200913820 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種視覺檢知裝置與植板檢知裝置及其 方法，尤指一種藉由視覺定位裝置，以,判斷子板及母板是否 為一良品，而後將該子板正確的設置於該母板之容置空間中。 【先前技術】 為了增進產能，目前電子產品製造者，多半將複數個產 品之印刷電路板（即子板），並合為一母板，以方便後續設置 電子元件時，能於一塊母板上同時針對複數個子板作同一製 程之處理。然而對於印刷電路板之製造者而言，於同一母板 中的該等子板，無法均為無瑕疵之子板，而電子產品製造者 為了節省成本，多半不願接受母板中具有瑕疵之子板，或是 要求印刷電路板製造者降價，而造成印刷電路板製造者成本 上的增加。 然而一般習知之作法係為將母板中具有瑕疵之子板挖 除，而該具有瑕疫之子板挖除後會留下一容置空間，而後針 對該母板製作一模具，該模具設有一凹槽能容納及卡合該母 板，另設有一配合該容置空間之卡槽，以供一子板值入，已 取代原板被挖除之該具有瑕疵之子板，而後點膠將該植入之 子板與該母板黏合。然而，該母板及該子板之置入係以人工 之方式貼合，其費日守費力又增加成本，但最重要的是，由於 該母板及子板係以該模具對位，該子板無法精準的於被挖除 之子板的位置相同，其位置的誤差，會造成後續製作時，電 子元件無法正確的設置其預定位置，尤其對於日益精密之電 路設計而言，會造成電子產品之電路短路等無法運作之情況。 200913820 是以，由上可知，上述習知之植板方式，顯然具有不便 與缺失存在，而可待加以改善者。 【發明,内容】 > 本發明之主要目的係提供—視覺檢知裝置與植板檢知表 置及其方法，其用以將一母板，經由自動化植入一植入子板 後，使該母板，修補為完整之母板，且該植入子板能精確的 植入該母板之各置空間。另於5亥植入子板植入該母板前，月b 預先檢測該植入子板及母板是否為一良品。 為了達成上述之目的’本發明係提供一種視覺檢知裝 置，其用以檢知一待檢知物之上下表面之複數個定位標誌， 該視覺檢知装置係包括：一搬移定位裝置，其用以搬移該待 檢知物及調整該待檢知物之位置；一第一視覺定位裝置，其 用以尋找及定位該待檢知物之下表面之定位標誌之位置；以 及一第二祝覺疋位裝置，其用以尋找及定位該待檢知物之上 表面之定位楳誌之位置，藉此，比對該等定位標誌之位置座 標是否超過/預定數值。 為了達成上述之》目的、’本發明另提供〜種視覺.檢知方 法’其步If㈣：―第—視覺定位裝置，其用以尋找及定位 —待檢知物之下表面之定位標德；—第二視覺定位袋置，其 用以尋找及定位該待檢知物之上表面之定，K固別判斷 該待檢知，上表面之定位料與相對應 表面之定位把 諸位置是#傾準’若料該狀數⑽丨鹄鱗檢知物: 為了達成上述之目的’本發明另提供、種植板檢知裝 置’其用以將，植人子板放置於—母板之容Ϊ空間，該母板 200913820 係包括複數個定位標誌，該植入子板係包括複數個植入子板 定位標誌，該植板檢知裝置係包括：一搬移定位裝置，其用 以搬移該植入子板及調整該植入子板之位置；一視覺定位裝 置’其用以哥找及定位該植入子板之上下表面之植入子板定 位標誌之位置，藉此比對該等植入子板定位標誌之位置座標 是否超過—預定數值；以及一定位檢視裝置，其用以尋找及 疋位違母板之定位標諸之位置；藉此，該搬移定位裝置依據 該母板之定位標誌之位置，以將該植入子板放置於該母板之 容置空間内。 為了達成上述之目的’本發明另提供一種植板'檢知方 法，其步驟包括：儲存一植入子板於一儲存裴置；一視覺定 位裝置尋找及定位該植入子板上下表面之定位標誌；分別比 車乂判畊a亥植入子板之上表面之定位標諸與相對應之下表面之 定位標誌位置是否超過一預定數值，若超過則捨棄該植入子 板’ 一定位檢視裝置尋找及定位該母板之定位標誌；搬移該 植入子板至於該母板之容置空間。 於本發明有益的是植入子板能精準的植入母板，而能增 加後‘製成的良率’植入子板植入母板係採自動化之方式， 能增加產能。並且能於該植入子板植入該母板前，能預先檢 測該植入子板及母板是否為 一良品，而能事先將不良品移 除，而能節省後續之製作費用。 為了能更進一步瞭解本發明為達成預定目的所採取之技 術、手段及功效，請參閱以下有關本發明之詳細說明與附圖， 相化本發明之目的、特徵與特點，當玎由此得一深入且具體 之瞭解，然而所附圖式僅提供參考與說明用，並非用來對本 7 200913820 發明加以限制者。 【實施方式】 請參考第一圖，本發明之視覺檢知裝置及植板檢知裝置 其設置於一之自動植板生產設備中，該自動植板生產設備其 包括，一載板供給裝置1 0 0、一載板塗膠裝置2 0 0、一 視覺檢知植板裝置3 0 0、一黏合裝置4 0 0、一固化裝置 500、一卸載裝置600。 本發明之主要目的為使一待檢知物於進行後續處理前， 能檢查該待檢知物上之複數個定位標誌之座標位置，特別是 針對該待檢知物之上下表面相對應之定位標誌，是否合乎標 準，以免不符合標準之待檢知物進入後續處理時，形成不良 品，而該待檢知物係可為具有任何定位標誌之物品，該定位 標誌、係可為印刷於該待檢知物表面之任何圖樣，或是凸出或 凹陷於該待檢知物表面之任一結構，舉例而言，該待檢知物 係可為一印刷電路板，或是，請參考第二圖及第三圖，該待 檢知_物係可為一具有子板8 2之母板8 '單一之植入子板8 5或是黏合有植入子板85之母板8，而假定該待鑑定物之 上下表面均需設置電子元件之情k，需於該鑑定物之上下表 面均設置ίέ位標誌，且位於上表面之定位標誌與位於下表面 之定位標誌相互對應，然而該定位標誌係先後設置於該待鑑 定物之上下表面，因此於印刷電路板上下表面相對應之定位 標誌，其位置可能會具有誤差，若誤差過大，則需判定該印 刷電路板為壞板，而捨棄。 請參考第一圖至第三圖，本發明之另一目的係為將該母 板8，經由本發明之自動植板生產設備，而植入至少一植入 8 200913820 子板8 5，而能修補成為一完整之母板8，，其步驟為，首 先將該母板8黏貼於一載板9 ’而於該母板8的一個以上之 容置空間84分別填補上一植入子板8 5，而該植入子板8 5亦黏貼於該載板9上，之後以黏膠黏接該植入子板8 5之 黏接部8 6與該母板8之連接凹槽8 § ,而使該母板8形成 完整之母板8，。而於該植入子板8 5植入該母板8前，需 先分別檢測該植入子板8 5與該母板8是否符合標準，若不 符合則予以捨棄，若符合才進行後續之植板處理。 §亥母板8其可為一印刷電路板或設置有複數個電子元件 之載板，其中該印刷電路板可為軟板或硬板，於本實施例中 該母板8設有三個子板8 2，其分別為一第一子板8 2 1、 一第二子板8 2 2及一第三子板8 2 3，而該等子板8 2係 可與該母板8 —體成形，該等子板8 2可為一應用於手機、 滑鼠等電子產品内部之印刷電路板’亦或為一電子元件。該 等子板8 2與該母板8之外框8 1以一連接部8 3連接，而 該容置空間8 4原本設置有外觀上與該等子板8 2相同之- 具有瑕疲之子板（圖未示），但已於事前經由一測試裝置（圖 未示）測式為不良品，而經由切除連接部而於以挖除，特別 ，意的是，該等子板8 2之數量不定，其可僅具有—個，該 荨子板8 2之位置也未予限定，而該容置空間8 4之位置及 數量亦未予限定。 不由於一般而言，母板上之子板數目及擺設位置會因產品 j需求而具有不同之設計，該測試裝置會於事前分別測試二 一母板上之每個子板是否具有缺陷，若該母板上之任何子板 一有夬卩曰，則予以挖除，一個以上之容置空 容置空間之位置及數目亦不定。 口而 9 200913820 另外，該植入子板8 5係設有複數個子 1，以作為識別、定位之用，而該等子 謂設置於該植入子板8 5之上下表面，且;上係 =直入子板8 5之侧邊係可設有複數個黏接部 二 8位於該容置空間84係設有配人於 b忒母板 板8二卜框 旻數個疋位υ 7，而該第子板8 2 b W 2及該第三子板8 2 3亦分別具有—第 1及一第二定位標誌872 ,以作87 箄㈡…士 β 7 一一 作為識別、疋位之用，而該 、 軚^ 8 7、5亥寺弟一定位標誌8 7丄及 標諸8 7 2係可分別設置於該母板8之上下表面4二= 對應。該載板9係複數個載板定位標誌91，以 =定位之用’該載板9另設有複數個點膠則2，其鱗點 膠洞9 2係配合該母板8之連接凹槽8 8，然而，由方:每 母板被挖技传㈣不盡_，目而 係 對不同母板之連接凹槽之位置而預先設置。 請參考第—圖及第，，該載板供給裝置1QQ係用以 提供-載板9至該載板塗職置2 Q Q以作後續處理， 板供給裝置1G G係可具有—運輸裝置（g未示）與該載板 ，膠裝置2 Q Q連接，其用以將該載板9運送至該載板塗膠 裝置2 0 0。該載板供給裝置2 Q Q之結構於本發明中並不 予限制’且由於該載板供給裝置工〇 〇係為一習知技術，非 本發明之目的，因而並不多作描述。 一明參考第四圖，其為本發明之該載板塗膠裝置2 〇 〇之 第一實施例，該載板塗膠裝置2 00其包括一架體11、一 運輸裝置1 2，一黏膠塗布裝置1 3。 10 200913820 該運輸裝置1 2係架設於該架體1 1上，其可為—輪送 帶、機械手臂或是其他具有運輸能力之裝置，1用以女 载板9。 八 Λ 該黏膠塗布裝置1 3係設置於該架體1 1上，其可架設 ，該架體1 1平行該運輸裝置丨2之—侧邊上，職膠塗布 裝置13係可延著平行該運輸裝置12之該側邊作水平移 動，而該黏膠塗布裝置丄3係包括一懸臂丄3 1，該懸臂工 3 1係具有伸縮之功能，該黏膠塗布裝置 -載板塗膠元件132，該載板塗膠元件132係;= 膠之塗布量，以將塗膠塗布於該載板9上。 當塗膠於該載板9時，該運輸裝置2 2係控制該載板g 移動至-預定位置，該轉塗布裝Η 3，係沿著該架體工 上之：邊f動，並調整該懸臂丄3工之長度，以將該載板塗 二兀 2移動至一預定位置，而後該載板塗膠元件1 3 塗布黏膠至該載板9上’該載板塗膠元件工3 式係可為點膠之方式塗布，或塗布該載板9之-特定;域。 ，於塗布時’該載板塗膠元件丄3 2係可相對於該懸臂丄3 ，下移動，接近該載板9以方便塗膠，而塗布完成時，該 載板塗勝70件1 3 2係可相對於㈣臂：3 i往上移動，以 方便該，板塗膠元件1 3 2移往下-塗膠位置。 ^本3轭例可更進一步包括—黏膠抹平裝置1 4，其可跨 體1 1之兩相對侧’該黏膠抹平裝置丄4可於該架 之：㈣側移動’而該黏膠抹平裝置1 4係設有-黏 种罢=4 1 ’该黏膠抹平元件1 4 1係可於該黏膠抹 :!移動’而該黏膠抹平元件1 41係可為-塗膠 1田。亥黏膠塗布裝置丄3完成塗布黏膠時，移動該黏膠抹 200913820 平裝置1 4由該載板9之-惻移動至另—相對側，而使該黏 膠抹平元件i 4 i抹平該黏膠呈現薄臈狀鋪設於該载板9 上。 =考第五®及第六0，其為本發明之視覺檢知植板装 置3 0 〇之第—實施例，該視覺檢知植板裝置3 〇 〇其包括 視覺檢知裝置2及一植板檢知I置3。 勺括:五圖及第五A™，該視覺檢知裝置2係包括係 b括㈣2 1、一運輸裝置2 2、—儲存裝置2 3、一搬 = 、一視覺定位裝置2 5、—定位檢視裝置2 7及-退料儲存裝置2 8。其用以檢知—待檢知物，是 一符合標準之良品，並放置於—該載 例 中該待檢知物係為該母板8。 而於本^例 /該運輸裝置2 2其設置於該架體2丄，該運輸裝 ::為：輸送帶、機械手臂或是其他具有運輸能力之裝置， ”用以傳送该載板9至下一處理步驟。 =存裝置2 3係設置於該架體2丄中 板231及複數個定位桿2 3 2，該等= 賴以儲存複數個·8，該料板8係上下科^ gi3:;，板8之相鄰兩侧邊係凸出於該升3 ^ 寺疋位桿232係分別靠近該等母板8之角或 侧邊’謂轉母板8轉於上下移動， _ 移動。而當該儲存裝置2 3頂部 ：Ζ軸方向 裝置2 3將其内剩餘之母板μ板8該儲存 上-片之母板8維持二=移動-預定距離’以將最 該搬移定位裝置2 4 以方便後續處理。 ，、用μ搬移該母板8 (待檢知物） 12 200913820 及調整該母板8 (待檢知物）之位置，其包括一定位臂24 1及一定位部2 4 3，該定位臂2 4 1係可跨設於該架體2 —1之兩相對側邊，而能使該定位臂2 4 1延該架體2丄:兩 相對侧邊移動，思即沿著γ軸方向移動，該定位臂2 4 1之 縱長方向係設有滑轨2 4 2，該滑執2 4 2係可供該定位部 2 4 3延該滑軌2 4 2而移動，意即沿著x軸方向移動。 該定位部2 4 3係設置於定位臂2 4丄上，該定位部2 4 3係用以吸取該母板8，並能配合該定位臂2 4 1梦 广的調整該母板軸、Y軸、2軸及方則。調整^位 部2 4 3係可包括-移動件2 4 4、-升降件2 4 5、-調 整件2 4 6、-轉動件2 4 7、-吸取件2 4 8。該移麟 2 4 4 U於该定位臂2 4 1上，並可沿著該定位臂2 4 1之該滑軌2 4 2移動，因而可調整該母板8 轴位置。 該升降件2 4 5係可設置於該移動件2 4 4之—侧，該升降 件245係可相對於該移動件2 4 4垂直移動，因而可調整 該母板8之Ζ軸位置。該調整件2 4 6係設置於該移動件2 I 4 4之下方’該調整件2 4 6係可相對於該升降件2 4 5於 X軸及Υ軸方向之水平移動，_可使該母板8於^轴及Υ 軸方向作更精細之移動。該轉動件2 4 7係可設置於該移動 件2 4 4之底部，其可相對於該升降件2 4 5而於水平面旋 轉’因而可調整該母板8之方向角。而該吸取件2 4 8係設 置於該轉動件2 4 7之底部。而該吸取件2 4 8係設置有複 數個檢視洞2 4 8 1，該等檢視祠2 4 8丄係貫穿於該吸取 件2 4 8 ’因而可由該吸取件2 4 8之上方檢視被吸取之該 母板8上表面之定位標誌8 7。 然則以上之該定位臂2 4 1及該定位部2 4 3之設計係 200913820 為使該母板8之位置能於χ轴、Y軸、z軸及方位角等方向 做一精細的調整，因而針對此目的而針對該疋位臂2 4 1及 該定位部2 4 3而作的結構上之變化旅未超出本發明。 當該搬移定位裝置2 4吸取該母板8時，則该搬移定位 裝置2 4移動該母板8至該視覺定位裝置2 5之間，該視覺 定位裝置2 5係包括—第一視覺定位裝置2 5 1及一第二視 覺定位裝置2 5 3，該第一視覺定位裝置2 5 1係可固定或 移動地設置於該架體2 1·，而可檢視該母板8之下表面’該 第一視覺定位裝置2 5 1係可包括一攝影機2 5 2，該攝影 機2 5 2係為拍攝該母板8之影像以供該第—視覺定位裝置 2 5 1作’分析處理’該第二視覺定位裝置2 5 3係可固定 或移動地=於該架體21，而可檢視該母板8之上表面， 該第；：：：：裝置2 5 3係可包括一攝“，該攝 影機2 5 4係為拍攝該母板 口 5 3作-分析處理。〜像此視覺疋位衣 該第一視覺定位萝罟0 續母板8之位w、 2 5 1係控制該搬移定位裝置2 4 母板檢知步驟，以找尋該母板 只2之彼此相對位i θ M而評估該母板8上之該等子板 8 j二低p仲奵位置，是否超 * 制該搬移定位裝置24移動並放置节:至右超過’則控 # 2 8，以作回收處理。錢板8至—退料儲存裝 請參考第二圖， H過程係為該第1㈣例，該母板檢知步驟之 ^ 不現覺定位裝詈9 q 1梦細斗u 4，以檢視該母板8上之==搬移定位裝 该第，預定位置8 9丄是否具有—子1，並判斷 #為 右有，則檢視該第一預定位置89ι上之 施例為例，該母板檢知步驟之 14 200913820 子板之定位標誌，而於此實施例中因為該第一預定位置8 g 1係為一容置空間8 4，因此該第一視覺定位裝置2 5 1則 送出—該第一預定位置8 9 1係為一容置空間8 4之訊號至 二伺服器7。之後該第一視覺定位裝置2 5 X並移動該搬移 定位裝置2 4至該母板8之第二預定位置8 9 2，重複上述 之檢視步驟，於此實施例中，該第二預定位置8 9 2具有一 第一子板8 2 1，則該第一視覺定位裝置2 5 1則尋找並定 位該第一子板8 2 1上之一第一定位標誌8 7 1及一第二定 位標誌8 7 2，並傳送該第一子板8 2 1之該第一定位標誌 8 7 1及該第二定位標誌8 7 2之位置座標於該伺服器7 :，而於第三預定位置8 9 3及第四預定位置8 9 4，亦重 稷上述步驟，而至最後的第四預定位置8 9 4處理完後，若 則該伺，器7依據所有該第一子板8 2 i、該第二子板8 2 ^及該第三子板8 2 3之第-定位標誌、8 7丄及第二定位標 誌8 7 2之位置座標做一比對判斷，是否超過一預定數值， 若有，則判斷該母板8為具有瑕疵的，則控制該搬移定位裝 置2 4移動並放置該母板8至一退料儲存裝置2 8，以作回 收處理，若無則繼續後續處理。 舉例而言，該伺服器7可將該第一子板8 2丄之第一定 位標諸8 71之位置座標減去該第二子板8 2 2之第 標言志8 7 1及或該第-子板8 2丄之第二定位標諸8 7 2之 位置座標減去該第二子板8 2 2之第二^位標諸8 7 2之位 =標=超過—預定數值，若有則判斷該母板8為具有瑕 疮的’後_之第二子板8 2 2與第三子板8 2 3及第三子板 8 2 3與第四子板8 2 4之輯亦比照上述步驟處理。 在此需注意的是，該母板之容置空間及子板之位置及數 15 200913820 目，因不同之母板°又δ十而有不同’因而上述步驟之母板檢知 步驟，因此產生之變化，並未超出本發明。 若該母板8經由該第一視覺定位裝置2 5 1檢視通過 後，該搬移定位裝置2 4移動該母板8至該第二視覺定位裝 置2 5 3之下方’而針對該母板8之上表面’進行如同該第 一視覺定位裝置2 5 1之母板檢知步驟，該母板8之上表面 之定位標誌8 7並儲存於該伺服器7中，而於此不再贅述。 而其中由於該母板8經由該吸取件2 4 8吸取，因而該母板 8上表面之該等定位標誌8 7 ,被該吸取件2 4 8所覆蓋， 因而該吸取件2 4 8設有該等檢視洞2 4 8 1，而可供該第 二視覺定位裝置2 5 3該等定位標达8 7。 而於另〆實施例，該第一視覺定位裝置2 5 1與§亥第二 視覺定位裝置2 5 3係可上下相對設置。該第1覺定位裝 置2 5 1係固定於該架體2 1，該第二視覺定位裝置2 5 3 係可移動地設f於雜體2 1。因_第二視衫位装置2 5 3係可參考該第—視覺定位裝口 5 1所測之該母板8之 定位標諸8 7之座標，而與該第，視覺定位裝置2 5 1可同200913820 IX. Description of the Invention: [Technical Field] The present invention relates to a visual detection device and a plant detection device and a method thereof, and more particularly to a method for determining a daughter board and a motherboard by using a visual positioning device Whether it is a good product, and then the daughter board is correctly disposed in the accommodating space of the motherboard. [Prior Art] In order to increase production capacity, most electronic product manufacturers currently combine printed circuit boards (ie, daughter boards) of a plurality of products into a mother board to facilitate subsequent installation of electronic components on a motherboard. At the same time, the same process is processed for a plurality of daughter boards. However, for the manufacturers of printed circuit boards, the sub-boards in the same motherboard cannot be innocent daughter boards, and the electronics manufacturers are mostly reluctant to accept the daughter boards in the motherboard in order to save costs. Or, asking printed circuit board manufacturers to cut prices, resulting in an increase in the cost of printed circuit board manufacturers. However, it is a common practice to excavate a sub-board having a crucible in the mother board, and the plague sub-board is left to leave an accommodating space, and then a mold is formed for the mother board, and the mold is provided with a concave surface. The slot can accommodate and engage the motherboard, and a card slot for accommodating the accommodating space is provided for the value of a sub-board to replace the sub-board which has been removed by the original board, and then the glue is implanted. The daughter board is bonded to the mother board. However, the insertion of the motherboard and the daughterboard is done manually, which is costly and costly, but most importantly, since the motherboard and the daughterboard are aligned with the mold, The sub-board can not be accurately positioned at the same position of the sub-board to be excavated, and the position error will cause the electronic component to not correctly set its predetermined position during subsequent production, especially for increasingly sophisticated circuit design, which will result in electronic products. The circuit is short-circuited and the like cannot be operated. 200913820 Therefore, it can be seen from the above that the above-mentioned conventional method of planting is obviously inconvenient and lacking, and can be improved. [Invention, Content] > The main object of the present invention is to provide a visual inspection device and a plant detection detection table and method thereof for automatically inserting a mother board into a daughter board after being implanted The motherboard is repaired into a complete mother board, and the implant daughter board can accurately implant the space of the mother board. Before the implanted daughterboard of the 5 hai implant is implanted into the mother board, the monthly b is pre-tested whether the implanted daughter board and the mother board are a good one. In order to achieve the above object, the present invention provides a visual detecting device for detecting a plurality of positioning marks on an upper surface of an object to be inspected, the visual detecting device comprising: a moving positioning device, which is used To move the object to be detected and adjust the position of the object to be detected; a first visual positioning device for finding and locating the position of the positioning mark on the lower surface of the object to be detected; and a second wish The clamping device is configured to find and locate the position of the positioning target on the upper surface of the object to be detected, thereby determining whether the coordinate of the position of the positioning mark exceeds/predetermined value. In order to achieve the above purpose, 'the present invention further provides a kind of visual. detection method', step If (4): - a first visual positioning device for finding and locating - the positioning of the surface under the object to be inspected; a second visual positioning pocket for finding and locating the upper surface of the object to be inspected, K determining the to-be-detected, the positioning of the upper surface and the positioning of the corresponding surface are # If you want to achieve the above number (10) 丨鹄 检 检 : : : : : : : : : : 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了Space, the motherboard 200913820 includes a plurality of positioning marks, the implanting daughter board includes a plurality of implanting daughter board positioning marks, and the plant detecting device comprises: a moving positioning device for moving the implant a sub-board and adjusting the position of the implant sub-board; a visual positioning device for locating and locating the position of the implant sub-board positioning mark on the lower surface of the implant sub-board, thereby comparing the implants Whether the position coordinates of the sub-board positioning mark exceeds— a fixed value; and a positioning inspection device for finding and clamping the position of the positioning of the parent board; thereby, the moving positioning device is configured to position the daughter board according to the position of the positioning mark of the motherboard Placed in the accommodating space of the motherboard. In order to achieve the above object, the present invention further provides a method for detecting a planting plate, the method comprising: storing an implanted daughterboard in a storage device; and a visual positioning device for finding and positioning the lower surface of the implanted daughterboard Marking; respectively, whether the position of the top surface of the surface of the sub-implanted sub-board of the arable implant is less than a predetermined value, and if it exceeds, the implanted sub-plate is discarded. The device searches for and locates the positioning mark of the motherboard; and moves the implanted daughter board to the accommodating space of the motherboard. It is beneficial in the present invention that the implanted daughter board can be accurately implanted into the mother board, and the increased yield of the 'made yield' implanted daughter board can be increased by increasing the throughput. Moreover, before the implanted daughter board is implanted into the mother board, the implanted daughter board and the mother board can be pre-detected as a good product, and the defective product can be removed in advance, thereby saving subsequent production costs. In order to further understand the techniques, means and functions of the present invention for achieving the intended purpose, reference should be made to the following detailed description of the invention and the accompanying drawings. In-depth and specific understanding, however, the drawings are provided for reference and description only, and are not intended to limit the invention of the present invention. [Embodiment] Please refer to the first figure, the visual detecting device and the planting detecting device of the present invention are disposed in an automatic planting production device, which comprises a carrier feeding device 1 0 0, a carrier glue application device 200, a visual inspection planting device 300, an adhesive device 400, a curing device 500, and an unloading device 600. The main object of the present invention is to enable the object to be inspected to check the coordinate position of the plurality of positioning marks on the object to be detected before performing the subsequent processing, in particular, the corresponding position on the upper surface of the object to be detected. Whether the mark is in conformity with the standard, so as to prevent the unqualified object to be inspected into a subsequent process, forming a defective product, and the object to be detected may be an article having any positioning mark, and the positioning mark may be printed on the Any pattern of the surface of the object to be inspected, or any structure protruding or recessed on the surface of the object to be inspected. For example, the object to be detected may be a printed circuit board, or, please refer to In the second and third figures, the object to be detected may be a mother board 8 having a daughter board 8 2 or a mother board 8 5 having a daughter board 85 bonded thereto. It is assumed that the upper surface of the object to be identified needs to be provided with an electronic component, and a lower mark is disposed on the upper surface of the identifier, and the positioning mark on the upper surface and the positioning mark on the lower surface correspond to each other, however, Positioning markers are set in succession Kam was set to be the upper and lower surfaces, so the surface of the printed circuit board at the corresponding alignment mark, its location may have an error, if the error is too large, it is determined that the need for the printed circuit board bad board, and discarded. Referring to the first to third figures, another object of the present invention is to implant the mother board 8 through the automatic planting equipment of the present invention, and implant at least one implant 8 200913820 daughter board 85, and The repair is made into a complete mother board 8 by first bonding the mother board 8 to a carrier board 9 ′ and filling the upper implant daughter board 8 with one or more accommodating spaces 84 of the motherboard 8 . 5, the implanting daughter board 85 is also adhered to the carrier board 9, and then the adhesive portion 8 6 of the implanting daughter board 85 and the connecting groove 8 of the mother board 8 are adhered by adhesive. The mother board 8 is formed into a complete mother board 8. Before the implanted daughter board 8 5 is implanted into the mother board 8, it is necessary to separately detect whether the implanted daughter board 8 5 and the mother board 8 meet the standard, and if not, discard it. Planting treatment. The mother board 8 can be a printed circuit board or a carrier board provided with a plurality of electronic components, wherein the printed circuit board can be a soft board or a hard board. In the embodiment, the motherboard 8 is provided with three sub-boards 8 2, which is a first sub-board 8 2 1 , a second sub-board 8 2 2 and a third sub-board 8 2 3, and the sub-boards 8 2 can be integrally formed with the motherboard 8 . The sub-boards 8 2 may be a printed circuit board used in an electronic product such as a mobile phone or a mouse, or an electronic component. The sub-boards 8 2 are connected to the outer frame 8 1 of the motherboard 8 by a connecting portion 8 3 , and the receiving space 8 4 is originally provided with the same appearance as the sub-boards 8 2 - having a fatigued child a plate (not shown), but has been tested as a defective product by a test device (not shown) beforehand, and is removed by cutting the connecting portion. In particular, it is intended that the daughter boards 8 2 The number of the slabs 8 2 is not limited, and the position and number of the accommodating spaces 804 are not limited. In general, the number of sub-boards and the placement position on the motherboard may have different designs due to the requirements of the product j. The test device will test whether each sub-board on the motherboard has defects, if the mother If any of the sub-boards on the board are defective, they will be excavated. The position and number of more than one vacant space are also uncertain. In addition, the implant sub-board 85 is provided with a plurality of sub-pieces 1 for identification and positioning, and the sub-segments are disposed on the lower surface of the implant sub-board 85, and = The side of the straight-in sub-board 8 5 can be provided with a plurality of bonding parts 2 and 8 in the accommodating space 84, which is provided with a plurality of 疋 υ 7 in the b 忒 mother board 8 The first sub-board 8 2 b W 2 and the third sub-board 8 2 3 also have a first and a second positioning mark 872, respectively, for 87 箄 (2) ... 士 β 7 - one for identification, 疋 position And the 軚^ 8 7 , 5 hai ji ji dynasty positioning mark 8 7 丄 and the standard 8 7 2 series can be respectively disposed on the lower surface of the mother board 8 4 = corresponding. The carrier board 9 is a plurality of carrier positioning marks 91 for the purpose of positioning. The carrier board 9 is additionally provided with a plurality of dispensing electrodes 2, and the scale plastic holes 92 are matched with the connecting grooves of the motherboard 8. 8 8, However, by the side: each mother board is excavated (four) is not enough _, the purpose is to pre-set the position of the connection groove of different mother boards. Referring to FIGS. 1 and 3, the carrier supply device 1QQ is used to provide the carrier board 9 to the carrier board for 2 QQ for subsequent processing, and the board supply device 1G G system may have a transport device (g Not shown), the glue device 2 is connected to the carrier, and is used to transport the carrier 9 to the carrier glue application device 200. The structure of the carrier supply device 2 Q Q is not limited in the present invention, and since the carrier supply device is a conventional technique and is not an object of the present invention, it will not be described. Referring to the fourth figure, which is the first embodiment of the carrier glue application device 2 of the present invention, the carrier glue application device 200 includes a frame body 11, a transportation device 12, and a glue. Glue coating device 13. 10 200913820 The transport device 12 is erected on the frame body 1 1 and can be a wheel conveyor belt, a robot arm or other transportable device, and a female carrier board 9. The adhesive coating device 13 is disposed on the frame body 1 and can be erected. The frame body 1 is parallel to the side of the transport device 2, and the adhesive coating device 13 can be extended in parallel. The side of the transport device 12 is horizontally moved, and the adhesive coating device 3 includes a cantilever 丄3 1, which has a telescopic function, and the adhesive coating device-carrier coating component 132, the carrier glue component 132 is; = the coating amount of the glue to apply the glue to the carrier 9. When the glue is applied to the carrier plate 9, the transport device 2 2 controls the carrier plate g to move to a predetermined position, and the transfer coating device 3 is moved along the frame body and is adjusted The length of the cantilever is 3 to move the carrier coating 2 to a predetermined position, and then the carrier glue component 13 is coated with adhesive to the carrier 9 'The carrier adhesive component 3 The system can be applied in the form of dispensing or coating the specific area of the carrier 9; When the coating is applied, the carrier adhesive component 丄3 2 can be moved downward relative to the cantilever 丄3, and is close to the carrier 9 to facilitate the application of glue. When the coating is completed, the carrier plate wins 70 pieces 1 3 The 2 series can be moved upward relative to the (4) arm: 3 i to facilitate the movement of the sheet glue component 133 to the lower-coating position. The present invention can further include a viscose screed device 14 which can span the opposite sides of the body 1 1 'the viscose screed device 4 can be moved on the side of the frame: (4) The rubber squeezing device 1 4 is provided with - the adhesive type = 4 1 ' the adhesive smearing element 1 4 1 can be used in the adhesive wipe: ! move 'and the adhesive smoothing element 1 41 can be - Glue 1 field. When the adhesive coating device 丄3 finishes coating the adhesive, the adhesive is wiped and the 200913820 flat device 14 is moved from the carrier 9 to the other side, and the adhesive smoothing member i 4 i is wiped. The adhesive is applied to the carrier 9 in a thin braid. = test fifth and sixth, which are the first embodiment of the visual detection planting device of the present invention, the visual detection planting device 3 comprising a visual detection device 2 and a plant The board detects that I is set to 3. The scoop includes: a five-figure and a fifth ATM, the visual detecting device 2 includes a system b (4) 2 1 , a transport device 2 2, a storage device 2 3, a transport = a visual positioning device 25, a positioning The inspection device 27 and the return storage device 28 are provided. It is used to detect that the object to be inspected is a good product that meets the standard and is placed in the case where the object to be detected is the mother board 8. In the present example, the transport device 22 is disposed on the frame body 2, and the transport device is: a conveyor belt, a robot arm or other transporting device, for transmitting the carrier plate 9 to The next processing step: The storage device 2 3 is disposed in the frame 2 231 of the frame body 2 and the plurality of positioning rods 2 3 2, which are used to store a plurality of ·8, and the material plate 8 is connected to the upper and lower parts ^ gi3 :;, the adjacent side edges of the board 8 are protruded from the liter 3 ^ Temple 杆 position bar 232 is respectively close to the corner or side of the mother board 8 'that the rotating mother board 8 is turned up and down, _ move And when the top of the storage device 2 3: the x-axis direction device 2 3 maintains the remaining mother board μ board 8 of the storage upper-plate mother board 8 to maintain two = movement - predetermined distance to the most moving positioning device 2 4 to facilitate subsequent processing. , Move the motherboard 8 (to be detected) with μ 12 200913820 and adjust the position of the motherboard 8 (to be detected), including a positioning arm 24 1 and a positioning portion 2 4 3, the positioning arm 2 4 1 can be spanned on two opposite sides of the frame body 2-1, and the positioning arm 2 4 1 can be extended to the frame body 2: two opposite sides move, thinking Edge Moving in the γ-axis direction, the longitudinal direction of the positioning arm 2 4 1 is provided with a slide rail 2 4 2, and the sliding handle 2 4 2 is for the positioning portion 2 4 3 to extend the slide rail 2 4 2 to move, meaning That is, moving along the x-axis direction. The positioning portion 2 4 3 is disposed on the positioning arm 24 4 , and the positioning portion 24 3 is used for sucking the mother board 8 and can cooperate with the positioning arm 2 4 1 Adjusting the mother board shaft, the Y axis, the 2 axis and the square. The adjusting position portion 2 4 3 system may include a moving member 2 4 4, a lifting member 2 4 5, an adjusting member 2 4 6 , a rotating member 2 4 7. The suction member 2 4 8. The moving arm 2 4 4 U is on the positioning arm 24 1 and can move along the sliding rail 2 4 2 of the positioning arm 2 4 1 , so that the adjustment can be adjusted The position of the motherboard 8 is. The lifting member 24 5 can be disposed on the side of the moving member 24 4 , and the lifting member 245 can be vertically moved relative to the moving member 24 4 , so that the motherboard 8 can be adjusted. The position of the shaft is set. The adjusting member 246 is disposed below the moving member 2 I 4 4. The adjusting member 2 4 6 is horizontally movable relative to the lifting member 24 5 in the X-axis and the x-axis direction. , _ allows the mother board 8 to make finer movements in the direction of the axis and the axis. The movable member 2 4 7 can be disposed at the bottom of the moving member 24 4, which can be rotated in a horizontal plane with respect to the lifting member 24 5 and thus can adjust the direction angle of the motherboard 8. The suction member 2 4 The 8 series is disposed at the bottom of the rotating member 247. The suction member 248 is provided with a plurality of viewing holes 2 4 8 1 , and the inspection 祠 2 4 8 贯穿 is inserted through the suction member 2 4 8 ' Therefore, the positioning mark 87 of the upper surface of the mother board 8 which is sucked up can be inspected from above the suction member 248. However, the design of the positioning arm 241 and the positioning portion 243 3200913820 is such that the position of the motherboard 8 can be finely adjusted in the directions of the x-axis, the y-axis, the z-axis, and the azimuth. The structural change of the clamping arm 241 and the positioning portion 243 for this purpose does not go beyond the present invention. When the moving positioning device 24 draws the motherboard 8, the moving positioning device 24 moves the motherboard 8 to the visual positioning device 25. The visual positioning device 25 includes a first visual positioning device. 2 5 1 and a second visual positioning device 2 5 3, the first visual positioning device 251 can be fixedly or movably disposed on the frame 2 1·, and the lower surface of the motherboard 8 can be inspected The first visual positioning device 251 may include a camera 252 that captures an image of the motherboard 8 for the first visual positioning device 251 to perform an 'analysis process'. The visual positioning device 2 5 3 can be fixed or moved to the frame 21, and the upper surface of the motherboard 8 can be inspected. The first :::: device 2 5 3 can include a camera, the camera 2 5 4 is for shooting the mother board port 5 3 - analysis processing. ~ like this visual position clothing, the first visual positioning, Luo Qi 0, the mother board 8 position w, 2 5 1 system control the moving positioning device 2 4 The mother board detecting step is to find the mother board 8 on the mother board 8 relative to each other i θ M to evaluate the daughter board 8 j two low p 奵Set, whether it is super*, the moving positioning device 24 moves and places the knot: to the right exceeds the 'control # 2 8, for recycling. The money board 8 to - the return storage, please refer to the second figure, the H process is In the first (fourth) example, the mother board detecting step is unconsciously positioning the mounting frame 9 q 1 dreaming bucket u 4 to view the == shifting positioning on the mother board 8 and the predetermined position is 8 9 If there is a sub-1 and judged that # is right, then the example of the first predetermined position 89ι is examined, and the positioning flag of the 1413813820 sub-board of the motherboard detection step is used in this embodiment. The first predetermined position 8 g 1 is an accommodating space 8 4 , so the first visual positioning device 251 sends out - the first predetermined position 8 9 1 is a receiving space 8 4 signal to two servos After the first visual positioning device 2 5 X and moving the moving positioning device 24 to the second predetermined position 8 9 2 of the motherboard 8, repeating the above-mentioned viewing step, in this embodiment, the second The predetermined position 8 9 2 has a first sub-board 8 2 1, and the first visual positioning device 251 searches for and locates the first sub-board 8 a first positioning mark 8 7 1 and a second positioning mark 8 7 2, and transmitting the first positioning mark 8 7 1 and the second positioning mark 8 7 2 of the first sub-board 8 2 1 The position coordinates on the server 7:, and the third predetermined position 8 9 3 and the fourth predetermined position 8 9 4 also repeat the above steps, and after the last fourth predetermined position 8 9 4 is processed, The servo 7 is based on all of the first sub-board 8 2 i, the second sub-board 8 2 ^, and the third sub-plate 8 2 3 - a positioning mark, 8 7 丄 and a second positioning mark 8 7 The coordinate of the position of 2 is judged by a comparison to determine whether the predetermined value is exceeded. If yes, if it is determined that the motherboard 8 has a defect, then the moving positioning device 24 is controlled to move and the motherboard 8 is placed to a return storage. The device 2 8 is for recycling, and if not, the subsequent processing is continued. For example, the server 7 may subtract the first position of the first sub-board 8 2 from the position coordinates of the 8 71 minus the second sub-board 8 2 2 of the first indication 87 1 1 or The second position of the first sub-board 8 2 标 is marked by the position of the arbitrarily deducted from the position of the second sub-board 8 2 2, the second position of the mark, the bit of the mark, the value of the mark, the value exceeds the predetermined value, if There is a case in which the mother board 8 is judged to have the second posterior board 8 2 2 and the third sub-board 8 2 3 and the third sub-board 8 2 3 and the fourth sub-board 8 2 4 with acne. Follow the above steps. It should be noted here that the position of the accommodating space and the sub-board of the mother board and the number of the main board are different depending on the mother board, and thus the mother board detecting step of the above steps is generated. The changes do not go beyond the invention. If the motherboard 8 passes through the first visual positioning device 251, the moving positioning device 24 moves the motherboard 8 to the lower portion of the second visual positioning device 253, and for the motherboard 8 The upper surface is subjected to the mother board detecting step of the first visual positioning device 251. The positioning mark 87 of the upper surface of the motherboard 8 is stored in the server 7, and will not be described herein. Wherein, because the motherboard 8 is sucked through the suction member 248, the positioning marks 8 of the upper surface of the motherboard 8 are covered by the suction member 248, and thus the suction member 248 is provided. The viewing holes 2 4 8 1 are available for the second visual positioning device 2 5 3 to locate the positioning 8 7 . In another embodiment, the first visual positioning device 251 and the second visual positioning device 253 are vertically disposed opposite each other. The first position locating device 251 is fixed to the frame body 2, and the second visual positioning device 253 is movably disposed at the body 21. The second visual position device 2 5 3 can refer to the coordinates of the positioning of the mother board 8 measured by the first visual positioning port 5 1 , and the first visual positioning device 2 5 1 Can be the same
時檢視該母板8。 〇 ry ^ rr 4® iA -, 於上述之母板8之上下表面之践標諸8 7之座標均測 完且八於桿準後，由於該等定位標別7之座標均已儲存於 σ於彳,1母板8上表面之定位標誌8 7 該祠服器7之中’因而可將#母板 m 7 之位置分別與其對應之該母板8下表面之定位 置作-比較，以满是否超過，預定數值’若超過則判斷該 母板8為具有―的，則控制該搬移定:裝置2移ΐί放 置該母板8直〆退料儲存裝置28 右 繼續後續處理 16 200913820 舉例而言’可將該母板8之第一子板8 2 1之上表面之 第一定位標誌8 7 1之位置座檩減去該第一子板8 2 1之下 表面之第一定位標誌8 71之第一定位標諸8 7 1之位置座 標，若超過一預疋數值’則判該母板8為具有瑕蔽的’而 該母板8之其他定位座標亦依照上述之判定方法處理，不再 贅述。 最後當該母板8經由上述之母板檢知步驟，符合標準 時，該搬移定位裝置2 4可依據該等定位標誌8 7之位置及 方向，微調該母板8之X軸、γ軸、z軸及方位角等方向及 位置於一預定位置，並從該預定位置搬移至該載板9之上表 面，使該母板8與該載板9黏合。 而於本實施例中，該母板8設置於該載板9上之位置可 错由该定位檢視裝置2 7檢視及定位該載板9上之載板定位 標誌9 1，而控制該搬移定位裝置24依據該載板定位標誌 9 1之位置而搬移該母板8至該載板9上之一預定位置。該 定位檢視裴置2 7係可設置於該定位部2 4 3，或是該定位 部2 4 3之升降件2 4 5或調整件2 4 6上，該定位檢視裝 置2 7係可包括一視覺定位攝影機2 7 1 ’該視覺定位攝影 機2 7 1係用以拍攝該載板9影像，以供該定位檢視裝置2 7分析及尋找該載板9上之載板定位標誌91。 當該母板8黏合於該載板9之後，請參考第六圖，該載 板9即傳送至本創作之植板檢知裝置3，以將植入子板8 5 植入該母板8之容置空間8 4，該植板檢知裝置3之設置如 同該視覺檢知裴置2 (請參考第五圖及第五A圖），包括同樣 結構之一架體3 1、一運輪裝置3 2 ' —儲存裝置3 3、一 搬移定位裝置3 4、一視覺定位裝置3 5、一定位檢視裝置 200913820The motherboard 8 is viewed at the time. 〇ry ^ rr 4® iA -, the coordinates of the lower surface of the above-mentioned mother board 8 are measured and the coordinates of the positioning marks 7 are stored in σ.彳, the positioning mark 8 on the upper surface of the mother board 8 is used to compare the position of the # mother board m 7 with the corresponding position of the lower surface of the corresponding mother board 8 If the full value exceeds, the predetermined value 'if it is exceeded, the board 8 is judged to have ―, then the movement is controlled: the device 2 is moved ΐ the mother board 8 is placed directly to the return storage device 28, and the subsequent processing is continued 16 200913820 The position of the first positioning mark 807 of the upper surface of the first sub-board 8 2 1 of the motherboard 8 can be reduced by the first positioning mark 8 of the lower surface of the first sub-board 8 2 1 The first position of 71 is marked with the position coordinates of 867. If the value exceeds an expected value, the mother board 8 is judged to be covered and the other positioning coordinates of the mother board 8 are also processed according to the above determination method. No longer. Finally, when the motherboard 8 passes the above-mentioned motherboard detecting step and conforms to the standard, the moving positioning device 24 can finely adjust the X axis, the γ axis, and the z of the motherboard 8 according to the position and direction of the positioning marks 87. The shaft and the azimuth are oriented and positioned at a predetermined position, and are moved from the predetermined position to the upper surface of the carrier 9 to bond the motherboard 8 to the carrier 9. In this embodiment, the position of the motherboard 8 disposed on the carrier 9 can be misdirected by the positioning inspection device 27 to view and position the carrier positioning mark 9 on the carrier 9 to control the positioning. The device 24 moves the motherboard 8 to a predetermined position on the carrier 9 in accordance with the position of the carrier positioning mark 91. The positioning inspection device 27 can be disposed on the positioning portion 2 4 3 or the lifting member 2 4 5 or the adjusting member 24 of the positioning portion 2 4 3 , and the positioning inspection device 27 can include a The visual positioning camera 2 7 1 ' is used to capture the image of the carrier 9 for the positioning and viewing device 27 to analyze and find the carrier positioning mark 91 on the carrier 9. After the mother board 8 is adhered to the carrier board 9, please refer to the sixth figure, the carrier board 9 is transferred to the board detecting device 3 of the present invention to implant the implant board 8 5 into the motherboard 8. The housing detecting device 3 is arranged like the visual detecting device 2 (please refer to FIG. 5 and FIG. 5A), and includes a frame body 3 1 and a transport wheel of the same structure. Device 3 2 ' - storage device 3 3, a moving positioning device 3 4, a visual positioning device 3 5, a positioning inspection device 200913820
Lli了退料儲存震置38。而不同之處在於該儲存裝置3 y 乂儲存a亥植入子板8 5，該退料儲存裝置3 8之大小 係適合儲存該植人子板8 5，而-吸取件3 4 8之設計係適 口吸取趟人子板8 5 ’且該吸取件3 4 8之檢視洞3 4 8 1之排列係配合該植人子板8 5之該子板定位標誌8 5 1而 設置。 —本貝知例之檢知步驟如下，該植板檢知裝置3之該搬移 定位，置3 4係從該儲存裝置3 3搬移該植入子板8 5至該 ，覺^位裝置3 5之間，該視覺定位裝置3 5之一第一視覺 定位裝置3 5 1係檢視該植入子板8 5下表面之子板定位標 誌8 5 1 ’ 一第二視覺定位裝置3 5 3係檢視該植入子板8 5上表面之子板定位標誌8 5 1，並將該等子板定位標誌8 5 1之座標傳送至該伺服器7，進而判斷將該植入子板8 5 上表面之子板定位標誌8 5 1之位置座標減去該植入子板8 5下表面相對應之子板定位標誌8 5 1之位置座標是否超過 一預定數值’若超過，則判斷該植入子板8 5為具有瑕疵的， 而控制該搬移定位裴置3 4搬移該植入子板8 5至該退料儲 存裳置3 8，若未超過，則進行後續之植板步，驟。 當前述之檢知步驟確認該植入子板8 5為一良品後，該 搬移定位裝置3 4可依據該等子板定位標誌8 5 1之位置及 方向’微調該植入子板8 5之X軸、Y軸、Z軸及方位角等 方向及位置於一預定位置，並從該預定位置搬移至該母板8 之容置空間8 4内。 而於本實施例中，由於該母板8之該等子板8 2位於該 母板8之位置均可能會有不同之位置誤差，而玎藉由該伺服 器7中該母板8之該等子板8 2之所有該等定位標諸8 7作 18 200913820 一平均計算後，而得出該植人子板8 5設置於該容置空間8 4上之精.確位置，因而可避免僅依據其中之一該等子板8 2，造成對其他之該等子板8 2 ,而造成之誤差二' 另外，該搬移定位裝置3 5移動設置於苴上之兮定你^ 視裝置3 7檢視該母板8上之定位標諸、8 /，、以確二母^ :之位置及方向角之正確位置，故而依據該母板8之正確位 置’而移動該植人子板8 5至該容置空 4 置，進而與該載板9黏合。 預疋位 本發明可更進一步設置一壓板裝置2 g，當該植入子板 仏亥母板8黏合於該載板9時，則驅動該運輸裝置3 ，丄移，該載板9至該壓《置2 9之下方，使該壓板裝置 了 [ Θ植人子板8 5與§纟母板8，使得該植入子板8 口亥母板8與4載板9更緊密之黏合。該壓板裝置2 9係 夂部2㈠及一壓板2 9 2，該壓板裝置2 9係以 =牛° 與該架體21之頂部及該壓板292連接， 丹1匕=㈣壓板2 9 2之升降，而使該壓板2 9 2下壓該 母板8與該植人子板8 5，壓完後係、可抬起。該壓板2 g 2 :可，平板’其底部為一柔軟材質’以防止 2下壓時，壓壞該母板8及該植入子板85,該壓板2 = 之面積可與該載板9之面積相當。 參考第五圖，於另—實施例中該壓板裝置2 9，亦 又f於該，覺檢知裝置2中，以壓密該母板8於該載板9。 --^考第七圖，其為本發明之視覺檢知植板裝置3 0 〇 例’本貫施例結合了該視覺檢知裝置及該植板檢知 ^方^同-裝置，與第-實施例不同之處在於，該儲存装置 係，、有兩個，—為儲树置2 3其用以儲存該母板8，另— 19 200913820 儲存裝置3 3其用以儲存該植入子板8 5，而退料儲存裝置 亦可設置兩個，一為退料儲存裝置2 8其用以回收該母板 8，另一為退料儲存裝置3 8，其用以回收該植入子板8 5， 而該吸取件2 4 8 b設計可同時吸取及配合該母板8及該植 入子板8 5。其處例步驟亦與第一實施例相同’其不同之處 在於，該搬移定位裝置2 4，搬移該母板8至該載板9上之 後，再搬移該植入子板8 5於該母板8之容置空間8 4。 綜上所述，請參考第八圖，並請參考第五圖及第五A圖， 其為本發明之視覺檢知方法之步驟，其包括儲存該待檢知物 於一儲存裝置2 3，而該待檢知物係可為一印刷電路板，或 是，另請參考第二圖及第三圖，該待檢知物係可為一具有子 板8 2之母板8、單一之植入子板8 5或是黏合有植入子板 8 5之母板8 ( S 1 0 2 );控制該搬移定位裝置2 4從該儲 存裝置2 3搬移該待檢知物至該視覺定位裝置2 5，該視覺 定位裝置2 5尋找及定位該待檢知物之上下表面之定位標諸 8 7、8 5 1，該視覺定位裝置2 5係括一第一視覺定位裝 置2 5 1，其用以尋找及定位該待檢知物之下表面之定位標 誌8 7、8 5 1，及一第二視覺定位裝置2 5 3，其用以尋 找及定位該待檢知物之上表面之定位標誌8 7、8 5 1 ( S 1 0 4 );分別比對判斷該待檢知物之上表面或下表面定位標 誌之位置座標是否超過一預定數值，若超過則進入步驟S 1 1 0，若不超過則進入步驟S112(S108); 捨棄該 待檢知物至一退料儲存裝置2 8，並重新執行步驟S 1 0 2 (S 1 1 0 )；個別判斷該待檢知物之上表面之定位標誌與 相對應之下表面之定位標誌位置座標是否超過一預定數值’ 20 200913820 若起過貞丨進人步US 1 1 Q，若不超過則進人步驟s 1 2 〇 (s 1 1 8 )’該搬移定位裝置2 4移動設置於該搬移定位 裝置2 4之較位檢視裝置2 7至—載㈣之上方，該定位 檢視裝置2 7檢視該載板9之載板定位標諸9 1，該搬移定 位裝置2 4依據該載板定位標tt9 動該待檢知物設置於 該載板9 ( S 1 2 Q );該壓板裝置2 9壓密該載板9與該 待檢知物，使之與該載板9黏合的更為緊密（s ι 2 2 )。 請參考第域，並齡料六圖，其為本發明之植板檢 知方法之步&，其包括儲存一子板於該儲存裝置3 3 ( $ 2 〇 2 );控制該搬移定位裝置3 4從該儲存裝置3 3搬移該植 入子板8 5至雜覺定位裝置3 5，該視覺定位裝置3 5尋 找及疋位雜人子板8 5上下表面之枝標糾5 i，該 視覺定位裝置3 5係包括-第-視覺定位裝置3 5丄及一第 -視見定位裝置3 5 3 ’該第-視覺定位裝置3 5 ι，豆用 以尋找及定位雜人子板8 5之下表面之子板定位標諸8、5 ^之位置，該第二視蚊位裝置3 5 3，其用以尋找及定位 该植入子板8 5之上表面之子板定位標誌8 5 i之位置 (=2 0 4 );分別比較判斷該植入子板8 5之上表面之子 板^位*48 5 1與相對應之下表面之子板定位標誌位8 5 1是否超過一預定數值，若超過則進入步驟s =則進入步驟S212 (S2〇6);捨棄該植入子= 5至一退料储存裝置3 8，並重新執行步驟s 2 〇 2 ( s 2 1)0 );該搬移定位裝置3 4移動設置於該搬移定位裝置3 4之該^檢視裝置3 7至該母板8之上方，該定位檢視裝 置3 7尋找及定位該母板8之定位標誌8 7 § 2 ι 2 );該 搬移定位裝置3 4依據該定位標諸8 7搬移該植人子板8 ^ 21 200913820 , 門8 4 (S 2 1 4 );該壓板裝置2 Θ 為緊密（S 2 1 6)。 冑之』載板9黏合的更 則、隹ΓίΓί人子板8 5與該母板8黏合於該載板9上時， 則進入本發明之黏合裝置4 G Q之步驟（請參考第—圖），而 係】括一佈膠裝置4 (請參考第十圖)與 點月#装置5 (凊荼考第十—圖）。 佈膠ΐ為本發明之佈膠裝置4之實施例，該 __ Ί 括一架體4 1、—運輸裝置4 2，-佈膠單 兀4 3 〇 •該運輸裝置42係架設於該架體41上，係可為一輸送 :、機械手臂或是其他具有運輸能力之裝置，其用以傳送該 載板9。 加單元4 3係設置於該架體4 1上，其可架設於該 “4王平㈣運輸裝置4 2之-側邊上，該佈膠單元4 3 著平行錢知裝置4 2之該側邊作水平移動，而該饰 貪早兀4 3係包括-懸臂4 3 1、-佈膠件4 3 2及-視覺 ^立裝置4 3 3，㈣臂4 3 1係具有伸縮之魏，該佈獻 件4!2係設置於該佈膠單元4 3之一端，其用以將黏膠塗 布於雜入子板8 5之黏接部8 6與該母板8之連接凹槽8 8之間以防止忒點膠裝置5 (請參考第十一圖）點膠時渗 漏，而該佈膠單元4 3所塗布之黏膠係可為一紫外光膠（= V膠），該視覺定位裝置4 3 3設置於該懸臂43丄或該估炚 件4 3 2之一側，其用以檢視該母板8及該植入子板8 ^ 位置。 υ < 其處理步驟為，控制該運輸裝置4 2將該載板9運送至 22 200913820 一預定位置，該佈膠單元4 3移動該視覺定位裝置4 3 3至 該母板8之上方，該視覺定位裝置4 3 3尋找該母板8之定 位標結'8 7及或該植入子板8 5之子板定位標誌8 5 1，以 訂出該母板8及該植入子板8 5之位置，而後控制該佈膠單 元4 3於该植入子板8 5之黏接部8 6與該母板8之連接凹 槽8 8之間塗膠，而後以一紫外光源（圖未示）照射，以將 該紫外光膠固化。 請參考第十一圖，並請參考第十圖，於上述之紫外光膠 固化後，則進入點膠裝置5，該點膠裝置5之設置與該佈膠 裝置4之結構相同，其包括同樣架構之一架體5 i、—運輸 裝置5 2，其不同之處在於該佈膠單元4 3以一點膠單元5 3取代，該點膠單元5 3係包括„點膠件5 3 2、二懸臂已 ^ 1及一視覺定位裝置5 3 3，該懸臂5 3丄及該視^定位 裝置5 3 3與該懸臂4 3 1及該視覺定位裝置4 3 3結構相 同二於進入該點膠裝置5之前，該載板9需於予以翻面，而 將及載板9之該等點膠洞9 2朝上，以利該點膠單元5 3透 過該等點膠則2 ’而於該植人子板8 5之黏接部8 6與該 '^板8之連接凹槽8 8之間點膠。而經由該點膠單元5 3點 膠之後，即完成該母板8及該植入子板8 5之連結。 …請參考第一圖、第十圖及第十-圖，該黏合裝置4 〇 〇 二實施例，其可將該佈膠裝置4與該點膠裝置5整合為 2置，意即’將該點膠裝置5之_件5 3 2設置於該佈 :衣置4之麵膠單^4 3上，而於該佈膠單元4 3之塗膠 ^ 3 2塗布完膠體時，經由翻轉該載板9而可由該點膠件 b 3 2點膠。 該黏合裝置4 0 〇 請參考第一圖、第十圖及第十一圖 23 200913820 之 而 〜第三實施例，該黏合裝置Q Q之步驟’可省略該怖 置4，而直接由該點膠裝置5直接針對該植人子板8 5 = 接部8 6與該母板8之連接凹槽8 8之間點膠，而此時該^ 板9不需翻轉’意即’該母板8及該植入子板8 5朝上， 該載板9亦不需設置該_膠=92。Lli has a return storage shock 38. The difference is that the storage device 3 y 乂 stores the ai implanting daughter board 85, the size of the material storage device 38 is suitable for storing the implanted daughter board 85, and the design of the suction member 348 The arrangement of the viewing hole 3 8 8 1 of the picking piece 384 is matched with the sub-plate positioning mark 851 of the implanting board 8 5 . - The detection step of the present example is as follows, the positioning and positioning of the plant detecting device 3 is carried out, and the implanting sub-plate 85 is moved from the storage device 33 to the position device 3 5 Between the visual positioning device 35, the first visual positioning device 351 checks the sub-board positioning mark 8 5 1 ' of the lower surface of the implant sub-plate 85. A second visual positioning device 3 5 3 views the The daughter board positioning mark 85 1 on the upper surface of the sub-board 8 5 is transferred to the servo 7 and the sub-board of the upper surface of the implant sub-board 8 5 is determined. The position coordinate of the positioning mark 8 5 1 minus whether the coordinate of the position of the daughter board positioning mark 8 5 1 corresponding to the lower surface of the implanting daughter board 8 5 exceeds a predetermined value 'if it is exceeded, it is determined that the implanted daughter board 8 5 is If there is a defect, the moving positioning device 34 is controlled to move the implanting daughter plate 85 to the returning storage shelf 3, and if not, the subsequent step of planting is performed. After the foregoing detecting step confirms that the implant sub-board 85 is a good product, the moving positioning device 34 can fine-tune the implant sub-board 85 according to the position and direction of the sub-board positioning marks 851. The X-axis, the Y-axis, the Z-axis, and the azimuth are oriented and positioned at a predetermined position, and are moved from the predetermined position into the accommodating space 84 of the motherboard 8. In this embodiment, since the sub-boards 8 2 of the motherboard 8 are located at the position of the motherboard 8, there may be different positional errors, and the motherboard 8 in the server 7 After all the positioning indexes of the equalizing boards 8 2 are used as an average calculation of 18 200913820, it is found that the implanted sub-board 8 5 is disposed on the accommodating space 8 4 and thus can be avoided. According to one of the sub-boards 8 2, the other sub-boards 8 2 are caused to cause the error 2'. In addition, the moving positioning device 3 5 is moved on the cymbal to set the device 3 7 Locating the positioning mark on the mother board 8, 8 /, to determine the correct position of the position and direction angle of the second mother, and thus moving the implanted board 8 5 according to the correct position of the mother board 8 The space is set to 4, and the carrier 9 is bonded. The present invention can further provide a platen device 2g. When the implanted daughterboard is bonded to the carrier plate 9, the transport device 3 is driven and moved, and the carrier 9 is Pressing "under the 2-9, the platen device is equipped with [the scorpion slab 8 5 and the § slab 8 so that the implanted slab 8 slabs 8 and 4 slabs 9 are more closely bonded. The platen device 2 9 is a crotch portion 2 (1) and a pressing plate 2 9 2, and the plate pressing device 2 9 is connected to the top of the frame body 21 and the pressing plate 292 by = cow, and the lifting and lowering of the plate 2 2 2 The platen 2 9 2 is pressed down to the mother board 8 and the implanted sub-board 8 5 , and after being pressed, it can be lifted up. The platen 2 g 2 : Yes, the plate has a soft material at the bottom thereof to prevent the mother plate 8 and the implant daughter plate 85 from being crushed when the pressure is 2, and the area of the platen 2 = can be matched with the carrier plate 9 The area is equivalent. Referring to the fifth embodiment, in another embodiment, the platen device 2, 9 is also used in the sensing device 2 to press the motherboard 8 to the carrier plate 9. -- The seventh picture of the test, which is the visual detection planting device of the present invention, the example of the present invention is combined with the visual detection device and the plant detection and detection device. - The embodiment differs in that there are two storage devices, namely, a storage tree 2 for storing the motherboard 8, and a storage device 3 for storing the implant The plate 8 5 and the strip storage device can also be provided with two, one for the return storage device 28 for recycling the motherboard 8 and the other for the return storage device 3 8 for recycling the implant The plate 8 5 and the suction member 2 4 8 b are designed to simultaneously pick up and cooperate with the mother board 8 and the implant daughter board 85. The steps are also the same as in the first embodiment. The difference is that the moving positioning device 24 moves the mother board 8 to the carrier board 9 and then moves the implant board 8 to the mother. The accommodation space 8 8 of the board 8 is provided. In summary, please refer to the eighth figure, and refer to FIG. 5 and FIG. 5A, which are steps of the visual detection method of the present invention, including storing the object to be detected in a storage device 23, The object to be detected may be a printed circuit board, or, referring to the second and third figures, the object to be detected may be a mother board 8 having a daughter board 8 2 and a single plant. The sub-board 8 5 is bonded to the mother board 8 (S 1 0 2 ) of the implant sub-board 85; and the moving positioning device 24 is controlled to move the object to be detected from the storage device 23 to the visual positioning device. 2, the visual positioning device 25 finds and locates the positioning target of the upper surface of the object to be detected, and the visual positioning device 25 includes a first visual positioning device 2 5 1 . Positioning marks 8 7 , 8 5 1 for finding and positioning the lower surface of the object to be detected, and a second visual positioning device 2 5 3 for finding and positioning the surface of the upper surface of the object to be detected Marking 8 7 , 8 5 1 ( S 1 0 4 ); respectively determining whether the position coordinates of the upper surface or the lower surface positioning mark of the object to be detected exceed a predetermined value, If yes, go to step S1 1 0, if not, go to step S112 (S108); discard the object to be detected to a material return storage device 2, and re-execute step S 1 0 2 (S 1 1 0 ); Individually determining whether the positioning mark on the upper surface of the object to be inspected and the position mark of the corresponding lower surface exceed a predetermined value ' 20 200913820 If the user enters the step US 1 1 Q, if not exceeded The human step s 1 2 〇(s 1 1 8 )' moves the positioning device 24 to be placed above the higher-level viewing device 27 to the (4) of the moving positioning device 24, and the positioning viewing device 27 views the The carrier plate of the carrier 9 is positioned and labeled 9. The moving positioning device 24 is disposed on the carrier 9 (S 1 2 Q ) according to the carrier positioning mark tt9; the pressing device 2 9 is pressed The carrier 9 and the object to be inspected are densely bonded to the carrier 9 (s ι 2 2 ). Please refer to the first field, and the sixth drawing of the age, which is the step of the method for detecting the planting plate of the present invention, which comprises storing a sub-board in the storage device 3 3 ($ 2 〇 2 ); controlling the moving positioning device 3 4, the implanting daughter board 85 is moved from the storage device 33 to the ambiguous positioning device 35, and the visual positioning device 35 searches for and corrects the branching and aligning of the upper and lower surfaces of the occupant's sub-board 85. The visual positioning device 35 includes a first-visual positioning device 35 and a first-view positioning device 3 5 3 'the first-visual positioning device 3 5 ι, the bean is used to find and locate the hybrid sub-board 8 5 The sub-board of the lower surface is positioned at a position of 8, 5 ^, and the second-disc mosquito device 3 5 3 is used to find and position the sub-board positioning mark 8 5 i of the upper surface of the implant sub-board 85. Position (=2 0 4 ); respectively, whether the sub-board position *48 5 1 of the upper surface of the implanted daughter board 85 and the corresponding sub-plate positioning mark position 85 1 1 exceed a predetermined value, if If yes, proceed to step s= to proceed to step S212 (S2〇6); discard the implant = 5 to a return storage device 3, and re-execute step s 2 〇 2 ( s 2 1) 0 ); The moving positioning device 3 4 is disposed above the monitoring device 37 of the moving positioning device 34 to the upper side of the motherboard 8. The positioning and viewing device 37 finds and locates the positioning mark of the motherboard 8 7 § 2 ι 2); the moving positioning device 34 moves the implanted sub-board 8^21 200913820, the door 8 4 (S 2 1 4 ) according to the positioning target 87; the pressing device 2 is compact (S 2 16) . The step of bonding the carrier 9 and the bonding of the mother board 8 5 to the carrier 9 enters the bonding device 4 GQ of the present invention (please refer to the figure - figure) , and the system includes a rubberizing device 4 (please refer to the tenth figure) and the point of the month # device 5 (refer to the tenth-figure). The cloth adhesive tape is an embodiment of the rubberizing device 4 of the present invention, and the __ 括 includes a frame body 41, a transport device 4 2, a cloth-coated single 兀 4 3 〇 • the transport device 42 is erected on the frame The body 41 can be a transport: a robotic arm or other transportable device for transporting the carrier 9. The adding unit 4 3 is disposed on the frame body 4 1 , and can be mounted on the side of the “4 Wangping (4) transport device 4 2 , and the glue unit 4 3 is parallel to the side of the Qian Qian device 4 2 Horizontal movement, while the decoration is early and the 4 3 series includes - cantilever 4 3 1 , - rubber member 4 3 2 and - visual device 4 3 3, (4) arm 4 3 1 system has a telescopic Wei, the The splicing member 4! 2 is disposed at one end of the splicing unit 433, and is used for applying the adhesive to the bonding portion 86 of the splicing sub-board 85 and the connecting groove 8 of the motherboard 8. In order to prevent leakage of the dispensing device 5 (refer to FIG. 11), the adhesive layer coated by the rubberizing unit 43 may be an ultraviolet glue (=V glue), the visual positioning The device 4 3 3 is disposed on one side of the cantilever 43 丄 or the estimator 4 3 2 for viewing the position of the mother board 8 and the implant daughter board 8 。. The processing step is: controlling the The transport device 42 transports the carrier 9 to a predetermined position of 22 200913820, the glue unit 43 moves the visual positioning device 433 to the upper side of the motherboard 8, and the visual positioning device 433 searches for the motherboard 8 positioning standard '8 7 and or the plant The sub-board positioning mark 815 is inserted into the sub-board 8 5 to define the position of the mother board 8 and the implant sub-board 85, and then the bonding of the embedding unit 43 to the implant sub-board 85 is controlled. The portion 8 6 is glued to the connecting groove 8 8 of the mother board 8 and then irradiated with an ultraviolet light source (not shown) to cure the ultraviolet light glue. Please refer to the eleventh figure, and refer to the In the tenth figure, after the ultraviolet glue is solidified, it enters the dispensing device 5, and the dispensing device 5 is disposed in the same structure as the rubberizing device 4, and includes a frame body 5 i of the same structure, the transportation device 5 2, the difference is that the glue unit 4 3 is replaced by a glue unit 5 3 , which includes „ dispensing member 5 3 2 , two cantilever arms 1 and a visual positioning device 5 3 3, the cantilever 5 3丄 and the visual positioning device 5 3 3 are identical in structure to the cantilever 4 3 1 and the visual positioning device 4 3 3, and the carrier plate 9 is required to be before entering the dispensing device 5 Turning the face and the dispensing holes 9 2 of the carrier 9 upward, so that the dispensing unit 5 3 passes through the dispensing members 2' and the bonding portion 8 of the implanting board 8 5 6 and the Dispense between the connecting grooves 8 8 of the '^ board 8. After the dispensing of the dispensing unit 53, the bonding of the mother board 8 and the implanting daughter board 85 is completed. Referring to the first, the tenth and tenth drawings, the bonding device 4 is a second embodiment, which can integrate the rubberizing device 4 and the dispensing device 5 into two positions, that is, The component 5 3 2 of the dispensing device 5 is disposed on the cloth: the rubber sheet 4 4 of the garment 4, and when the glue is applied to the rubber unit 43, the coating is overturned. The plate 9 can be dispensed by the dispensing member b 3 2 . The bonding device 40, please refer to the first figure, the tenth figure and the eleventh figure 23 200913820 to the third embodiment, the step of the bonding device QQ can omit the horror 4, and directly by the dispensing The device 5 directly dispenses between the implanted sub-board 8 5 = the joint portion 8 6 and the connecting groove 8 8 of the mother board 8 , and at this time, the board 9 does not need to be flipped 'meaning' the mother board 8 And the implant sub-board 85 is facing upwards, and the carrier 9 does not need to be provided with the glue_92.
請參考第〆圖、第二®及，三圖’經由上述該黏合袭置 4〇0處理之後，將該載板9运進該固化裝置5 〇 〇，以將 黏膠固化，而該固化裝置5◦◦可為—烤箱，最後再將該母 板8、該植入子板8 5及該載板9运至一卸載裝置6 〇 〇， 以將該載板9,與該母板8及該植入子板8 5分離， 而此時即 形成該完整母板8’ ° 惟，以上所述，僅為本發明最佳之一的具體實施例之詳 細說明與圖式，惟本發明之特彳政並不侷限於此，並非用以限 制本發明，本發明之所有範圍應以下述之申請專利範圍為 準，凡合於本發明申請專利範圍之精神與其類似變化之實施 例，皆應包含於本發明之範疇中，任何熟悉該項技藝者在本 發明之領域内，可輕易思及之變化或修飾皆可涵蓋在以下本 案之專利範圍。 【圖式簡單說明】 第一圖係本發明之自動植板生產設備的流程圖； 第二圖係本發明之母板、植入子板及載板的俯視圖； 第三圖係本發明之完整之母板及載板的俯視圖， 第四圖係本發明之載板塗膠裝置的立體圖； 第五圖係本發明之視覺檢知植板裝t之視覺檢知裝置之第一 實施例的立體圖； 24 200913820 圖； 之植板檢知裝 置第一實 第五A圖係第九圖A部份之局部放大 第六圖係本發明之視覺檢知植板裝置 施例的立體圖； 第七圖係本發明之視覺檢知植板裝置之第二實施例的立 圖； ，八圖係本發明之視覺檢知方法之步驟流程圖； 第九圖係本發明之植板檢知方法之步驟流程圖；Please refer to the second drawing, the second and the third figure, after the treatment by the bonding action 4〇0, the carrier 9 is transported into the curing device 5 以 to cure the adhesive, and the curing device 5◦◦ can be an oven, and finally the mother board 8, the implant daughter board 85 and the carrier board 9 are transported to an unloading device 6 以 to the carrier board 9 and the motherboard 8 The implanted daughter board 85 is separated, and the complete mother board 8' is formed at this time. However, the above description is only a detailed description and drawing of the specific embodiment of the present invention, but the present invention The present invention is not limited thereto, and is not intended to limit the scope of the invention, and all the scope of the invention should be determined by the following claims. Included in the scope of the present invention, any variation or modification that can be easily conceived by those skilled in the art of the present invention can be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of the automatic planting equipment of the present invention; the second drawing is a top view of the mother board, the seeding board and the carrier board of the present invention; The top view of the mother board and the carrier board, the fourth figure is a perspective view of the board glue application apparatus of the present invention; and the fifth figure is the perspective view of the first embodiment of the visual inspection apparatus of the visual inspection board assembly t of the present invention. 24 200913820 Figure; Planting plate detection device first real fifth A picture system ninth part A partial partial enlargement sixth figure is a perspective view of the embodiment of the visual detection planting device of the present invention; A vertical view of a second embodiment of the visual inspection planting device of the present invention; an eighth diagram showing a flow chart of the steps of the visual detection method of the present invention; and a ninth drawing is a flow chart of the steps of the method for detecting the growth of the present invention ;
=十圖係本發明之黏合裝置之佈膠裝置之立體圖；以及 第十一圖係本發明之黏合裝置之點膠裝置之立體圖。 【主要元件符號說明】 載板供給裝置100 載板塗膠裝置2◦0 架體1 1 運輸裝置1 2 黏膠塗布裝置13 懸臂131 載板塗膠元件1 3 2 黏膠抹平裝置14 黏膠抹平元件141 視覺檢知植板裝置3 0 0 視覺檢知裝置2 架體2 1 運輸裝置2 2 儲存裴置2 3 升降板2 3 1 定位桿2 3 2 搬移定位裝置2 4 定位臂2 4 1 25 200913820 定位部2 4 3 視覺定位裝置2 5 定位檢視裝置2 7 退料儲存裝置2 8 壓板裝置2 9 植板檢知裝置3 架體3 1 運輸裝置3 2 儲存裝置3 3 搬移定位裝置3 4 視覺定位裝置3 5 定位檢視裝置3 7 退料儲存裝置3 8 滑執2 4 2 移動件244 升降件2 4 5 調整件2 4 6 轉動件2 4 7 吸取件2 4 8 吸取件2 4 8 b 檢視洞2 4 8 1 第一視覺定位裝置2 5 1 攝影機2 5 2 第二視覺定位裝置2 5 3 攝影機2 5 4 視覺定位攝影機2 71 升降部2 9 1 壓板2 9 2 吸取件3 4 8 檢視洞3 4 8 1 第一視覺定位裝置3 5 1 第二視覺定位裝置3 5 3 26 200913820 黏合裝置4 0 0 佈膠裝置4 架體4 1 運輸裝置4 2 佈膠單元4 3 懸臂4 3 1 佈膠件432 視覺定位裝置4 3 3 點膠裝置5 架體5 1 運輸裝置5 2 點膠單元5 3 點膠件5 3 2 懸臂5 3 1 視覺定位裝置5 3 3 固化裝置5 0 0 卸載裝置6 0 0 伺服器7 母板8 完整之母板8’ 外框8 1 子板8 2 第一子板8 2 1 第二子板8 2 2 第三子板8 2 3 連接部8 3 容置空間8 4 27 200913820 植入子板8 5 定位標諸· 8 7 連接凹槽8 8 第一預定位置8 9 1 第二預定位置8 9 2 第三預定位置8 9 3 第四預定位置8 9 4 載板9 子板定位標諸8 5 1 黏接部8 6 第一定位標諸8 7 1 第二定位標諸8 7 2 載板定位標誌91 點膠洞9 2 28= Fig. 10 is a perspective view of a gluing device of the bonding device of the present invention; and Fig. 11 is a perspective view of a dispensing device of the bonding device of the present invention. [Description of main component symbols] Carrier supply device 100 Carrier glue applicator 2◦0 Frame 1 1 Transport device 1 2 Adhesive coating device 13 Cantilever 131 Carrier adhesive component 1 3 2 Adhesive smoothing device 14 Adhesive Smoothing element 141 visual inspection planting device 3 0 visual inspection device 2 frame 2 1 transport device 2 2 storage device 2 3 lifting plate 2 3 1 positioning rod 2 3 2 moving positioning device 2 4 positioning arm 2 4 1 25 200913820 Positioning unit 2 4 3 Visual positioning device 2 5 Positioning inspection device 2 7 Material return storage device 2 8 Platen device 2 9 Plant detection device 3 Frame 3 1 Transport device 3 2 Storage device 3 3 Moving positioning device 3 4 Vision positioning device 3 5 Positioning inspection device 3 7 Return storage device 3 8 Slipper 2 4 2 Moving member 244 Lifting member 2 4 5 Adjusting member 2 4 6 Rotating member 2 4 7 Suction member 2 4 8 Suction member 2 4 8 b Viewing hole 2 4 8 1 First visual positioning device 2 5 1 Camera 2 5 2 Second visual positioning device 2 5 3 Camera 2 5 4 Visual positioning camera 2 71 Lifting unit 2 9 1 Platen 2 9 2 Suction part 3 4 8 Viewing hole 3 4 8 1 First visual positioning device 3 5 1 Second visual positioning device 3 5 3 26 200913820 Adhesive device 4 0 0 Clothing device 4 Frame 4 1 Transporting device 4 2 Laminating unit 4 3 Cantilever 4 3 1 Covering material 432 Vision positioning device 4 3 3 Dispensing device 5 Frame 5 1 Transport device 5 2 Dispensing unit 5 3 Dispensing parts 5 3 2 Cantilever 5 3 1 Vision positioning device 5 3 3 Curing device 5 0 0 Unloading device 6 0 0 Servo 7 Mother board 8 Complete mother board 8' Outer frame 8 1 Daughter board 8 2 First daughter board 8 2 1 Second daughter board 8 2 2 Third daughter board 8 2 3 Connection part 8 3 accommodating space 8 4 27 200913820 Implanted daughter board 8 5 Positioning mark · 8 7 Connection groove 8 8 First predetermined position 8 9 1 second predetermined position 8 9 2 third predetermined position 8 9 3 fourth predetermined position 8 9 4 carrier 9 sub-plate positioning mark 8 5 1 adhesive portion 8 6 first positioning target 8 7 1 second positioning Standard 8 7 2 Carrier positioning mark 91 Dot hole 9 2 28