TW201230901A - Printed circuit board and method for manufacturing the same - Google Patents

Printed circuit board and method for manufacturing the same Download PDF

Info

Publication number
TW201230901A
TW201230901A TW100125945A TW100125945A TW201230901A TW 201230901 A TW201230901 A TW 201230901A TW 100125945 A TW100125945 A TW 100125945A TW 100125945 A TW100125945 A TW 100125945A TW 201230901 A TW201230901 A TW 201230901A
Authority
TW
Taiwan
Prior art keywords
layer
insulating layer
manufacturing
circuit board
printed circuit
Prior art date
Application number
TW100125945A
Other languages
English (en)
Chinese (zh)
Inventor
Il-Sang Maeng
Duk-Nam Kim
Original Assignee
Lg Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Innotek Co Ltd filed Critical Lg Innotek Co Ltd
Publication of TW201230901A publication Critical patent/TW201230901A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
TW100125945A 2010-10-20 2011-07-22 Printed circuit board and method for manufacturing the same TW201230901A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100102395A KR20120040892A (ko) 2010-10-20 2010-10-20 인쇄회로기판 및 그의 제조 방법

Publications (1)

Publication Number Publication Date
TW201230901A true TW201230901A (en) 2012-07-16

Family

ID=45975412

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100125945A TW201230901A (en) 2010-10-20 2011-07-22 Printed circuit board and method for manufacturing the same

Country Status (4)

Country Link
JP (1) JP2013540368A (ko)
KR (1) KR20120040892A (ko)
TW (1) TW201230901A (ko)
WO (1) WO2012053729A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685289B (zh) * 2012-11-01 2020-02-11 日商味之素股份有限公司 印刷配線板之製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104662692B (zh) 2012-09-18 2018-07-06 应用材料公司 金属上方的sin层上的胶带辅助单步剥除
CN104661449B (zh) * 2015-02-16 2019-01-01 珠海元盛电子科技股份有限公司 一种基于激光活化技术的孔金属化方法
KR102326505B1 (ko) 2015-08-19 2021-11-16 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR20230048958A (ko) * 2021-10-05 2023-04-12 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100674319B1 (ko) * 2004-12-02 2007-01-24 삼성전기주식회사 얇은 코어층을 갖는 인쇄회로기판 제조방법
KR100701353B1 (ko) * 2005-08-19 2007-03-29 주식회사 두산 다층 인쇄 회로 기판 및 그 제조 방법
KR20100028306A (ko) * 2008-09-04 2010-03-12 삼성전기주식회사 인쇄회로기판 및 그 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685289B (zh) * 2012-11-01 2020-02-11 日商味之素股份有限公司 印刷配線板之製造方法

Also Published As

Publication number Publication date
WO2012053729A1 (en) 2012-04-26
KR20120040892A (ko) 2012-04-30
JP2013540368A (ja) 2013-10-31

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