TW201216430A - Pad configurations for an electronic package assembly - Google Patents

Pad configurations for an electronic package assembly Download PDF

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Publication number
TW201216430A
TW201216430A TW100119804A TW100119804A TW201216430A TW 201216430 A TW201216430 A TW 201216430A TW 100119804 A TW100119804 A TW 100119804A TW 100119804 A TW100119804 A TW 100119804A TW 201216430 A TW201216430 A TW 201216430A
Authority
TW
Taiwan
Prior art keywords
row
pads
die
pad
electronic package
Prior art date
Application number
TW100119804A
Other languages
English (en)
Other versions
TWI458062B (zh
Inventor
Sehat Sutardja
Shiann-Ming Liou
Hua-Hung Kao
Original Assignee
Marvell World Trade Ltd
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Publication date
Application filed by Marvell World Trade Ltd filed Critical Marvell World Trade Ltd
Publication of TW201216430A publication Critical patent/TW201216430A/zh
Application granted granted Critical
Publication of TWI458062B publication Critical patent/TWI458062B/zh

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Description

201216430 六、發明說明： 【相關申請案的交叉參考】 本公開要求2010年6月4日提交的美國臨時專利申請N〇. 61/351,471的優先權，就各方面而言，在此通過引用的方式包 含其整個說明書的全部内容，除了可能存在的與本說明書不一 致的那些部分。 【發明所屬之技術領域】 本公開的實施方式涉及電子封裝組件領域，並且更特別地 涉及用於電子封裝組件的墊的技術、結構以及配置。 【先前技術】 在此出於一般地呈現本公開的上下文的目的而提供了背景 技術描述。在該背景技術部分中所描述的#前署名的發明人的 工作、以及本說明書中的並未以其他方式被判定為巾請時的現 有技術的各方面，均不表示明確地或隱含地縣認為相對於本 公開的現有技術。 積體電路器件（諸如電晶體）形成在其尺寸持續縮減為更 小維度的晶粒或晶片上。晶粒的緊縮維度和相關聯的容納晶粒 的封裝組㈣當前歸路由錄絲自 θ，古 傳統塾結構和/配置如了織。 ㈣彳。就的 【發明内容】 在個實施方式中’本公開包括一種電子封裝組件，該電 201216430 子封裝組件包括：焊接遮罩層，該焊接遮罩層具有至少一個開
口；以及_合_焊接遮罩層的多健，其巾鮮個塾中的I 少-個墊包括⑴第-側，⑻第二側，該第—側佈置為與該 第二侧相對’（iii)端子部分以及（iv)延伸部分，其中在該端 子部分處的該第-側配置為通過轉接遮罩射的該至少一個 開口接納封裝互連結構，該封裝互連結翻以在晶粒與該電子 封裝組件外部的另—電子II件之間路由電錢，並且其中在該 延伸部分處_第二側配置為接絲自該晶粒的-個或多個^ 連接。 在另-實施方式中，本公開包括一種裝置，該裝置包括電 子封裝組件以及印刷電路板，該電子封裝組件包括：谭接遮罩 層，該焊接遮罩層具有至少一個開口；以及輕合到該焊接遮罩 層的多個墊，其中該多個墊中的至少—健包括⑴第一側， (11)第二側’該第一側佈置為與該第二側相s，（iii)端子部 ^以及（iv)延伸部分，其中在該端子部分處的該第一側配置 為通過該焊接遮罩層中的該至少—_σ接納封裝互連結構， 並在該延伸部分處的該第二側配置為接納來自該晶粒的 :個或多個電連接，該印刷電路板使用該封裝互連結難合到 個墊的該端子部分處的該第—側，該封裝互連結構 用以在B曰粒與該印刷電路板之間路由電信號。 早式中’本公開包括-種㈣裝組件，該電 子封裝組件包括：焊接遮罩層，其中鱗接遮罩層罝有至少一 合到該焊接遮罩層的多 個墊中該多個墊中的至少一個塾包括⑴第一側，⑻第 二侧，該第-侧佈置為與該第二侧相對，㈤端子部分 201216430 ^二分。在該端子部分處的該第—侧配置為通過 一個或多個開口接納封裝互連結構。該封襄互連4: :粒與該細裝組件外部的另一電子器件之間路由=在 部分處的該第二側配置為接納來自該晶粒二固 或多個電連接。該電子封裝組件進一 的晶粒墊。該多健包括第—行墊 行==晶粒 粒墊相鄰。糊她_觸^=^該晶 二行墊’該第一行墊佈置為比节第一鄰平仃的第 Α/ 帛—订妓靠近_晶粒墊。 2少兩個墊中的第一墊佈置在該第一行墊 墊中的第二墊佈置在該第二行塾中。 ^個 在另-實施方式中’本公開提供了—㈣作電子封裝崎 ^ 其巾該方法包括提供齡基板並在频牲基板上形成 ，分佈層。該再分佈層包括多個墊並且墊配置為容納晶粒。該 多個墊的至少兩個墊中的每—個包括：⑴第—侧，⑻ 側，該第-側佈置為與該第二側相對，（m)端子部分以及^ 延伸部分。在該端子部分處_第_她合至該犧牲基板，以 及在該延伸部分處的該第二嫩置為接納來自該晶粒的一個或 多個電連接。該多健包括第—行墊，該第—行墊佈置為與該 晶粒墊相鄰。該多個墊包括佈置為與該第一行墊相鄰且平行= 第二行塾’該第-行塾佈置為比該第二行墊更靠近於該晶粒 墊。該至少兩個墊中的第一墊佈置在該第一行墊中，而該至少 兩個墊中的第二墊佈置在該第二行墊中。 在另一實施方式中，本公開包括一種電子封裝組件，該電 子封裝組件包括焊接遮罩層。該焊接遮罩層具有至少一個開 口。該電子封裝組件進一步包括耦合到該焊接遮罩層的多個 201216430 =二端子部分處的該第二=及= =部=該第二側配置為接納來自該晶粒的-‘㊁ 封裝組件進一步包括配置為接納該晶粒的晶粒 鄰二二括帛一打墊，該第一行墊佈置為與該晶粒墊相 墊^第為與該第—行墊相鄰且平行的第二行 塾該第-订藝佈置為比該第二行 的方式中，本公開提供了—種製作電子封裝組件 再八靜^料包括提顯牲紐並德犧牲基板上形成 : 括多個墊並且塾配置為接納晶粒。該 夕:墊的至少一個塾包括:⑴第一侧，⑻第二側，該第一 側佈置為與該第二側相對，㈤端子部分以及㈤延伸部分。 處_第，合至該犧牲基板，以及在該延伸 第一行墊，該第-行墊佈置為與 2。該多健包括佈置為與該第—行墊轉且平行的第二行 |二第一行塾佈置為比該第二行塾更靠近於該晶粒墊。該至 >-個塾的延伸部分在不垂直於該第—行墊的方向中延伸。 子射杜實施方式中，本公開提供—種包括烊接遮罩層的電 子封裝組件。該焊接縣層具有至少—侧^。 件進-步包括搞合到該焊接遮罩層的多個墊。該多個墊中^至 201216430 =一個塾包括⑴第-侧，⑻第二側，該第—侧佈置為與該 第-側姆，（m)端子部分以及（iv) ^伸部分。在該端 =處的該第-側配置為通過該焊接遮罩層中的該至少一個開口 ^封裝互賴構。該雜互連結構在晶粒與該電子封裝組件 獨另-電子ϋ件之間路由電信^在該延伸部分處的該第 -則配置為接納來自該晶粒的—個或多個電連接。該電子封裝 ^牛進-步包括配置為接納該晶粒的晶粒墊。該多健包括第 行墊該帛行墊佈置為與該晶粒塾相鄰 該第-行，鄰且平行的第二行塾，該第—行 ^ 一行墊更錢霞晶粒墊。該多個墊包括佈置為與該第 ^行墊相鄰且平行的第三行墊，該第二行塾佈置為比該第三行 墊更靠近於該晶粒塾。該延伸部分具有在該第一行墊和該第二 行墊之間佈置的終止端。 在另-實施方式中，本公開提供了—種製作電子封裝組件 的方法’其中該方法包括提供犧牲基板並在該犧牲基板上形成 ，分佈層。該再分佈層包括多個墊並且墊配置為接納晶粒。該 多個塾的至少-個墊包括：⑴第—侧，⑻第二侧，該第一 側佈置為與該第二術目對，（iii)端子部分以及⑻延伸部分。 在該端子部分處的該第-_合至該犧牲基板，以及在該延伸 部分處的該第二側配置為接納來自該晶粒的—個或多個電連 接。該多個藝包括第-行塾，該第一行墊佈置為與該晶粒塾相 鄰。該多健包括佈置域該第—行墊相鄰且平行的第二行 塾，該第-行塾佈置為比該第二行墊更靠近於該晶粒塾。該多 個墊包括佈置域对二行墊神且平行料三行墊，該第二 行墊佈置為比該第三行墊更靠近於該晶粒墊。該延伸部分具有
S 201216430 在該第一行墊和該第二行墊之間佈置的終止端。 子封實，式中，本公開提供—種包括_遮草層的電 件進^接遮罩層具有至少—個開σ。該電子封裝組 該焊接遮罩層的多個塾。該多個墊中的一 個或者夕個墊包括（i)第一侧，（丨丨）第二 盥該第-#丨；<：日#+ η 一側，該第一側佈置為 …第-撕目對’（111)端子部分以及（iv)延伸部分 =部=處的該第-侧配置為通過該焊接遮罩層中的該至少一個 互連結構。該封裝互連結構在晶粒與該電子封裝 電子器件之間路由電信號。在該延伸部分處的 該第-側配置為接納來自該晶粒的一個或多個電連接。該電子 進—步包括配置為接納該晶粒的晶粒墊。該多個墊包 括佑署該第—π墊佈置為與該晶粒墊轉。該多個墊包 署該第一行墊相鄰且平行的第二行墊，該第-行墊佈 ^〜一仃墊更靠近於該晶粒墊。該多個墊包括佈置為盥 該第二行塾相鄰且平行的第三行塾，該第二行 第 三行墊更靠近於該晶錄。該延伸部分實質上在包』多個1 的平面上與該端子部分遠離的所有方向中擴展。 在另-實施方式中，本公開提供了一種製作電子封裝組件 $法’其中該方法包括提供犧牲基板並在該犧牲基板上形成 ，分佈層。該再分佈層包括多個墊並且墊配置為接納晶粒。該 夕個塾的-個或者多個墊包括：⑴第一側，（ii)第二側，該 第-側佈置為與該第二側相對，㈤端子部分以及⑼）延伸 部分。在該端子部分處的該第一側耦合至該犧牲基板，以及在 該延伸部分處的該第二侧配置為接納來自該晶粒的—個或多個 電連接。該多個墊包括第一行塾，該第一行藝佈置為與該晶粒 201216430 = 目鄰。該多個墊包括佈置為與該第-行墊相鄰且平行的第二 第—行墊佈置為比該第二行墊更靠近於該晶粒塾。該 夕^括佈置為與該第二行墊相鄰且平行的第三行塾，該 „置為比該第三行塾更靠近於該晶粒墊。該延伸部竹 質上在與該端子部分遠離騎有方向中擴展。 實施方式中，本公開提供—種包括焊接遮罩層的電 T封裝組件。該焊接遮罩層具有至少一個開口。該電子封餘 件進-步包括輕合到該焊接遮罩層的多健。該多個墊中^至 Γ個塾包括⑴第—側，⑻第二側，該第—側佈置為與該 Γ)端子部分以及（iv)延伸部分。在該端子部 二通過轉接遮罩層中的該至少一個開口 外邱^互結構。雜裝互連結構在晶粒與該電子封裳組件 間路由電信號。在該延伸部分處的該第 -側配置為接絲自該晶粒的—個❹個電連接。該電 步包括配置為接納該晶粒的晶粒墊以及佈置為與該曰曰: m目鄰的一個或者多個環狀段結構個或者多個環狀段 π構為該晶粒提供電源連接和/或接地連接。 在另-實施方式中，本公職供了—種製作電 其巾該方法包括提供犧牲基板並在該犧牲基板上形 =:。該再_包括⑴多個塾，⑻配置為接納晶： ΐ二Γ佈置為與該晶粒塾相鄰的-個或者多個 ^ η 者多個環狀段結構配置為為該晶粒提供 ^原連接和/或接地連接。該多健的—個或者多健包括：⑴ 第-側’⑷第二侧，該第一侧佈置為與該第二侧相對，⑽） 端子部分以及㈤延伸部分。在朗子部錢賴第一側輕 201216430 合至該犧牲基板’以及在該延伸部分處_第二娜置為接納 來自該晶粒的一個或多個電連接。 【實施方式】 本公開的實施方式描述了用於電子難組件的墊的技術、 結構以及配置。在以下詳細描述中，參考了作為其—部分的附 圖’其中貫穿附圖，類似的參考標號表示類似的部分。在不脫 離本公開範_情況下，可以_其他實施方式，並且可以進 =結構上和邏輯上的改變。因此，以下詳細描述不應理解為限 1性的’並且實施方式的範圍由騎權利要求書及其等同方案 限定。 圖1示意性地示_合_卩刷電路板15G的電子封裝組件 =〇的橫截面視圖。電子封農組件觸包括如圖所示地麵合的 焊接遮罩層114和-個或多個再分佈層1〇6。 其他一般地包括阻焊材料’諸如環氧樹脂。在 f他實施方式巾’可以制其他合適的魏賴料 還可哺為阻焊_，形成在 焊接遮罩層m中以提供對—個或多個再分佈層1G6的訪問。 的多個再分佈層106酉己置為路由電子封震組件⑽ 的-個或多個晶粒1G8的電信號。例如，該—個或多個再 層106能夠提供在一個或多個晶粒1〇8與-個或多個封裳互連 ^構116之間對輸入/輸出⑽信號和/或電源/接地信號的路 該一個或多個再分佈層106 -般地包括導電材料， 諸如金 201216430 在-個實施方式中，該—贼多個再分佈層1G6包括多個 塾102和晶粒塾104。在某些實施方式中，如所示出，墊102 2粒塾1G4是該-個或多個再分佈㉟的同—再分佈層的 塾102 一般地具有第一侧A1和佈置為與第-侧A1相對的 第二側A2。第一侧A1和第二侧A2通常指代墊1〇2的相對表 面，以方便描述在此描述的各種配置。 八該多個塾102中的至少一個塾包括端子部分101和延伸部 分103。端子部分1〇1配置為接納該一個或多個封裝互連結構 μ中的至少-個封裝互連結構。也就是說，端子部分1〇1的第 一侧A1用作該一個或多個封襄互連結構116的接點塾(1_吨 Pad)、，正如可以看到的那樣。該一個或多個封裝互連結構116 可以通過形成在焊接遮罩層m中的一個或多個開口 lb直接 接合到端子部分101的第一侧A1。 延伸部分1G3配置為接納來自—個或多個晶粒⑽的一個 或多個電連接。在-個實施方式中，—根或多根接合線⑽輕 合到延伸部分103的第二側A2以路由該一個或多個晶粒1〇8 的電信號。 -個或多個晶粒齡到該-個或多個再分佈層1〇6。 f 一個實施方式中’該-個或多個晶粒⑽_到晶粒塾1〇4。 a曰粒墊1〇4包括如下表面，該一個或多個晶粒1〇8附接在該表 Γ上。該—個或錢晶粒1G8可以使祕何合適的技術（諸如 晶粒粘合技術）來耦合到晶粒墊104。
S 12 201216430 •該個或多個晶粒108 一般地包括半導體材料，諸如石夕。 該-個或多個晶粒1G8 —般地具有有賴和非有源側，有源側 包括如下表面，在該表面上形成多個積體電路（ic)器件（未 不出），諸如用於邏輯和/或記憶體的電晶體，並且非有源側佈 置為與有源側相對。該—個或多個晶粒的有源側使用一根 或夕根接合線no電耦合到一個或多個再分佈層1〇6，正如可以 看到的那樣。 在某些實施方式中，晶粒墊1〇4用作接地墊以提供用於該 一個或多個晶粒1〇8的電接地連接。該—個或多個晶粒·;r 以使用一根或多根接合線11〇電耦合到晶粒墊1〇4，正如可以 到的那樣。 模塑料(molding compound)112形成為實質上封住該一個或 多個晶粒108、該一根或多根接合線11〇以及墊1〇2，正如可以 看到的那樣。麵料(mQldingeGmpc)Und)112 -舰包括電絕緣 材料，諸如熱固性樹脂，其佈置為保護該一個或多個晶粒1〇8 和電子封衷組件100的其他部件不受到與處理相關聯的破碎、 氧化或者潮濕的影響。 電子封裝組件100電搞合到電子封裝組件1⑻外部的另一 電子器件’諸如印刷電路板15G。在某些實施方式中，印刷電 路板150可以包括主機板。 電子封裝組件100使用該一個或多個封裝互連結 麵合到印刷電路板15G。該-個或多個封裝互連結構116 一般地 包括諸如金屬的導電材料。該一個或多個封裝互連結構ιι6可 以形成為各種各樣的形狀（包括球面、平面或者多邊形形狀）， 並且可以定位在各種各樣的位置（包括在一行中，或者在含多 13 201216430 行的陣列中）。在-個實施方式中’該—個❹個封裝互連結構 116包括焊球。 根據各種實财式，電子職組件i⑻可·置在球拇陣 列、針柵陣列、接點柵格陣列、_四方扁平封裝、雙列直插 式、混合刻線框架球⑽B) _或者其合適驗合中。在 其他實施方式中，可以使用其他合適的封裝配置。 電子封裝組件的塾1G2可叫各種各樣的方式來排 列’以提供各種各樣的益處。例如，在此描述的塾結構和/或配 置可以允許或促_小的接合縣度、·電子雖組件· 的增加的I/O結構（例如墊）數量、由於用於接合的塾ι〇2的 增加的面積或特定定㈣引起的在·接合位置方面（例如接 合線角度、間隙（clearance))的增加的靈活性、接合線到同一 墊的多重接合、和/或對單-電子封裝佈局的使用可·多個不 同應用’或者其組合。圖2A至圖7繪製了根據各種實施方式 可以使用的某些示例塾配置。 圖2A示意性地示出具有塾酉己置的電子封裝組件施的一 部分260的頂視圖。為清楚起見，未繪製模塑料(—a㈣ compound) ° 電子封裝組件2GG包括-個或多個晶粒⑽，該一個或多 ，曰曰粒108包括多個接合墊1〇9。該一個或多個晶粒⑽的接 口墊109使用-根或多根接合線11〇電輕合到相應的塾脱。該 根或多根接合線11〇的一端可以直接輕合到接合塾1〇9,該一 根或多根接合線U0的另一端可以直_合到墊1〇2的端子部 分101或延伸部分103，正如可以看到的那樣。 塾102的第-行202佈置為與晶粒塾1〇4相鄰，正如可以 201216430 的第二行204佈置為與第-行2。2相鄰且 =墊1〇2的第三行2〇6佈置為與第二行2〇4相鄰且 j塾1〇2的第四行208佈置為與第三行206相鄰且平行’正 如可以看到的那樣。第—行2()2佈置為比 晶粒塾104，塾102的第二行204佈置為比&三行2〇6 2 = ==04，並且墊的第三行_佈置為比 ^ 可以看到的那樣。在其他實施_ 第第三行206中的塾102相對於第二行204和 == 錯，正如可以看到的那樣。也就是說， 在實質上垂直於行202、2〇4、2G6、⑽的方向上，第 和第三行206中的㈣2的端子部分1〇1並未盘第二行2 第四行2〇8中的墊102的端子部分1〇1對準。實質上垂直 ίϋν。6、208的方向用箭頭25。標出。第一行2。2和第 行：中，第二行204和第四 如可以看到的那樣奸Μ1和延伸部分⑽兩者，正 子和第四行2〇8中的墊1〇2的延伸部分103從端 =ί伸到第一行2〇2與第三行206的謂之間 分103在朝向晶粒塾104和7或該一個或多個晶 延伸。延伸部分103可以在實質上垂直於該一 2多個晶粒⑽的終止邊緣的方向上延伸，該終止邊緣與墊 相鄰且平行’正如可以看到的那樣。所繪製的端 其他實财射，可骑對軒部分⑼ 15 201216430 其他合適的形狀。 在圖2A的頂視圖中’形成在焊接遮罩層114中的一個或多 個開口 115以虛線形式繪製，以表明該一個或多個開口 115位 於墊102的端子部分1〇1之下。儘管所繪製的電子封裝組件2〇〇 的該一部分260僅示出了與一個或多個晶粒1〇8的終止邊緣之 一相鄰的墊102的配置，但是應當理解，可以沿著該一個或多 個晶粒108的其他或所有終止邊緣類似地配置墊1〇2和接合墊 109。 圖2B示意性地示出電子封裝組件2〇〇的該一部分26〇沿著 圖2A的段XY的橫截面視圖。圖2B的線211 一般地對應於圖 2A的線211，其一般地表明圖2A和圖2B中墊1〇2的共同維度^ 電子封裝組件2GG包括如®所示地輕合的具有端子部分1〇1和 延伸部分的多個墊102、晶粒墊1〇4、一個或多個晶粒1〇8、一 根或多根接合線110、模鋪(mGiding eGmpQund)112以及具有 一個或多個開口 115的焊接遮罩層114。 圖3示意性地示出具有另一塾酉己置的電子封裝組件3〇〇的 -部分·的頂視圖。電子封裝姆3⑻包括排列為第一行 202、第二行2〇4、第三行206和第四行208的多個墊1〇2。行 202、204、206、208對應於塾1〇2的端子部分1(H，正如可以 看到的那樣。在其他實施方式中，可贿用附加行。 第-行202和第二行204相對於彼此交錯，並且第一行2〇2 和第二行2〇4中的墊1G2的延伸部分⑽延伸為使得每個延伸 部分103的終止端對準以形成實質上平行於第-行2G2和第二 行204的行終止端3〇2。第三行2〇6和第四行2⑽相對於彼 此交錯，並且第三行206和第四行2〇8中_ 1〇2的延伸部分 201216430 =延伸為使得每個延伸部細的終止端（例如接點區域305) ί準以形成實質上平行於第三行2〇6和第四行的另一行終 止端304行302和304實質上彼此平行。儘管所繪製的延伸 部分103實質上是線性的，但在其他實施方式中，可以針對延 伸部分103使用其他非線性形狀。 、正如可以看到的那樣，延伸部分1〇3包括··接點區域3〇5， 以促進將-根或多根接合線11〇連接到延伸部分;走線區 307 ’以促進塾1〇2之間的路由，接點區域3〇5比走線區挪更 寬丄例如’該更寬接點區域3G5可靴置為接_—根或多根 接口線110’正如可以看到的那樣。儘管該更 綠製為圓形，但在其他實施方式中，可以針對該更寬接點區域 305使用其他形狀。延伸部分1〇3可以促進縮短一根或多根接 線110的導線長度，或者允許將塾1〇2放置在接合線夠不到 的位置上（例如超出導線長度製造能力）。 泣圖4示意性地示出具有另一墊配置的電子封裝組件4⑽的 邛分460的頂視圖。電子封裝組件4〇〇包括排列為第一行 和第二行204的多個墊102。在其他實施方式中，可以使用附 加行。 墊102包括端子部分101和延伸部分1〇3，延伸部分1〇3 在遠離端子部分1〇1的相反方向上延伸’正如可以看到的那 樣。延伸部分1〇3可以在遠離端子部分101的單一方向上延伸， 而不疋在运離h子部分101的兩個方向上延伸。在某此實施方 式中，延伸部分103在實質上平行於一個或多個晶粒1〇8的終 止邊緣的方向上延伸’該終止邊緣與墊1〇2的第一行2〇2相鄰 且平行。在其他實施方式中’延伸部分1〇3在與一個或多個晶 17 201216430 粒108的相鄰終止邊緣既不平行又不垂直的方向上延伸。第一 行202和第二行2〇4中的墊並不相對於彼此交錯。 延伸口103可以配置為在不垂直於一個或多個晶粒⑽ 的相鄰終止邊緣的方向上延伸以增加選擇接合位置方面的靈活 性（例如接合線角度、間隙）。在一個實施方式中，延伸部分 103在不垂直於第一行2〇2和/或第二行的方向上延伸正 如可以看到畴樣，以提供所希望的接合線肖度或離…根 或多根接合線110可以輜合到塾1〇2的端子部分1〇1和/或延伸 部分103 〇 圖5示忍性地示出具有另一墊配置的電子封裝組件$⑻的 -部分56G的頂視圖。電子封裝組件5⑻包括排列為第一行 202、第二行204和第三行206的多個墊1〇2。在其他實施方式 中，可以使用附加行。 行202、204、206並不相對於彼此交錯。也就是說，行2〇2、 204 206中的墊1〇2的端子部分在實質上垂直於行加、 204、206的方向上對準。實f上垂直於行观、2()4、的方 向由箭頭250標出。在此情況下，墊1〇2的延伸部分丨〇3可以 以非線性方式在更靠近於晶粒塾1〇4或該一個或多個晶粒1〇8 的行的墊102之間延伸。例如，在所繪製的實施方式中，第三 行206的墊1〇2的延伸部分1〇3以非線性方式在第二行2〇4的 整102之間延伸’從而使得延伸部分1〇3的終止端（例如接點 區域305)佈置在佈置於第一行2〇2與第二行2〇4令的墊 的端子部分101之間。在某些實施方式中，塾1〇2的每個延伸 部分103延伸為使得每個延伸部分1〇3的終止端（例如接點區 域305)對準，以形成實質上平行於第一行藝2〇2和第二行墊 201216430 204的一行終止端502。 正如可以看到的那樣’延伸部分1〇3包括：接點區域3〇5， 以促進將一根或多根接合線11〇連接到延伸部分1〇3 ;走線區 307，以促進在墊1〇2之間進行路由，接點區域3〇5比走線區 307更寬。例如，該更寬接點區域3〇5可以配置為接納該一根 或多根接合線110，正如可以看到的那樣。儘管該更寬接點區域 305繪製為矩形’但在其他實施方式中，可以針對該更寬接點 區域305使用其他形狀。電子封裝組件的配置允 許利用墊102之間的區域來進行多重接合或者允許在選擇用於 一根或多根接合線的接合位置方面的增加的靈活性。 個墊 102。行 202、204、206、208、2 如可以看到的那樣。在其他實施方式中 圖6不意性地示出具有另一墊配置的電子封裝組件60〇的 -部分660的觀圖。電子封裝崎_包括湖為第一行 202、第一行204、第三行2Q6、第四行和第五行21〇的多 210相對於彼此交錯，正 _，可以使用附加行。 伸部分103，延 離端子部分101 第一仃202、第二行204和第三行206中的墊1〇2包括延 延伸部分1G3在包括墊1G2的平面上在實質上遠 ° 77 1的所有方向上延伸。該平面例如可以與墊1〇2 ，^^、"^&(例如聯繫圖8的方法_而插述的犧牲層） 5 1G2所輕合到的表面（例如焊接遮罩層114)共面。
19 201216430 約束或可靠性問題（諸如墊之間的電短路），從製造角度而言， 將諸如墊102之類的導電特徵定位在小於最小間隔s的距離處 甚至是不可行的。在所繪製的實施方式中，延伸部分1〇3進一 步在平行於行（例如第一行202、第二行204等）的方向上、 而不是在垂直於行的方向上延伸。垂直於行的方向用箭頭25〇 標出。一個或多個開口 115以虛線形式繪製，以表明該一個或 多個開口 115位於墊1〇2的端子部分101之下。 在單一電子封裝組件200中可以使用多種不同結構的墊 102。第四行208包括僅具有端子部分1〇1的墊1〇2。第五行21〇 包括如下墊102，該墊1〇2包括端子部分1〇1和延伸部分1〇3， 延伸部分103朝向晶粒墊1〇4或一個或多個晶粒1〇8延伸。在 其他實施方式巾’可贿用採用多種不同結構的墊1Q2的其他 配置。例如’在某些實施方式中，聯繫圖1-圖7而描述的針對 墊102的結構和配置的實施方式可以適當地組合在單一的 封裝組件中。 圖7不意性地示出具有一個或多個環狀段結構720的電子 封裝組件700的-部分76〇的頂視圖。電子封裝組件包括 適合於在此插述的用於任何塾1〇2的實施方式的多個塾1〇2。 墊1 〇2排列在第一行202和第二行204中。在其他實施方式甲， 可以使用附加行。 ί個或多個環狀段結構720配置為為該一個或多個晶粒 供電源連接和/或接地連接。根據各種實施方式，該一個 個狀^'結構720佈置在第一行202與該一個或多個晶粒 108之間’正如可以看到的那樣。 使用-根或多根接合線11〇來將該一個或多個晶粒的
S 20 201216430 接合墊109電為人私,# D該―個或多個環狀段結構72〇和墊102， ==Γ樣。該一根或多根接合線η”以進-步用 在—二^個環狀段結構72〇中的分離環狀段結構電耦合 看到的那樣’該一個或多個環狀段結構72〇 一般 晶粒108⑽ΤΙ相鄰行(例如第一行2〇2)或該-個或多個 二、緣的方向上伸長，該終止邊緣與該一個或多 4二又、’口 720相鄰。該一個或多個環狀段結構720可以沿 者1個或多個晶粒_的—個或多個（例如所有）終止邊緣 而佈置’以實質上圍繞該—個或多個晶粒⑽，正如可以看到 的那樣在個實施方式中，該一個或多個環狀段結構別是 用於形成墊102和/或晶粒墊（例如圖6的晶粒塾1〇4)的同一 金屬層（例如圖1的再分佈層1G6)的部分。 該一個或多個環狀段結構720提供將同-設計用於多種或 ^種類型的||件（例如—個或多個晶粒間的靈活性。也就 是說’使用該-個或多個環狀段結構72G允許用於電子封裝組 件的單一佈局可用於多個不同的應用。 儘管相應的電子封裝組件200、300、400、500、600、700 的所繪製的部分260、360、460、560、660、760僅示出了與一 個或多個晶粒108的終止邊緣之一相鄰的墊1〇2的配置，但應 當清楚，可以沿著該一個或多個晶粒108的其他或所有終止邊 緣類似地配置墊102和接合墊1〇9。應當理解，在此描述的各 種墊配置可以用於四方扁平無引腳（QFN)封裝或其他類型的 封裝。 圖8示意性地示出用以製作在此描述的電子封裝組件（例 21 201216430 如電子封裝組件100)的方法800的工藝流程圖。在802處， 方法800包括提供基板。該基板包括如下表面，在該表面上形 成一個或多個再分佈層（例如圖1的一個或多個再分佈層 106)。該基板是在最終電子封裝組件中被去除的犧牲基板。最 終電子封裝組件是準備好運輸或由客戶使用的組件。該基板可 以包括各種各樣的合適的材料。在一個實施方式中，該基板包 括諸如銅的金屬。 在804處，方法800進一步包括在基板上形成再分佈層（例 如圖1的一個或多個再分佈層1〇6>該再分佈層包括多個墊(例 如圖1的墊102)。再分佈層可以進一步包括晶粒墊（例如圖丄 的晶粒墊104)。再分佈層可以通過任何合適的技術來形成，這 些技術包括例如電鍍、沉積、附接、對基板進行圖案化（如刻 蝕）或者其他合適的工藝來形成，以提供在此描述的墊的結構 或配置。 在806處，方法800進一步包括將晶粒（例如圖丨的一個 或多個晶粒108)麵合到再分佈層。在一個實施方式中，晶粒 的非有源表面個晶㈣合趣合到晶粒墊，晶粒的有源表面 使用一根或多根接合線（例如圖1的一根或多根接合線丨1〇)電 耦合到形成在基板上的多個墊。在其他實施方式中，可以使用 其他合適的技術來將晶粒耦合到再分佈層。 在808處，方法8〇〇進一步包括形成模塑料（例如圖i的 模塑料112 )。該模塑料(molding comp〇und) 一般地形成為封住晶 粒、該-根或多根接合線錢再分佈層^根據各種實施方式， 模塑料(moldingcompound)通過將固態形式（例如，粉末）的樹 脂（例如，熱固性樹脂）沉積到模具中並施加熱量和/或麼力以
S 22 201216430 熔化該樹脂而形成。在其他實施方式中，可以使用其他公知的 用於形成模塑料(molding compound)的技術。 在81〇處，方法800 it-步包括去除基板以暴露再分佈層。 基板可以例如通過使用諸如刻蝕工藝之類的工藝選擇性地去除 基板材料來去除。模塑料(molding compound)可以用作在去除^ 板的刻蝕工藝期間的機械載體。 承土 在812處，方法800進一步包括在暴露的再分佈層上形成 焊接遮罩層（例如圖1的焊接遮罩層m)。焊接遮罩層可以通 過任何公知的工藝來沉積。例如可以使用任何公知^案 曝光/顯影工藝在焊接遮罩層形成—個衫個開口（例 的 一個或多個開口 115)。 、 在似處，方法_進一步包括通過焊接遮單層將一個或 構(例如圖1的一個或多個封裝互連結構ιΐ6) 多個墊中的相應墊。該—個或多個難互連結構（例如 知球）可贿贿何合適_積技術來形成或放置。在一 ’該-個或多個封裝互連結構通過I 二個或多個開口附接到塾的端子部分(例如圖丨的= 在麵合該-個或多個封裝互連結構之後，電子 印刷電路板。 以將一個或多個晶粒的電信號路由到 各種操作以最有助於理解所要求保護的主題的方式被据述 23 201216430 為按次？㈣娜雜作。細，觀的順料應當理解為暗 不沒些操作必然是依賴於順序的。特別地，這些操作可以不以 所呈現_序執行。所贿_作可咖無描賴實施方式 不同的順序來執行。可喊行各種附加的操作和/或所描述的操 作在附加實施方式中可以省略。 、 本指述可以制基於透視的贿，諸如向上/向下、之上/ 之下’和/，或頂部/底部、。這種描述僅用於方便討論，而並非旨在 〜 〜低邓。延裡描述僅用於方便討論， 將在此描述的實施方式的應祕制為任何特定方向 出於本公開的目的，短語“，，意思是A或B。出於本 ^的，短語“A和/或B”意思是“（A)、（B)或者（A和b )。 的目的’短語“A、B * c中的至少一個，，意思是 bL^ 、（師3)、（八和〇、（料〇、或者（八、 )。出於本公開的目的，短語“（Α)Β，，意思是“（β)或 (ΑΒ) ”，也就是說，Α是可選元素。 者類使用短語“在—個實施方式中，，、“在實施方式中，，或 言，其均可以指代—個或多個相同或不同的實施方 更和/或糾付财錢纽 5式因Π旨/樹此討論物糊任何調整或變 其等同H喻旨機懈删及
S 24 201216430 【圖式簡單說明】 通過結合附圖的以下詳4 施方式。為方便進行這一^田述’將很容易理解本公開的實 構性元件。這裡的實施方類似的參考標號表示類似的結 是限制的方式示出。^在附圖的各圖中以示例的方式而不 截面=地不峰合到印刷電路板的電子封裝組件的橫 的頂:2,示意性地示出具有塾配置的電子封裝組件的-部分 分的2Α所鍋綱餘件的該一部 圖3示意性地示出具有另—塾配置的電子封裝 分的頂視圖。 圖4不意性地不出具有另一塾配置的電子封裝組件的-部 分的頂视圖。 圖5不意性地示出具有另一塾配置的電子封裝組件的一部 分的頂視圖。 圖6示思性地示出具有另一墊配置的電子封裝組件的一部 分的頂视圖。 圖7示意性地示出具有一個或多個環狀段結構的電子封裝 組件的一部分的頂視圖。 :’y '.tf 圖8示意性地示出用以製作在此描述的電子封裝組件的方 法的工藝流程圖。 25 201216430 【主要元件符號說明】 A1 :第一侧 101 :端子部分 A2 :第二側 102 :墊 100 :電子封裝組件 103 :延伸部分 200 :電子封裝組件 104 :晶粒墊 300 :電子封裝組件 106 :再分佈層 400 :電子封裝組件 108 :晶粒 500 :電子封裝組件 109 :接合墊 600 :電子封裝組件 110 :接合線 700 :電子封裝組件 112 :模塑料 260 : —部分 114 :焊接遮罩層 360 : —部分 115 :開口 460 : —部分 116 :封裝互連結構 560 : —部分 150 :印刷電路板 660 : —部分 211 :線 760 : —部分 250 :箭頭 202 :第一行 302 :行 204 :第二行 304 :行 206 :第三行 305 :接點區域 208 :第四行 307 :走線區 502 :行 720 :環狀段結構
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Claims (1)

  1. 201216430 七、申請專利範圍： 1. 一種電子封裝組件，包括： 焊接遮罩層，所述焊接遮軍層具有至少一個開口；以及 搞合到所述焊接遮罩層的多個墊，其中所述多個墊中的至少一 個墊包括⑴第-側，⑻第二側，所述第—側佈置為與所述 第二側相對，㈤端子部分以及（iv)延伸部分， 其中在所述端子部分處的所述第—做置為通過所述焊接遮罩 層中的所述至少-個開口接納封裝互連結構，所述封裝互連結 構用以在晶粒與所述電子封裝組件外部的另一電子器件之間路 由電信號，並且 其巾麵舰伸部分處騎述第二繼置為接絲自所述晶粒 的一個或多個電連接。 2. 根據請求項丨所述的電子封裝組件，進—步包括配置為接納所 述晶粒的晶粒墊，其中： 所述多個墊包括第-行墊，所述第—雜_與所述晶粒塾 相鄰；以及 所述多個墊包括佈置為與所述第一行塾相鄰且平行的第二行 塾’所述第-行墊佈置為比所述第二行塾更靠近於所述晶粒 墊。 3. 根據請求項2所述的電子封裝組件，其中： 所述至少一個墊佈置在所述第二行墊中。 根據請求項3所述的電子封裝組件，其中所述第一行塾和戶斤述 27 201216430 第二行墊相對於彼此交錯。 5. 根據請求項2所述的電子封裝組件，其中·· 所述多個墊包括佈置為與所述第二行塾相鄰且平行的第三行 塾，所述第二行墊佈置為比所述第三行墊更靠近於所述晶粒墊； 所述多個墊包括佈置為與所述第三行塾相鄰且平行的第四行 墊’所述第三行墊佈置為比所述第四行墊更靠近於所述晶粒 墊；以及 所述至少-個塾佈置在⑴所述第三行墊或（u)所述第四行 整> 中。 6. 根據請求項5所述的電子封裝組件，其中所述第三行塾和所述 第四行墊相對於彼此交錯。 7. 根據請求項5所述的電子封裝組件，其中： 如果所述至少一個墊佈置在所述第三行墊中，則所述至少一個 墊的所述延伸部分在（i)所述第二行墊的墊之間延伸；或者如 果所述至少一個墊佈置在所述第四行墊中，則所述至少一個墊 的所述延伸部分在（ii)所述第三行墊的墊之間延伸。 8. 根據請求項1所述的電子封裝組件，其中所述延伸部分在遠離 所述端子部分的相反方向上延伸。 9. 根據請求項1所述的電子封裝組件，其中所述延伸部分實質上 是非線性的。 10. 根據請求項2所述的電子封裝組件，進一步包括： 所述晶粒佈置在所述晶粒墊上，所述晶粒具有接合墊，所述接 S 28 201216430 合墊使用接合線電耦合到所述至少一個塾。 11.根據請求項10所述的電子封裝組件，其中所述接合線附接到 (1)所述接合墊以及（11)在所述至少一個墊的所述延伸部分 處的所述第二侧。 12·根據請求項10所述的電子封裝組件，其中： 所述晶粒墊是接地螯，所述接地墊用以提供用於所述晶粒的接 地連接；以及 所述晶粒通過使用另一接合線被電耦合到所述接地墊。 13. 根據請求項1〇所述的電子封裝組件，其中所述延伸部分在不 垂直於所述晶粒的邊緣的方向上延伸’所述晶粒的所述邊緣與 所述第一行墊相鄰且平行。 14. 根據請求項1〇所述的電子封裝組件，進一步包括： 模塑料’佈置為實質上封住所述晶粒和所述接合線，所述模塑 料布置在所述至少一個墊的所述第二侧上；以及 所述_互連結構’所述封裝互連結構通過所述至少一個開口 耦合到在所述至少一個㈣所述端子部分處的所述第一側。 15. 根據請求項10所述的電子封裝組件，進一步包括：佈置在⑴ 所述第-行墊與⑻所述晶粒之間的一個或多個環狀段結構， 所述-個或多個環狀段結構在實質上平行於與所述一個或多個 環狀段結構相鄰的所述晶粒的邊緣的方向上伸長，其中： e 所述晶粒的所述接合墊使麟述接合線電輕合到所述一個或 多個環狀段結構； 一 29 201216430 所述一個或多個環狀段結構使用附加的接合線電耦合到所述 至少一個墊；以及 所述一個或多個環狀段結構為所述晶粒提供電源連接或接地 連接。 16·根據請求項2所述的電子封裝組件，其中所述晶粒塾和所述多 個墊是同一金屬層的部分。 17. —種電子裝置，包括： 電子封装組件，包括： 焊接遮罩層，所述焊接遮罩層具有至少一個開口；以及 耦合到所述焊接遮罩層的多個墊，其中所述多個墊中的至少 -個墊包括⑴第-側’（ii)第二側，所述第一側佈置為與所 述第二侧相對’（出）端子部分以及（iv)延伸部分， 其中在所述端子部分處騎述第—做置為通過所述焊接遮罩 層中的所述至少一個開口接納封裝互連結構，並且 其中在所述延㈣分處騎述第二娜置為接納來自所述晶粒 的一個或多個電連接；以及 印刷電路板’通過使用所述封裝互連結構搞合到在所述至少一 個墊的所述端子部分處的所述第一側，所述封裝互連結構用以 在所述晶粒與所述印刷電路板之間路由電信號。 18 ·根據請求項17所述的電子裝置，其中所述電子封裝組件進一 步包括： 耦合到所述焊接遮罩層的晶粒墊； 201216430 所述晶粒佈置在所述晶粒墊上，所述晶粒具有接合墊，所述接 合墊使用接合線電輕合到所述至少一個墊；以及 模塑料，佈置為實質上封住所述晶粒和所述接合線，所述模塑 料布置在所述至少一個墊的所述第二側上。 19 ·根據請求項18所述的電子裝置，其中： 所述多個墊包括第-行藝，所述第一行墊佈置為與所述晶粒塾 相鄰；以及 所述夕個墊包括佈置為與所述第一行塾相鄰且平行的第二行 墊’所述第-行塾佈置為比所述第二行塾更靠近於所述晶粒甏 所述多個塾包括佈置為與所述第二行墊相鄰且平行的第三行 墊，所述第二行墊佈置為比所述第三行蚊靠近於所述晶粒塾； 所述多個墊包括佈置為與所述第三行墊相鄰且平行的第四行 墊’所述第三行塾佈置為比所述第四行墊更靠近於所述晶粒 墊；以及 所述至少-個墊佈置在⑴所述第三行墊或⑻所述第四 墊中。 如·根據請求項所述的電子震置，其中所述接合線附接到⑴ 所^接合塾以及（ii)所述至少一個塾的所述延伸部分的所述第 31
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US9543236B2 (en) 2017-01-10
CN102270619A (zh) 2011-12-07
CN102270619B (zh) 2014-03-19
US20150035160A1 (en) 2015-02-05
US8860193B2 (en) 2014-10-14
US9331052B2 (en) 2016-05-03
US20160240459A1 (en) 2016-08-18
TWI458062B (zh) 2014-10-21

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