TW201109399A - Adhesive sheet for plating - Google Patents

Adhesive sheet for plating Download PDF

Info

Publication number
TW201109399A
TW201109399A TW098135410A TW98135410A TW201109399A TW 201109399 A TW201109399 A TW 201109399A TW 098135410 A TW098135410 A TW 098135410A TW 98135410 A TW98135410 A TW 98135410A TW 201109399 A TW201109399 A TW 201109399A
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive sheet
resin
weight
parts
Prior art date
Application number
TW098135410A
Other languages
English (en)
Chinese (zh)
Inventor
Sang-June Um
Sung-Hwan Choi
Chang-Hoon Sim
Ki-Jeong Moon
Hae-Sang Jeon
Original Assignee
Toray Saehan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Saehan Inc filed Critical Toray Saehan Inc
Publication of TW201109399A publication Critical patent/TW201109399A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Laminated Bodies (AREA)
TW098135410A 2009-09-04 2009-10-20 Adhesive sheet for plating TW201109399A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090083241A KR20110025258A (ko) 2009-09-04 2009-09-04 도금용 점착시트

Publications (1)

Publication Number Publication Date
TW201109399A true TW201109399A (en) 2011-03-16

Family

ID=43841013

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098135410A TW201109399A (en) 2009-09-04 2009-10-20 Adhesive sheet for plating

Country Status (5)

Country Link
JP (1) JP2011057956A (ko)
KR (1) KR20110025258A (ko)
CN (1) CN102010676A (ko)
SG (1) SG169262A1 (ko)
TW (1) TW201109399A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5858347B2 (ja) * 2014-02-05 2016-02-10 大日本印刷株式会社 粘着剤組成物およびそれを用いた粘着フィルム
JP6275861B2 (ja) * 2014-09-29 2018-02-07 富士フイルム株式会社 積層体、導電性積層体およびその製造方法、タッチパネルセンサー、タッチパネル、転写フィルム
JP6727849B2 (ja) * 2016-02-29 2020-07-22 リンテック株式会社 粘着シートおよび光学製品の製造方法
JP7111558B2 (ja) * 2018-08-27 2022-08-02 日東電工株式会社 積層体
US11015255B2 (en) * 2018-11-27 2021-05-25 Macdermid Enthone Inc. Selective plating of three dimensional surfaces to produce decorative and functional effects
CN111218701A (zh) * 2020-01-16 2020-06-02 西安微电子技术研究所 一种sop封装的待镀电路模块局部阻镀保护方法
KR102472342B1 (ko) * 2020-02-10 2022-11-30 진테크 주식회사 열반응성 점착제층을 구비한 전자파 차폐용 캐리어 금속극박 및 이의 제조방법
CN118440606A (zh) * 2024-05-04 2024-08-06 万洲胶粘制品(江苏)有限公司 一种金属保护与环保脱除结合的pcb镀金胶带制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281623A (ja) * 1989-04-21 1990-11-19 Nec Corp メッキ配線の形成方法
JP4132642B2 (ja) * 1999-11-15 2008-08-13 東京応化工業株式会社 ネガ型レジスト基材及びそれを用いたイオン注入基板の製造方法
JP4480548B2 (ja) * 2004-11-10 2010-06-16 シャープ株式会社 両面回路基板およびその製造方法
JP5559952B2 (ja) * 2007-08-01 2014-07-23 東洋インキＳｃホールディングス株式会社 活性エネルギー線粘着力消失型粘着剤組成物および粘着テープ
KR100910672B1 (ko) * 2007-08-03 2009-08-04 도레이새한 주식회사 내열성 점착시트

Also Published As

Publication number Publication date
KR20110025258A (ko) 2011-03-10
JP2011057956A (ja) 2011-03-24
CN102010676A (zh) 2011-04-13
SG169262A1 (en) 2011-03-30

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