TW201132803A - Method for treating a foundation surface of copper material and a copper material having a treated foundation surface coating - Google Patents

Method for treating a foundation surface of copper material and a copper material having a treated foundation surface coating Download PDF

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Publication number
TW201132803A
TW201132803A TW99139297A TW99139297A TW201132803A TW 201132803 A TW201132803 A TW 201132803A TW 99139297 A TW99139297 A TW 99139297A TW 99139297 A TW99139297 A TW 99139297A TW 201132803 A TW201132803 A TW 201132803A
Authority
TW
Taiwan
Prior art keywords
copper
film
underlayer
underlying
treatment
Prior art date
Application number
TW99139297A
Other languages
English (en)
Chinese (zh)
Inventor
Masaya Miyazaki
Kazuhiko Mori
Hitoshi Ishii
Takaomi Nakayama
Original Assignee
Nihon Parkerizing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Parkerizing filed Critical Nihon Parkerizing
Publication of TW201132803A publication Critical patent/TW201132803A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/34—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing fluorides or complex fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Laminated Bodies (AREA)
TW99139297A 2009-11-17 2010-11-16 Method for treating a foundation surface of copper material and a copper material having a treated foundation surface coating TW201132803A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009261794A JP5571938B2 (ja) 2009-11-17 2009-11-17 銅材料の下地処理方法および下地処理被膜付き銅材料

Publications (1)

Publication Number Publication Date
TW201132803A true TW201132803A (en) 2011-10-01

Family

ID=44059386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99139297A TW201132803A (en) 2009-11-17 2010-11-16 Method for treating a foundation surface of copper material and a copper material having a treated foundation surface coating

Country Status (3)

Country Link
JP (1) JP5571938B2 (ja)
TW (1) TW201132803A (ja)
WO (1) WO2011061899A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112064003A (zh) * 2020-08-20 2020-12-11 华帝股份有限公司 一种前处理剂及其制备方法和应用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6837332B2 (ja) * 2016-12-28 2021-03-03 日本パーカライジング株式会社 化成処理剤、化成皮膜の製造方法、化成皮膜付き金属材料、及び塗装金属材料
JP7387326B2 (ja) * 2019-08-02 2023-11-28 上村工業株式会社 無電解めっきの前処理方法及び無電解めっきの前処理液

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909920B2 (ja) * 1997-07-24 2007-04-25 メック株式会社 銅および銅合金の表面処理法
JP2003129254A (ja) * 2001-10-22 2003-05-08 Nikko Materials Co Ltd 銅及び銅合金の表面処理剤
JP2004140268A (ja) * 2002-10-18 2004-05-13 Matsushita Electric Works Ltd 高周波用多層プリント配線板の製造方法
JP2004346410A (ja) * 2003-05-26 2004-12-09 Nippon Paint Co Ltd 防錆皮膜の形成方法
JP5105137B2 (ja) * 2006-04-25 2012-12-19 日立化成工業株式会社 銅箔を有する基板の製造方法及び銅箔を有する基板
JP4364252B2 (ja) * 2007-04-02 2009-11-11 メック株式会社 基板の製造方法及びこれに用いる銅表面処理剤
CN101868563B (zh) * 2007-11-19 2012-09-12 日本帕卡濑精株式会社 金属材料用基底处理剂和金属材料的基底处理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112064003A (zh) * 2020-08-20 2020-12-11 华帝股份有限公司 一种前处理剂及其制备方法和应用
CN112064003B (zh) * 2020-08-20 2022-06-17 华帝股份有限公司 一种前处理剂及其制备方法和应用

Also Published As

Publication number Publication date
JP5571938B2 (ja) 2014-08-13
JP2011105989A (ja) 2011-06-02
WO2011061899A1 (ja) 2011-05-26

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