TW201120978A - LED chip bonding apparatus - Google Patents

LED chip bonding apparatus Download PDF

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Publication number
TW201120978A
TW201120978A TW098144524A TW98144524A TW201120978A TW 201120978 A TW201120978 A TW 201120978A TW 098144524 A TW098144524 A TW 098144524A TW 98144524 A TW98144524 A TW 98144524A TW 201120978 A TW201120978 A TW 201120978A
Authority
TW
Taiwan
Prior art keywords
wafer
light
emitting diode
lead frame
platform
Prior art date
Application number
TW098144524A
Other languages
English (en)
Chinese (zh)
Inventor
Hyun-Suk Jang
Min-Hyung Lee
Duck-Ho Lee
Min-Kyu Park
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW201120978A publication Critical patent/TW201120978A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Die Bonding (AREA)
TW098144524A 2009-12-04 2009-12-23 LED chip bonding apparatus TW201120978A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090119536A KR101086303B1 (ko) 2009-12-04 2009-12-04 엘이디 칩 본딩 장치

Publications (1)

Publication Number Publication Date
TW201120978A true TW201120978A (en) 2011-06-16

Family

ID=44099756

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098144524A TW201120978A (en) 2009-12-04 2009-12-23 LED chip bonding apparatus

Country Status (3)

Country Link
KR (1) KR101086303B1 (ko)
CN (1) CN102088052A (ko)
TW (1) TW201120978A (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473180B (zh) * 2012-08-24 2015-02-11 Gallant Micro Machining Co Ltd Wafer bonding device
TWI514523B (zh) * 2014-02-27 2015-12-21 Shinkawa Kk 接合裝置以及接合方法
TWI566308B (zh) * 2013-11-08 2017-01-11 均華精密工業股份有限公司 高產出之高精度晶片接合裝置
TWI623982B (zh) * 2015-08-31 2018-05-11 捷進科技有限公司 晶粒接合器、接合方法及半導體裝置之製造方法
TWI663678B (zh) * 2017-07-11 2019-06-21 萬潤科技股份有限公司 Component transfer method and device
TWI694535B (zh) * 2017-07-11 2020-05-21 萬潤科技股份有限公司 氣體銜接組件及使用氣體銜接組件之元件搬送裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103247562B (zh) * 2013-05-17 2015-11-25 嘉兴景焱智能装备技术有限公司 晶粒转塔式取放装置
CN104009144B (zh) * 2014-04-22 2016-08-24 华南理工大学 大功率led共晶焊接中基板与芯片的匹配方法
CN107452644B (zh) * 2016-05-31 2020-11-20 上海微电子装备（集团）股份有限公司 分体式芯片载板搬运键合装置
CN106601657B (zh) * 2016-12-12 2019-12-17 厦门市三安光电科技有限公司 微元件的转移系统、转移方法、制造方法、装置和电子设备
CN112018015B (zh) * 2019-05-31 2024-05-28 昆山扬明光学有限公司 Led自动组装装置及led自动组装制造方法和led
CN110289240A (zh) * 2019-06-27 2019-09-27 上海天马微电子有限公司 电子元件巨量转移头及转移方法
TWM626077U (zh) * 2020-05-20 2022-04-21 馬來西亞商正齊科技有限公司 黏合半導體晶粒的裝置
CN112992758B (zh) * 2020-07-08 2022-02-25 重庆康佳光电技术研究院有限公司 巨量转移装置、方法、系统及设备
CN114566445B (zh) * 2022-01-22 2023-09-08 苏州艾科瑞思智能装备股份有限公司 一种面向晶圆三维集成的高精度微组装设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2529387Y (zh) * 2002-02-27 2003-01-01 东贝光电科技股份有限公司 发光二极管的改良
JP4111160B2 (ja) * 2004-03-26 2008-07-02 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
CN1677702A (zh) * 2004-03-29 2005-10-05 斯坦雷电气株式会社 发光二极管
JP2007335542A (ja) * 2006-06-14 2007-12-27 Nidec Tosok Corp ボンディング装置
JP4853467B2 (ja) 2007-12-03 2012-01-11 パナソニック株式会社 部品実装装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI473180B (zh) * 2012-08-24 2015-02-11 Gallant Micro Machining Co Ltd Wafer bonding device
TWI566308B (zh) * 2013-11-08 2017-01-11 均華精密工業股份有限公司 高產出之高精度晶片接合裝置
TWI514523B (zh) * 2014-02-27 2015-12-21 Shinkawa Kk 接合裝置以及接合方法
TWI623982B (zh) * 2015-08-31 2018-05-11 捷進科技有限公司 晶粒接合器、接合方法及半導體裝置之製造方法
TWI663678B (zh) * 2017-07-11 2019-06-21 萬潤科技股份有限公司 Component transfer method and device
TWI694535B (zh) * 2017-07-11 2020-05-21 萬潤科技股份有限公司 氣體銜接組件及使用氣體銜接組件之元件搬送裝置

Also Published As

Publication number Publication date
KR20110062723A (ko) 2011-06-10
KR101086303B1 (ko) 2011-11-23
CN102088052A (zh) 2011-06-08

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