201226300 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種同步貼板之視覺定位裝置及其 方法尤扣種將多個基板高精度、高速地貼合於載板上 之同步貼板之視覺定位裝置及其方法。 【先前技術】 電子產σσ的技術快速發展，相關產品特性大多要求重 ^幸工組積小、呵品質、低價位、低消耗功率及高可靠度 _ 等特點，上述特點促進了通訊、多媒體等技術的開發與市 場成長，而以隨身攜帶的多媒體用品或資訊產品的發展更 為迅速’為了電子產品的可攜性，產品的體積與尺寸都以 微小化為其前提。 從生產成本與效率的角度來看，為了配合smt廠的 置件需求，傳統上將多個小尺寸的電路板合併成一個面積 卓乂^、7〇件數目較多的併板，但將電路板併成多連板，勢 必％•另承又—種風險，—為印刷機的單—鋼板無法隨時目# 應不同電路板漲縮尺寸及時修正，而造成錫膏印刷偏移的 兀件立碑與空焊問題；二為多連板中將出現電路板因内層 線斷、短路的不良板參雜其中，成為另一導致生產 線稼動率下降的因素’或因謝廠拒收此多連板，而造 成採構成本大幅增加的問題。 然而，傳統貼板/併板時產生以下問題： 1以人工方式，利用高溫勝帶將電路板貼合於載板 4/17 201226300 士。然而，此方法所製作的併板的精度不佳， 3的誤差，更可朗為電路板本身的可撓 、， 使得電路板在貼附時產生翹 人 是高溫膠帶僅貼附軟板二=歪斜的情形’尤其 ㈣圍故其巾央位置可能會形成突 機1二將故^併板的精度無法有效控制，造成SMT U將π件置放在所要求的位置；另外，人 造成SMT廠的負擔。 成本亦 2 #彳用可重複使用之高溫黏膠將電路板貼合於載板 。此方式可解決電路板之巾央位置的突起 ^膠的壽命無法量化’僅能以預估最低壽命的方式力 : 吕三故使得併板的成本大幅提高；另外，上述傳統併板 勺方式均無法提升其速度，例如逐片進行貼板製程，使得 貼板製程出現CyCje time的時間瓶頸。 【發明内容】 本發明之實施例提供-種多基板之高精度的同步貼 鲁板之視覺定位方法，其用以將複數個基板放置於一載板， 该同步貼板之視覺定位方法係包括以下步驟：提供一用以 存放，板的暫存區，並將複數個基板傳送至該暫存區丨提 供一定位區，該些基板係由該暫存區被移動至該定位區， 其中利用一移動平台將該些基板由該暫存區移動至該定 品利用視覺裝置揭取該些基板的影像，並分析該些 ^的偏移值’其巾卿时台係㈣些基板運載至該視 覺裝置的下方；利用一搬移定位裝置依據每一基板之偏移 值進行補正後吸取位於該定位區上的該些基板，其中該視 5/17 201226300 覺裝置係設於該搬移定位裝置上，該搬移定位裝置係依據 每一基板之偏移值改變其吸取角度及位置，以補正補正每 一基板之偏移值；以及利用該搬移定位裝置將上述經過定 位之該些基板高精度地且同步地放置於該載板上，使固定 於該載板上的兩兩基板之間具有高精度的相對位置。 本發明實施例更提供一種多基板之高精度的同步貼 板之視覺定位裝置，其用以將複數個基板放置於一載板 上，該視覺定位裝置係包括：一架體；一設於該架體上之 暫存區，該些基板係暫存於該暫存區；一設於該架體上之 籲 定位區，該些基板係藉由一移動平台自該暫存區被移動至 該定位區；一設於搬移定位裝置的視覺裝置，其中該移動 平台係將該些基板運載至該視覺裝置的下方；一搬移定位 裝置，其係可移動地設置於該架體上，用以依據每一基板 之偏移值進行補正後吸取位於該定位區上的該些基板，其 中該搬移定位裝置係依據每一基板之偏移值改變其吸取 角度及位置，以補正每一基板之偏移值；以及承放於該架 體上之該載板，藉此，該搬移定位裝置係將該些基板高精 · 度地且同步地放置於該載板上，使固定於該載板上的兩兩 基板之間具有高精度的相對位置。 本發明具有以下有益的效果：本發明先分析基板的 偏移值，再於吸附基板的同時進行基板偏移值的補正，接 著進行同步貼板，故可提升貼板的精準度，據此，不論是 就生產線的速度與精確度而言，本發明的同步貼板之視覺 定位裝置/方法均具有大幅改善的效果。 6/17 201226300 【實施方式】 本毛明提出一種多基板的同步貼板之視覺定位裝置 及其方法，其主要係可用於快速的搬移基板，利用補正偏 矛夕的技術將基板調整於正確角度/正確位置後，同步且高精 度地貼σ固疋於載板上，故可縮短貼板的產出時間（ time )’以達到提升生產效能的目標。 首，，請參閱圖2至圖2A所示，本發明所提出的多 基板之尚精度的同步貼板之視覺定位裝置至少包含：一架 •體1〇、一設於架體10上之暫存區1 1A、一設於架: 1 0上之定位區（又稱取料區）丄1B、一於暫存區工 1A與疋位區1 之間往復移動之移動平台1 2、一可 移動地设置於該架體1 〇上之搬移定位裝置1 3、一設於 該搬移定位裝置i 3上的視覺裝置丄4及一承放於架體 1 0上之載板1 5，而該同步貼板之視覺定位裝置的功用 在於補正（或稱補償）基板2的偏移值，如各種電路板、 幸人板等，以將多個基板2同步地、高精度地貼合於載板1 鲁5上，其中「高精度」係指兩兩相鄰之基板2之間具有高 精度的相對位置d (如圖4所示），本發明可依程式宣告兩 兩相鄰之基板2間的相對位置d而達到補正的效果，且由 於本發明之多基板的同步貼板之視覺定位裝置可同步貼 合多個基板2於載板1 5上，故可節省貼板製程的產出時 間（cycle time);另外，該基板2上設有複數個定位標誌 2 0，以作為識別、定位之用，而上述定位標諸2 〇較佳 地設置於該基板2之上表面。例如圖2、圖2A，搬移定位 裝置1 3可一次將兩片基板2進行同步貼板，而載板1 5 7/17 201226300 上已固定有四片基板2，即表示搬移定位裝置1 3已經完 成兩次的貼板作業。 據此’本發明可應用上述多基板的同步貼板之視覺定 位裝置進行以下的同步貼板之視覺定位方法，以同步針對 多個基板2進行貼板作業，以下將以兩個基板2說明本發 明之同步貼板之視覺定位方法： 步驟S101 :提供一用以存放基板2的暫存區丄丄A。 在本實施例中，兩個基板2係利用吸取頭1 ^丄或其他搬 移裝置將基板2由進料區搬移置放於暫存區i丄A中之 φ 移動平台1 2，以提高將基板2搬移至定位區丄1B的速 率。由於吸取頭i i i將基板2搬移、放置於移動平台工 2上％，基板2之間的位置可能出現誤差，如圖3所示， 左右兩側之基板2可能出現歪斜的情況，而本發明可解決 上述的歪斜情形，而同步地將歪斜的基板2以高精度的方 式貼合於載板1 5上（如圖4所示）。 另外，架體1 〇係為本裝置的主體，前述的裝置係實 質地架設於架體1 〇。架體丄〇上可包括有用以放置基板鲁 2的儲存裝置（圖未示）等’儲存裝置係相當於進料區，其 功能在於放置上述基板2，而吸取頭丄丄i即可將基板2' 由進料區之儲存裝置以真空方式取放且置於暫存區工 上的移動平台1 2，移動平台1 2較佳地可具有真空吸 力’並可承载基板2在暫存區1 1 A與定位區i iB、2 往返移動。 曰 步驟SH)3··提供-定位區i 1Β。在本步驟中，該些 基板2係由該暫存區i1Α被移動至該定位區丄 8/17 201226300 如利用快速往返的移動平台12將基板2由該暫存區！ 1A移動至該定㈣1 1B，該移動平台1 2可提供真空 ^力（如連接至—真空幫浦）或其他固定方式將基板2穩 定地置放於移動平台1 2上，而不會產生基板2掉落的問 題。 而月）述之暫存區1 1 A係位於進料區與定位區1 1 B 之間，其功能在於暫存基板2，卩縮短進料區與後述之定 位區1 1B的距離。換言之，暫存區丄工a的位置較接近 •上述之定位區11B，並利用移動平台12承載基板2在 暫存區1 1 A與定位區丄1B之間往返移動，故可提高工 作的效率（移動行程距離較短），使基板2可高速地由暫 存區1 iA傳送至定位區丄1B。在具體實施例中，暫存 ^ 1 1A與定位區1 1B可為同一機台區域，本說明僅 是在文字上加以定義以方便說明。 /步驟Sl05:利用一個視覺裝置1 4擷取該些基板2 的衫像’亚分析該些基板2的偏移值，在本具體實施例 中j視覺裝置1 4係裝設於搬移定位裝置J 3上，以避免 視覺裝置1 4與搬移定位裝置丄3的相對誤差，並中在本 步驟中，該移動平台工2係將該些基板2運載至視覺束置 14的下方，以利視覺裝414擷取基板2的影像並進行 影像分析。在一具體實施例中，視覺裝置i 4可為一種上 視覺檢測裝置，以用於檢視基板2的上表面影像’，例如依 ，檢視基板2之定位標钱2 0的位置，以利用影像分析判 所基板2的偏移值，並將檢知結果傳遞給控制單元等等 (圖未示），以控制後續之吸取步驟。 、 9/17 201226300 步驟S1G7 :利用搬移定位裝置1 3依據每-基板2 之偏移值進行補正後吸取位於該定位區丄丄B上的該此 基板2，其中該搬移定位裝置丄3係依據每—基板2之偏 移值改^其吸取肖度及位置，以補正每—基板2之偏移 值；換言之，在本步驟中，該搬移定位褒置工3較佳地且 有-可調之吸取頭（如真空吸頭、吸盤或其他具有搬移能 力之裝置），其可依據前—步驟中所分析的檢知結果進行 基板2的偏移補正，並將基板2加以吸取。具體而言 驟四可分為以下子步驟： 心=該吸取縣依據該些基板2的其令之一的偏移 值5周正其吸取角度及位置； ⑺該錄料下以吸取完成補正該偏移值的基板 確角度與正確位/r、被錄之絲板2向上並移動至正 基板述步驟’逐—吸取該些基板2中的其他 ft 吸取其他基板2時，係控制兩相鄰之基板2 =、曰1 E而進行補正，例如可依I統 補正，使後續貼板後，兩—兩：= I有局精度的相對位置d (如圖4所示）。 明配σ圖3 ’上述的步驟可具體說明如下，首先吸取 =、依據左側之基板2的偏移值調整其吸取角戶及位 針偏之分析結果，左側之基板2逆時 頭逆二，故控制單元先依照分析結果，將吸取 時針偏移角度仏接著，吸取頭向下位移，以吸取 10/17 201226300 完成補正該偏移值的基板2 (即左側之基板2);接著， «亥吸取頭與被吸取之該基板2向上移動，並順時針旋轉， 以調整基板2至正確角度與正確位置。 接下來，針對右側之基板2，控制單元再依照分析结 果，將吸取頭順時針偏移角度们；接著，吸取頭向下位 矛夕以吸取凡成補正該偏移值的基板2 (即右側之基板 2 )’而吸取右側之基板2時，可依程式宣告兩相鄰基板 ^2間的間距而進行吸取動作；接著，該吸取頭與被吸取之 _。亥基板2向上移動’並逆時針旋轉，以調整基板2至正確 角度與正確位置。 、、藉此，本發明可將本實施例之左右兩個歪斜的基板2 補正至正確角度與正確位置，使後續之貼板具有高精度， 以達到兩兩相鄰之基板2之間具有高精度的相對距離廿。 值得說明的是，本實施例係以偏移角度進行說明，但並非 以上述為限，其他例如距離等偏移亦可利用上述方式進行 補正與凋整。另外，如圖2b所示，搬移定位裝置1 3的 _吸取面較佳為凹凸面，凸面主要係用於吸取基板2 ,而凹 面1 3 0則是為了在貼板時影響到先前的貼板作業中已 完成之基板2，而凹面1 3 〇的寬度可依據貼板之相對距 離d進行調整。 而在步驟S107之後，步驟S109即可利用搬移定位裝 置1 3將上述經過補正、定位之基板2高精度地放置於載 板1 5上（如圖5所示），使固定於載板i 5上的兩兩基 板2之間具有高精度的相對位置。因此，本發明可同步地 將夕個基板2咼精度地貼合於載板1 5上，故可有效節省 11/17 201226300 貼板的作業時間。 故，依據上述說明，本發明可根據視覺裝置1八 析的結果調整基板2的偏移位置/角度，即搬移定= 1 3可依據該等定位標社办要X；七a 展置 物…η 方向’補償、調整 基板2之Χ軸、γ轴、ζ軸及方位角等方向及位置等等， 再同步地料個基板2高精度地齡於餘i 5上，使兩 =相#之基板2之間具有高精度的相對距離d，並可效 節省貼板的作業時間。 综上所述，本發明具有下列諸項優點： 、本發明仙帛同步貼板的^將乡録㈣步貼合於 載板上，故可解決傳統單片進行貼板的速率低落問 題，換言之，本發明可大幅節省貼板的製程時間，例 如在本具體實施例中，其產出時間（cycletime)約為 4·5秒/2片。 2、另外，本發明搭配影像分析的步㉟，纽每一基板的 偏移值進行分析，在於吸附基板的同時進行基板偏移 值的補正，使兩兩貼板之間的精度可達約±3〇um，因 此在生產的速度與精度上均可達到製程上的要求。 以上所述僅為本發明之較佳可行實施例，非因此侷 限本發明之專利範圍，故舉凡運用本發明說明書及圖示 内谷所為之等效技術變化，均包含於本發明之範圍内。 【圖式簡單說明】 圖1係為本發明之多基板之高精度的同步貼板之視覺定位方 法的流程圖。 12/17 201226300 圖2係為本發明之多基板之高精度的同步貼板之視覺定位 裝置的立體示意圖。 圖2A係為圖2中之A部分的放大圖。 圖2B係為搬移定位裝置的側視圖。 圖3係為基板歪斜地置於移動平台的示意圖。 圖4係為基板高精度地貼合於載板的示意圖。 【主要元件符號說明】 10 架體 1 1 A 暫存區 111 吸取頭 1 1 B 定位區 12 移動平台 13 搬移定位裝置 13 0 凹面 14 視覺裝置 1 5 載板 2 基板 2 0 定位標言态 Θ \、Θ1 角度 d 相對距離 0 S101〜S109 流程步驟 13/17201226300 VI. Description of the Invention: [Technical Field] The present invention relates to a visual positioning device for a synchronous bonding board and a method thereof, and a method for attaching a plurality of substrates to a synchronous board on a carrier board with high precision and high speed A visual positioning device for a panel and a method therefor. [Prior Art] The technology of electronic production σσ is developing rapidly, and most of the related product characteristics require the characteristics of small size, good quality, low price, low power consumption and high reliability. These characteristics promote communication and multimedia. The development of technology and the growth of the market, and the development of multimedia products or information products that are carried around is more rapid. 'For the portability of electronic products, the size and size of products are reduced to the premise. From the point of view of production cost and efficiency, in order to meet the requirements of the smt factory, it is traditional to combine multiple small-sized circuit boards into a single board with a large area and a large number of pieces, but the circuit will be The board is made into multiple boards, and it is bound to be %. Another kind of risk---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The problem of monument and air welding; the second is that there will be a bad board in which the inner board is broken or short-circuited in the multi-connected board, which becomes another factor that causes the production line to decrease in the production line' or the Xie factory rejects the multi-connected board. And caused the problem of the increase in the composition. However, the following problems arise in the traditional board/slab: 1 Manually, the board is attached to the carrier board using the high temperature belt 4/17 201226300. However, the accuracy of the parallel plate produced by this method is not good, and the error of 3 can be made flexible for the circuit board itself, so that the circuit board is bumped when attached. The high temperature tape is only attached to the soft board. The situation of skewing is especially 'fourth', the position of the towel may be formed at the center of the towel. The accuracy of the board may not be effectively controlled, causing the SMT U to place the π piece in the required position; in addition, the person causes the SMT factory. The burden. The cost is also 2 #彳Use the reusable high temperature adhesive to attach the board to the carrier board. This method can solve the problem that the life of the protrusion of the board is not quantified. The force can only be estimated in the way of estimating the minimum life: Lu San has greatly increased the cost of the board; in addition, the above traditional method of board and spoon It is impossible to increase its speed, for example, the sheet-by-sheet process, which causes the CyCje time time bottleneck in the board process. SUMMARY OF THE INVENTION Embodiments of the present invention provide a high-precision simultaneous positioning method for a multi-substrate, which is used to place a plurality of substrates on a carrier. The method for visual positioning of the synchronization board includes The following steps: providing a temporary storage area for storing the board, and transmitting a plurality of substrates to the temporary storage area, providing a positioning area, wherein the substrates are moved to the positioning area by the temporary storage area, wherein the A mobile platform moves the substrates from the temporary storage area to the predetermined product to extract images of the substrates by using a visual device, and analyzes the offset values of the substrates. The substrate is positioned on the positioning device by using a moving positioning device to correct the offset value of each substrate, and the substrate is located on the positioning device, wherein the device is disposed on the moving positioning device. The moving positioning device changes its suction angle and position according to the offset value of each substrate to correct the offset value of each substrate; and uses the moving positioning device to locate the above-mentioned positioning The substrate is placed on the carrier with high precision and synchronization so that the two substrates fixed to the carrier have a high relative position. The embodiment of the present invention further provides a high-precision synchronous positioning device for a multi-substrate, which is used for placing a plurality of substrates on a carrier. The visual positioning device includes: a frame; a temporary storage area on the frame, the substrate is temporarily stored in the temporary storage area; and a substrate is disposed on the frame, and the substrates are moved from the temporary storage area to the temporary storage area by the mobile platform a positioning device; a visual device disposed on the moving positioning device, wherein the mobile platform carries the substrates to the underside of the visual device; and a moving positioning device is movably disposed on the frame for After the offset value of each substrate is corrected, the substrates located on the positioning area are sucked, wherein the moving positioning device changes the suction angle and position according to the offset value of each substrate to correct the offset of each substrate. And a carrier plate mounted on the frame, whereby the moving positioning device places the substrates on the carrier plate with high precision and synchronization, so as to be fixed on the carrier Between two substrates The relative positional accuracy. The invention has the following beneficial effects: the invention first analyzes the offset value of the substrate, and then corrects the offset value of the substrate while adsorbing the substrate, and then performs synchronous bonding, so that the precision of the bonding board can be improved, according to which Regardless of the speed and accuracy of the production line, the visual positioning device/method of the synchronous patch of the present invention has a greatly improved effect. 6/17 201226300 [Embodiment] The present invention provides a multi-substrate synchronous positioning device and a method thereof, which are mainly used for rapidly moving a substrate, and the substrate is adjusted to a correct angle by using a technique of correcting the eclipse. / After the correct position, the σ is fixed on the carrier plate synchronously and with high precision, so the output time (time) of the slab can be shortened to achieve the goal of improving production efficiency. First, referring to FIG. 2 to FIG. 2A, the visual positioning device for the synchronous board of the multi-substrate of the present invention includes at least one body, one body, and one frame 10. Storage area 1 1A, one set in the rack: 10 0 in the positioning area (also known as the reclaiming area) 丄 1B, a mobile platform that reciprocates between the temporary storage area 1A and the squat area 1 a moving positioning device 13 that is movably disposed on the frame body 1 , a visual device 丄 4 disposed on the moving positioning device i 3 , and a carrier plate 15 mounted on the frame 10 , and The function of the visual positioning device of the synchronous patch is to correct (or compensate) the offset value of the substrate 2, such as various circuit boards, lucky boards, etc., so that the plurality of substrates 2 are attached to the carrier 1 in a synchronous manner with high precision. In Lu 5, wherein "high precision" refers to a high-precision relative position d between two adjacent substrates 2 (as shown in FIG. 4), the present invention can declare between two adjacent substrates 2 according to the program. The effect of the correction is achieved by the relative position d, and the visual positioning device of the synchronous board of the multi-substrate of the present invention can simultaneously fit a plurality of bases 2 is on the carrier board 15, so that the cycle time of the board process can be saved; in addition, the substrate 2 is provided with a plurality of positioning marks 20 for identification and positioning, and the above positioning marks The two turns are preferably disposed on the upper surface of the substrate 2. For example, in FIG. 2 and FIG. 2A, the transfer positioning device 13 can simultaneously align the two substrates 2, and the four substrates 2 are fixed on the carrier 1 5 7/17 201226300, that is, the moving positioning device 13 has been Finish the boarding job twice. According to the present invention, the visual positioning device for the synchronous board of the multi-substrate described above can be used to perform the following method of visual positioning of the synchronous bonding board to simultaneously perform the bonding operation for the plurality of substrates 2, and the following description will be made with the two substrates 2 The visual positioning method of the synchronous board of the invention: Step S101: providing a temporary storage area 丄丄A for storing the substrate 2. In this embodiment, the two substrates 2 are used to move the substrate 2 from the feeding zone to the φ moving platform 1 2 in the temporary storage area i丄A by using the suction head 1丄 or other moving device to improve the substrate. 2 The rate of moving to the location area 丄1B. Since the suction head iii moves the substrate 2 and places it on the mobile platform 2, an error may occur between the substrates 2, as shown in FIG. 3, the substrate 2 on the left and right sides may be skewed, and the present invention may The above-described skewing situation is solved, and the skewed substrate 2 is simultaneously attached to the carrier 15 in a highly precise manner (as shown in FIG. 4). Further, the frame body 1 is the main body of the apparatus, and the above-described apparatus is substantially erected on the frame body 1 . The storage rack may include a storage device (not shown) for placing the substrate 2, etc. The storage device is equivalent to a feeding zone, and its function is to place the substrate 2, and the head 丄丄i can be used to transfer the substrate. 2' The mobile platform 12 is placed in a vacuum mode by the storage device of the feeding zone and placed on the temporary storage area. The mobile platform 12 preferably has a vacuum suction and can carry the substrate 2 in the temporary storage area 1 1 A and the positioning area i iB, 2 move back and forth.曰 Step SH) 3·· Provide - Positioning area i 1Β. In this step, the substrate 2 is moved from the temporary storage area i1Α to the positioning area 丄 8/17 201226300. The substrate 2 is taken by the fast-moving mobile platform 12 from the temporary storage area! 1A moves to the fixed (four) 1 1B, and the mobile platform 12 can provide a vacuum force (such as a vacuum pump) or other fixed manner to stably place the substrate 2 on the mobile platform 12 without generating a substrate. 2 drops the problem. The temporary storage area 1 1 A is located between the feeding zone and the positioning zone 1 1 B, and its function is to temporarily store the substrate 2, and shorten the distance between the feeding zone and the positioning zone 1 1B to be described later. In other words, the location of the temporary storage area a is closer to the above-mentioned positioning area 11B, and the substrate 2 is moved back and forth between the temporary storage area 1 1 A and the positioning area 丄 1B by the mobile platform 12, thereby improving the work efficiency. (The moving stroke distance is short), so that the substrate 2 can be transferred from the temporary storage area 1 iA to the positioning area 丄 1B at a high speed. In a specific embodiment, the temporary storage ^ 1 1A and the positioning area 1 1B may be the same machine area, and the description is only textually defined for convenience of explanation. /Step S105: using a visual device 14 to capture the shirt image of the substrate 2 to sub-analyze the offset values of the substrates 2, in the specific embodiment, the j vision device 14 is mounted on the moving positioning device J 3, to avoid the relative error between the visual device 14 and the moving positioning device 3, and in this step, the mobile platform 2 carries the substrates 2 below the visual beam 14, to facilitate the visual installation. 414 captures the image of the substrate 2 and performs image analysis. In a specific embodiment, the visual device i 4 can be an upper visual detecting device for viewing the upper surface image of the substrate 2, for example, by viewing the position of the positioning target 2 of the substrate 2 to utilize image analysis. The offset value of the substrate 2 is judged, and the detection result is transmitted to a control unit or the like (not shown) to control the subsequent suction step. 9/17 201226300 Step S1G7: The substrate 2 located on the positioning area 丄丄B is taken up by the displacement positioning device 1 3 according to the offset value of each substrate 2, wherein the moving positioning device 丄3 is based on The offset value of each substrate 2 is changed to absorb the degree and position to correct the offset value of each substrate 2; in other words, in this step, the moving positioning device 3 is preferably and has an adjustable The suction head (such as a vacuum nozzle, a suction cup or other device having a moving ability) can perform offset correction of the substrate 2 according to the detection result analyzed in the previous step, and suck the substrate 2. Specifically, the fourth step can be divided into the following sub-steps: heart = the suction county according to the offset value of one of the substrates 2 of the order of 5 weeks is the suction angle and position; (7) under the recording material to complete the correction by suction The value of the substrate is changed to the correct position /r, the recorded wire 2 is moved up to the positive substrate, and the steps of the other substrates in the substrate 2 are taken up. The substrate 2 =, 曰1 E is corrected, for example, it can be corrected according to the I system, so that after the subsequent splicing, the two-two: = I have a relative position d of the local precision (as shown in Fig. 4). The matching step σFig. 3 'The above steps can be specifically described as follows. Firstly, the suction value is adjusted according to the offset value of the substrate 2 on the left side, and the analysis result of the suction angle and the positional needle deviation is adjusted, and the substrate 2 on the left side is reversed. Therefore, according to the analysis result, the control unit firstly shifts the suction hour hand offset angle, and then sucks the head downward to absorb the substrate 2 (ie, the substrate 2 on the left side) that corrects the offset value by 10/17 201226300; then, «hai The suction head and the sucked substrate 2 are moved upward and rotated clockwise to adjust the substrate 2 to the correct angle and the correct position. Next, for the substrate 2 on the right side, the control unit further shifts the suction head clockwise according to the analysis result; then, the suction head is down to the bottom of the spear to absorb the substrate 2 that corrects the offset value (ie, the right side) When the substrate 2) is sucked and the substrate 2 on the right side is sucked, the suction operation can be performed by declaring the distance between the two adjacent substrates 2; then, the suction head and the sucked one. The substrate 2 is moved up' and rotated counterclockwise to adjust the substrate 2 to the correct angle and the correct position. Therefore, the present invention can correct the two left and right skewed substrates 2 of the present embodiment to the correct angle and the correct position, so that the subsequent slabs have high precision, so as to achieve high between the two adjacent substrates 2 The relative distance of precision 廿. It should be noted that the present embodiment is described with an offset angle, but it is not limited to the above, and other offsets such as distances may be corrected and rounded by the above method. In addition, as shown in FIG. 2b, the suction surface of the transport positioning device 13 is preferably a concave-convex surface, the convex surface is mainly used for sucking the substrate 2, and the concave surface 130 is for affecting the previous pasting plate when the board is applied. The substrate 2 has been completed in the operation, and the width of the concave surface 1 3 可 can be adjusted according to the relative distance d of the slab. After step S107, in step S109, the corrected and positioned substrate 2 can be accurately placed on the carrier 15 by the transfer positioning device 13 (as shown in FIG. 5) to be fixed to the carrier i5. There is a high-precision relative position between the two substrates 2 on the upper side. Therefore, the present invention can accurately attach the substrate 2 to the carrier 15 in a synchronized manner, thereby effectively saving the working time of the 11/17 201226300 patch. Therefore, according to the above description, the present invention can adjust the offset position/angle of the substrate 2 according to the result of the visual device 1 analysis, that is, the shift setting = 1 3 can be based on the positioning of the standard agency X; seven a exhibits ... η Direction 'compensate, adjust the direction and position of the Χ axis, γ axis, ζ axis and azimuth of the substrate 2, etc., and then synchronously feed the substrate 2 with high precision on the remaining i 5 to make the substrate of the two = phase # There is a high-precision relative distance d between 2, which can save the working time of the board. In summary, the present invention has the following advantages: The method of the present invention is applied to the carrier board, so that the rate of the conventional single-chip board is low, in other words, the problem is low. The invention can greatly save the processing time of the affixing board. For example, in the specific embodiment, the cycle time is about 4. 5 seconds/2 pieces. 2. In addition, the present invention is combined with the image analysis step 35, and the offset value of each substrate is analyzed, and the substrate offset value is corrected while the substrate is adsorbed, so that the precision between the two boards can reach about ± 3〇um, so the process speed and accuracy can meet the requirements of the process. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalent technical changes of the present invention and the invention are included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a method for visually positioning a high-precision synchronous patch of a multi-substrate of the present invention. 12/17 201226300 Fig. 2 is a perspective view of a visual positioning device for a high-precision synchronous patch of a multi-substrate of the present invention. Fig. 2A is an enlarged view of a portion A in Fig. 2. Fig. 2B is a side view of the transport positioning device. Figure 3 is a schematic illustration of the substrate being placed obliquely on the mobile platform. 4 is a schematic view showing that the substrate is attached to the carrier plate with high precision. [Main component symbol description] 10 frame body 1 1 A temporary storage area 111 suction head 1 1 B positioning area 12 moving platform 13 moving positioning device 13 0 concave surface 14 visual device 1 5 carrier plate 2 substrate 2 0 positioning state Θ Θ1 Angle d Relative distance 0 S101~S109 Process step 13/17