2_(對二甲基胺基苯甲酿基)苯乙稀 等。又,該等化合物可單獨使用,或以2種以上之混合物 之形式使用。添加增感劑之情形時之添加量雖然亦取決於 其他添加劑成分量’但相對於聚有機石夕氧烧⑷較佳為 0.1〜10質量份’更佳為1〜5質量份。 本發明之感光性樹脂組合物中’視需要為了提高保存時 或感光度之穩定性’可添加聚合抑制劑。作為此種 聚合抑制劑’例如可使用:對苯二盼、Ν_亞硝基二苯基 胺對第二丁基鄰苯二紛、紛嘆ρ井、ν_苯基蔡胺、乙二胺 四乙一酸、」,2_環己二胺四乙酸、乙二醇趟二胺四乙酸、 2:6-二第三丁基對甲基苯齡、%亞硝基_8_經基嗤琳、“亞 ^ 蔡紛2_亞硝基萘酚、2-亞硝基-5-(Ν-乙基-Ν-磺 丙2胺基)笨盼、Ν_亞硝基·Ν_苯基㈣㈣ ^基&amp;胺錄鹽、Ν_亞硝基_ν_(ι_萘基)經胺銨鹽、雙(4_ 开^3,、5·二第三丁基)苯基甲烧等。添加聚合抑制劑之情 + ^量相對於聚有機石夕氧院⑷100質量份較佳為 〇·001〜5質量份,更佳為0.0W質量份。 159229.doc -37- 201231509 本發明之感光性樹脂組合物中,視需要為了提高氧氣存 在下之熱穩定性,可添加抗氧化劑。作為此種抗氧化劑’ 可列舉:受阻酚、磷系、内酯系、維生素E系、硫系者。 具體而言,可例示:三乙二醇雙[3-(3-第三丁基-5-甲基-4-羥基苯基)丙酸酯](BASF公司製造之IRGANOX 245)、1,6-己二酵雙[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯KBASF公 司製造之IRGANOX 259)、2,4-雙(正辛硫基)-6-(4-羥基-3,5-二第三丁基苯胺基)-1,3,5-三畊(BASF公司製造之 IRGANOX 565)、季戊四醇四[3-(3,5-二第三丁基-4-羥基苯 基)丙酸酯](BASF公司製造之IRGANOX 1010)、2,2-硫代二 伸乙基雙[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯](BASF公 司製造之IRGANOX 1035)、3-(3,5-二第三丁基-4-羥基苯 基)丙酸十八酯(BASF公司製造之IRGANOX 1076)、Ν,Ν1-六亞甲基雙(3,5-二第三丁基-4-羥基苯丙醯胺)(BASF公司 製造之IRGANOX 1098)、3,5-二第三丁基-4-羥基苄基膦酸 二乙酯(8八8卩公司製造之1尺〇八1^00 295)、1,3,5-三甲基· 2,4,6-三(3,5-二第三丁基-4-羥基苄基)苯(BASF公司製造之 IRGANOX 1330)、三(3,5-二第三丁基-4-羥基苄基)異氰尿 酸酯(BASF公司製造之IRGANOX 3114)、辛基化二苯基胺 (BASF公司製造之IRGANOX 5057)、2,4-雙[(辛硫基)甲基] 鄰甲酚(BASF公司製造之IRGANOX 1520L) ' 3-(3,5-二第 三丁基-4-羥基苯基)丙酸異辛酯(BASF公司製造之 IRGANOX 1135)、2,4-雙(十二烷基硫基甲基)-6-甲基苯酚 (BASF 公司製造之 IRGANOX 1 726)、2,5,7,8-四甲基-2- 159229.doc • 38 - 201231509Examples of the monomer represented by the above formula (9) include a bis-A diglycidyl ether-acrylic acid addition product, a bisphenol A diglycidyl ether-methacrylic acid addition product, and an ethoxylation (tetra) propylene return. The number of acid (tetra) ethylene glycol units is 2 bone ethoxylated bis-octane octamethyl acrylate (the number of B is 2 to 30). As a monomer for improving hardness and photosensitivity, it is possible to feed a monomer having three or more propylene or methyl propyl groups in the formula (15), (H2C=C(R)-(C=〇 )-〇-Y)n_x ...丨(15) 159229.doc -33- 201231509 {wherein, R is hydrogen or methyl, and γ is a carbon number 1 containing an oxiranyl group and/or an oxypropylene group. The organic group of 90, X&quot;&quot; is an η-valent organic group having a carbon number of 1 to 6, and η is 3 or 4}. Examples of the monomer represented by the above formula (15) include pentaerythritol tripropionate, pentaerythritol tetraacrylate, trihydroxydecyl propane triacrylate acrylate, and ethoxylated tris(tetra)propylpropane tripropylene. Acid [the number of ethylene glycol units is 2 20] - methacrylic acid trimethacrylate, tris(2_ylethyl)isocyanuric acid triacrylate, tris(2-hydroxyethyl)isocyanuric acid Trimethacrylate, bis(trihydroxydecylpropane)triacrylate, bis(trihydroxymethylpropane)tetrapropene I from Japan, dipentaerythritol pentaacetic acid vinegar, dipentaerythritol hexaacrylate acid vinegar, and the like. In addition, when the above-mentioned monomers are used, they may be used singly or in combination of two or more kinds as needed. In view of the crack resistance, the heat resistance, the refractive index, and the viscosity (operability), a specific example in which the monomer 4 having an alicyclic group is a monomer having an alicyclic structure is exemplified, and examples thereof include: Tricyclohexane dimethanol dimethyl propylene 8 fat, tricyclohexan dimethanol dipropylene dilute, dicyclopentyl (tetra) acid vinegar,: cyclopentyl methacrylate vinegar, hydrogenation, etc. Moreover, the number of phenolic oxime-modified bismuth acrylate (diox) units is reduced, and the hydrogenated bismuth oxime oxime modified methyl group, dilute (the number of epoxidized units is 10), etc. From the viewpoint of cracking, it is completed, and it is preferable to use δ, and further preferably, in addition to the alicyclic soil, and then use a monomer having an extended alkyl group. Specific examples of the monomer may be: polyethylene glycol #400 acrylate of the general formula (9) (m = 〇, η = 9), non-acid vinegar (tetra),, polyethylene glycol _,;: _ Propylene 7-based acrylate (m = 〇, 159229.doc -34 &gt; 201231509 n = 9), polyethylene glycol #6 methacrylate (m = hydrazine, etc.. The above-mentioned ethylenic unsaturated addition polymerization property The amount of the substance (c) (i.e., one or more compounds selected from the group consisting of acrylic or methyl acetonate) is O.^WOO mass relative to 100 parts by mass of the polyorganosiloxane (a). The portion is preferably 1 to 500 parts by mass, and more preferably 2 to 2 parts by mass, and is preferably 5 to 1 part by mass in terms of heat resistance. &lt;Other additives&gt; A photosensitive resin composition having properties excellent in light resistance of a molded article after curing is provided, and the photosensitive resin composition of the present invention may further comprise a group selected from the group consisting of an ultraviolet absorber and a light stabilizer containing a hindered amine. At least one compound, in the case of addition, the total amount of the additive is preferably set to be the amount of the stomach in the case of the polyoxygen (4) (10) f, which is better in terms of transparency and thermal weight loss. It is set to 0.01 to 20 parts by mass. In the case of containing a UV absorber or a light-stable amine containing a hindered amine (4) ο = addition amount _ in the poly (4) oxygen appearance (4) _ mass part is preferably set to Jin 50 quality reading, More preferably, it is set to i, the mass part. If the amount is added to the quality Therefore, it is possible to effectively improve the weather resistance of the cured product and the light resistance = the amount of addition to the amount of 5 Gf or less, and the high transmittance of the photosensitive material and the cured molded product after the addition can be maintained, and the light resistance and the resistance are improved. : A photosensitive resin composition which maintains a high adhesion to an inorganic material substrate such as glass or metal, and a subsequent additive such as a decane coupling agent may be added to a combination of a resin and a resin. 35- 201231509 Especially in terms of price or harmfulness, 3-glycidoxypropyltrimethoxydecane (Shin-Etsu Chemical Co., Ltd. kbm_403), 3-methylpropenyloxypropyl group is preferred. Trimethoxy decane (Shin-Etsu Chemical Co., Ltd. KBM-503), 3-aminopropyltriethoxy zeshi (Shin-Etsu Chemical Co., Ltd. KBE-903). In the case where the decane coupling agent is contained, the amount of addition is preferably 100 parts by mass, more preferably 10 to 50 parts by mass, based on 100 parts by mass of the polyorgano oxyazepine (a). When the amount of addition is i parts by mass or more, a cured molded article which retains excellent adhesion to an inorganic material substrate such as glass or metal can be obtained. A sensitizer for improving the sensitivity may be added to the photosensitive resin composition of the present invention as needed. Examples of such a sensitizer include, for example, rice ketone, 4,4,-bis(diethylamino)benzophenone, and 2,5-bis(4,2-diethylamino) Benzyl)cyclopentanone, 2,6-bis(4,-diethylaminobenzylidene)cyclohexanone, 2,6-bis(4,-dimethylaminobenzylidene)·4· Methylcyclohexanone, 2,6-bis(4,2-diethylaminobenzylidene)-4-methylcyclohexanone, 4,4'-bis(dimethylamino)chalcone 4 '4-Bis(monoethylamino)chalcone, 2-(4'-dimethylamino cinnamic acid) 茚, 2-(4'-dimethylaminobenzylidene) fluorenone , 2_(p-_4,_didecylaminobiphenyl)benzoindole, bis(4)dimethylaminosuccine) propionium, 1,3_bis(4-diethylamino) Benzylene)acetone, 3,3, carbonyl bis(7-diethylaminocoumarin), 3-ethoxyphenyl_7-dimethylamino coumarin' ethoxycarbonyl-7-di Methylamino coumarin, 3-benzyloxycarbonyl-7-dimethylamine glucoside, 3-methoxycarbonyl-7-diethylamino coumarin, 3-ethoxycarbonyl Ethylamine coumarin, N-phenyl-N-ethylethanolamine, N-phenyl I59229.doc -36 - 20123 1509 Diethyl-alcoholamine, phenyldiethanolamine, hydrazine-phenylethanolamine, hydrazine, hydrazine-bis(2-hydroxyethyl)aniline, 4·morpholinylbenzophenone, bistrioxyl benzene Acid isotonic vinegar, 4-diethylaminobenzionic acid isotonic vinegar, benzotrisodium, 2_mercaptobenzimidazole, 〗-phenyl-5-whale base 152,3,4_tetraindole Ο When the base is like 4·, 〖-(t-butyl)~-cut, 4·= base t is basic and (4), 2-(p-dimethylamino stupidyl) benzo-sit, 2_ ( p-Dimethylaminophenylvinyl)benzopyrene, 2-(p-dimethylaminophenylethyl)naphthoquinone (1,2·Ρ) vomiting, 2_(p-dimethylamino benzene A brewed base) styrene and the like. Further, these compounds may be used singly or in the form of a mixture of two or more. The amount of addition in the case where the sensitizer is added depends on the amount of the other additive component, but is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, based on the polyorgano oxysulfuric acid (4). In the photosensitive resin composition of the present invention, a polymerization inhibitor may be added as needed to improve stability during storage or sensitivity. As such a polymerization inhibitor, for example, it is possible to use: p-benzoic acid, hydrazine-nitroso-diphenylamine, p-butylene phthalate, sputum p, ν_phenyl ceamine, ethylenediamine Tetraethyl acid,", 2_cyclohexanediaminetetraacetic acid, ethylene glycol guanidine diamine tetraacetic acid, 2:6-di-t-butyl-p-methyl benzene, % nitroso _8_ , "Asia ^ Cai Rin 2 nitroso-naphthol, 2-nitroso-5-(Ν-ethyl-Ν-sulfopropyl 2 amine group) stupid, Ν _ nitroso Ν phenyl (four) (four) ^基和amp;amine salt, Ν_nitroso_ν_(ι_naphthyl) via amine ammonium salt, bis(4_open^3,5·di-t-butyl) phenyl ketone, etc. Addition polymerization The amount of the inhibitor + is preferably 0.001 to 5 parts by mass, more preferably 0.0 W by mass, based on 100 parts by mass of the polyorganisms (4). 159229.doc -37- 201231509 The photosensitive resin of the present invention In the composition, an antioxidant may be added in order to improve the thermal stability in the presence of oxygen. Examples of such an antioxidant include hindered phenol, phosphorus, lactone, vitamin E, and sulfur. Illustratively, it can be exemplified: triethylene glycol bis[3-(3-tert-butyl-5-- Methyl-4-hydroxyphenyl)propionate] (IRGANOX 245, manufactured by BASF Corporation), 1,6-hexanedialdehyde bis[3-(3,5-di-t-butyl-4-hydroxyphenyl) Propionate KBASF company IRGANOX 259), 2,4-bis(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-three Plowing (IRGANOX 565, manufactured by BASF), pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] (IRGANOX 1010, manufactured by BASF), 2,2-sulfur Diethyl bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] (IRGANOX 1035, manufactured by BASF), 3-(3,5-di-3rd Octadecyl 4-hydroxyphenyl)propanoate (IRGANOX 1076, manufactured by BASF Corporation), hydrazine, Ν1-hexamethylene bis(3,5-di-t-butyl-4-hydroxyphenylpropanamide) (IRGANOX 1098 manufactured by BASF Corporation), diethyl 3,5-di-tert-butyl-4-hydroxybenzylphosphonate (1 〇8 1^00 295 manufactured by 8 8 8 Company), 1, 3 , 5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene (IRGANOX 1330 manufactured by BASF Corporation), three (3,5-two third) Butyl-4-hydroxybenzyl)isocyanurate (I manufactured by BASF) RGANOX 3114), octylated diphenylamine (IRGANOX 5057 manufactured by BASF Corporation), 2,4-bis[(octylthio)methyl] o-cresol (IRGANOX 1520L manufactured by BASF Corporation) ' 3-(3 , 5-di-t-butyl-4-hydroxyphenyl)propionic acid isooctyl ester (IRGANOX 1135, manufactured by BASF Corporation), 2,4-bis(dodecylthiomethyl)-6-methylphenol (IRGANOX 1 726 manufactured by BASF Corporation), 2,5,7,8-tetramethyl-2- 159229.doc • 38 - 201231509

(4,8,12-三甲基十三烷基)色滿-6-醇(BASF公司製造之 11^入1^〇又£201)、5,7-二第三丁基-3-(3,4-二甲基苯基)笨 并呋喃-2(3H)-酮(IRGANOX HP-136)、亞磷酸三(2,4-二第 三丁基苯酯)(BASF公司製造之IRGAFOS 168)、三[2-[[2,4,8,10-四(1,1-二甲基乙基)二苯并[山幻[1,3,2]二噚磷環 庚烷-6-基]氧基]乙基]胺(BASF公司製造,IRGAFOS 12)、 亞磷酸雙(2,4-二第三丁基-6-曱基苯基)乙酯(BASF公司製 造之IRGAFOS 3 8)、3,3-硫代雙丙酸二-十二烷基酯(BASF 〇 公司製造之IRGANOX PS800)、3,3-硫代雙丙酸二-十八烷 基酯(BASF公司製造之IRGANOX PS802)、3,9-雙[2·[3-(3· 第三丁基-4-經基-5·曱基苯基)丙酼氧基]-l,l-二甲基乙基]_ 2,4,8,10-四氧雜螺[5,5]十一烷(住友化學公司製造之 SUMILIZER GA-80)、2,2'-亞曱基雙(6-第三丁基曱基苯 酚)(住友化學公司製造之SUMILIZER MDP-S)、4,4'-亞丁 基雙(6-第三丁基-3-甲基苯酚)(住友化學公司製造之 SUMILIZER BBM-S)、4,4’-硫代雙(6-第三丁基 _3-甲基苯 Ο 、来〇·、結 酚)(住友化學公司製造之SUMILIZER WX-R)、季戌四醇四 (3-月桂基硫代丙酸酯)(住友化學公司製造之SUMILIZER TP-D)、2-巯基苯并咪°坐(住友化學公司製造之SUMILIZER MB)、聯苯-4,4'-二基雙[雙(2,4-二第三丁基-5-曱基苯氧基) 膦](大崎工業公司製造之GSY-P1 01)等,俱並不限定於該 等。又,該等抗氧化劑可單獨使用或以2癯以上之混合物 之形式使用。添加抗氧化劑之情形時之添加量相對於聚有 機矽氧烷(a) 100質量份,較佳為0.001〜30質量份’更佳為 159229.doc -39· 201231509 0_01〜10質量份。 只要不阻礙本發明之感光性樹脂組合物所要求之各特 性,則本發明之感光性樹脂組合物中可視需要適當調配塗 膜平滑性賦予劑、無機微粒子等各種添加劑。 &lt;溶劑&gt; 於本發明之感光性樹脂組合物中亦可添加溶劑而調整黏 度。作為較佳溶劑,可列舉:N,N_:甲基甲醯胺、N_甲 基-2-吡咯烷酮(以下,亦稱為「NMP(N_Methyl_2_ py 1^4〇116)」)、]^-乙基-2-'1比嘻院_、四氫吱0南'队;^-二 甲基乙醯胺(以下,亦成為「DMAc(N,N-dimethyl • tamide)」)、一甲亞磯、六甲基磷醯胺、吼啶、環戊 酮、γ-丁内酯(以下,亦稱為「GBL(y_butyr〇lact〇ne)」)、 α_乙酿基个丁内西旨、四甲基脲、1,3·二甲基-2-咪唾咬酮、 Ν-環己基-2-吡咯烷酮、丙二醇單曱醚、丙二醇單甲醚乙 酸自曰甲基乙基酮、甲基異丁基酮、笨甲醚、乙酸乙醋、 乳Sic乙s曰、乳酸丁酯等,該等可單獨使用或以二種以上之 «之形式使用。該等中,尤佳為N_曱基_2_吡咯烷酮或γ_ 丁内s日、丙一醇單曱醚乙酸酯。該等溶劑可根據塗佈膜 厚、黏度而適當地添加於感光性樹脂組合物中,但較佳為 相對於聚有機矽氧烷(a) 100質量份於0〜200質量份之範圍 内使用。 &lt;硬化物&gt; 2本發明之一實施形態中,藉由使本發明之感光性樹脂 口物'或含有藉由上述聚有機矽氧烷之製造方法而獲得 159229.d〇( 201231509 之聚有機矽氧烷(a)及光聚合起始劑(b)之感光性樹脂組合 物光硬化,可獲得硬化物。 &lt;成型物之製造方法&gt; 以下,對使用本發明之感光性樹脂組合物之成型物之製 造方法加以說明。 作為成型物,例如可列舉:塑膠微透鏡或液晶偏光板用 光學元件。於本說明書中,所謂塑膠微透鏡,揭示有通常 直徑為數mm以下之微小之塑膠製透鏡,於CCD攝像元件 或LCD(liquid crystal display,液晶顯示器)投影器中為了 提高光利用效率而利用配置有多個直徑數十μπ1左右之微 透鏡之微透鏡陣列,於光通訊用連接器或行動電話之相機 模組等中利用直徑數百pm左右之微透鏡。 又’所謂液晶偏光板用光學元件,係指作為液晶投影器 或液晶顯示器構件之一之偏光鏡(偏光板)上之構造體。通 常於液晶面板中,於封入有液晶之透明基板之表面背面設 置有一組偏光鏡(偏光板)’而僅使一定振動方向之偏光通 過。液晶偏光板可藉由將膜延伸,使組合物配向等而製 作’但亦可藉由於基板上以〇 2〜3 μηι之間距形成特定之 構造體’而製作具有作為偏光鏡之特性的材料。 塑膠微透鏡與液晶偏光板用光學元件僅模具之大小、種 類不同,兩者之製造方法相同。具體而言,本發明之成型 物之製造方法包括如下步驟: 1)將本發明之感光性樹脂組合物、或含有藉由上述製造 方法獲得之聚有機矽氧烷(a)及光聚合起始劑(b)之感光性 159229.doc -41 - 201231509 樹脂組合物填充至成型用模具中之步驟, 2) 將該模具之開σ部㈣至基板或另—模具上之步驟, 3) 自該模具及/或該基板側將該感光性樹脂組合物曝光而 獲得光硬化物之步驟, 4) 將該模具自該基板剝離或將位於兩面之該模具剝離之 步驟,以及 5) 僅將該光硬化物加#,或將該光硬化物與該基板一併 加熱之步驟。 1)將感光性樹脂組合物填充至成型用模具中之步驟 自成型用模具之開口部將感光性樹脂組合物填充至成型 用模具中’或向基板或模具中滴加感光性樹脂組合物,以 成為基板/感光性樹赌組合物/模具、或模具/感光性樹脂組 合物/模具之方式按壓基板或模具,而將感光性樹脂組合 物填充至成型用模具中。 於塗佈於成型用模具之開口部之情形時,只要使用滴管 或分注器將感光性樹脂組合物滴加於成型用模具之開口部 即可。又,於塗佈於基板側之情形時,使用滴管或分注器 滴加,或利用旋轉塗佈機、棒式塗佈機、到刀塗佈機、淋 幕式塗佈機'網版印刷機等進行塗佈,或利用喷塗機等進 行喷霧塗佈,藉此於視需要實施了預處理之基板上塗佈感 光性樹脂組合物,而形成感光性樹脂組合物之膜。 感光性樹脂組合物之厚度較佳為0 01〜10 mm,更佳為 〇·〇5 1 mm,進而較佳為1〇〇〜500 μιη。塗佈感光性樹脂組 «物時,可使用ΝΜΡ等溶劑進行稀釋,但於此情形時,藉 I59229.doc -42· 201231509 由加熱將所使用之溶劑除去之步驟成為 塗佈之基板之感光性樹脂組合物之薄膜形成面朝::吏; 作為加熱裝置’只要為烘箱、遠紅外線 可加熱之裝置,則可使用已…、板等 5(rc〜15(rc、較佳為100t ^條件係 υ &lt;把圍,1分鐘〜八 :、較佳為5分鐘〜10分鐘。再者’即便於未使用溶劑對: 光性樹脂組合物進行稀釋之情料,就提高基板與感光性 Ο 樹:組:物之密著性之觀點而言’可任意加入對每個基板 加熱之步驟,作為此情形時所使用之裝置,較佳為加熱 板0 、 作為基板之預處理,為了賦予與基板之密著性,可 視情況將矽烷偶合劑塗佈於基板上。於塗佈矽烷偶合劑之 障形時’使用NMP等有機溶劑對發垸偶合劑進行稀釋,使 用旋轉塗佈機、棒式塗佈機、到刀塗佈機、淋幕式塗佈 機、網版印刷機等進行塗佈後,藉由加熱將所使用之溶劑 除去。加熱係藉由使用烘箱、遠紅外線爐、加熱板等已知 者進行。作為矽烷偶合劑之化學種類,較佳為3_縮水甘油 氧基丙基三甲氧基矽烷(信越化學工業股份有限公司kbm_ 4〇3)、3-曱基丙烯醯氧基丙基三甲氧基矽烷(信越化學工業 股份有限公司ΚΒΜ-503)、3-丙烯醯氧基丙基三甲氧基矽烷 (信越化學工業股份有限公司ΚΒΜ-5103)、3-胺基丙基三乙 氧基矽烷(信越化學工業股份有限公司ΚΒΕ-903)等。 作為基板,例如可使用玻璃基板、石英基板、矽基板、 銅箱積層板等銅基板。於成型用模具為不會使光透射之材 159229.doc -43- 201231509 質之情形時,較佳為玻璃基板或石英基板。 2)將成型用模具之開口部按壓至基板或另一模具上之步驟 將成型用模具例如㈣微透鏡之模具或液晶偏光板用光 學元件之模具之開口部按麼至基板或另一模具上之薄膜形 成面。此時,亦可視需要進行加壓。作為成型用模具之材 質,可列舉:橡膠、玻璃、聚二甲基石夕氧烧等樹脂、犯等 金屬’尤佳為透明樹脂。 又,於本發明之成型物之製造方法中’⑨將模具之開口 指壓於基板上之情形時’較佳為於該步驟之前加入在基 板上塗佈矽烷偶合劑之步驟,於將模具之開口部按壓至基 板上之步驟中,較佳為將模具之開口部按壓至基板上之塗 佈有上述矽烷偶合劑之面。 3)自模具及/或基板侧將該感光性樹脂組合物曝光而獲得光 硬化物之步驟 於以基板與成型用模具夾持感光性樹脂組合物之狀態 下,自成型用模具或基板中可使曝光光透射之材質之側照 射紫外線。視需要,亦可自以基板與成型用模具或模具彼 此夾持感光性樹脂組合物之狀態的積層體之兩側照射紫外 線。就作為光硬化型樹脂之圖案之解像度及操作性之觀點 而言,作為曝光光源之波長,較佳為丨射線。 4) 將模具自基板剝離或將位於兩面之模具剝離之步驟 紫外線硬化後,將成型用模具自基板剝離或將位於兩面 之模具剝離。 5) 僅將光硬化物加熱,或將光硬化物與基板一併加熱之步 159229.doc -44 · 201231509 驟(PEB(P〇st exp0SUre bake,曝光後烘烤)處理) 於15(TC〜270t之溫度下加熱5秒〜5小時,藉此使殘留之 反應基鍵結,而獲得耐熱性優異之成型物,例如塑膠微透 鏡或液晶偏光板用光學元件。加熱可使用加熱板、供箱、 可設定溫度程式之升溫式烘箱而進行。作為加熱時之環境 氣體’可為空氣,較佳為使用氮氣 '氬氣等惰性氣體。再 者,該加熱步驟係為了提高成型物例如塑膠微透鏡或液晶 偏光板用光學元件之硬度而可任意加入之步驟。 藉由進行上述所說明之步驟,可獲得本發明之成型物。 &lt;硬化凹凸圖案及聚有機矽氧烷膜之形成方法&gt; 以下,對使用本發明之感光性樹脂組合物形成硬化凹凸 圖案之方法之一例加以說明。硬化凹凸圖案之製造方法包 括如下步驟: 1) 塗佈本發明之感光性樹脂組合物、或含有藉由本發明 之聚有機矽氧烷之製造方法獲得之聚有機矽氧烷(a)及光聚 合起始劑(b)之感光性樹脂組合物而獲得塗佈臈之步驟, 2) 對該塗佈膜照射活性光線使曝光部光硬化之步驟, 3) 使用顯影液將該膜之未硬化部分除去之步驟,以及 4) 將硬化部分與該基板一併加熱之步驟。 1)塗佈本發明之感光性樹脂組合物而獲得塗佈膜之步驟 首先’將本發明之感光性樹脂組合物塗佈於石夕晶圓 (silicon wafer)、陶瓷基板、鋁基板、其他所需之各種基板 上。作為塗佈裝置或塗佈方法,可利用旋轉塗佈機、模塗 佈機、喷塗機、浸潰、印刷、刮刀塗佈機、輥塗法等。於 159229.doc -45· 201231509 80〜200°c下對經塗佈之基板進行時間10秒〜1小時之軟烤。 2) 對塗佈膜照射活性光線而使曝光部光硬化之步驟 使用接觸式對準機、鏡像投影、步進機等曝光投影裝 置,經由所需之光罩照射活性光線。作為活性光線,可利 用X射線、電子束、紫外線、可見光線等,但於本發明 中,較佳為使用200〜500 nm之波長者。就圖案之解像度及 操作性之觀點而言,該光源波長尤佳為uv_i射線(365 nm) ’作為曝光投影裝置’尤佳為步進機。 於步驟2)之後,為了提高感光度等,可視需要於任意溫 度與時間之組合(較佳為溫度4(rc〜2〇(rc,時間1〇秒〜3〇分 鐘)下,實施曝光後烘烤(PEB,Post exposure bake)或顯影 前烘烤。 3) 使用顯影液將膜之未硬化之部分除去之步驟 該步驟可藉由浸潰法、覆液法、或旋轉噴霧法等方法進 行。作為顯影液,可單獨使用本發明之感光性樹脂組合物 之良溶劑,或將良溶劑與不良溶劑適當混合而使用。作為 良溶劑,可列舉:N-甲基-2-吼咯烷酮、N_乙醯基_2_吡咯 烷酮' N,N-二甲基乙醢胺、N,N_二甲基甲醯胺、二甲亞 石風、P丁内酯、α-乙醯基-γ_丁内酯、環戊酮、環己酮、丙 二醇單曱醚、丙二醇單甲醚乙酸酯、甲基乙基酮、甲基異 丁基_等《作為不良溶劑,可列舉:甲醇、乙醇、異丙 醇' 水等。 顯影結束後,利用淋洗液進行清洗,除去顯影液,藉此 獲侍附有凹凸圖案之塗膜。作為淋洗液,可單獨或適當混 159229.doc 46· 201231509 合使用蒸餾水'曱醇、乙醇、異丙醇、丙二醇單甲醚等, 或將該等階段性地組合使用。 4)將硬化部分與該基板一併加熱之步驟((最終)加熱步 驟,PEB處理) 以如上所述之方式獲得之凹凸圖案於15 0〜260。(:下可轉 化為硬化凹凸圖案。該加熱硬化可使用加熱板、無氧化烘 箱、可設定溫度程式之升溫式烘箱等進行。作為加熱硬化(4,8,12-trimethyltridecyl)chroman-6-ol (11^ into 1^〇 and £201 by BASF), 5,7-di-t-butyl-3-( 3,4-Dimethylphenyl) benzofuran-2(3H)-one (IRGANOX HP-136), tris(2,4-di-t-butylphenyl) phosphite (IRGAFOS 168, manufactured by BASF) ), three [2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[山,[1,3,2]diphosphoranecycloheptane-6- Alkyloxy]ethyl]amine (manufactured by BASF Corporation, IRGAFOS 12), bis(2,4-di-tert-butyl-6-nonylphenyl)ethyl phosphite (IRGAFOS 3 8 manufactured by BASF Corporation) , 3,3-thiobispropanoic acid di-dodecyl ester (IRGANOX PS800 manufactured by BASF Corporation), 3,3-thiobispropanoic acid di-octadecyl ester (IRGANOX PS802 manufactured by BASF Corporation) ,3,9-bis[2·[3-(3·t-butyl-4-transyl-5·nonylphenyl)propenyloxy]-l,l-dimethylethyl]- 2,4,8,10-Tetraoxaspiro[5,5]undecane (SUMILIZER GA-80, manufactured by Sumitomo Chemical Co., Ltd.), 2,2'-arylene di(6-tert-butylfluorenyl) Phenol) (SUMILIZER MDP-S by Sumitomo Chemical Co., Ltd.), 4,4'-butylidene bis(6-tert-butyl-3-methyl Phenol) (SUMILIZER BBM-S, manufactured by Sumitomo Chemical Co., Ltd.), 4,4'-thiobis(6-tert-butyl-3-methylbenzoquinone, hydrazine, phenol) (manufactured by Sumitomo Chemical Co., Ltd.) SUMILIZER WX-R), quaternary tetraol tetrakis(3-lauryl thiopropionate) (SUMILIZER TP-D manufactured by Sumitomo Chemical Co., Ltd.), 2-mercaptobenzopyrene (SUMILIZER MB manufactured by Sumitomo Chemical Co., Ltd.) ), biphenyl-4,4'-diylbis[bis(2,4-di-t-butyl-5-nonylphenoxy)phosphine] (GSY-P1 01 manufactured by Osaki Industries Co., Ltd.), etc. It is not limited to these. Further, the antioxidants may be used singly or in the form of a mixture of 2 Torr or more. The amount of the antioxidant added is preferably 0.001 to 30 parts by mass, more preferably 159 to 229 parts by weight, more preferably 159 to 229 parts by weight, based on 100 parts by mass of the polyorganosiloxane (a). In the photosensitive resin composition of the present invention, various additives such as a coating film smoothness imparting agent and inorganic fine particles may be appropriately added as needed, as long as the properties of the photosensitive resin composition of the present invention are not inhibited. &lt;Solvent&gt; The solvent may be added to the photosensitive resin composition of the present invention to adjust the viscosity. Preferred examples of the solvent include N,N_: methylformamide and N-methyl-2-pyrrolidone (hereinafter also referred to as "NMP (N_Methyl_2_ py 1^4〇116)"),]^-B.基-2-'1 比嘻院_,四氢吱0南' team; ^-dimethylacetamide (hereinafter, also known as "DMAc(N, N-dimethyl • tamide)") , hexamethylphosphoniumamine, acridine, cyclopentanone, γ-butyrolactone (hereinafter, also referred to as "GBL (y_butyr〇lact〇ne)"), α_乙乙基丁内西,四Methylurea, 1,3-dimethyl-2-imidone, Ν-cyclohexyl-2-pyrrolidone, propylene glycol monoterpene ether, propylene glycol monomethyl ether acetate, hydrazine methyl ethyl ketone, methyl isobutyl Ketone, methyl ether, ethyl acetate, milk Sic, butyl lactate, etc., which may be used singly or in the form of two or more. Among these, N-mercapto-2-pyrrolidone or γ-butane s day and propanol monoterpene ether acetate are particularly preferable. The solvent may be appropriately added to the photosensitive resin composition in accordance with the thickness and viscosity of the coating film, but it is preferably used in an amount of from 0 to 200 parts by mass based on 100 parts by mass of the polyorganosiloxane (a). . &lt;Cured product&gt; 2 In one embodiment of the present invention, the photosensitive resin resin of the present invention or the method for producing the polyorganosiloxane is used to obtain 159229.d〇 (201231509) The photosensitive resin composition of the organic siloxane (a) and the photopolymerization initiator (b) is photocured to obtain a cured product. <Method for Producing Molded Article> Hereinafter, the photosensitive resin composition using the present invention is used. For the molded article, for example, a plastic microlens or an optical element for a liquid crystal polarizing plate is used. In the present specification, a plastic microlens discloses a minute plastic having a diameter of usually several millimeters or less. In the CCD image sensor or LCD (liquid crystal display) projector, a microlens array in which a plurality of microlenses having a diameter of several tens μπ 1 are disposed in order to improve light use efficiency is used in the optical communication connector. Or a microlens having a diameter of several hundred pm or the like in a camera module of a mobile phone. Also, an optical element for a liquid crystal polarizing plate is used as a liquid crystal projector or liquid. A structure on a polarizing plate (polarizing plate) of one of the display members. Usually, in the liquid crystal panel, a set of polarizing mirrors (polarizing plates) is disposed on the back surface of the transparent substrate on which the liquid crystal is sealed, and only a certain polarization direction is polarized. The liquid crystal polarizing plate can be produced by extending the film to align the composition, etc., but can also be formed as a polarizing mirror by forming a specific structure on the substrate at a distance of 〜2 to 3 μηι. The optical element for the plastic microlens and the liquid crystal polarizing plate differs only in the size and type of the mold, and the manufacturing method of the two is the same. Specifically, the manufacturing method of the molded article of the present invention includes the following steps: 1) sensitizing the present invention The resin composition or the photosensitive 159229.doc -41 - 201231509 resin composition containing the polyorganosiloxane (a) and the photopolymerization initiator (b) obtained by the above production method are filled into a molding die a step of 2) exposing the σ portion (4) of the mold to the substrate or another mold, 3) exposing the photosensitive resin composition from the mold and/or the substrate side And obtaining the photo-cured material, 4) removing the mold from the substrate or peeling the mold on both sides, and 5) adding only the photo-cured material to the substrate, or bonding the photo-cured material to the substrate And the step of heating. 1) a step of filling the photosensitive resin composition into a molding die, filling the photosensitive resin composition into the molding die from the opening of the molding die, or dropping the photosensitive resin composition into the substrate or the mold, The substrate or the mold is pressed so as to become a substrate/photosensitive tree gambling composition/mold or a mold/photosensitive resin composition/mold, and the photosensitive resin composition is filled in a molding die. In the case of being applied to the opening of the molding die, the photosensitive resin composition may be dropped onto the opening of the molding die by using a dropper or a dispenser. Further, when applied to the substrate side, a dropper or a dispenser is used for dropping, or a spin coater, a bar coater, a knife coater, or a curtain coater is used. The film is applied by a printing machine or the like, or spray-coated by a spray coater or the like to apply a photosensitive resin composition onto a substrate subjected to pretreatment as necessary to form a film of the photosensitive resin composition. The thickness of the photosensitive resin composition is preferably from 0 to 10 mm, more preferably from 5 to 1 mm, still more preferably from 1 to 500 μm. When the photosensitive resin group is coated, it may be diluted with a solvent such as hydrazine. However, in this case, the step of removing the solvent used by heating by I59229.doc -42·201231509 becomes the photosensitive property of the coated substrate. The film formation of the resin composition is faced with:: 吏; as a heating device, as long as it is an oven or a device capable of heating far-infrared rays, it is possible to use 5, rc, 15 (rc, preferably 100 t ^ conditions). υ &lt; 围, 1 minute ~ 8:, preferably 5 minutes ~ 10 minutes. In addition, even if the solvent is not used: the photosensitive resin composition is diluted, the substrate and the photosensitive Ο tree are improved. From the viewpoint of the adhesion of the substance, the step of heating each substrate can be arbitrarily added. As the device used in this case, the heating plate 0 is preferably used as a pretreatment for the substrate, in order to impart a substrate. The adhesion of the decane coupling agent may be applied to the substrate as appropriate. When the barrier of the decane coupling agent is applied, the hairpin coupling agent is diluted with an organic solvent such as NMP, and coated by a spin coater or a bar coat. Cloth machine, knife coating machine After coating with a curtain coater, a screen printer, etc., the solvent to be used is removed by heating, and the heating is carried out by using a known person such as an oven, a far-infrared furnace, or a heating plate. The chemical species of the mixture is preferably 3-glycidoxypropyltrimethoxydecane (Shin-Etsu Chemical Co., Ltd. kbm_4〇3), 3-mercaptopropenyloxypropyltrimethoxydecane (Shin-Etsu Chemical) Industrial Co., Ltd. ΚΒΜ-503), 3-propenyloxypropyltrimethoxydecane (Shin-Etsu Chemical Co., Ltd. ΚΒΜ-5103), 3-aminopropyltriethoxydecane (Shin-Etsu Chemical Industry Co., Ltd.) ΚΒΕ-903), etc. As the substrate, for example, a copper substrate such as a glass substrate, a quartz substrate, a tantalum substrate, or a copper box laminate can be used. The mold for molding is a material that does not transmit light 159229.doc -43- 201231509 In the case of a glass substrate or a quartz substrate, 2) a step of pressing the opening of the molding die onto the substrate or another mold, for example, a mold for molding, for example, a mold for a microlens or an optical element for a liquid crystal polarizing plate. The opening of the mold is formed on the substrate or the film on the other mold. At this time, it is also possible to pressurize as needed. As a material for the mold for molding, rubber, glass, and polydimethyl sulphur oxide are mentioned. It is preferable to use a resin such as a resin or a metal such as a transparent resin. In the case of the method for producing a molded article of the present invention, when the opening of the mold is pressed against the substrate, it is preferable to add it before the step. The step of applying a decane coupling agent to the substrate, in the step of pressing the opening of the mold onto the substrate, preferably, the opening of the mold is pressed against the surface of the substrate coated with the decane coupling agent. The step of exposing the photosensitive resin composition to the mold and/or the substrate side to obtain a photocured material is such that the photosensitive resin composition is sandwiched between the substrate and the molding die, and the exposure light can be obtained from the molding die or the substrate. The side of the transmissive material is exposed to ultraviolet light. If necessary, the ultraviolet rays may be irradiated from both sides of the laminate in a state in which the substrate and the molding die or the mold are sandwiched with the photosensitive resin composition. From the viewpoint of the resolution and workability of the pattern of the photocurable resin, the wavelength of the exposure light source is preferably x-ray. 4) The step of peeling the mold from the substrate or peeling off the mold on both sides After the ultraviolet curing, the molding die is peeled off from the substrate or the molds on both sides are peeled off. 5) Only heat the photo-cured material, or heat the photo-cured material together with the substrate. 159229.doc -44 · 201231509 (PEB (P〇st exp0SUre bake)) at 15 (TC~) Heating at a temperature of 270 t for 5 seconds to 5 hours, whereby the remaining reactive groups are bonded to obtain a molded article excellent in heat resistance, for example, an optical element for a plastic microlens or a liquid crystal polarizing plate, and a heating plate or a supply box can be used for heating. The temperature can be set to a temperature-increasing oven. The ambient gas during heating can be air, preferably an inert gas such as nitrogen gas argon. Further, the heating step is to increase the molded object such as a plastic microlens. Or the step of arbitrarily adding the hardness of the optical element for the liquid crystal polarizing plate. The molded article of the present invention can be obtained by performing the above-described steps. &lt;Method for forming hardened concave-convex pattern and polyorganosiloxane film&gt; Hereinafter, an example of a method of forming a cured concavo-convex pattern using the photosensitive resin composition of the present invention will be described. The method for producing a cured concavo-convex pattern includes the following steps: 1) Coating the hair The photosensitive resin composition or the photosensitive resin composition containing the polyorganosiloxane (a) and the photopolymerization initiator (b) obtained by the method for producing a polyorganosiloxane of the present invention is coated. a step of sputum, 2) a step of irradiating the coating film with actinic light to photoharden the exposed portion, 3) a step of removing the uncured portion of the film using a developing solution, and 4) heating the hardened portion together with the substrate The steps. 1) Step of obtaining a coating film by applying the photosensitive resin composition of the present invention First, the photosensitive resin composition of the present invention is applied to a silicon wafer, a ceramic substrate, an aluminum substrate, and the like. Needed on a variety of substrates. As the coating device or the coating method, a spin coater, a die coater, a spray coater, a dipping, a printing, a knife coater, a roll coating method, or the like can be used. The coated substrate was soft baked for 10 seconds to 1 hour at 159229.doc -45·201231509 80~200°c. 2) The step of irradiating the coating film with the active light to harden the exposed portion is performed by using an exposure projection device such as a contact aligner, a mirror projection, or a stepper, and irradiating the active light through a desired mask. As the active light, X-rays, electron beams, ultraviolet rays, visible rays, and the like can be used, but in the present invention, it is preferred to use a wavelength of 200 to 500 nm. From the viewpoint of resolution and operability of the pattern, the wavelength of the light source is particularly preferably uv_i ray (365 nm) as an exposure projection device, which is particularly preferably a stepping machine. After step 2), in order to increase the sensitivity and the like, it may be necessary to perform a post-exposure bake in any combination of temperature and time (preferably temperature 4 (rc~2〇(rc, time 1 〜 to 3 〇 minutes)). Bake (PEB, Post exposure bake) or pre-development bake. 3) Step of removing the uncured portion of the film using a developing solution This step can be carried out by a dipping method, a liquid coating method, or a rotary spray method. As the developer, a good solvent of the photosensitive resin composition of the present invention or a good solvent and a poor solvent may be used as appropriate. Examples of the good solvent include N-methyl-2-pyrrolidone. N_acetamido_2_pyrrolidone' N,N-dimethylacetamide, N,N-dimethylformamide, dimethyl sulphur, P-butyrolactone, α-ethinyl-γ _butyrolactone, cyclopentanone, cyclohexanone, propylene glycol monoterpene ether, propylene glycol monomethyl ether acetate, methyl ethyl ketone, methyl isobutyl _, etc. "As a poor solvent, methanol, ethanol , isopropyl alcohol, water, etc. After the development is completed, the eluent is used for cleaning, and the developer is removed, thereby obtaining a bump map. As the eluent, it may be used alone or as appropriate 159229.doc 46· 201231509 in combination with distilled water 'decanol, ethanol, isopropanol, propylene glycol monomethyl ether, etc., or may be used in combination in stages. The step of heating the hardened portion together with the substrate ((final) heating step, PEB treatment) has a concave-convex pattern obtained at 150 to 260 in the manner as described above. (: It can be converted into a hardened concave-convex pattern. This heat-hardening can be carried out using a heating plate, an oxidation-free oven, a temperature-increasing oven capable of setting a temperature program, etc. as heat hardening.

時之環境氣體,可使用大氣(空氣),亦可視需要使用氮 氣、氩氣等惰性氣體。 將藉由上述製造方法獲得之硬化凹凸圖案用作選自由形 成於夕日a 15等基板上之半導體裝置之表面保護膜、層間絕 緣膜、(X射線屏蔽膜、微透鏡陣列等微構造體與其封裝材 料之間之支持體(隔離壁)所組成之群中之任一者,進而、應 用眾所周知之半導體裝置之製造方法中之其他步驟,藉此 可製造含有CMOS影像感測器等光學元件之各種半導體裝 置又,可獲仔具有包含使感光性樹月旨組合物硬化而獲得 之樹脂之塗膜的電子零件或半導體裝置。 [實施例] 案發明之範圍並不限定於該等。 [實施例1 ]感光性樹脂組合物 於2 L之可分離式燒舨中添 力作為矽烷醇化合物之二環 戊基矽烷二醇1·37莫耳(275 裒 ^ 1乍為疏氧基矽烷化合物夕 (CH3〇)3-Si-(CH2)3-〇-(c=〇)_c(CH、 (H3)=CH2 1.37 莫耳(341 159229.doc -47- 201231509 g)、及作為觸媒之Ba(〇H)2 · h20 0.00858莫耳(1.63 g),於 安裝有用以除去所生成之醇之李比希冷卻管(Liebig condenser)之狀態下,於油浴中進行5〇〇 hpa之減壓化自 室溫緩慢地升溫至5(rc,於反應開始後反應溶液變為透明 (即二環戊基矽烷二醇溶解)時減壓至25〇 hPa。於此狀態下 繼續攪拌,利用李比希冷卻管將由此產生之甲酵冷卻而液 化,並開始其除去至體系外,確認此狀態後,進而繼續反 應2小時。繼而’於與減壓時間點相同之溫度下以不引起 爆沸之方式緩慢地降低真空度,一面於8〜15 hPaT進而將 曱醇除去一面繼續反應2小時。最後恢復至常壓而結束甲 醇之除去。將所獲得之白色渾濁黏性液體溶解於環己烧, 過濾後,利用蒸發器將溶劑除去後,於8(rc下進行3〇分鐘 真空抽吸。放置冷卻後,恢復至室溫後,添加甲醇,進行 攪拌,除去上清液,並重複三次上述操作。使用蒸發器於 60°C下將所獲得之不溶於甲醇之部分除去後,於8〇&lt;&gt;c下乾 燥1 _5小時。所獲得之聚有機矽氧烷之重量平均分子量為 5,329。於所獲得之聚有機矽氧烷中,其Si原子數之3〇%包 含於上述通式(2)(式中,X為-(CH2)3·)所表示之結構内(藉 由13C-NMR測定)。於iH_NMR中酯部位之源自羧酸之波峰 減少31°/。,於GPC圖表中重量平均分子量為ι,〇5〇以上之面 積為83°/〇(圖1、圖2及圖3)。 相對於聚有機矽氧烷100質量份添加光自由基聚合起始 劑DAROCURE 1173(Ciba公司製造)2質量份而獲得感光性 樹脂組合物。 159229.doc -48 - 201231509 酯部位之源自叛酸之波峰之減少率係藉由於1H-NMR譜 中比較(CH30)3-Si-(CH2)3-0-(C=0)-C(CH3)=CH2 之-C=CH2 與Si-CH2-而算出。 [實施例2]感光性樹脂组合物 使用(CH30)3-Si-(CH2)3-0-(C=0)-CH=CH2代替實施例 1 之 (CH30)3-Si-(CH2)3-0-(C=0)-C(CH3)=CH(CH3),使之反應At the time of the ambient gas, the atmosphere (air) may be used, and an inert gas such as nitrogen or argon may be used as needed. The hardened concavo-convex pattern obtained by the above-described manufacturing method is used as a surface protective film selected from a semiconductor device formed on a substrate such as an a-day a 15 , an interlayer insulating film, a micro-structure such as an X-ray shielding film or a microlens array, and a package thereof Any one of the groups of the support (separation wall) between the materials, and further, other steps in the manufacturing method of the well-known semiconductor device, whereby various optical components including CMOS image sensors can be manufactured Further, in the semiconductor device, an electronic component or a semiconductor device including a coating film of a resin obtained by curing the photosensitive resin composition can be obtained. [Embodiment] The scope of the invention is not limited thereto. 1] The photosensitive resin composition is added to a 2 L separable roasting ketone as a decyl alcohol compound of dicyclopentyl decanediol 1.37 mol (275 裒 ^ 1 乍 is an oxodecane compound eve ( CH3〇)3-Si-(CH2)3-〇-(c=〇)_c(CH, (H3)=CH2 1.37 Mo (341 159229.doc -47- 201231509 g), and Ba as a catalyst 〇H)2 · h20 0.00858 Mo (1.63 g), installed In a state where the Liebig condenser for removing the produced alcohol is removed, the pressure reduction of 5 〇〇hpa in an oil bath is gradually increased from room temperature to 5 (rc, and the reaction solution becomes after the reaction starts. When it is transparent (that is, the dicyclopentyl decanediol is dissolved), the pressure is reduced to 25 〇 hPa. In this state, stirring is continued, and the thus-produced collagen is cooled and liquefied by a Liebig cooling tube, and the removal is started until the system is confirmed. After this state, the reaction was further continued for 2 hours. Then, the degree of vacuum was slowly lowered at the same temperature as the time of the depressurization so as not to cause a bump, and the reaction was continued while removing the decyl alcohol at 8 to 15 hPaT. Finally, the reaction was resumed to normal pressure to complete the removal of methanol. The obtained white turbid viscous liquid was dissolved in cyclohexane, filtered, and the solvent was removed by an evaporator, and then vacuum-extracted at 8 (rc for 3 minutes). After standing to cool, after returning to room temperature, methanol was added, stirring was carried out, the supernatant was removed, and the above operation was repeated three times. The obtained methanol-insoluble portion was obtained at 60 ° C using an evaporator. After removal, it was dried at 8 Torr &lt;&gt;c for 1 to 5 hours. The obtained polyorganosiloxane had a weight average molecular weight of 5,329. Among the obtained polyorganosiloxanes, the number of Si atoms was 3〇. % is contained in the structure represented by the above formula (2) (wherein, X is -(CH2)3·) (determined by 13C-NMR). The peak of the carboxylic acid-derived ester moiety in the iH_NMR is 31. °/., in the GPC chart, the weight average molecular weight is ι, and the area above 〇5〇 is 83°/〇 (Fig. 1, Fig. 2 and Fig. 3). 2 parts by mass of a photoradical polymerization initiator DAROCURE 1173 (manufactured by Ciba Co., Ltd.) was added to 100 parts by mass of the polyorganosiloxane to obtain a photosensitive resin composition. 159229.doc -48 - 201231509 The reduction rate of the ester-derived peaks from the ester sites is based on the comparison of (CH30)3-Si-(CH2)3-0-(C=0)-C in the 1H-NMR spectrum. CH3)=CH2 is calculated by -C=CH2 and Si-CH2-. [Example 2] The photosensitive resin composition was replaced with (CH30)3-Si-(CH2)3-0-(C=0)-CH=CH2 instead of (CH30)3-Si-(CH2)3 of Example 1. -0-(C=0)-C(CH3)=CH(CH3), reacting

75分鐘’使用乙腈代替甲醇作為所獲得之聚有機矽氧院之 清洗溶劑,除此以外,以與實施例丨相同之方式進行聚有 機矽氧烷之合成。所獲得之聚有機矽氧烷之重量平均分子 量為1,582。於所獲得之聚有機矽氧烷中,其“原子數之 27%包含於上述通式(2)所表示之結構内,並且χ為 (藉由13C-NMR測定於《Η-NMR中酯部位之源自羧酸之波 峰減少29%(圖4)。相對於所獲得之聚有機矽氧烷1〇〇質量 份添加光自由基聚合起始劑Lucirin(註冊商標)tp〇(basf 公司製造)2質量份而獲得感光性樹脂組合物。 酯部位之源自羧酸之波峰之減少率係藉由於,h _ n Μ r譜 中比較(CH30)3-Si-(CH2)3-〇-(C=〇)-CH=CH2 之 _CH=CH2 (5·80 ppm、6.10 ppm、6.37 ppm 附近之波峰)與 8丨偶_2 (0.65 ppm附近之波峰)而算出。 [實施例3 ]感光性樹脂組合物 除了將實施例2之反應時間設為6〇分鐘以外以與實施 例2相同之方式進行。所獲得之聚有機石夕氧燒之重量平均 =量=…於所獲得之聚有財氧貌中,其⑴原子數 。包含於上述通式⑺所表示之結構内,並且Μ 159229.doc •49· 201231509 -(CH2)3-(藉由丨3C_NMR測定)。於1H-NMR中酯部位之源自 羧酸之波峰減少2 2 %。 [實施例4]感光性樹脂組合物 除了將實施例2之反應時間設為45分鐘以外,以與實施 例2相同之方式進行。所獲得之聚有機矽氧烷之重量平均 分子量為1,380。於所獲得之聚有機矽氧烷中,其&amp;原子數 之12°/。包含於上述通式(2)所表示之結構内並且X為 -(CH2)3·。於1H-NMR中酯部位之源自羧酸之波峰減少 13%。 [實施例5]感光性樹脂組合物 除了將實施例2之反應時間設為30分鐘以外,以與實施 例2相同之方式進行。所獲得之聚有機矽氧烷之重量平均 分子量為1,260。於所獲得之聚有機矽氧烷中,其&amp;原子數 之9%包含於上述通式(2)所表示之結構内,並且χ為 -(CH2)3·(藉由13C-NMR測定)。於iH_NMRt酯部位之源自 羧酸之波峰減少9°/〇。 [實施例6]感光性樹脂組合物 將實施例1之感光性樹脂冷卻至室溫後,於添加光自由 基聚合起始劑之同時,添加A_600(新中村化學工業股份有 限公司製造)5質量%、A_DCP(新中村化學工業公司製 造)45質量。/〇,除此以外,進行與實施例丨相同之處理,而 獲得感光性樹脂組合物。 [實施例7]感光性樹脂組合物 將實施例2之感光性樹脂冷卻至室溫後,於添加光自由 159229.doc •50- 201231509 基聚合起始劑之同時,添加A-600(新中村化學工業股份有 限公司製造)1〇質量%、A-DCP(新中村化學工業股份有限 公司製造)5質量%,除此以外,進行相同之處理,而獲得 感光性樹脂組合物β [實施例8] . 於2 L之可分離式燒瓶中添加作為烷氧基矽烷化合物之 (CH30)3-Si-(CH2)3-〇-(C=〇)-CH=CH2 0.2莫耳(49.8 g)、作 為觸媒之Ba(OH)2 · H2〇 0.001莫耳(0·19 g)、及水〇 18莫耳 〇 (3.24幻,於安裝有用以除去所生成之醇之李比希冷卻管 之狀態下,於油浴中進行250 hPa之減壓化,自室溫緩慢 地升溫至50°C。於此狀態下繼續攪拌,利用李比希冷卻管 將由此所產生之甲醇冷卻而液化,並開始將其除去至體系 外,確認此狀態後,進而繼續反應2小時。其後,使反應 溫度緩慢地升溫至8(TC,其後,進而反應2小時後,以不 會引起爆沸之方式緩慢地降低真空度,—面於8〜15 hpaT 〇 $而將甲醇除去-面繼續反應2小時。最後,恢復至常壓 而結束甲醇之除去。將所獲得之白色渾濁黏性液體溶解於 環己院,過遽後,利甩蒸發器除去溶劑後,於8〇&lt;t下進行 3〇分鐘真空抽吸。放置冷卻後,恢復至室溫,添加甲醇, 進行搜拌,除去上清液,並重複三次上述操作。使用蒸發 HMGC下將所獲得之不溶於甲醇之部分除去後於机 下乾燥1.5小時。所獲得之聚有機矽氧烷之重量平均分子 ’ 56 *所獲得之聚有機⑦氧烧中,其Si原子數之 匕含於上述通式(2)所表示之結構内,並且X為_(ch2)3- 159229.doc 51 201231509 (藉由^C-NMR測定)。於1H-NMR中酿部位之源自羧酸之波 峰減少16 %。 [比較例1]感光性樹脂組合物 於300 mL之可分離式燒瓶中添加作為矽烷醇化合物之二 環戊基矽烷二醇0.1 50莫耳(3〇.〇 g) '作為烷氧基矽烷化合 物之(CH30)3-Si-(CH2)3-0-(C=0)-C(CH3)=CH2 0.15 莫耳 (37.2 g)、及作為觸媒之 Ba(OH)2.H2〇 〇 〇〇〇3 莫耳(〇 〇945 g),於安裝有用以除去所生成之醇之李比希冷卻管之狀態 下,於油浴中進行500 hPa之減壓化„王,皿硬戊地开胍 至50°C,於反應開始後反應溶液變為透明(即二環戊基矽 烷二醇溶解)時減壓至25〇 hPa。於此狀態下繼續攪拌,利 用李比希冷卻管將由此所產生之甲醇冷卻而液化,並開始 將其除去至體系外,確認此狀態後,進而反應2小時。繼 而,於與減壓時間點相同之溫度下以不會引起爆沸之方式 緩慢地降低真空度,一面於8〜15 hPa下進而將甲醇除去一 面繼續反應2小時。最後,恢復至常壓而結束曱醇之除 去。將所獲得之白色渾濁黏性液體溶解於環己烷中,過濾 後利用蒸發器除去溶劑後,於80°C下進行30分鐘真空抽 吸。所獲得之聚有機矽氧烷之重量平均分子量為L002。 於所獲得之聚有機矽氧烷中,其Si原子數之1%以下包含於 上述通式(2)所表示之結構内,並且X為-(CH2)3-(藉由i3c_ R/貞丨疋)。於1 Η·ΝΜΙΙ中酯部位之源自羧酸之波峰之減少 率為1%以下。相對於所獲得之聚有機矽氧烷100質量份添 加2皙番、μ &amp; 物光自由基聚合起始劑Lucirin(註冊商標〕 159229.doc -52- 201231509 TPO(BASF公司製造)而獲得感光性樹脂組合物。 [性能比較結果1] 將藉由以玻璃基板夹持實施例1~8及比較例1中獲得之樹 脂組合物,並以直徑10 mm、厚度500 μιη進行3000 mJ/cm2 之曝光而獲得的硬化膜之性能示於下述表1。耐溫度衝擊 性(龜裂、剝離)之評價係使用Aspcs公司製造之TSE-11,以 目視檢查冷熱循環試驗(交替重複於+ 125°C之環境中進行 15分鐘、於-40°C之環境中進行15分鐘之試驗)中之形成於 玻璃基板上之樹脂中所產生之龜裂之有無與膜剝離之有 無。 將即便經過100次冷熱循環後樹脂亦無龜裂及膜剝離之 情形設為A, 將經過10次冷熱循環後樹脂無龜裂及膜剝離但於經過 10 0次後存在龜裂及膜剝離之情形設為B, 將經過10次冷熱循環後樹脂存在龜裂及膜剝離之情形設 [表1]The synthesis of the polyorganosiloxane was carried out in the same manner as in Example 75 except that acetonitrile was used instead of methanol as the cleaning solvent for the obtained polyorganosiloxane. The polyorganosiloxane obtained had a weight average molecular weight of 1,582. In the obtained polyorganosiloxane, "the 27% of the atomic number is contained in the structure represented by the above formula (2), and the oxime is (the ester moiety in the Η-NMR is determined by 13C-NMR). The peak of the carboxylic acid is reduced by 29% (Fig. 4). The photoradical polymerization initiator Lucirin (registered trademark) tp〇 (manufactured by Basf Co., Ltd.) is added to 1 part by mass of the obtained polyorganosiloxane. The photosensitive resin composition was obtained in an amount of 2 parts by mass. The reduction rate of the peak derived from the carboxylic acid of the ester moiety was obtained by comparing (CH30)3-Si-(CH2)3-〇- in the h _ n Μ r spectrum. C=〇)-CH=CH2 _CH=CH2 (5.80 ppm, 6.10 ppm, peak near 6.37 ppm) and 8丨 even_2 (peak near 0.65 ppm) were calculated. [Example 3] Photosensitive The resin composition was carried out in the same manner as in Example 2 except that the reaction time of Example 2 was set to 6 Torr. The weight average of the obtained polyorganisms was = the amount = ... In the financial oxygenation, the number of atoms (1) is contained in the structure represented by the above formula (7), and Μ 159229.doc •49· 201231509 -(CH2)3-(determined by 丨3C_NMR) The peak of the carboxylic acid-derived ester at the ester site was reduced by 22% in 1H-NMR. [Example 4] The photosensitive resin composition was the same as Example 2 except that the reaction time of Example 2 was 45 minutes. The weight average molecular weight of the obtained polyorganosiloxane is 1,380. In the obtained polyorganosiloxane, the number of atoms of &amp; 12 ° / is contained in the above formula (2) In the structure indicated and X is -(CH2)3. The peak of the carboxylic acid derived from the ester moiety in the 1H-NMR is reduced by 13%. [Example 5] The photosensitive resin composition except the reaction time of Example 2. The reaction was carried out in the same manner as in Example 2 except that the weight average molecular weight of the obtained polyorganosiloxane was 1,260. Among the obtained polyorganosiloxanes, the number of atoms was & 9% is contained in the structure represented by the above formula (2), and χ is -(CH2)3·(determined by 13C-NMR). The peak of the carboxylic acid-derived peak at the iH_NMRt ester site is reduced by 9°/〇. [Example 6] Photosensitive resin composition After the photosensitive resin of Example 1 was cooled to room temperature, photoradical polymerization was added thereto. At the same time as the initiator, the same treatment as in Example 进行 was carried out, except that 5 mass% of A_600 (manufactured by Shin-Nakamura Chemical Co., Ltd.) and A_DCP (manufactured by Shin-Nakamura Chemical Co., Ltd.) were added in an amount of 45 mass%. The photosensitive resin composition was obtained. [Example 7] Photosensitive resin composition After cooling the photosensitive resin of Example 2 to room temperature, it was added with the light free 159229.doc • 50-201231509-based polymerization initiator. The same treatment was carried out to obtain photosensitivity, except that A-600 (manufactured by Shin-Nakamura Chemical Co., Ltd.) was added in an amount of 1% by mass and A-DCP (manufactured by Shin-Nakamura Chemical Co., Ltd.). Resin composition β [Example 8]. (CH30)3-Si-(CH2)3-〇-(C=〇)-CH=CH2 was added as alkoxydecane compound in a 2 L separable flask. 0.2 mol (49.8 g), Ba(OH)2 · H2 〇 0.001 mol (0·19 g) as a catalyst, and leeches 18 moir (3.24 phantom, used to remove the alcohol produced In the state of the Liebig cooling tube, decompression at 250 hPa in an oil bath, slowing from room temperature Warmed to 50 ° C. Stirring was continued in this state, and the methanol thus produced was cooled and liquefied by a Liebig cooling tube, and the removal was started until the outside of the system. After confirming this state, the reaction was further continued for 2 hours. Thereafter, the reaction temperature was slowly raised to 8 (TC, and thereafter, after further reacting for 2 hours, the degree of vacuum was slowly lowered so as not to cause a bump, and the methanol was removed at 8 to 15 hpaT 〇$. - The surface was further reacted for 2 hours. Finally, the reaction was returned to normal pressure to complete the removal of methanol. The obtained white turbid viscous liquid was dissolved in the ring hexagram, and after the hydrazine was removed, the solvent was removed at 8 〇. Vacuum evacuation was carried out for 3 minutes at t. After cooling, return to room temperature, add methanol, stir the mixture, remove the supernatant, and repeat the above operation three times. The obtained methanol-insoluble HMGC was used. After partial removal, it is dried under the machine for 1.5 hours. The polyorgano 7 oxygen obtained by the weight average molecular molecule of the obtained polyorganosiloxane is obtained in the above formula (2). Within the structure indicated, and X is _(ch2)3- 159229.doc 51 201231509 (determined by ^C-NMR). The peak of the carboxylic acid-derived peak of the brewed portion was reduced by 16% in 1H-NMR. 1] A photosensitive resin composition is added to a 300 mL separable flask Dicyclopentyl decanediol of a stanol compound 0.1 50 mol (3 〇.〇g) '(CH30)3-Si-(CH2)3-0-(C=0)- as an alkoxydecane compound C(CH3)=CH2 0.15 Molar (37.2 g), and Ba(OH)2.H2〇〇〇〇〇3 Moer (〇〇945 g) as a catalyst, useful for installation to remove the alcohol produced In the state of the Liebig cooling tube, the decompression of 500 hPa was carried out in an oil bath. The king, the dish was softly opened to 50 ° C, and the reaction solution became transparent after the reaction started (ie, dicyclopentyl decane II). When the alcohol was dissolved, the pressure was reduced to 25 〇 hPa. In this state, the stirring was continued, and the methanol produced by the use of a Liebig cooling tube was cooled and liquefied, and the removal was started outside the system. After confirming this state, the reaction was further carried out for 2 hours. Then, at the same temperature as the depressurization time, the degree of vacuum was gradually lowered so as not to cause a bump, and the reaction was further continued for 2 hours while removing methanol at 8 to 15 hPa. Finally, the pressure was returned to normal pressure. And the sterol removal is completed. The obtained white turbid viscous liquid is dissolved in cyclohexane, and the evaporator is used after filtration. After removing the solvent, vacuum suction was carried out for 30 minutes at 80 ° C. The weight average molecular weight of the obtained polyorganosiloxane was L002. Among the obtained polyorganosiloxanes, the number of Si atoms was less than 1%. Included in the structure represented by the above formula (2), and X is -(CH2)3- (by i3c_R/贞丨疋). The peak of the carboxylic acid derived from the ester moiety in 1 Η·ΝΜΙΙ The reduction rate is 1% or less. In comparison with 100 parts by mass of the obtained polyorganosiloxane, 2 皙, μ &amp; photoradical polymerization initiator Lucirin (registered trademark) 159229.doc -52 - 201231509 TPO ( A photosensitive resin composition was obtained by the BASF company. [Performance Comparison Result 1] Hardening obtained by sandwiching the resin compositions obtained in Examples 1 to 8 and Comparative Example 1 with a glass substrate and exposing 3000 mJ/cm 2 with a diameter of 10 mm and a thickness of 500 μm The properties of the film are shown in Table 1 below. Temperature shock resistance (cracking, peeling) was evaluated by using TSE-11 manufactured by Aspcs to visually inspect the thermal cycle test (alternately repeated in an environment of +125 ° C for 15 minutes at -40 ° C environment In the test for 15 minutes, the presence or absence of cracks generated in the resin formed on the glass substrate and the presence or absence of film peeling were observed. The resin was cracked and the film was peeled off even after 100 cycles of heat and cold, and the resin was cracked and the film was peeled off after 10 cycles of heat and cold, but cracking and film peeling occurred after 10 times. The case is set to B, and the cracking and film peeling of the resin after 10 cycles of hot and cold cycles are set [Table 1].

實施例 1 實施例 2 實施例 3 實施例4 Si鍵中形成=Si-〇-X_Sis鍵之 比例(%) 30 27 21 12 W-NMR譜之源自羧酸之波峰 面積之減少率(%) 31 29 22 13 耐溫度衝擊 A A A B 159229.doc -53- 201231509 201231509 實施例 5 實施例 6 實施例 7 實施例 8 比較例 1 Si鍵中形成=Si-〇-X-S—鍵之比 例(%) 9 30 27 14 &lt;1 b-NMR譜之源自羧酸之波峰 面積之減少率(%) 9 31 29 16 &lt;1 ^溫度衝擊性* 人 jj· m人.a 本-~ΓΓΓ-:- B A A B C 冷熱循環試驗:A表示&gt;1〇〇次,B表示10〜100次,C表示&lt;10次 [實施例9]感光性樹脂組合物 於實施例1中,分別將反應溫度變更為95。€,將反應壓 力變更為常壓,將反應時間變更為3〇分鐘,將乾燥溫度變 更為130°c,將乾燥時間變更為3〇分鐘,除此以外,以與 實施例1相同之方式進行。所獲得之聚有機矽氧烷之重量 平均分子量為7,830。於所獲得之聚有機矽氧烷中,其_ 子數之48%包含於上述通式(2)所表示之結構内,並且以 -(CH2)3-。於iH-NMR中醋部位之源自羧酸之波峰減少 54。/。’於GPC圖表中分子量為i,咖以上之面積為_(圖 5 、圖 6) 〇 [實施例10]感光性樹脂組合物 將實施例1之感光性樹脂冷卻至室溫後,於添加光自由 基聚合起始劑之同時,添加丙烯酸二環戍稀導 513AS,日立化成股份有限、 限仏司製造)5〇質量%,除此以外 進行與實施例1相同之處理, 阳獲传感光性樹脂組合物。 [比較例2]感光性樹脂組合物 1中記載之方法合成之聚有 之方法獲得感光性樹脂組 使用依據專利文獻3之合成例 機矽氧烧’藉由與實施例1相同 合物。 159229.doc 54. 201231509 [性能比較結果2] 將藉由分別以玻璃基板夾持實施例1、6、9及1 0以及比 較例2中獲得之樹脂組合物,並以直徑1 0 mm、厚度500 μιη進行3000 mJ/cm2之曝光而獲得的硬化膜之性能示於下 述表2。耐溫度衝擊性(龜裂、剝離)之評價係以目視檢查冷 熱循環試驗(交替重複於+125°C環境中進行15分鐘,於 -40°C環境中進行15分鐘之試驗)中之形成於玻璃基板上之 樹脂中產生之龜裂之有無與膜剝離之有無。 將即便經過100次冷熱循環後樹脂亦無龜裂及膜剝離之 情形設為A, 將經過100次冷熱循環後樹脂存在龜裂及膜剝離之情形 設為B。 [表2] 表2Example 1 Example 2 Example 3 Example 4 Formation in Si bond = ratio of Si-〇-X_Sis bond (%) 30 27 21 12 W-NMR spectrum reduction rate of peak area derived from carboxylic acid (%) 31 29 22 13 Temperature shock resistance AAAB 159229.doc -53- 201231509 201231509 Example 5 Example 6 Example 7 Example 8 Comparative Example 1 Formation in Si bond = ratio of Si-〇-XS-bond (%) 9 30 27 14 &lt;1 b-NMR spectrum reduction rate of peak area derived from carboxylic acid (%) 9 31 29 16 &lt;1 ^temperature shock resistance* person jj· m person.a Ben-~ΓΓΓ-:- BAABC Cold and heat cycle test: A indicates &gt; 1 time, B indicates 10 to 100 times, and C indicates &lt; 10 times. [Example 9] The photosensitive resin composition was changed to 95 in Example 1 in each case. In the same manner as in the first embodiment, the reaction pressure was changed to the normal pressure, the reaction time was changed to 3 minutes, the drying temperature was changed to 130 ° C, and the drying time was changed to 3 minutes. . The weight average molecular weight of the obtained polyorganosiloxane was 7,830. In the obtained polyorganosiloxane, 48% of the number of _ subunits is contained in the structure represented by the above formula (2), and -(CH2)3-. The peak of the carboxylic acid derived from the vinegar moiety in iH-NMR was reduced by 54. /. 'The molecular weight is i in the GPC chart, and the area above the coffee is _ (Fig. 5, Fig. 6) 〇 [Example 10] Photosensitive resin composition After the photosensitive resin of Example 1 was cooled to room temperature, light was added thereto. At the same time as the radical polymerization initiator, 513AS of dicyclopentadienyl acrylate was added, and the product was manufactured by Hitachi Chemical Co., Ltd., limited to 5 mass%, and the same treatment as in Example 1 was carried out, and the sensory light was obtained. Resin composition. [Comparative Example 2] Method for obtaining a photosensitive resin by a method of synthesizing the photosensitive resin composition 1 The method of using the composition according to Patent Document 3 is the same as that of Example 1. 159229.doc 54. 201231509 [Performance comparison result 2] The resin compositions obtained in Examples 1, 6, 9, and 10 and Comparative Example 2 were respectively held by a glass substrate, and were 10 mm in diameter and thickness. The properties of the cured film obtained by subjecting 500 μm to 3000 mJ/cm 2 were shown in Table 2 below. The evaluation of temperature resistance (cracking, peeling) was carried out by visual inspection of the thermal cycle test (alternately repeated in a +125 ° C environment for 15 minutes, and in a -40 ° C environment for 15 minutes) The presence or absence of cracks in the resin on the glass substrate and the presence or absence of film peeling. In the case where the resin was not cracked and the film was peeled off even after 100 cycles of the heat and cold cycle, the resin was cracked and the film was peeled off after 100 times of the heat cycle. [Table 2] Table 2

實施例1 實施例6 實施例9 實施例10 比較例2 分子量 5329 5329 7830 5329 6629 高分子量含有率υ 83% 83% 89% 83% 67% 耐溫度衝擊性a A A A A B ※冷熱循環試驗:A表示&gt;100,B表示&lt;100 υ所謂高分子含有率,表示於GPC之RI檢測器之圖表中重量平均分子量為1,050以 上之部分之面積。 [實施例11]感光性樹脂組合物 於實施例7之感光性樹脂組合物中進而添加抗氧化劑 IRGANOX 245(BASF公司製造)0.28質量份與抗氧化劑GSY-P101(大崎工業股份有限公司製造)0.11質量份,除此以外 進行與實施例7相同之處理,而獲得感光性樹脂組合物。 自藉由分別以玻璃基板夾持實施例7及11中獲得之樹脂 159229.doc •55· 201231509 組合物,並以厚度500 μιη進行3000 mJ/cm2之曝光而獲得 的硬化膜,將一側之玻璃基板剝離而製作樣品。將於氮氣 中或氧氣濃度為7%之氮氣環境中,於1 50°C下對所獲得之 樣品進行1 3小時之加熱處理(將氮氣中設為A1,將氧氣7% 環境中設為A2)時的波長400 nm下之透射率,與進而於氮 氣中,於260°C下對上述加熱處理樣品進行1 〇秒x3次之加 熱處理(B)時的波長400 nm下之透射率示於下述表3。硬化 膜之透射率係使用日本分光股份有限公司製造之紫外可見 分光光度計V-550,以未處理之玻璃基板為參考而測定。 得知添加有抗氧化劑之實施例10之感光性樹脂組合物於氧 氣存在下之熱穩定性提高。 [表3] 表3 實施例7 透射率(%) 實施例11 透射率(%) 加熱處理(A1) 96 97 加熱處理(A1)+(B) 96 96 加熱處理(A2) 83 94 加熱處理(A2)+(B) 78 93 [產業上之可利用性] 根據本發明,可獲得用於需要260°C之回流焊步驟之固 體攝像元件或電子零件一體型製品之製造用途的耐熱性感 光性透明樹脂,因此可獲得適合於要求耐熱性之塑膠透鏡 或投影器之液晶偏光板用光學元件。 【圖式簡單說明】Example 1 Example 6 Example 9 Example 10 Comparative Example 2 Molecular weight 5329 5329 7830 5329 6629 High molecular weight content υ 83% 83% 89% 83% 67% Temperature shock resistance a AAAAB ※Cold and heat cycle test: A indicates &gt 100, B represents a polymer content of &lt;100 υ, and represents an area of a portion having a weight average molecular weight of 1,050 or more in a graph of an RI detector of GPC. [Example 11] Photosensitive resin composition Further, an antioxidant IRGANOX 245 (manufactured by BASF Corporation), 0.28 parts by mass, and an antioxidant GSY-P101 (manufactured by Osaki Industries Co., Ltd.) 0.11 were further added to the photosensitive resin composition of Example 7. The same treatment as in Example 7 was carried out, except that the photosensitive resin composition was obtained. A cured film obtained by sandwiching the composition of the resin 159229.doc • 55· 201231509 obtained in Examples 7 and 11 with a glass substrate and exposing at 3000 mJ/cm 2 with a thickness of 500 μm, The glass substrate was peeled off to prepare a sample. The obtained sample is subjected to heat treatment at 150 ° C for 1 to 3 hours in nitrogen or oxygen atmosphere at a concentration of 7% (the nitrogen is set to A1, and the oxygen is set to 7% in the environment). The transmittance at a wavelength of 400 nm at a wavelength of 400 nm at a wavelength of 400 nm when the heat-treated sample is subjected to heat treatment at 260 ° C for 1 〇 3 times or 3 times at 260 ° C. Table 3 below. The transmittance of the cured film was measured using an ultraviolet-visible spectrophotometer V-550 manufactured by JASCO Corporation, based on an untreated glass substrate. The photosensitive resin composition of Example 10 to which an antioxidant was added was found to have improved thermal stability in the presence of oxygen. [Table 3] Table 3 Example 7 Transmittance (%) Example 11 Transmittance (%) Heat treatment (A1) 96 97 Heat treatment (A1) + (B) 96 96 Heat treatment (A2) 83 94 Heat treatment ( A2) + (B) 78 93 [Industrial Applicability] According to the present invention, heat-resistant photosensitive light for use in manufacturing of a solid-state image sensor or an electronic component integrated product requiring a reflow step of 260 ° C can be obtained. Since the transparent resin is obtained, an optical element for a liquid crystal polarizing plate suitable for a plastic lens or a projector which requires heat resistance can be obtained. [Simple description of the map]

圖1係表示本發明之實施形態之聚有機矽氧烷之1H-NMR 159229.doc -56- 201231509 圖表的圖。 圖2係表示本發明之實施形態之聚有機矽氧烷之Gpc圖 表的圖。 圖3係表示本發明之實施形態之聚有機石夕氧烧之丨3C_ NMR圖表的圖。 ' 圖4係表示本發明之另一實施形態之聚有機石夕氧院之ιΗ_ NMR圖表的圖。 圖5係表示本發明之又一實施形態之聚有機矽氧貌之,η· NMR圖表的圖。 圖ό係表示本發明之又一實施形態之聚有機矽氧院之 GPC圖表的圖。 圖7係表示本發明之實施形態之聚有機矽氧燒之 COSY光譜的圖β 圖8係表示本發明之實施形態之聚有機矽氧境之 COSY光譜的圖。 ❹ 159229.doc •57-Fig. 1 is a view showing a chart of 1H-NMR 159229.doc - 56 - 201231509 of a polyorganosiloxane according to an embodiment of the present invention. Fig. 2 is a view showing a Gpc chart of a polyorganooxynitane according to an embodiment of the present invention. Fig. 3 is a view showing a C3C_NMR chart of a polyorganococcal oxynitride according to an embodiment of the present invention. Fig. 4 is a view showing an ιΗ_NMR chart of a polyorganismite according to another embodiment of the present invention. Fig. 5 is a view showing a η· NMR chart of a polyorganophosphorus oxide according to still another embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a GPC chart of a polyorganotoxime according to still another embodiment of the present invention. Fig. 7 is a view showing a COSY spectrum of a polyorgano-oxygenated gas according to an embodiment of the present invention. Fig. 8 is a view showing a COSY spectrum of a polyorgano-oxygen atmosphere according to an embodiment of the present invention. ❹ 159229.doc •57-

Claims (1)

201231509 七、申請專利範圍: 1 · 一種感光性樹脂組合物,其含有: 聚有機矽氧烷(a) 100質量份、及 光聚合起始劑(b) 0.01〜30質量份, Ο ο 上述聚有機矽氧烷(a)係藉由將下述通式(1)所表示之 至少一種烷氧基矽烷化合物、及觸媒混合並使之聚合之 方法獲得的具有聚合性官能基者,該聚有機矽氧烷(&amp;)含 有下述通式(2)所表示之結構,且該聚有機矽氧烷(a)所具 有之Si原子數中之5〜60%包含於上述通式所表示之結 構内, R'aR^SiCOR3),.^ (1) {式中,R1為碳數2〜17之含有酯鍵之有機基,Ri之至少 一個具有丙稀醯基或曱基丙烯酿基,R2於存在複數個之 情形時分別獨立為可具有取代基之碳數卜⑺之脂肪族 基’ R3於存在複數個之情形時分別獨立為甲基或乙基, a為1或2之整數,b為〇〜2之整數,並且a+b為3以下} = Si-0-X-Si= (2) {式中’ X為碳數1〜15之有機基}。 2.如請求項1之感光性樹脂組合物,其中上述聚有機矽氧 烧(a)係藉由將上述㉟式⑴所表示之至少一種院氧基石夕烷 化合物、下述通式(3)所表示之至少一種矽烷醇化合物、 及觸媒混合並使之聚合之方法而獲得者, R R Si(〇H)2 (3) (式中,R4及R5為可具有取代基之碳數3〜1〇之脂肪族 159229.doc 201231509 基'脂環式基或芳香族基}。 3.如請求項1或2之感光性樹脂組合物,其中上述聚有機石夕 氧烷(a)所具有之si原子數中之〜40%包含於上述通式 (2)所表示之結構内。 4· 一種感光性樹脂組合物,其含有·· 聚有機矽氧烷(a) 100質量份、及 光聚合起始劑(b) 0.01〜30質量份, 上述聚有機矽氧烷(a)係藉由將下述通式〇)所表示之 至少一種烷氧基矽烷化合物、及觸媒混合並使之聚合之 方法而獲得者,且丨H-NMR譜中之酯鍵之源自羧酸之波 峰面積與酯鍵之源自醇之波峰面積的比與添加時相比減 少5〜60%, R'aR^SiCOR3)^^, ⑴ {式中,R1為碳數2〜17之含有酯鍵之有機基,Ri之至少 一個具有丙烯醯基或甲基丙烯醯基,R2於存在複數個之 情形時分別獨立為可具有取代基之碳數卜1〇之脂肪族 基,R3於存在複數個之情形時分別獨立為氫、甲基或乙 基,a為1或2之整數,“ο〜2之整數,並且㈣為以 下}。 5.如請求項4之感光性樹脂組合物,其中上述聚有機石夕氧 烧⑷係藉由將上述通式⑴所表示之至p㈣氧 化合物、下述通式⑺所表示之至少-種錢醇化合物、 及觸媒混合並使之聚合之方法而獲得者, 物 R4R5Si(OH)2 (3) 159229.doc 201231509 {式中,R4及R5為可具有取代基之 基、脂環式基或芳香族基卜 之脂肪族 6.如請求項4或5之感光性樹脂組合物,其中上述 氧烷⑷係丨H-NMR譜中之酯鍵之源自 ^ 硬暖之波峰面積與 酉曰鍵之源自醇之料面積的比與添加時相比減少1〇〜4〇% 者。 7· —種感光性樹脂組合物,其含有: Ο ο 聚有機矽氧烷(a) 100質量份、及 光聚合起始劑(b)0.01〜30質量份, ^述聚有㈣氧燒⑷係藉由將下述通式⑴所表示之 至)一種院氧基;化合物、τ述通式(3)所表示之至少 /一種石夕院醇化合物、及觸媒混合並使之聚合之方法而獲 得者’且於凝膠渗透層析法(Gpc)測定中標準聚苯乙烯 換算之重量平均分子量以上的面積為7G%以上, RWbSHOR^.ab ⑴ {式中,R1為碳數2〜17之含有酯鍵之有機基,R1之至少 一個具有丙烯醯基或曱基丙烯醯基,R2於存在複數個之 情形時分別獨立為可具有取代基之碳數丨〜1〇之脂肪族 基,R3於存在複數個之情形時分別獨立為曱基或乙基, 丑為1或2之整數’ b為〇〜2之整數,並且a+b為3以下} R4R5Si(〇H)2 (3) {式中’R及R5為可具有取代基之碳數3〜1〇之脂肪族 基、脂環式基或芳香族基}。 8.如請求項1至7中任一項之感光性樹脂組合物,其中上述 159229.doc 201231509 通式⑴所表*之絲基我化合物為下述通式⑷所表 不之至少一種烷氧基矽烷化合物, H2C=C(R6Hc=〇)〇(CH2)n_siR7j〇R8h ⑷ R為氫或甲基,R7於存在複數個之情形時分別 獨立為可具有取代基之碳數卜10之脂肪族基,R8於存在 複數個之情形時分別獨立為甲基或乙基,。為〇〜2之整 9. 10. Π. 12. 13. 14. 數上’ d為i〜3之整數,則為3以下,並且n為卜叫。 如咕求項2、3及5至8中任一項之感光性樹脂組合物其 :上述通式(3)中之❼^至少―者為可具有取代基之 碳數3〜1〇之脂環式基。 青求項1至9中任一項之感光性樹脂組合物,其相對於 聚有機矽氧烷⑷100質量份進而含有乙烯性不飽和加成 聚合性單體(C)〇.l〜1000質量份。 如请未項1G之感光性樹脂組合物,其中上述乙烯性不飽 和加成聚合性單體⑷為含有脂環式基之化合物。 如請求項1至11中任-項之感光性樹脂組合物,其進而 含有選自由紫外線吸收劑、光穩定劑、接著助劑、、聚人 抑制劑、增感劑'抗氧化劑及平滑性賦予劑所組成之群 中之至少1種添加劑。 如請求項1至12中任-項之感光性樹脂组合物,其中上 述感光性樹脂組合物中之驗金屬或驗土金屬濃度為 〇. 1〜500 ppm。 種聚有機矽氧烷之製造方法,其包括: 〇將下述通式⑴所表示之至少—我氧基#化合 159229.doc 201231509 物、相對於存在於反應體系中之烷氧基矽烷化合物所具 有之〇R3Si當量為0.01〜〇_5當量之水、及觸媒加以混 合,於20〜130°C下,使之反應〇. 由反應而生成之醇除去至體系外 烷(a)之步驟, 1〜20小時,且一面將藉 ,一面生成聚有機矽氧 R 丨 aR2bSi(〇R3)“_b (1)201231509 VII. Patent application scope: 1 . A photosensitive resin composition comprising: polyorganosiloxane (a) 100 parts by mass, and photopolymerization initiator (b) 0.01 to 30 parts by mass, Ο ο The organosiloxane (a) is a polymerizable functional group obtained by a method in which at least one alkoxydecane compound represented by the following formula (1) and a catalyst are mixed and polymerized, and the polymerization is carried out. The organic oxime (&amp;) contains a structure represented by the following formula (2), and 5 to 60% of the number of Si atoms of the polyorganosiloxane (a) is represented by the above formula In the structure, R'aR^SiCOR3), .^ (1) wherein R1 is an organic group having an ester bond of 2 to 17 carbon atoms, and at least one of Ri has an acrylonitrile group or a mercapto propylene group. When R2 is present in a plurality of cases, it is independently an aliphatic group of the carbon number which can have a substituent (7). R3 is independently a methyl group or an ethyl group in the case of a plurality of cases, and a is an integer of 1 or 2. , b is an integer of 〇~2, and a+b is 3 or less} = Si-0-X-Si= (2) {wherein X is an organic group having 1 to 15 carbon atoms}. 2. The photosensitive resin composition of claim 1, wherein the polyorganooxime (a) is at least one of the amphoteric compounds represented by the above formula (1), and the following formula (3) The method of obtaining and polymerizing at least one stanol compound and a catalyst, RR Si(〇H)2 (3) (wherein R4 and R5 are carbon atoms which may have a substituent 3~ 1. A photosensitive resin composition according to claim 1 or 2, wherein the polyorgano-oxyalkane (a) has the above-mentioned aliphatic 159229.doc 201231509. ~40% of the number of si atoms is contained in the structure represented by the above formula (2). 4. A photosensitive resin composition containing 100 parts by mass of polyorganosiloxane (a) and photopolymerization The initiator (b) is 0.01 to 30 parts by mass, and the polyorganosiloxane (a) is obtained by mixing and polymerizing at least one alkoxydecane compound represented by the following formula (〇) and a catalyst. Obtained by the method, and the ester bond derived from the carboxylic acid in the H-NMR spectrum is derived from the peak region of the carboxylic acid and the peak derived from the ester bond. The ratio of the area is reduced by 5 to 60% compared with the case of addition, R'aR^SiCOR3)^^, (1) where R1 is an organic group having an ester bond of 2 to 17 carbon atoms, and at least one of Ri has an acrylonitrile Or a methacryloyl fluorenyl group, and R2 is independently an aliphatic group which may have a carbon number of a substituent in the case where a plurality of groups are present, and R3 is independently hydrogen, methyl or Ethyl, a is an integer of 1 or 2, "an integer of ο~2, and (4) is the following.) 5. The photosensitive resin composition of claim 4, wherein the above-mentioned polyorganismite (4) is R4R5Si(OH)2 (3) obtained by the method of mixing the p(tetra)oxy compound represented by the above formula (1), at least the mercapto compound represented by the following formula (7), and a catalyst, and polymerizing the same. In the formula, R 4 and R 5 are an aliphatic group which may have a substituent group, an alicyclic group or an aromatic group. The photosensitive resin composition of claim 4 or 5, wherein the above oxyalkylene (4) The ester bond in the H-NMR spectrum is derived from the peak area of the hard warming and the area of the alcohol-derived material from the oxime bond. It is reduced by 1 〇 to 4 〇% compared with the case of addition. 7.1. A photosensitive resin composition containing: Ο ο polyorganosiloxane (a) 100 parts by mass, and a photopolymerization initiator (b) 0.01 to 30 parts by mass, ^ 聚聚 (4) Oxygen (4) is represented by the following formula (1): a compound of the formula; τ, at least one of the formulas represented by the formula (3) In the gel permeation chromatography (Gpc) measurement, the area of the weight average molecular weight of the standard polystyrene conversion is 7 G% or more, and the RWbSHOR^ is obtained by the method of mixing and polymerizing the alcohol compound and the catalyst. .ab (1) wherein R1 is an organic group having an ester bond of 2 to 17 carbon atoms, and at least one of R1 has an acryloyl group or a fluorenyl fluorenyl group, and R2 may independently have a plurality of cases. The aliphatic group of the carbon number of the substituent 丨~1〇, R3 is independently a fluorenyl group or an ethyl group in the case of a plurality of cases, and the ugly is an integer of 1 or 2 'b is an integer of 〇~2, and a+ b is 3 or less} R4R5Si(〇H)2 (3) {wherein 'R and R5 are aliphatic groups having 3 to 1 carbon atoms which may have a substituent Alicyclic group or an aromatic group}. 8. The photosensitive resin composition according to any one of claims 1 to 7, wherein the above-mentioned 159229.doc 201231509 is a compound of the formula (1), and the at least one alkoxy group represented by the following formula (4) A decane compound, H2C=C(R6Hc=〇)〇(CH2)n_siR7j〇R8h (4) R is hydrogen or a methyl group, and R7 is independently an aliphatic group which may have a substituent and a carbon number in the presence of a plurality of The base, R8, is independently methyl or ethyl in the presence of a plurality of cases. It is 〇~2. 9. 10. Π. 12. 13. 14. When the number 'd is an integer from i to 3, it is 3 or less, and n is a call. The photosensitive resin composition according to any one of the items 2, 3, and 5 to 8, wherein at least one of the above formula (3) is a carbon having a carbon number of 3 to 1 可 which may have a substituent Ring base. The photosensitive resin composition according to any one of the items 1 to 9 further comprising an ethylenically unsaturated addition polymerizable monomer (C) 〇1 to 1000 parts by mass based on 100 parts by mass of the polyorganosiloxane (4). . The photosensitive resin composition according to the item 1G, wherein the ethylenically unsaturated addition polymerizable monomer (4) is a compound containing an alicyclic group. The photosensitive resin composition according to any one of claims 1 to 11, further comprising an ultraviolet ray absorbing agent, a light stabilizer, a auxiliaries, a poly-inhibitor, a sensitizer, an antioxidant, and a smoothness imparting At least one additive of the group consisting of the agents. The photosensitive resin composition according to any one of claims 1 to 12, wherein the metal or soil-measuring metal concentration in the photosensitive resin composition is from 0.1 to 500 ppm. A method for producing a polyorganosiloxane, comprising: hydrating at least a oxy group represented by the following formula (1): 159229.doc 201231509, relative to an alkoxy decane compound present in the reaction system The water having a R3Si equivalent of 0.01 to 〇5 equivalents and a catalyst are mixed and reacted at 20 to 130 ° C. The step of removing the alcohol formed by the reaction to the external alkane (a) , 1~20 hours, and one side will borrow, one side of polyorgano-oxygen R 丨aR2bSi (〇R3) "_b (1) 15.15. {式中,R1為碳數2〜17之含有酯鍵之有機基,Rl之至少 一個具有丙烯醯基或曱基丙烯醯基,R2於存在複數個之 情形1分別獨立為可具有取代基之碳數卜1〇之脂肪族 基,R3於存在複數個之情形時分別獨立為曱基或乙基, a為1或2之整數,b為〇〜2之整數,並且a+b為3以下丨^及 π)利用不會溶解聚有機矽氧烷之溶劑對該聚有機矽氧 院(a)進行清洗之步驟。 一種聚有機矽氧烷之製造方法,其包括: i)將下述通式⑴所表示之至少―種烧氡基錢化合 物、下述通式(3)所表示之至少—種石夕燒醇化合物、及觸 媒加以混合,於20〜BOX:下,使之反應(M〜20小時,且 一面將藉由反應而生成之醇除去至體系外 有機矽氧烷(a)之步驟, 一面生成聚 R aR2bSi(〇R3)4 a b ⑴ (式中,R1為碳數2〜17之含有酯鍵之有機基,r1之至少 一個具有丙烯醯基或甲基丙烯醯基,R2於存在複數個之 :形時分別獨立為可具有取代基之碳數二脂= 土,R於存在複數個之情形時分別獨立為甲基或乙基, 159229.doc 201231509 a為1或2之整數,b為0〜2之整數,並且a+b為3以下} R4R5Si(〇H)2 (3) {式中’ R4及R5為可具有取代基之碳數kiO之脂肪族 基、脂環式基或芳香族基};及 11)利用不會溶解聚有機石夕氧烧之溶劑#該聚有機# ^ 烷Ο)導行清洗之步驟。 16.如請求項14或15之製造方法,其中上述觸媒為選自由鹼 金屬氫氧化物及鹼土金屬氫氧化物所組成之群中之至少 一種化合物。 17.如请求項14至16中任一項之製造方法,其中上述觸媒為 Ba(〇H)2&amp;/或其水合物。 18.如請求項14至17中任一項之製造方法,其中上述觸媒之 量相對於矽(Si)之總莫耳數為0.05〜30莫耳〇/〇。 19. 20. 如請求項14至18中任一項之製造方法,其中上述觸媒之 量相對於矽(Si)之總莫耳數為〇卜丨〇莫耳〇/〇。 如》月求項14至19中任-項之製造方法’其中上述溶劑為 醇或乙腈。 種硬化物,其係使如請求項i至i 3中任__項之感光性 ^脂組合物' 或含有藉由如請求項U至2〇中任-項之製 ^方法而獲得之聚有機錢院⑷及光聚合起始劑(b)之感 光性樹脂組合物經光硬化而獲得者。 22. 一種成型物之製造方法,其包括如下步驟: 人將如凊求項1至13中任一項之感光性樹脂組合物、或 3有藉由如請求項14至20中任-項之製造方法而獲得之 159229.doc 201231509 聚有機矽氧烷(a)及光聚合起始劑(b)之感光性樹脂組合物 填充至成型用模具中之步驟, 將該模具之開口部按壓至基板或另一模具上之步驟, 自該模具及/或該基板側將該感光性樹脂組合物曝光而 獲得光硬化物之步驟, 將該模具自該基板剝離或將位於兩面之該模具剝離之 步驟,以及 僅將該光硬化物加熱’或將光硬化物與該基板一併加 熱之步驟。 23· —種硬化物,其係藉由如請求項22之製造方法而獲得 者。 24. —種如上述之聚有機矽氧烷,其係藉由將下述通式⑴所 表示之至夕種蜆氧基石夕烧化合物、下述通式(3)所表示 之至少一種矽烷醇化合物、及觸媒混合並使之聚合之方 法而獲得者,該聚有機錢燒含有下述通^(2)所表示之 結構,且該聚有機矽氧烷所具有之Si原子數中之5〜6〇% 包含於上述通式(2)所表示之結構内, (I) RWbSUOR3)^ {式中,R1為碳數2〜17之含㈣鍵之有機基,r2於存在 複數個之情㈣分_立為可具有取代基之碳數卜10之 月曰肪族基’ R於存在複數個之情形時分_立為甲基或 乙基’a為1或2之整數,b為〇〜2之整數,並且a+b為3以 下} R4R5Si(OH)2 159229.doc (3) 201231509 {式令,m R5 &amp; 其、為可具有取代基之碳數3〜10之菔肪糝 暴月曰壤式基或芳香族基} 、 sSi-〇.x.Si=⑺ {式令’ X為碳數1〜I5之有機基)。 25. 如凊求項24之聚有機梦氧炫,其中上述通式⑴中之尺!.為 具有丙烯酸酯及/或曱基丙烯酸酯之基。 159229.docIn the formula, R1 is an organic group having an ester bond having 2 to 17 carbon atoms, at least one of R1 has an acryloyl group or a fluorenyl fluorenyl group, and R2 is independently a plurality of cases, and each may independently have a substituent. The aliphatic group of carbon number, R3 is independently a fluorenyl group or an ethyl group in the case of a plurality of cases, a is an integer of 1 or 2, b is an integer of 〇~2, and a+b is 3 or less.丨^ and π) a step of washing the polyorganophthalocyanine (a) with a solvent which does not dissolve the polyorganosiloxane. A method for producing a polyorganosiloxane, comprising: i) at least one type of sulphur-based compound represented by the following formula (1), at least one of the following formula (3) The compound and the catalyst are mixed and reacted at 20 to BOX: (M to 20 hours, and the alcohol formed by the reaction is removed to the external organooxane (a). PolyR aR2bSi(〇R3)4 ab (1) (wherein R1 is an organic group having an ester bond of 2 to 17 carbon atoms, at least one of r1 has an acryloyl group or a methacryloyl group, and R2 is present in a plurality of The form is independently a carbon number diester which can have a substituent = soil, and R is independently a methyl group or an ethyl group in the case of a plurality of cases, 159229.doc 201231509 a is an integer of 1 or 2, and b is 0. An integer of ~2, and a+b is 3 or less} R4R5Si(〇H)2 (3) {wherein R4 and R5 are an aliphatic group, an alicyclic group or an aromatic group of a carbon number kiO having a substituent Base}; and 11) using a solvent that does not dissolve the polyorgano oxy- smoldering solvent. The polyorgano # ^ alkane oxime is followed by a cleaning step. The production method according to claim 14 or 15, wherein the catalyst is at least one compound selected from the group consisting of alkali metal hydroxides and alkaline earth metal hydroxides. The production method according to any one of claims 14 to 16, wherein the above catalyst is Ba(〇H)2&amp;/or a hydrate thereof. The production method according to any one of claims 14 to 17, wherein the amount of the above catalyst is 0.05 to 30 moles per gram relative to the total number of moles of cerium (Si). The manufacturing method according to any one of claims 14 to 18, wherein the amount of the above catalyst relative to the total number of moles of cerium (Si) is 〇 丨〇 丨〇 〇 〇. The manufacturing method of any one of the items 14 to 19 wherein the above solvent is an alcohol or acetonitrile. a cured product obtained by the photosensitive resin composition of any of the items _ to i 3 or containing the method of the method of any one of the items U to 2 The photosensitive resin composition of the organic money house (4) and the photopolymerization initiator (b) is obtained by photocuring. A method of producing a molded article, comprising the steps of: the photosensitive resin composition according to any one of items 1 to 13, or 3, by any one of claims 14 to 20 159229.doc 201231509 The photosensitive resin composition of the polyorganosiloxane (a) and the photopolymerization initiator (b) is filled in a molding die, and the opening of the die is pressed to the substrate. Or a step on the other mold, the step of exposing the photosensitive resin composition from the mold and/or the substrate side to obtain a photocured material, the step of peeling the mold from the substrate or peeling off the mold on both sides And a step of heating only the photocured material or heating the photocured material together with the substrate. A hardened material obtained by the manufacturing method of claim 22. 24. The above-mentioned polyorganosiloxane, which is represented by the following formula (1), which is represented by the following formula (1), at least one stanol represented by the following formula (3) The compound and the catalyst are obtained by a method of mixing and polymerizing the same, and the polyorganic money is contained in the structure represented by the following formula (2), and the polyorganosiloxane has 5 of the Si atoms. ~6〇% is contained in the structure represented by the above formula (2), (I) RWbSUOR3)^ where R1 is an organic group having a carbon number of 2 to 17 and containing a bond, and r2 is present in plural (4) _ 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立An integer of ~2, and a+b is 3 or less} R4R5Si(OH)2 159229.doc (3) 201231509 {Formula, m R5 &amp; This is a fatty group having a carbon number of 3 to 10 which may have a substituent暴 曰 曰 或 或 或 或 或 或 或 或 或 或 或 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 25. The polyorganocene oxime of claim 24, wherein the ruthenium of the above formula (1) is a group having an acrylate and/or a methacrylate. 159229.doc
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