TW201202690A - Defect repair apparatus and defect tracking method - Google Patents

Defect repair apparatus and defect tracking method Download PDF

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Publication number
TW201202690A
TW201202690A TW100107498A TW100107498A TW201202690A TW 201202690 A TW201202690 A TW 201202690A TW 100107498 A TW100107498 A TW 100107498A TW 100107498 A TW100107498 A TW 100107498A TW 201202690 A TW201202690 A TW 201202690A
Authority
TW
Taiwan
Prior art keywords
defect
image
correction
tracking
region
Prior art date
Application number
TW100107498A
Other languages
English (en)
Chinese (zh)
Inventor
Ryuichi Yamazaki
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW201202690A publication Critical patent/TW201202690A/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW100107498A 2010-03-05 2011-03-04 Defect repair apparatus and defect tracking method TW201202690A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010049573 2010-03-05
JP2010231020A JP5730528B2 (ja) 2010-03-05 2010-10-13 欠陥修正装置および欠陥追跡方法

Publications (1)

Publication Number Publication Date
TW201202690A true TW201202690A (en) 2012-01-16

Family

ID=44880364

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107498A TW201202690A (en) 2010-03-05 2011-03-04 Defect repair apparatus and defect tracking method

Country Status (3)

Country Link
JP (1) JP5730528B2 (ko)
KR (1) KR20110101077A (ko)
TW (1) TW201202690A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495875B2 (ja) * 2010-03-18 2014-05-21 オリンパス株式会社 レーザ加工方法、及び、レーザ加工装置
JP6184746B2 (ja) * 2012-08-27 2017-08-23 Ntn株式会社 欠陥検出装置、欠陥修正装置および欠陥検出方法
KR102153914B1 (ko) * 2013-07-31 2020-09-09 엘지디스플레이 주식회사 표시장치의 휴대용 리페어 시스템 및 이의 동작방법
CN112658470B (zh) * 2020-12-10 2023-05-26 安徽巨一科技股份有限公司 一种激光焊接定子端部扁线的视觉定位引导和标定方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369914A (ja) * 1989-08-09 1991-03-26 Toshiba Corp 液晶ディスプレイの修正装置
JPH06110069A (ja) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd 電子部品の欠陥修復方法および欠陥修復装置
JP2993373B2 (ja) * 1994-07-19 1999-12-20 住友金属工業株式会社 パターン加工方法およびパターンを備えるセラミックス部材
JPH09101236A (ja) * 1995-10-04 1997-04-15 Hitachi Ltd 表示欠陥検査装置および表示欠陥検査方法
JPH10340935A (ja) * 1997-06-06 1998-12-22 Mitsubishi Electric Corp 検査装置
JP2002195955A (ja) * 2000-12-25 2002-07-10 Matsushita Electric Ind Co Ltd 半導体欠陥検査方法及び半導体欠陥検査装置
KR101061653B1 (ko) * 2003-05-09 2011-09-01 올림푸스 가부시키가이샤 결함수정장치 및 결함수정방법
JP2005249946A (ja) * 2004-03-02 2005-09-15 Inter Action Corp 表示装置の欠陥検査装置
KR101120531B1 (ko) * 2005-03-24 2012-03-06 올림푸스 가부시키가이샤 리페어 방법 및 그 장치
JP2007333491A (ja) * 2006-06-13 2007-12-27 Sumitomo Electric Ind Ltd 板状部材の外観検査装置
JP4951323B2 (ja) * 2006-12-08 2012-06-13 オリンパス株式会社 欠陥修正方法及び欠陥修正装置
JP5100419B2 (ja) * 2008-01-30 2012-12-19 オリンパス株式会社 検査システム

Also Published As

Publication number Publication date
KR20110101077A (ko) 2011-09-15
JP5730528B2 (ja) 2015-06-10
JP2011203710A (ja) 2011-10-13

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